CN115696766B - Manufacturing method of high-precision flexible circuit board - Google Patents
Manufacturing method of high-precision flexible circuit board Download PDFInfo
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- CN115696766B CN115696766B CN202211168457.4A CN202211168457A CN115696766B CN 115696766 B CN115696766 B CN 115696766B CN 202211168457 A CN202211168457 A CN 202211168457A CN 115696766 B CN115696766 B CN 115696766B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000012790 adhesive layer Substances 0.000 claims description 82
- 239000010410 layer Substances 0.000 claims description 75
- 238000004080 punching Methods 0.000 claims description 57
- 230000001681 protective effect Effects 0.000 claims description 23
- 239000002313 adhesive film Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 27
- 239000000463 material Substances 0.000 abstract description 12
- 230000001976 improved effect Effects 0.000 abstract description 6
- 230000008602 contraction Effects 0.000 abstract description 4
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 230000001939 inductive effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 238000003754 machining Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
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- 238000009826 distribution Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
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Abstract
The invention discloses a high-precision flexible circuit board manufacturing method, which comprises a coil circuit area and a plug flexible board area; the manufacturing method comprises the following steps: an inner adjusting circuit is arranged inwards on the inner contour line of the coil circuit area, a stress balance circuit is arranged outwards on the outer contour line of the coil circuit area, and a stress relief groove structure is arranged in the circuit range of the stress balance circuit; attaching a first functional film layer and a second functional film layer before forming processing of an inner forming line, and forming a flexible circuit board through forming processing; the inner adjusting circuit is added to adjust the inductive balance and sensitivity of the inductor, the stress balance circuit and the stress relief groove structure are added, the expansion and contraction of the inside of the material in the processing process is effectively released, the first functional film layer and the second functional film layer are attached, the special function of the flexible circuit board is effectively given, the whole method is effective and feasible, and the precision, the functionality, the reliability and the quality of the inductor flexible circuit board product can be improved.
Description
Technical Field
The invention relates to the field of circuit board design and processing, in particular to a method for manufacturing a high-precision flexible circuit board.
Background
At present, more and more inductance modules are provided, an inductance circuit is designed into a circuit board, and the inductance modules with higher integration level, more space saving and better reliability are formed; for some circuit boards with inductance design applied to the field of induction unlocking, flexible circuit board designs with higher precision and more flexible installation modes and inductance circuit designs can be selected.
The flexible circuit board with the inductance circuit design generally requires the circuit board to have higher precision, good inductance stability and distribution uniformity, so as to ensure that phenomena such as slow induction and insensitive induction can not occur in the application process.
At present, a flexible circuit board with an inductance circuit is generally processed by adopting a common processing mode of the flexible circuit board, namely, a traditional mode of circuit pattern processing and outline shaping processing is generally adopted for direct processing.
However, because unavoidable errors caused by machining can be generated in the machining process of the circuit board, the general machining mode does not have the adjusting function in terms of circuit design, machining mode or structure, and the problems of machining and application errors of certain errors between the design of the inductance circuit board and the actually machined product are easy to occur; therefore, for the flexible circuit board with high precision requirement, high sensitivity requirement and more balanced inductance performance requirement, the requirements of processing and application of the flexible circuit board are difficult to meet; in some application scenarios (such as high-frequency characteristics, environmental resistance, a certain supporting property so as to be capable of welding components and parts) which need to implement special protection on the circuit board, the application requirements are difficult to meet from the structural end by adopting a general design and processing mode.
Therefore, based on the above background, there is a need to provide a manufacturing method that effectively improves the optimal design and high-precision processing methods of inductance-based flexible circuit boards.
Disclosure of Invention
The invention aims to solve the problems of larger errors in design and processing, single product structure, unbalanced application performance of the product and the like when the inductance type flexible circuit board is designed and processed in the prior art; the flexible circuit board comprises a coil circuit area and a plug flexible board area; the method is characterized in that:
The coil circuit area is a loop-shaped surrounding circuit area, the plug flexible board area is a flexible board extending outwards from one side of the coil circuit area, and the tail end of the plug flexible board area is provided with a golden finger plug;
the manufacturing method comprises the following steps:
s10: setting an inner adjusting line in an area range of which the inner contour line of the coil line area extends inwards by a certain width distance, wherein the inner contour line moves to an inner side of an encircling area formed by the inner adjusting line to form an inner forming line;
setting a stress balance line in a region range of which the outer contour line of the coil line region extends outwards by a certain width distance, wherein the stress balance line extends to a pattern edge region formed at the periphery to form an outer reference line;
S20: a stress relief groove structure is arranged in the line range of the stress balance line to form a plate to be processed;
S30: the board to be processed is processed, a first functional film layer is attached before the inner forming line is processed in a forming mode, and the first functional film layer is arranged on one surface of the flexible circuit board and integrally covers the area within the range of the outer reference line;
S40: attaching a second functional film layer, wherein the second functional film layer is arranged on the other surface of the flexible circuit board and covers the area surrounded by the inner contour line;
S50: and forming to form the flexible circuit board.
Optionally, the inner adjusting circuit is composed of a plurality of U-shaped circuit patterns with uniformly distributed openings facing the inner forming line direction.
Optionally, the inner conditioning line is at a distance of 20 μm to 100 μm from the inner profile.
Optionally, the stress balance circuit is formed by a plurality of uniformly distributed U-shaped circuit patterns with openings facing the external reference line, and the circuit of the bending part of the stress balance circuit is a broken section circuit.
Optionally, the stress balance line is at a distance of 50 μm to 200 μm from the outer contour line.
Optionally, the stress relief groove structure is disposed within a line range of an opening at one end surrounded by the U-shaped line pattern of the stress balance line, and extends outwards from inside to outside.
Optionally, the stress relief groove structure is a slot formed by punching, and through holes are formed at two ends of the slot; the stress relief groove structure is separated from the stress balance circuit.
Optionally, the attaching the first functional film layer is:
s310: attaching a first adhesive layer to an area within the outer reference line of the board to be processed;
s320: forming according to the inner forming line;
s330: and attaching a first functional film layer to the area attached with the first adhesive layer.
Optionally, the attaching the second functional film layer is:
S410: taking a second adhesive layer, wherein two sides of the second adhesive layer are respectively covered with a first protective film of the second adhesive layer and a second protective film of the second adhesive layer; punching the second adhesive layer for the first time by referring to the inner contour line and the inner forming line, and punching half of the graph of the inner contour line and half of the graph of the inner forming line;
S420: attaching a second adhesive layer micro-adhesive film to the second adhesive layer first protective film, and punching the second time by referring to the inner contour line and the inner forming line, and punching the other half pattern of the inner contour line and the other half pattern of the inner forming line;
S430: tearing off the first protective film of the second adhesive layer, the second adhesive layer and the second protective film of the second adhesive layer, and reserving the first protective film of the second adhesive layer and the second adhesive layer within the range from the inner contour line to the inner forming line after the first punching and the second punching processing to form a second adhesive layer structure to be attached;
S440: taking the second functional film layer, punching the second functional film layer for the first time by referring to the inner contour line, and punching half of the graph of the inner contour line;
S450: attaching a second functional film micro-adhesive film to one surface of the second functional film, punching the second functional film for the second time by referring to the inner contour line, and punching the other half of the graph of the inner contour line;
s460: tearing off the second functional film layer, and reserving the second functional film layer within the range of the first film layer punching and the second film layer punching by referring to the inner contour line to form a second functional film layer structure to be attached;
S470: performing alignment lamination on one surface of the second adhesive layer to be laminated with the second functional film layer to be laminated with the second adhesive layer structure, and tearing off the second adhesive layer micro-adhesive film and the second adhesive layer first protective film; forming a film layer attaching structure to be subjected to a second function;
S480: and (3) attaching the second functional film layer to one surface of the second adhesive layer of the structure to be attached to the board to be processed in an alignment manner, and tearing off the second functional film layer micro-adhesive film.
Optionally, the molding process is a die-cutting molding process with reference to the outer contour line and the contour line of the plug flexible board region.
The invention can effectively release the expansion and contraction of the material in the processing process and offset the stress generated by the design of the internal regulating circuit by adding the internal regulating circuit reserved by the finished product so as to better regulate the inductive balance and the sensitivity of the inductance and add the stress balance circuit and the stress relieving groove structure in the processing process, thereby effectively preventing the problem that the product precision is influenced due to overlarge expansion and contraction in the processing process of the product; the design of attaching the second functional film layer to the functional surface and attaching the first functional film layer to the back surface can effectively improve the special functions (high frequency, environment resistance, supportability and the like) of the flexible circuit board, and meanwhile, the attaching mode of the transfer film is utilized, the processing procedures of high-precision attaching and mass attaching of the first functional film layer and the second functional film layer are realized, and the processing precision and the processing efficiency of products are effectively improved; the whole design improvement and the processing process are effective and feasible, and the precision, the functionality, the reliability and the quality of the inductance type flexible circuit board product can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a process flow diagram of a method for manufacturing a high-precision flexible circuit board according to an embodiment of the present invention;
Fig. 2 is a schematic plan view of a high-precision flexible circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a planar structure of a high-precision flexible circuit board processing pattern design according to an embodiment of the present invention;
FIG. 4 is an enlarged plan view of a stress balance circuit according to an embodiment of the present invention;
FIG. 5 is a process flow diagram of attaching a first functional film layer according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional structure of a first functional film according to an embodiment of the present invention;
FIG. 7 is a process flow diagram of attaching a second functional film layer according to an embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view illustrating a process of attaching a second functional film according to an embodiment of the present invention;
Fig. 9 is a schematic cross-sectional structure of a high-precision flexible circuit board after molding processing according to an embodiment of the present invention;
Fig. 10 is a schematic plan view of a high-precision flexible circuit board after molding processing according to an embodiment of the present invention.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 10 | Flexible circuit board | 220 | First adhesive layer |
| 110 | Coil line region | 2210 | First adhesive layer protection film |
| 120 | Plug flexible board area | 320 | Second adhesive layer |
| 1210 | Golden finger plug | 3210 | Second adhesive layer first protective film |
| 1110 | Inner contour line | 3220 | Second protective film of second adhesive layer |
| 1120 | Internal regulating circuit | 330A | Second adhesive layer structure to be attached |
| 1130 | Internal forming wire | 3201 | First punching seam of second adhesive layer |
| 1140 | Outline of the outer contour | 3202 | Second adhesive layer second punching seam |
| 1150 | Stress balance circuit | 310 | Second functional film layer |
| 1150A | Unit stress balance circuit | 3101 | First punching gap of second functional film layer |
| 1150B | Break line gap | 3102 | Second die-cut gap of second functional film layer |
| 1160 | External reference line | 300B | To-be-attached second functional film layer structure |
| 1170 | Stress relief groove structure | 330 | Second adhesive layer micro-mucosa |
| 1170A | Slot groove | 340 | Second functional film layer micro-mucosa |
| 1170B | Through hole | 300C | Film laminating structure for second function |
| 200 | Board to be processed | 300 | Flexible circuit board to be molded |
| 210 | First functional film layer | / | / |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the prior art, a high-precision flexible circuit board in the prior art is of a conventional design, is provided with an inductance circuit pattern area, and is provided with a plug flexible board area in the prior art for connecting an inductance circuit with other electronic modules; the high-precision flexible circuit board in the prior art is simple in design mode and simpler in processing mode, namely, a mode of manufacturing a circuit pattern and processing an outline is adopted, and then the finished product is directly processed by adopting modes of electroplating copper, electroplating gold and the like.
Referring to fig. 1 and 2, fig. 1 is a process flow chart of a method for manufacturing a high-precision flexible circuit board according to an embodiment of the invention; fig. 2 is a schematic plan view of a high-precision flexible circuit board according to an embodiment of the present invention;
The flexible circuit board 10 includes a coil circuit region 110 and a plug flexible board region 120; the method is characterized in that:
the coil circuit region 110 is a loop-shaped surrounding circuit region, the plug flexible board region 120 is a flexible board extending outwards from one side of the coil circuit region 110, and the end of the plug flexible board region 120 is provided with a golden finger plug 1210.
With continued reference to fig. 1 and further reference to fig. 3, fig. 3 is a schematic plan view of a high-precision flexible circuit board processing pattern design according to an embodiment of the invention.
The manufacturing method of the high-precision flexible circuit board of the embodiment comprises the following steps:
s10: an inner adjustment line 1120 is provided within a region range in which the inner contour 1110 of the coil line region 110 extends inward by a certain width distance, and the inner contour 1110 is moved to an inner side of a surrounding region formed by the inner adjustment line 1120 to form an inner formation line 1130;
in this embodiment, the inner adjusting wire 1120 is composed of a plurality of uniformly distributed "U" -shaped wire patterns with openings facing the direction of the inner forming wire 1130.
In the present embodiment, the inner adjustment line 1120 is located at a distance of 20 μm to 100 μm from the inner contour 1110.
Through setting up interior adjusting circuit 1120, and for the increase design that needs remain on flexible circuit board 10, can play the inductance effect of the inductance circuit of adjusting coil circuit region 110 in the application process on the one hand, make the inductance more balanced and increase the coverage, on the other hand can improve the intensity of inductance class flexible circuit board, be that flexible circuit board is more favorable to processing, and can improve constraint and the balancing effect to material stress when flexible circuit board processes.
The line width of the inner adjusting line 1120 is generally consistent with the width of the coil line, and the distribution density, the opening size and the length are set according to specific inductance requirements and adjusting actions, and the product size and stress adjusting requirements during processing; since the inner adjusting circuit 1120 is designed to be increased, a certain distance is required between the inner adjusting circuit and the original circuit so as not to influence the processing and application of the original circuit pattern.
In the region where the outer contour line 1140 of the coil line region 110 extends outward by a certain width distance, a stress balance line 1150 is provided, and the stress balance line 1150 extends to a pattern edge region formed at the periphery to form an outer reference line 1160;
Because the inner adjusting circuit 1120 is additionally designed, the stress bound in the direction of the inner adjusting circuit 1120 is increased in the processing process of the flexible circuit board 10, so that in order to avoid the inward shrinkage of the material in the direction of the inner adjusting circuit 1120 in the processing process, the effect of the inner adjusting circuit 1120 on the stress of the processed material is balanced by adopting the design of adding the stress balancing circuit 1150; the stress balance circuit 1150 is only a circuit pattern used in the manufacturing process and is not left on the finished flexible circuit board 10.
With continued reference to fig. 3, and with reference to fig. 4, fig. 4 is an enlarged plan view of a stress balance circuit according to an embodiment of the invention.
In the present embodiment, the stress balance circuit 1150 is formed by a plurality of uniformly distributed "U" -shaped circuit patterns with openings facing the external reference line, and the bent portion of the stress balance circuit 1150 is a broken-section type circuit, i.e., a circuit formed by a plurality of unit stress balance circuits 1150A and break line gaps 1150B alternately.
Because the inner tuning circuit 1120 is designed with a "U" shaped circuit pattern, the stress balance circuit 1150 may be designed with a "U" shaped circuit pattern that is designed in a "back-to-back" opposite pattern to balance the stress of the material during processing in a more matched manner.
In order to balance the processing stress more finely, the bending part of the stress balance circuit 1150 adopts a broken-link circuit design, so that excessive stress constraint can be prevented from generating processing reaction from a fine angle.
In this embodiment, the stress balance circuit 1150 is located at a distance of 50 μm to 200 μm from the outer contour line 1140.
Because the stress balance circuit 1150 is a circuit pattern used in the processing process, the stress balance circuit 1150 is designed to be far away from the original outer contour 1140, on one hand, the problem that the stress balance circuit 1150 is too close to affect the compression of the flexible circuit board and the delamination of the edge of the outer contour 1140 is generated is prevented, on the other hand, the subsequent punching processing is facilitated, and the rebound shrinkage of the material of the flexible circuit board 10 is not caused after the punching processing.
Please continue to refer to fig. 3.
S20: a de-stressing groove structure 1170 is provided within the line limits of the stress balance line 1150 to form the board 200 to be processed.
In this embodiment, the stress relief groove structure 1170 is disposed within a line range surrounded by a "U" -shaped line pattern of the stress balance line and extends outward from the inside.
In this embodiment, the stress relief groove structure 1170 is a slot 1170A formed by punching, and two ends of the slot 1170A are provided with through holes 1170B; the de-stressing trench structure 1170 is separate from the stress-balancing circuitry 1150.
In order to further improve the release effect of material stress in the processing process, prevent the problem of exceeding the standard of expansion and contraction caused by the material stress on the processing, and prevent the stress balance circuit 1150 from being distributed in the unreserved area of the flexible circuit board 10 to cause the transition regulation effect of the material stress in the unreserved area, a stress relief groove structure 1170 is arranged in the circuit range of the stress balance circuit 1150, and the stress in the unreserved area of the flexible circuit board 10 can be released in advance by designing the slot 1170A and the through hole 1170B, and the material stress in the unreserved area of the flexible circuit board 10 can be effectively released in the processing process, so that a more stable condition is provided for the processing of the reserved area; the stress groove structure 1170 may be designed according to the actual processing requirements, the external reference line 1160 with a length generally exceeding the processing range extends to the non-reserved area, and the distribution density may be designed according to the stress relief requirements, alternatively, not every single stress balance line 1150 is provided with the stress groove structure 1170, and the stress groove structures 1170 of 1 stress balance line 1150 or 2 stress balance lines 1150 may be distributed.
Referring to fig. 5 and 6, fig. 5 is a processing flow chart of attaching a first functional film layer according to an embodiment of the present invention; fig. 6 is a schematic cross-sectional structure of a processing procedure for attaching a first functional film layer according to an embodiment of the present invention.
S30: the board 200 to be processed is processed, and before the inner forming line 1130 is formed, the first functional film 210 is attached, and the first functional film 210 is disposed on one surface of the flexible circuit board 10 and entirely covers the area within the range of the outer reference line 1160.
In this embodiment, the attaching the first functional film layer 210 is:
S310: attaching a first adhesive layer 220 to the region within the range of the outer reference line 1160 of the board to be processed, wherein the non-attaching surface of the first adhesive layer is covered with a first adhesive layer protection film 2210;
s320: forming according to the inner forming line 1130;
s330: the first functional film 210 is attached to the region to which the first adhesive layer 220 is attached.
The first functional film layer 210 is attached to the flexible circuit board 10, and the first functional film layer 210 can be a polytetrafluoroethylene film, an FR-4 film, an electromagnetic shielding film, an aluminum sheet film or other material film body, so that the flexible circuit board 10 can have special properties (such as high-frequency properties, environmental resistance, a certain supporting property and the like); since the area within the inner molding line 1130 of the flexible circuit board 10 does not need to be reserved, the non-reserved area within the inner molding line 1130 needs to be removed (punched out or laser ablated) before the first functional film 210 is attached, so that the first functional film 210 can cover the coil circuit area 110 without affecting the original design of the product; the first functional film layer 210 is attached to the back surface of the flexible circuit board 10, i.e. one surface of the component is not welded, so that the first functional film layer 210 can be completely covered on the coil circuit area 110, and special performance with higher integrity can be provided for the coil circuit area 110; if the coil circuit area 110 needs to be soldered with a component, the first functional film layer 210 can have better supporting property on one hand, and can process patterns such as via holes on the other hand to form soldering and plugging of the component.
In the circuit board processing process, a large processing board is generally formed by splicing a plurality of unit boards, so that a batch processing mode is needed to be provided, and if the unit boards are arranged in parallel, the coil circuit areas 110 are distributed on the same level, the first functional film 210 can be directly stuck to the parallel coil circuit areas 110 of the unit boards, a batch disposable processing process is formed, and the processing efficiency can be effectively improved.
Referring to fig. 7 and 8, fig. 7 is a process flow chart of attaching a second functional film layer according to an embodiment of the present invention; fig. 8 is a schematic cross-sectional structure of a processing procedure for attaching a second functional film layer according to an embodiment of the present invention.
S40: attaching a second functional film layer 310, wherein the second functional film layer 310 is arranged on the other surface of the flexible circuit board 10, and the second functional film layer 310 covers the area surrounded by the inner contour line 1110;
In this embodiment, the attaching the second functional film layer 310 is:
S410: taking a second adhesive layer 320, wherein two sides of the second adhesive layer 320 are respectively covered with a second adhesive layer first protective film 3210 and a second adhesive layer second protective film 3220; first punching the second adhesive layer 320 with reference to the inner contour 1110 and the inner forming line 1130, and punching a half pattern of the inner contour 1110 and a half pattern of the inner forming line 1130, after the first punching, forming a second adhesive layer first punching slit 3201;
S420: attaching a second adhesive layer micro-adhesive film 330 to the second adhesive layer first protective film 3210, performing secondary punching by referring to the inner contour line 1110 and the inner forming line 1130, punching the other half pattern of the inner contour line 1110 and the other half pattern of the inner forming line 1130, and forming a second adhesive layer second punching seam 3202 after the secondary punching;
S430: tearing off the second adhesive layer first protective film 3210, the second adhesive layer 320 and the second adhesive layer second protective film 3220, and reserving the second adhesive layer first protective film 3210 and the second adhesive layer 320 within the range from the reference inner contour line 1110 to the inner forming line 1130 after the first punching and the second punching processing to form a second adhesive layer structure 300A to be attached;
S440: taking the second functional film 310, punching the second functional film 310 for the first time by referring to the inner contour line 1110, punching half of the graph of the inner contour line 1110, and forming a first punching gap 3101 of the second functional film after punching the first time;
s450: attaching a second functional film micro-adhesive film 340 to one surface of the second functional film 310, punching the second functional film 310 for the second time by referring to the inner contour line 1110, punching the other half pattern of the inner contour line 1110, and forming a second punching gap 3102 of the second functional film after punching the second time;
S460: tearing off the second functional film 310, and reserving the second functional film 310 within the range of the first film punching and the second film punching according to the inner contour line 1110 to form a second functional film structure 300B to be attached;
s470: aligning and bonding one surface of the second adhesive layer 320 to be bonded with the second functional film layer 310 of the second adhesive layer structure 300A to be bonded with one surface of the second functional film layer structure 300B, and tearing off the second adhesive layer micro-adhesive film 330 and the second adhesive layer first protective film 3210; forming a film lamination structure 300C to be subjected to a second function;
S480: and (3) aligning and attaching one surface of the second adhesive layer 320 of the to-be-second functional film layer attaching structure 300C to the to-be-processed board 200, and tearing off the second functional film layer micro-adhesive film 340 to form the to-be-formed flexible circuit board 300.
In order to provide the more complete special performance on both sides of the flexible circuit board 10, the original processing and use of the coil circuit area 110 are not affected, the weldability and inductance effects of the coil circuit area 110 are not covered, and the second functional film 310 is attached to the area of the inner adjusting circuit 1120, namely, the second functional film 310 is attached to the area within the range of the inner contour 1110, because the inner adjusting circuit 1120 is designed; in order to maintain the unreserved region within the inner molding line 1130 in its original state, and without changing the original design and the original bending property of the flexible circuit board 10, the unreserved region within the inner molding line 1130 of the second functional film 310 and the first functional film 210 are not adhered to each other.
The second functional film 310 needs to be applied to the second adhesive layer 320 when being applied, and in fact, the application range of the second adhesive layer 320 is the area between the inner contour 1110 and the inner forming line 1130, i.e. in this embodiment, the second adhesive layer 320 is a "back" shape area.
Therefore, in the batch attaching process similar to the first functional film 210, for the second adhesive layer 320 attached in the area of the "back" shape, the second adhesive layer 320 needs to be first manufactured into the area of the "back" shape to be attached, then the second functional film 310 is manufactured into the area within the range of the inner contour 1110, and then the second functional film 310 is attached to the second adhesive layer 320, and then integrally attached to the board 200 to be processed.
The shape of the second adhesive layer 320 and the shape of the second functional film layer 310 are processed by micro-mucosa transfer; the steps S410 to S480 are adopted for attaching, namely, half of the pattern is firstly punched and cut, then a micro-mucosa layer is attached, the other half of the pattern is integrally punched, then the areas of all the layers which are not required to be reserved are removed, and then mutual attachment is carried out; thus, the micro-mucosa layer is subjected to one-time punching, and a completed punching surrounding graph is not formed by one-time punching, so that the area of the micro-mucosa corresponding to the functional film layer and the adhesive layer cannot be punched, and the functional film layer and the adhesive layer are subjected to two-time punching, and therefore the micro-mucosa layer has an effective transfer effect.
It should be noted that, if the coil circuit area 110 has no design such as soldering, plugging, or pad exposure, the second functional film 310 may be attached in the same attachment range as the first functional film 210, but the non-reserved area within the inner forming line 1130 is already punched out, so that the attachment still needs to be performed by micro-adhesive transfer.
The attaching mode of micro-mucosa transfer not only can satisfy the demand of batch attached processing, can more effectively promote the precision of attaching, adopts the mode of machine counterpoint, carries out accurate counterpoint with flexible circuit board 10 to promote product machining precision.
Referring to fig. 9 and 10, fig. 9 is a schematic cross-sectional structure of a molded high-precision flexible circuit board according to an embodiment of the invention; fig. 10 is a schematic plan view of a high-precision flexible circuit board after molding processing according to an embodiment of the present invention.
S50: and forming to form the flexible circuit board 10, wherein the schematic cross-sectional structure of the coil circuit area 110 of the flexible circuit board 10 is the flexible circuit board shown in fig. 9.
In this embodiment, the molding is performed by punching with reference to the outer contour 1140 and the contour of the plug flexible board area 120.
The first functional film layer 210 and the second functional film layer 310 are attached to form the flexible circuit board 10 with special performance and special design, and then the outer contour of the flexible circuit board 10 is punched, so that a finished product of the flexible circuit board 10 is formed.
Through the above processing, the flexible circuit board 10 not only has more stable application effect, but also can be processed in batch with high precision, and the precision and quality of the product are improved, so that the reliability of the product is improved.
It should be noted that, in the actual processing and application processes, there are different circuit board designs, processing and application situations, and the drawing of this embodiment is only used as an implementation process for illustrating this embodiment, and does not represent the dimension ratio of the actual product or the drawing of scaling up according to the actual situation.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
1. A high-precision flexible circuit board manufacturing method comprises a coil circuit area and a plug flexible board area; the method is characterized in that:
The coil circuit area is a loop-shaped surrounding circuit area, the plug flexible board area is a flexible board extending outwards from one side of the coil circuit area, and the tail end of the plug flexible board area is provided with a golden finger plug;
the manufacturing method comprises the following steps:
s10: setting an inner adjusting line in an area range of which the inner contour line of the coil line area extends inwards by a certain width distance, wherein the inner contour line moves to an inner side of an encircling area formed by the inner adjusting line to form an inner forming line;
setting a stress balance line in a region range of which the outer contour line of the coil line region extends outwards by a certain width distance, wherein the stress balance line extends to a pattern edge region formed at the periphery to form an outer reference line;
S20: a stress relief groove structure is arranged in the line range of the stress balance line to form a plate to be processed;
S30: the board to be processed is processed, a first functional film layer is attached before the inner forming line is processed in a forming mode, and the first functional film layer is arranged on one surface of the flexible circuit board and integrally covers the area within the range of the outer reference line;
S40: attaching a second functional film layer, wherein the second functional film layer is arranged on the other surface of the flexible circuit board and covers the area surrounded by the inner contour line;
S50: and forming to form the flexible circuit board.
2. The method of manufacturing a high precision flexible circuit board as defined in claim 1, wherein said internal adjusting circuit is composed of a plurality of uniformly distributed "U" -shaped circuit patterns with openings facing said internal forming line direction.
3. The method of manufacturing a high precision flexible circuit board as claimed in claim 1, wherein the inner adjusting wire is spaced from the inner contour by a distance of 20 μm to 100 μm.
4. The method of manufacturing a high-precision flexible circuit board according to claim 1, wherein the stress balance circuit is composed of a plurality of U-shaped circuit patterns with uniformly distributed openings facing the external reference line, and the circuit of the bent portion of the stress balance circuit is a broken-section circuit.
5. The method of manufacturing a high precision flexible circuit board according to claim 1, wherein the stress balance line is located at a distance of 50 μm to 200 μm from the outer contour line.
6. The method of claim 4, wherein the stress relief groove structure is disposed within a line range of the stress balance line surrounded by the U-shaped line pattern and having an opening at one end, and extends outward from the inside.
7. The method of manufacturing a high-precision flexible circuit board according to claim 6, wherein the stress relief groove structure is a slot formed by punching, and both ends of the slot are provided with through holes; the stress relief groove structure is separated from the stress balance circuit.
8. The method for manufacturing a high-precision flexible circuit board according to claim 1, wherein the attaching the first functional film layer is:
s310: attaching a first adhesive layer to an area within the outer reference line of the board to be processed;
s320: forming according to the inner forming line;
s330: and attaching a first functional film layer to the area attached with the first adhesive layer.
9. The method for manufacturing a high-precision flexible circuit board according to claim 1, wherein the attaching the second functional film layer is:
S410: taking a second adhesive layer, wherein two sides of the second adhesive layer are respectively covered with a first protective film of the second adhesive layer and a second protective film of the second adhesive layer; punching the second adhesive layer for the first time by referring to the inner contour line and the inner forming line, and punching half of the graph of the inner contour line and half of the graph of the inner forming line;
S420: attaching a second adhesive layer micro-adhesive film to the second adhesive layer first protective film, and punching the second time by referring to the inner contour line and the inner forming line, and punching the other half pattern of the inner contour line and the other half pattern of the inner forming line;
S430: tearing off the first protective film of the second adhesive layer, the second adhesive layer and the second protective film of the second adhesive layer, and reserving the first protective film of the second adhesive layer and the second adhesive layer within the range from the inner contour line to the inner forming line after the first punching and the second punching processing to form a second adhesive layer structure to be attached;
S440: taking the second functional film layer, punching the second functional film layer for the first time by referring to the inner contour line, and punching half of the graph of the inner contour line;
S450: attaching a second functional film micro-adhesive film to one surface of the second functional film, punching the second functional film for the second time by referring to the inner contour line, and punching the other half of the graph of the inner contour line;
s460: tearing off the second functional film layer, and reserving the second functional film layer within the range of the first film layer punching and the second film layer punching by referring to the inner contour line to form a second functional film layer structure to be attached;
S470: performing alignment lamination on one surface of the second adhesive layer to be laminated with the second functional film layer to be laminated with the second adhesive layer structure, and tearing off the second adhesive layer micro-adhesive film and the second adhesive layer first protective film; forming a film layer attaching structure to be subjected to a second function;
S480: and (3) attaching the second functional film layer to one surface of the second adhesive layer of the structure to be attached to the board to be processed in an alignment manner, and tearing off the second functional film layer micro-adhesive film.
10. The method of manufacturing a high-precision flexible circuit board according to claim 1, wherein the molding is a die-cut molding with reference to the outer contour line and the contour line of the plug flexible board region.
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