CN211744839U

CN211744839U - Flexible circuit board

Info

Publication number: CN211744839U
Application number: CN201922394214.2U
Authority: CN
Inventors: 陈国辉
Original assignee: AAC Technologies Pte Ltd
Current assignee: AAC Technologies Pte Ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-10-23
Anticipated expiration: 2029-12-26

Abstract

The utility model provides a flexible circuit board, it includes the board body and reinforcement layer, the board body includes die-cut district and treats the reinforcement district, the reinforcement layer sets up in treating the reinforcement district, treat that the reinforcement district includes first section, second section and third section, the distance of definition die-cut district to second section is first distance of contracting, the distance of outer peripheral edge to second section of definition board body is second distance of contracting, the distance that causes die-cut appearance to shift to first section when the definition forms the die-cut district by die-cut processing technology is first skew distance, the distance that causes die-cut appearance to shift to third section when the definition forms the outer peripheral edge of board body by die-cut processing technology is second skew distance, first distance of contracting is greater than first skew distance, second distance of contracting is greater than second skew distance; the reinforcing layer is disposed on the second segment. Compared with the prior art, the utility model discloses a flexible line way board is favorable to reinforcing layer and this combination back die-cut shaping to produce the broken filament few and assemble the reliability high.

Description

Flexible circuit board

[ technical field ] A method for producing a semiconductor device

The utility model relates to a circuit board technical field especially relates to a flexible line way board.

[ background of the invention ]

As electronic products are used more and more widely. At present, flexible wiring boards in electronic products are an important part thereof.

The related art flexible printed circuit includes a board body and a reinforcing layer attached to the board body.

However, the board body and the reinforcing layer in the flexible printed circuit board of the related art are the same as the boundary of the steel film punching shape at the boundary of the reinforcing region, because the material of the board body and the reinforcing layer and the structure of the board body and the reinforcing layer which are stacked together easily generate broken filaments during punching, which affects the assembly structure.

Therefore, it is necessary to provide a new flexible circuit board to solve the above technical problems.

[ Utility model ] content

An object of the utility model is to provide a be favorable to reinforcing layer and this flexible line way board that the broken filament that the die-cut shaping produced after combining is few and the equipment reliability is high.

In order to achieve the above object, the utility model provides a flexible circuit board, it includes that it includes the board body and the laminating is fixed in strengthening layer on the board body, the board body including be used for die-cut processing die-cut district and by the district is strengthened to treating that the die-cut district extends, strengthening layer set up in treat in the district of strengthening, treat the district of strengthening include with the first section that the die-cut district is connected, by the first section is to keeping away from the second section that the die-cut district direction extends and by the second section is to keeping away from the third section that the first section extends, the third section is kept away from the periphery of second section one side does the outer peripheral edge of board body, definition die-cut district extremely the distance of second section is first distance that contracts, definition the outer peripheral edge of board body extremely the distance of second section is second distance that contracts, and the definition is formed by die-cut zone time processing technology die-cut causes die-cut appearance to shift to the distance in the first section is first distance that offsets Defining a distance which causes the deviation of the punching shape to the third section when the outer periphery of the plate body is punched and formed by a punching processing technology as a second deviation distance, wherein the first inward shrinkage distance is greater than the first deviation distance, and the second inward shrinkage distance is greater than the second deviation distance; the reinforcing layer is disposed on the second section.

Preferably, the reinforcing layer is made of any one or a combination of more of polyimide and a glass fiber epoxy resin copper-clad plate.

Preferably, the board body is any one of a single-sided board, a double-sided board, a pure copper board, a single plus single board and a multilayer board.

Preferably, in the offset range that laminating processing technology caused, the width of second section satisfies the reinforcement layer laminating is fixed in the reinforcement design requirement of board body, the reinforcement design requirement includes intensity requirement, processing design requirement and the requirement of back assembly standard.

Preferably, the local area of the region to be reinforced is outside the range of the design requirement of reinforcement, the first retraction distance of the local area is smaller than the first retraction distances of other areas, and the width of the second section of the local area meets the strength index of the plate body, to which the reinforcing layer is attached and fixed.

Preferably, a local area of the area to be reinforced is outside the range of the design requirement of reinforcement, a second retraction distance of the local area is smaller than second retraction distances of other areas, and the width of the second section of the local area meets the strength index of the plate body, to which the reinforcing layer is attached and fixed.

Compared with the prior art, the utility model discloses a flexible line way board through wait that the reinforcement district marks off have first interior shrink distance first section, be used for pasting the second section of establishing fixed strengthening layer and have the second third section of shrink distance in to make first interior shrink distance be greater than first skew distance, the second is shrunk distance and is greater than second skew distance, wherein, defines die-cut district extremely the distance of second section is first interior shrink distance, defines the outer peripheral edges of board body extremely the distance of second section contracts distance in for the second, and the definition is by the die-cut formation of die-cut processing technology cause die-cut appearance skew extremely when die-cut district distance in first section is first skew distance, and the definition is by the die-cut formation of die-cut processing technology cause die-cut appearance skew extremely when the outer peripheral edges of board body distance in the third section is second skew distance. That is to say, make the stiffening layer internal contraction, make the die-cut of steel mould only fall on the board body to avoid producing the broken filament when die-cut because of the material of stiffening layer and the board body two and the structure that these two are folded and are established among the correlation technique, the broken filament that die-cut shaping produced is few and the equipment reliability is high.

[ description of the drawings ]

Fig. 1 is a schematic structural view of the flexible circuit board of the present invention;

fig. 2 is a schematic structural diagram of a first embodiment of the flexible printed circuit of the present invention;

fig. 3 is a schematic structural diagram of a second embodiment of the flexible printed circuit of the present invention.

[ detailed description ] embodiments

The present invention will be further explained with reference to the drawings and the embodiments.

Referring to fig. 1-3, the present invention provides a flexible printed circuit 100, wherein the flexible printed circuit 100 includes a board body 1 and a reinforcing layer 2 attached and fixed on the board body 1.

The board body 1 is any one of a single-sided board, a double-sided board, a pure copper board, a single plus single board and a multilayer board. Specifically, the plate body 1 includes a blanking region 11 and a region to be reinforced 12.

The blanking areas 11 are used for the blanking process.

The region to be reinforced 12 is formed by extending the blanking region 11. The reinforcing layer 2 is disposed in the region to be reinforced 12.

Specifically, the region to be reinforced 12 includes a first section 121, a second section 122, and a third section 123. The first segment 121 is connected to the blanking region 11.

The second segment 122 is formed by the first segment 121 extending away from the blanking region 11. The stiffening layer 2 is disposed on the second segment 122.

The third segment 123 extends from the second segment 122 away from the first segment 121. The periphery of the third section 123 far away from the second section 122 is the outer periphery of the plate body 1.

The distance from the blanking area 11 to the second section 122 is defined as a first retraction distance a. The first offset distance d1 is defined as the distance that causes the die cut profile to be offset into the first segment 121 when the die cut region 11 is die cut by the die cutting process. The first retraction distance a is greater than the first offset distance d 1. That is, the second segment 122 (i.e., the region where the reinforcing layer 2 is bonded and fixed) has a gap from the die-cut outline (i.e., the first offset distance d 1). This structure has guaranteed when die-cut, and the position of die-cut appearance skew only falls first section 121, and can not fall second section 122 to make die-cut only fall board body 1, rather than falling the stiffening layer 2 with the region is established in folding of board body 1, thereby reduces and avoids producing the broken filament when die-cut because of the material of stiffening layer and board body two and these two fold the structure of establishing in the correlation technique, and the broken filament that die-cut shaping produced is few and the equipment reliability is high.

The distance from the outer periphery of the plate body 1 to the second section 122 is defined as a second retraction distance b. The second offset distance d2 is defined as the distance that causes the die-cut profile to be offset into the third section 123 when the outer peripheral edge of the sheet body 1 is die-cut and formed by the die-cutting process. The second retraction distance b is greater than the second offset distance d 2. The third section 123 is arranged in the same way as the first section 121, and the structure ensures that the position of the deviation of the punching appearance only falls on the third section 123 and cannot fall on the second section 122 during punching, so that the punching only falls on the plate body 1 instead of the overlapping area of the reinforcing layer 2 and the plate body 1, thereby reducing the generation of broken filaments during punching due to the material quality of the reinforcing layer and the plate body and the overlapping structure of the reinforcing layer and the plate body in the related technology, and reducing the generation of broken filaments during punching and having high assembling reliability.

The design size of the first retraction distance a needs to consider the fitting offset dimension of the reinforcing layer 2 fitted and fixed to the second section 122, in addition to the factor of the first offset distance d 1. Similarly, the design size of the second retraction distance b also needs to consider the fitting offset dimension of the reinforcing layer 2 fitted and fixed to the second section 122, in addition to the factor of the second offset distance d 2. Specifically, in the offset range caused by the laminating process, the width of the second section 122 meets the reinforcing design requirement that the reinforcing layer 2 is laminated and fixed on the plate body 1. The reinforcement design requirements comprise strength requirements, processing design requirements and subsequent assembly standard requirements. The width here refers to the distance of the second section 122 from one side to the opposite side in the direction from the blanking area 11 to the first section 121.

Of course, if the first section 121 is retracted inward all around to affect the strength of the overlapped region (i.e., the reinforcement region) between the reinforcement layer 2 and the plate body 1 or to affect the processing design of reinforcement, the first section may be partially retracted as follows. Specifically, the local area of the region to be reinforced 12 is outside the range of the reinforcement design requirement, that is, if the local area of the region to be reinforced 12 cannot satisfy the reinforcement design requirement, the first retraction distance a of the first section 121 set for the local area is smaller than the first retraction distance a of the other areas, and the width of the second section 122 of the local area satisfies the strength index of the reinforcing layer 2 attached and fixed to the plate body 1. Similarly, the second retraction distance b of the third segment 123 provided in the local region is smaller than the second retraction distance b of the other regions, and the width of the second segment 122 in the local region satisfies the strength index of the reinforcing layer 2 attached and fixed to the panel body 1.

Factors to be considered in practical operation are:

1. the area of the reinforcing layer 2 with the effective local retraction position does not affect the strength of the plate body 1.

2. The partial first retraction distance takes into account the reinforcement biasing capability and the mold forming biasing capability.

3. The size of the formed broken filament is required to meet the range of the standard of the subsequent assembly.

In this embodiment, the reinforcing layer 2 is made of any one or a combination of several of polyimide and glass fiber epoxy resin copper clad laminate.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.

Claims

1. A flexible circuit board comprises a board body and a reinforcing layer which is attached and fixed on the board body, wherein the board body comprises a punching area for punching and machining and a to-be-reinforced area extending from the punching area, the reinforcing layer is arranged in the to-be-reinforced area, the reinforcing layer is characterized in that the to-be-reinforced area comprises a first section connected with the punching area, a second section extending from the first section in a direction away from the punching area and a third section extending from the second section in a direction away from the first section, the periphery of one side of the third section away from the second section is the outer periphery of the board body, the distance from the punching area to the second section is defined as a first inward shrinkage distance, the distance from the outer periphery of the board body to the second section is defined as a second inward shrinkage distance, and the distance from the punching appearance to the first section when the punching area is formed by punching and machining technology is defined as a first offset distance, defining a distance which causes the punching appearance to be deviated into the third section when the outer peripheral edge of the plate body is punched and formed by a punching processing technology as a second deviation distance, wherein the first inward shrinkage distance is greater than the first deviation distance, and the second inward shrinkage distance is greater than the second deviation distance; the reinforcing layer is disposed on the second section.

2. The flexible circuit board of claim 1, wherein the reinforcing layer is made of any one or a combination of polyimide and glass fiber epoxy resin copper clad laminate.

3. The flexible circuit board of claim 1, wherein the board body is any one of a single-sided board, a double-sided board, a pure copper board, a single plus single board, and a multi-layer board.

4. The flexible circuit board of claim 1, wherein the width of the second section meets the design requirement of the reinforcement layer fixed to the board body in the offset range caused by the bonding process, and the design requirement of the reinforcement includes the strength requirement, the processing design requirement and the post-assembly standard requirement.

5. The flexible printed circuit board of claim 4, wherein a local area of the region to be reinforced is outside the range of the design requirement for reinforcement, a first retraction distance of the local area is smaller than the first retraction distances of other areas, and a width of the second section of the local area satisfies the strength index of the plate body to which the reinforcing layer is attached and fixed.

6. The flexible printed circuit board according to claim 4, wherein a local area of the region to be reinforced is outside the range of the design requirement for reinforcement, a second retraction distance of the local area is smaller than the second retraction distances of other areas, and a width of the second section of the local area satisfies the strength index of the plate body to which the reinforcing layer is attached and fixed.