CN102791086A - Manufacturing method of rigid-flexible combined circuit board - Google Patents
Manufacturing method of rigid-flexible combined circuit board Download PDFInfo
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- CN102791086A CN102791086A CN2012102877339A CN201210287733A CN102791086A CN 102791086 A CN102791086 A CN 102791086A CN 2012102877339 A CN2012102877339 A CN 2012102877339A CN 201210287733 A CN201210287733 A CN 201210287733A CN 102791086 A CN102791086 A CN 102791086A
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- combined circuit
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Abstract
The invention provides a manufacturing method of a rigid-flexible combined circuit board, comprising the following steps of: step 1, providing a rigid-flexible combined substrate, wherein the rigid-flexible combined substrate comprises a flexible plate layer basic film, rigid plate layer glass fiber cloth adhered to the flexible plate layer basic film, an adhesive layer arranged between the flexible plate layer basic film and the rigid plate layer glass fiber cloth, and two copper coil layers which are respectively arranged on the surface of the flexible plate layer basic film, which is far away from the surface of the rigid plate layer glass fiber cloth, and on the surface of the rigid plate layer glass fiber cloth, which is far away from the flexible plate layer basic film; step 2, drilling at a corresponding position of the rigid-flexible combined substrate and carrying out copper sinking plating on the inner wall of a drilled hole to communicate the copper foil layers at the two sides; step 3, respectively forming needed line patterns on the two copper foil layers according to the design; step 4, arranging protection layers on the surfaces of the two copper coil layers, which are provided with the line patterns, according to the requirements of a finished product of the rigid-flexible combined circuit board, so as to manufacture a rigid-flexible combined circuit board semi-finished product; and step 5, carrying out surface treatment and appearance machining on the rigid-flexible combined circuit board semi-finished product so as to manufacture the rigid-flexible combined circuit board finished product.
Description
Technical field
The present invention relates to the board production field, relate in particular to a kind of manufacture method of soft or hard combined circuit plate.
Background technology
Along with continuous advancement in technology; Functional requirement to electronic product is increasingly high; Also pay attention to very much short, little, light, thin simultaneously in appearance; The wiring board of multilayer integrated functionality is increasing for this reason is used, and especially Rigid Flex obtains swift and violent development in recent years, but also there is a lot of problems in present whole wiring board industry on the fabrication and processing of Rigid Flex; The big breakthrough of failing all the time of yield and performance, how the highly-efficient processing Rigid Flex has become at present stubborn problem the most for this reason.
The wiring board that comprises soft board conductive layer and hardboard conductive layer is Rigid Flex; Traditional Rigid Flex no matter the number of plies what produce and all need adopt simple soft board layer and hardboard layer to carry out follow-up compacting to form; Even two-layer Rigid Flex also must adopt soft board and hardboard to separate the way that material is suppressed then; High multilayer needs every range upon range of adding especially, and the production difficulty is very big, especially the soft or hard combination interface; Have bad phenomenon such as adhesion is bad, easy layering, production cost is high.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of soft or hard combined circuit plate, the procedure for producing that it has simplified soft or hard combined circuit plate has reduced production cost, and has promoted the overall performance of soft or hard combined circuit plate.
For realizing above-mentioned purpose, the present invention provides a kind of manufacture method of soft or hard combined circuit plate, and it may further comprise the steps:
Step 4, the surface that requires to have line pattern at two copper foil layers according to soft or hard combined circuit board finished product are provided with protective layer, make soft or hard combined circuit boards half-finished product;
Said soft or hard combines the soft board layer basement membrane of substrate to comprise polyimides (PI) film, polyester (PET) film, gather naphthalene ester (PEN) film and liquid crystal polymer (LCP) film.
The thickness of said soft board layer basement membrane is 10～100 μ m.
Said soft or hard combines the hardboard layer glass cloth of substrate to comprise 106,1080,2116,1500 and 7628 electron level glass cloth.
The thickness of said hardboard layer glass cloth is 0.03～0.2mm.
Said adhesive layer is epoxy resin layer or acrylate resin layer.
The thickness of said adhesive layer is 5～10 μ m.
Said copper foil layer comprises rolled copper foil and electrolytic copper foil, and the thickness of this copper foil layer is 5～70 μ m.
Said protective layer be pressed on copper foil layer have line pattern the surface diaphragm or be printed in the ink lay that copper foil layer has the surface of line pattern.
Said surface treatment is for handling the pad and the bare wire nickel gold surface that form on the copper foil layer, and said sharp processing is the processing of gong plate.
Beneficial effect of the present invention: the manufacture method of soft or hard combined circuit plate of the present invention; It combines the use of substrate through soft or hard; Make soft or hard combined circuit plate plate with the manufacturing process of double-sided PCB in the prior art; Thereby realize changing the overall performance of the manufacturing process of soft or hard combined circuit plate in the prior art, the cost of manufacture that reduces soft or hard combined circuit plate, the making flow process of optimizing soft or hard combined circuit plate, lifting soft or hard combined circuit plate, make reliability more secure.
In order further to understand characteristic of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide reference and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effect obvious.
In the accompanying drawing,
Fig. 1 is the flow chart of the manufacture method of soft or hard combined circuit plate of the present invention;
Fig. 2 is for making the structural representation in each stage of embodiment of soft or hard combined circuit plate with the manufacture method of soft or hard combined circuit plate of the present invention.
Embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
See also Fig. 1 and Fig. 2, the present invention provides a kind of manufacture method of soft or hard combined circuit plate, and it may further comprise the steps:
Said soft or hard combines substrate 20 can cut into suitable dimensions in advance, also can be through continuous web-like production of the prior art.
Said soft or hard combines the soft board layer basement membrane 22 of substrate 20 to comprise polyimides (PI) film, polyester (PET) film, gather naphthalene ester (PEN) film and liquid crystal polymer (LCP) film, and the thickness of this soft board layer basement membrane 22 is 10～100 μ m.Said soft or hard combines the hardboard layer glass cloth 24 of substrate 20 to comprise electron level glass cloth such as 106,1080,2116,1500 and 7628, and the thickness of this hardboard layer glass cloth 24 is 0.03～0.2mm.Said adhesive layer 26 is epoxy resin layer or acrylate resin layer etc., and the thickness of this adhesive layer 26 is 5～10 μ m.Said copper foil layer 28 comprises rolled copper foil and electrolytic copper foil, and the thickness of this copper foil layer 28 is 5～70 μ m.
The formation technology of this line pattern can be selected existing development and etch process for use.
Step 4, the surface that requires to have line pattern at two copper foil layers 28 according to soft or hard combined circuit board finished product are provided with protective layer 40, make soft or hard combined circuit boards half-finished product.
Said protective layer 40 for be pressed on copper foil layer 28 have line pattern the surface the diaphragm of holding window successfully or be printed in the ink lay that copper foil layer 28 has the surface of line pattern, with the protection circuit figure, also play insulating effect simultaneously.
Said surface treatment is that pad that forms on the copper foil layer 28 and bare wire nickel gold surface are handled, and said sharp processing is the processing of gong plate.
What deserves to be mentioned is that when needs were made the Rigid Flex of high multilayer, its product that can above-mentioned steps 3 makes was that substrate continues to do other layers, its concrete technology can be the technology of existing multilayer circuit board.
In sum; The manufacture method of soft or hard combined circuit plate of the present invention; It combines the use of substrate through soft or hard; Make soft or hard combined circuit plate plate with the manufacturing process of double-sided PCB in the prior art, thereby realize changing the overall performance of the manufacturing process of soft or hard combined circuit plate in the prior art, the cost of manufacture that reduces soft or hard combined circuit plate, the making flow process of optimizing soft or hard combined circuit plate, lifting soft or hard combined circuit plate, make reliability more secure.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of claim of the present invention.
Claims (10)
1. the manufacture method of a soft or hard combined circuit plate is characterized in that, may further comprise the steps:
Step 1, provide soft or hard to combine substrate, this soft or hard combine substrate comprise soft board layer basement membrane, fit in this soft board layer basement membrane hardboard layer glass cloth, be located at the adhesive layer between this soft board layer basement membrane and the hardboard layer glass cloth and be located at soft board layer basement membrane respectively away from hardboard layer glass cloth surface and hardboard layer glass cloth copper foil layer away from soft board layer membrane surface;
Step 2, combine on the substrate correspondence position to hole, and sink copper facing and then connection both sides copper foil layer for the boring inwall in soft or hard;
Step 3, on two copper foil layers, form needed line pattern according to design respectively;
Step 4, the surface that requires to have line pattern at two copper foil layers according to soft or hard combined circuit board finished product are provided with protective layer, make soft or hard combined circuit boards half-finished product;
Step 5, soft or hard combined circuit boards half-finished product is carried out surface treatment and sharp processing, and then make soft or hard combined circuit board finished product.
2. the manufacture method of soft or hard combined circuit plate as claimed in claim 1 is characterized in that, said soft or hard combines the soft board layer basement membrane of substrate to comprise polyimides (PI) film, polyester (PET) film, gather naphthalene ester (PEN) film and liquid crystal polymer (LCP) film.
3. the manufacture method of soft or hard combined circuit plate as claimed in claim 2 is characterized in that, the thickness of said soft board layer basement membrane is 10～100 μ m.
4. the manufacture method of soft or hard combined circuit plate as claimed in claim 1 is characterized in that, said soft or hard combines the hardboard layer glass cloth of substrate to comprise 106,1080,2116,1500 and 7628 electron level glass cloth.
5. the manufacture method of soft or hard combined circuit plate as claimed in claim 4 is characterized in that, the thickness of said hardboard layer glass cloth is 0.03～0.2mm.
6. the manufacture method of soft or hard combined circuit plate as claimed in claim 1 is characterized in that, said adhesive layer is epoxy resin layer or acrylate resin layer.
7. the manufacture method of soft or hard combined circuit plate as claimed in claim 6 is characterized in that, the thickness of said adhesive layer is 5～10 μ m.
8. the manufacture method of soft or hard combined circuit plate as claimed in claim 1 is characterized in that said copper foil layer comprises rolled copper foil and electrolytic copper foil, and the thickness of this copper foil layer is 5～70 μ m.
9. the manufacture method of soft or hard combined circuit plate as claimed in claim 8 is characterized in that, said protective layer be pressed on copper foil layer have line pattern the surface diaphragm or be printed in the ink lay that copper foil layer has the surface of line pattern.
10. the manufacture method of soft or hard combined circuit plate as claimed in claim 1 is characterized in that, said surface treatment is for handling the pad and the bare wire nickel gold surface that form on the copper foil layer, and said sharp processing is the processing of gong plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102877339A CN102791086A (en) | 2012-08-13 | 2012-08-13 | Manufacturing method of rigid-flexible combined circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102877339A CN102791086A (en) | 2012-08-13 | 2012-08-13 | Manufacturing method of rigid-flexible combined circuit board |
Publications (1)
| Publication Number | Publication Date |
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| CN102791086A true CN102791086A (en) | 2012-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102877339A Pending CN102791086A (en) | 2012-08-13 | 2012-08-13 | Manufacturing method of rigid-flexible combined circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491730A (en) * | 2013-07-25 | 2014-01-01 | 博罗县精汇电子科技有限公司 | Shape manufacturing method of soft and hard combined circuit board |
| WO2019090858A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Pin-free positioning processing method |
| CN112863353A (en) * | 2021-01-21 | 2021-05-28 | 深圳市伽弥科技有限公司 | Manufacturing method of flexible transparent screen |
| CN114390778A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Battery protection circuit board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10311510A1 (en) * | 2003-03-15 | 2004-09-23 | Deere & Company, Moline | Electrically nonconductive substrate and an electrically conductive coating useful in electronic and electrical technology |
| CN101296557A (en) * | 2007-04-23 | 2008-10-29 | 亚洲电材股份有限公司 | Flexible printing circuit board |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| CN102510660A (en) * | 2011-11-27 | 2012-06-20 | 常州市协和电路板有限公司 | Single-layer impedance printed circuit board and manufacturing method thereof |
-
2012
- 2012-08-13 CN CN2012102877339A patent/CN102791086A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10311510A1 (en) * | 2003-03-15 | 2004-09-23 | Deere & Company, Moline | Electrically nonconductive substrate and an electrically conductive coating useful in electronic and electrical technology |
| CN101296557A (en) * | 2007-04-23 | 2008-10-29 | 亚洲电材股份有限公司 | Flexible printing circuit board |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| CN102510660A (en) * | 2011-11-27 | 2012-06-20 | 常州市协和电路板有限公司 | Single-layer impedance printed circuit board and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491730A (en) * | 2013-07-25 | 2014-01-01 | 博罗县精汇电子科技有限公司 | Shape manufacturing method of soft and hard combined circuit board |
| WO2019090858A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Pin-free positioning processing method |
| CN114390778A (en) * | 2020-10-20 | 2022-04-22 | 深南电路股份有限公司 | Battery protection circuit board and manufacturing method thereof |
| CN112863353A (en) * | 2021-01-21 | 2021-05-28 | 深圳市伽弥科技有限公司 | Manufacturing method of flexible transparent screen |
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Application publication date: 20121121 |