CN104219900A - Rigid-flexible printed circuit board and method for manufacturing same - Google Patents
Rigid-flexible printed circuit board and method for manufacturing same Download PDFInfo
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- CN104219900A CN104219900A CN201310215178.3A CN201310215178A CN104219900A CN 104219900 A CN104219900 A CN 104219900A CN 201310215178 A CN201310215178 A CN 201310215178A CN 104219900 A CN104219900 A CN 104219900A
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- hole
- prepreg
- soft board
- rigid flex
- copper foil
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Abstract
The invention discloses a method for manufacturing a rigid-flexible printed circuit board. The method includes providing a flexible printed circuit board, copper foils and a prepreg; forming hollow-out patterns and first through holes inside the prepreg; performing press-fit on the flexible printed circuit board, the copper foils and the prepreg to form a rigid-flexible printed circuit board body; forming second through holes in the flexible printed circuit board and the copper foils; cleaning the first through holes and the second through holes and forming auxiliary holes in the rigid-flexible printed circuit board body. The flexible printed circuit board is provided with circuit patterns. The hollow-out patterns and the first through holes correspond to the circuit patterns of the flexible printed circuit board. The second through holes correspond to the first through holes of the prepreg. The sectional areas of the second through holes are smaller than the sectional areas of the first through holes along the directions parallel to fitting planes of the prepreg and the flexible printed circuit board or the copper foils, and the sectional centers of the second through holes coincide with the sectional centers of the first through holes along the directions parallel to the fitting planes of the prepreg and the flexible printed circuit board or the copper foils. The method has the advantages that the inner walls of the auxiliary holes of the rigid-flexible printed circuit board formed by the aid of the method are free of burrs, and accordingly the rigid-flexible printed circuit board is high in yield and competitiveness.
Description
Technical field
The invention belongs to field of liquid crystal, particularly relate to a kind of Rigid Flex and preparation method thereof.
Background technology
Industry, Medical Devices, 3G mobile, LCD TV and other consumer electronics are as the continuous expansion of the portable electronics market demand such as hard disk drive, floppy disk, mobile phone, notebook computer, camera, video camera, PDA of electronic computer, and electronic equipment is more and more towards light, thin, short, the little and future development of multifunction.The particularly application of the flexible board of high density interconnection structure, greatly drive the fast development of flexible printed circuit technology, simultaneously along with development and the raising of printed circuit technique, Rigid Flex (Rigid-Flex PCB, be called for short RF-PCB) developmental research more and more come into one's own, meanwhile, because Rigid Flex has good durability and flexibility, also make it be more suitable for medical treatment to apply with military field, make the Production and application of RF-PCB more and more extensive.
The manufacture method of existing Rigid Flex comprises soft board and makes, and hardboard makes, rigid-flex pressing and boring etc.Concrete, described soft board makes the soft board formed and has certain circuitous pattern; Described hardboard makes and comprises prepreg making and Copper Foil making, and wherein prepreg makes and can form the hollow out figure corresponding with the circuitous pattern of soft board in prepreg; Form Rigid Flex after described rigid-flex pressing, described Rigid Flex comprises Copper Foil, soft board and the prepreg between Copper Foil and soft board; And described drilling operation needs to run through the Copper Foil of described Rigid Flex, soft board and prepreg, to form in subsequent fabrication process the fabrication hole needing to use in described Rigid Flex.
But the yields applying the Rigid Flex that existing manufacture method makes is lower.
Summary of the invention
In view of this, the invention provides a kind of Rigid Flex and preparation method thereof, the manufacture method of this kind of Rigid Flex can improve the yields of Rigid Flex.
For achieving the above object, following technical scheme is embodiments provided:
A manufacture method for Rigid Flex, comprising: provide soft board, Copper Foil and prepreg, and wherein, described soft board has circuitous pattern; The hollow out figure corresponding with the circuitous pattern of described soft board and the first through hole is formed in prepreg; Soft board, Copper Foil and prepreg are carried out pressing, forms Rigid Flex; The position corresponding with the first through hole of described prepreg with Copper Foil at described soft board forms the second through hole, wherein, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the sectional area of described second through hole is less than the sectional area of described first through hole, and the kernel of section of described second through hole overlaps with the kernel of section of described first through hole; To described first through hole and the cleaning of the second through hole, formation process hole in Rigid Flex.
Preferably, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the cross section of described first through hole and described second through hole is circular cross-section.
Preferably, the difference range of the radius of the radius of the circular cross-section of described first through hole and the circular cross-section of described second through hole is 0.8mm ~ 1.5mm, comprises endpoint value.
Preferably, described prepreg is low gummosis amount prepreg.
Preferably, the gummosis amount of described low gummosis amount prepreg is less than or equal to 0.8mm.
A kind of Rigid Flex made according to above-mentioned manufacture method, comprise soft board, Copper Foil and the prepreg between described soft board and Copper Foil, wherein, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the area of section of the soft board of described Rigid Flex and the second through hole of Copper Foil is less than the area of section of the first through hole of the prepreg corresponding with it.
Compared with prior art, the embodiment of the present invention has the following advantages:
The manufacture method of Rigid Flex provided by the invention, before soft board, Copper Foil and prepreg are carried out pressing, first the first through hole can be formed in prepreg, then after soft board, Copper Foil and prepreg are carried out pressing, then the second through hole is formed in the position that described soft board is corresponding with the first through hole of described prepreg with Copper Foil.In the process, when described soft board and Copper Foil form the second through hole, the position that second through hole of the prepreg between described soft board and Copper Foil and described soft board and Copper Foil is corresponding has been formed with the first through hole, and to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the sectional area of described second through hole is less than the sectional area of described first through hole, the kernel of section of described second through hole overlaps with the kernel of section of described first through hole, therefore when described soft board and Copper Foil form the second through hole, without the need to operating prepreg again, avoid forming burr in prepreg.Simultaneously, area of section due to described second through hole is less than the area of section of described first through hole, also namely because the edge of the edge of the first through hole of described prepreg and the second through hole of described soft board and Copper Foil has certain distance, therefore also can not impact the edge of described prepreg in the process that soft board and Copper Foil form the second through hole, avoid the inward flange of the second through hole of prepreg to occur burr further.
Second through hole of the first through hole in described prepreg and described soft board and Copper Foil constitutes the fabrication hole of described Rigid Flex.Therefore the inwall of the fabrication hole of this kind of Rigid Flex can not exist burr, eliminates the possibility occurring dust in follow-up processing procedure, improve the yields of Rigid Flex, strengthen the product competitiveness of Rigid Flex.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the manufacture method of a kind of Rigid Flex provided by the invention;
Fig. 2 to Fig. 5 is the schematic diagram of each step of the manufacture method of a kind of Rigid Flex provided by the invention;
Fig. 6 is the profile of a kind of Rigid Flex provided by the invention.
Embodiment
As made in the background art, the yields of the Rigid Flex of existing manufacture method making is lower.
Inventor finds after deliberation, make in the process of Rigid Flex in the existing Rigid Flex manufacture method of application, when holing to the Rigid Flex after pressing, because comprise prepreg in the Rigid Flex after pressing, and prepreg is made up of the material such as glass fibre and epoxy resin, therefore the restriction of material character due to glass fibre and epoxy resin, described Rigid Flex is when holing, described prepreg easily produces burr, and also namely the hole wall of the fabrication hole of described Rigid Flex easily produces burr.Rigid Flex fabrication hole inwall being existed to burr carries out in the process of subsequent operation, burr in described fabrication hole can come off generation dust, and dust can affect the successive process of Rigid Flex, cause the yields of Rigid Flex Related product lower, reduce the product competitiveness of Rigid Flex Related product.
For CCM camera module, if in the making early stage of CCM camera module, Rigid Flex in integrated circuit can produce dust, so in follow-up manufacturing process, dust just may enter module internal, and then can on photosensitive IC residual fraction dust, make the image that exports at camera module produces have the stain of black, affect the image quality of CCM camera module.
For these reasons, the invention discloses a kind of manufacture method of Rigid Flex, comprising: provide soft board, Copper Foil and prepreg, wherein, described soft board has circuitous pattern; The hollow out figure corresponding with the circuitous pattern of described soft board and the first through hole is formed in prepreg; Soft board, Copper Foil and prepreg are carried out pressing, forms Rigid Flex; The position corresponding with the first through hole of described prepreg with Copper Foil at described soft board forms the second through hole, wherein, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the sectional area of described second through hole is less than the sectional area of described first through hole, and the kernel of section of described second through hole overlaps with the kernel of section of described first through hole; To described first through hole and the cleaning of the second through hole, formation process hole in Rigid Flex.
The manufacture method of corresponding above-mentioned Rigid Flex, present invention also offers a kind of Rigid Flex, described Rigid Flex comprises soft board, Copper Foil and the prepreg between described soft board and Copper Foil, wherein, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the area of section of the soft board of described Rigid Flex and the second through hole of Copper Foil is less than the area of section of the first through hole of the prepreg corresponding with it.
The manufacture method of this kind of Rigid Flex is before carrying out pressing, first is windowed in the position of the corresponding fabrication hole of prepreg, avoid follow-up when formation process hole, to the operation of prepreg, avoid the inward flange of prepreg to produce burr, be also, no longer there is burr in the inwall of the fabrication hole of this kind of manufacture method formation, eliminate the possibility occurring dust in follow-up processing procedure, improve the yields of Rigid Flex Related product, improve the product competitiveness of Rigid Flex Related product.
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when describing the embodiment of the present invention in detail; for ease of explanation; represent that the plane graph of device shape can be disobeyed general ratio and be made partial enlargement, and described schematic diagram is example, it should not limit the scope of protection of the invention at this.In addition, the three-dimensional space of length, width and the degree of depth should be comprised in actual fabrication.
Below in conjunction with accompanying drawing, Rigid Flex provided by the invention and preparation method thereof is specifically described.
Embodiment one
Present embodiments provide a kind of manufacture method of Rigid Flex, as shown in Figure 1, comprise the following steps:
Step 101: provide soft board, Copper Foil and prepreg, wherein, described soft board has circuitous pattern.
Described Copper Foil is the stock that conductive pattern is formed.
Described soft board, also claims central layer (CORE), is the skeleton of wiring board.Structure comprises the two-sided plank being coated with layers of copper, namely can be used for the double sided board that internal layer makes.
Described prepreg (Prepreg, be called for short PP sheet) be that Rigid Flex makes indispensable material, for the Rigid Flex comprising multiple soft board, described prepreg is the adhesive between adjacent soft board, plays the effect of insulating barrier simultaneously.Described prepreg is primarily of resin material and glass fibre composition, prepreg can soften under the condition of heating pressurization, solidification can be reacted after cooling, the ruckbildung of corresponding prepreg under heating pressurized conditions, introduce the concept of gummosis amount, the gummosis amount of described prepreg refers to that prepreg is when the condition pressing of HTHP, the size of prepreg softening transform.For the manufacture method of Rigid Flex provided by the invention, the prepreg of described Rigid Flex is preferably low gummosis amount prepreg, and preferred, the gummosis amount of described low gummosis amount prepreg is less than or equal to 0.8mm.
Step 102: as shown in Figure 2, forms the hollow out figure 207 corresponding with the circuitous pattern 205 of described soft board 201 and the first through hole 206 in prepreg 202.
Take Rigid Flex as reference, Rigid Flex comprises soft board 201, Copper Foil 203, prepreg 202 between described soft board 201 and Copper Foil 203 and runs through the fabrication hole 204 of described Rigid Flex, and wherein said soft board 201 has circuitous pattern 205.Before formation Rigid Flex, first this step forms the hollow out figure 207 corresponding with the circuitous pattern 205 of described soft board 201 and first through hole 206 corresponding with the fabrication hole 204 of described Rigid Flex in described prepreg 202.
For the hollow out figure 207 that described prepreg 202 is corresponding with the circuitous pattern 205 of described soft board 201, because described prepreg 202 is insulating barriers that in Rigid Flex, hardboard part increases the number of plies, and because prepreg 202 is hard material after solidifying, so, in order to retain the flexibility of the soft board 201 with circuitous pattern 205, must window in the region corresponding with the circuitous pattern 205 of described soft board 201 to prepreg 202, avoid described in later stage pressing when soft board 201 and prepreg 202, semi-solid preparation 202 is bonded together with the soft board 201 with circuitous pattern 205.
For described first through hole 206, the process forming described first through hole 206 in prepreg 202 comprises: according to the design configuration of described Rigid Flex, the predeterminated position of the fabrication hole 204 of corresponding described Rigid Flex and default cross-sectional area S
0the first through hole 206 is formed in prepreg 202, the described position of the first through hole 206 is corresponding with the predeterminated position of the fabrication hole 204 of described Rigid Flex, and to fit the direction of plane along being parallel to described prepreg 202 and described soft board 201 or Copper Foil 203, the sectional area S of described first through hole 206
1be greater than the sectional area S of described soft or hard in conjunction with the fabrication hole 204 of board
0.
Fabrication hole 204 due to Rigid Flex is mainly used in being fixed the position of Rigid Flex, avoids Rigid Flex to produce unnecessary displacement at subsequent fabrication process, affects the accuracy of other manufacture crafts.Therefore, described fabrication hole 204 is generally positioned at the surrounding of Rigid Flex, its particular location, shape and cross-sectional area can sets itself as required, therefore be corresponding with the fabrication hole 204 of Rigid Flex at the first through hole 206 of described prepreg 202, and meet the sectional area S of described first through hole 206
1be greater than the sectional area S of described soft or hard in conjunction with the fabrication hole 204 of board
0prerequisite under, the present invention is not construed as limiting the shape of described fabrication hole 204 and the first through hole 206 and cross-sectional area.
For convenience of description, the present invention is for fabrication hole as shown in Figure 2, and described fabrication hole 204 is positioned at four angles of Rigid Flex, and the cross section of described fabrication hole 204 is circular, and the radius of circular fabrication hole is a, and cross-sectional area is S
0.
It should be noted that, determine that the radius b of the first through hole 206 of described prepreg 202 needs consideration two point: the via hole effect first needing to consider Rigid Flex.Via hole is the hole that Rigid Flex needs to use aborning, be mainly used for the effects such as film location, test position fix, if that is designed by the radius b of the first through hole 206 of prepreg is excessive, only remaining PI layer and Copper Foil in the lamination of so via hole of Rigid Flex, the undercapacity of via hole, the event resolves of via hole can be caused, affect the follow-up making of Rigid Flex.Next needs the gummosis amount considering prepreg, owing to by the process of soft board, Copper Foil and prepreg pressing being the course of reaction of a HTHP, in bonding processes, semi-solid preparation sector-meeting softening transform, if the difference of the radius a of the radius b of the first through hole 206 and the fabrication hole 204 of Rigid Flex is too small, described in the Edge Distance of also i.e. described first through hole 206, the edge of fabrication hole 204 is nearer, have the softening prepreg of part after prepreg softening transform to flow in the fabrication hole 204 of Rigid Flex, affect the successive process of Rigid Flex.
In sum, the gummosis amount that corresponding the present embodiment provides is less than or equal to the prepreg of 0.8mm, preferably, the difference range of the radius b of the first through hole 206 of described prepreg 202 and the radius a of the fabrication hole 204 of described Rigid Flex is between 0.8mm ~ 1.5mm, comprise endpoint value, also namely the radius b of the first through hole and the radius a of fabrication hole meets relational expression 0.8mm≤b-a≤1.5mm.
Step 103, as shown in Figure 3, carries out pressing by soft board, Copper Foil and prepreg, forms Rigid Flex.Rigid Flex described in Fig. 3 along aa' direction profile as shown in Figure 4, comprise soft board 201, Copper Foil 203 and prepreg 202 between described soft board 201 and Copper Foil 203, wherein, in described prepreg, be formed with the first through hole 206.
, by means of the viscosity of prepreg 202, each sandwich circuit is bonded to overall process by the process that soft board 201, Copper Foil 203 and the prepreg 202 that is formed with through hole 206 carry out pressing, this bonding be by molecule large on interface between phase counterdiffusion, infiltration, and then produce and be interweaved and realize, concrete, the sandwich construction folded is sent into vacuum hotpressing machine, then the heat energy that machinery provides is utilized, the resin material in prepreg is made to be molten condition, so as to bonding Copper Foil and soft board.
Step 104: form the second through hole 208 at described soft board 201 and Copper Foil 203 position corresponding with the first through hole 206 of described prepreg 202, wherein, to fit the direction of plane along being parallel to described prepreg 202 and described soft board 201 or Copper Foil 203, the sectional area S of described second through hole 208
2be less than the sectional area S of described first through hole 206
1, equal the fabrication hole radius S of described Rigid Flex
0, and the kernel of section of described second through hole 208 overlaps with the kernel of section of described first through hole 206.
Step 105: described first through hole 206 and the second through hole 208 are cleaned, formation process hole 205 in Rigid Flex.
Second through hole 208 and first through hole 206 of described prepreg 202 of described soft board 201 and Copper Foil 203 form the fabrication hole 205 of Rigid Flex, and also, the profile of the final Rigid Flex with fabrication hole 205 formed as shown in Figure 5.
As shown in Figure 5, the second through hole 208 is formed in described soft board 201 and described Copper Foil 203, in the process in also final formation process hole 205, the position corresponding to described fabrication hole 205 due to described prepreg 202 has been formed with the first through hole 206, so time without the need to operating prepreg 202, only need form the second through hole 208 specifying shape Copper Foil 203 and soft board 201 in.And the second through hole 208 area of section S owing to being formed in Copper Foil 203 and soft board 201
2be less than the area of section S of the first through hole 206 in prepreg 202
1also namely because the edge of the first through hole 206 of described prepreg and the edge of described second through hole 208 have certain distance, therefore the process forming the second through hole 208 in described soft board 201 and Copper Foil 203 can not impact the edge of the first through hole 206 in described prepreg 202.Also namely, in Rigid Flex formation process hole process in, the drilling operation not only without the need to being correlated with to prepreg, and the edge of described prepreg also can not by the impact of forming process in formation process hole.
Therefore no longer there is burr in the inwall of the fabrication hole of the manufacture method formation of this kind of Rigid Flex, eliminates the possibility occurring dust in follow-up processing procedure, improve the yields of Rigid Flex Related product, strengthen the product competitiveness of Rigid Flex Related product.
Embodiment two
Present embodiments provide a kind of Rigid Flex, as shown in Figure 6, this kind of Rigid Flex comprises soft board 601, Copper Foil 603 and the prepreg 602 between described soft board 601 and Copper Foil 603, wherein, to fit the direction of plane along being parallel to described prepreg 602 and described soft board 601 or Copper Foil 603, the area of section S of the soft board 601 of described Rigid Flex and the second through hole 604 of Copper Foil 603
2(be also the area of section S of the fabrication hole of Rigid Flex
0) be less than the area of section S of the first through hole 605 of the prepreg 602 corresponding with it
1.No longer there is burr in the inwall of the fabrication hole of this kind of Rigid Flex, the yields of Rigid Flex is higher, and product competitiveness is stronger.
The above embodiment is only preferred embodiment of the present invention, not does any pro forma restriction to the present invention.
Although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention.Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. a manufacture method for Rigid Flex, is characterized in that, comprising:
There is provided soft board, Copper Foil and prepreg, wherein, described soft board has circuitous pattern;
The hollow out figure corresponding with the circuitous pattern of described soft board and the first through hole is formed in prepreg;
Soft board, Copper Foil and prepreg are carried out pressing, forms Rigid Flex;
The position corresponding with the first through hole of described prepreg with Copper Foil at described soft board forms the second through hole, wherein, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the sectional area of described second through hole is less than the sectional area of described first through hole, and the kernel of section of described second through hole overlaps with the kernel of section of described first through hole;
To described first through hole and the cleaning of the second through hole, formation process hole in Rigid Flex.
2. manufacture method according to claim 1, is characterized in that, along the direction being parallel to the plane that described prepreg and described soft board or Copper Foil are fitted, the cross section of described first through hole and described second through hole is circular cross-section.
3. manufacture method according to claim 2, is characterized in that, the difference range of the radius of the radius of the circular cross-section of described first through hole and the circular cross-section of described second through hole is 0.8mm ~ 1.5mm, comprises endpoint value.
4. manufacture method according to claim 1, is characterized in that, described prepreg is low gummosis amount prepreg.
5. manufacture method according to claim 4, is characterized in that, the gummosis amount of described low gummosis amount prepreg is less than or equal to 0.8mm.
6. the Rigid Flex made according to the manufacture method described in claim 1 to 5, it is characterized in that, described Rigid Flex comprises soft board, Copper Foil and the prepreg between described soft board and Copper Foil, wherein, to fit the direction of plane along being parallel to described prepreg and described soft board or Copper Foil, the area of section of the soft board of described Rigid Flex and the second through hole of Copper Foil is less than the area of section of the first through hole of the prepreg corresponding with it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310215178.3A CN104219900A (en) | 2013-05-31 | 2013-05-31 | Rigid-flexible printed circuit board and method for manufacturing same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310215178.3A CN104219900A (en) | 2013-05-31 | 2013-05-31 | Rigid-flexible printed circuit board and method for manufacturing same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682382A (en) * | 2016-03-30 | 2016-06-15 | 高德（无锡）电子有限公司 | High-glass temperature rigid-flex board containing copper-free substrate layer and glue removing process of rigid-flex board |
| CN105704908A (en) * | 2016-02-25 | 2016-06-22 | 广东欧珀移动通信有限公司 | Mobile terminal, soft or hard combined plate and manufacturing method thereof |
| CN110248472A (en) * | 2019-05-20 | 2019-09-17 | 南亚电路板（昆山）有限公司 | A kind of circuit board machining process |
| CN111343790A (en) * | 2020-03-09 | 2020-06-26 | 四川锐宏电子科技有限公司 | PCB soft and hard combination process |
-
2013
- 2013-05-31 CN CN201310215178.3A patent/CN104219900A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704908A (en) * | 2016-02-25 | 2016-06-22 | 广东欧珀移动通信有限公司 | Mobile terminal, soft or hard combined plate and manufacturing method thereof |
| CN105704908B (en) * | 2016-02-25 | 2018-01-19 | 广东欧珀移动通信有限公司 | Mobile terminal, Rigid Flex and its manufacture method |
| CN105682382A (en) * | 2016-03-30 | 2016-06-15 | 高德（无锡）电子有限公司 | High-glass temperature rigid-flex board containing copper-free substrate layer and glue removing process of rigid-flex board |
| CN105682382B (en) * | 2016-03-30 | 2019-02-12 | 高德（无锡）电子有限公司 | It is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its remove adhesive process |
| CN110248472A (en) * | 2019-05-20 | 2019-09-17 | 南亚电路板（昆山）有限公司 | A kind of circuit board machining process |
| CN111343790A (en) * | 2020-03-09 | 2020-06-26 | 四川锐宏电子科技有限公司 | PCB soft and hard combination process |
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Application publication date: 20141217 |