CN105682382B - It is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its remove adhesive process - Google Patents
It is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its remove adhesive process Download PDFInfo
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- CN105682382B CN105682382B CN201610192412.9A CN201610192412A CN105682382B CN 105682382 B CN105682382 B CN 105682382B CN 201610192412 A CN201610192412 A CN 201610192412A CN 105682382 B CN105682382 B CN 105682382B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its except adhesive process, belongs to PCB chemical process technical field.It is followed successively by top layer copper foil, Dummy without copper base layer, copper foil base material, prepreg and bottom copper foil from top to bottom.When except glue, complete to remove adhesive process by drilling and plated-through-hole, plated-through-hole process specifically includes flash removal, bulk, de-smear and PTHization copper and completes.Original independence except glue+PTH all fronts streamlining is that a PTH is completely produced, can be effectively reduced and be bitten except glue stinging for PP by the present invention, achieve the purpose that improvement plating metapore is thick, while saving except glue cost improves production efficiency.
Description
Technical field
The present invention relates to a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its except adhesive process, answers
For Printed circuit board (hereinafter referred to as PCB) the electroplating technology stage, belong to PCB chemical process technical field.
Background technique
With the development of science and technology, the raising of social progress and living standards of the people, electronic product are consumption-orientation electricity by it
For sub- product gradually to short, small, light, thin development, Rigid Flex external form is soft, foldable, flexible, can be along X, Y, Z tripartite
To moving freely, and for three-dimensional space wiring, the space for keeping instrument and meter narrow is available to be made full use of, and is met
Miniature, the light and small development trend of electronic product, in the consumer electrical products such as computer, communication, camera field, automobile, aviation boat
The high-tech areas such as it have all obtained promotion and application energetically.
Rigid Flex is the combination of flexible (Flex) and rigidity (Rigid) circuit board (hereinafter referred to as RF), is related to complexity
Production technology and process, due to its special folded structure and flexible characteristic, after internal layer soft board route completes, accordingly
PP, hardboard core will do corresponding windowing process, while in order to avoid gummosis, it is bigger than hardboard core that PP takes windowing to inside contract
Certain numerical value, and (Low flow) low (No flow) gummosis PP film in use.
Commonly (Normal flow) PP become in low gummosis PP there are mainly two types of mode, one is dried PP by heating
Dry to reduce its gummosis, another kind is the addition bulky grain molecule in common PP, hinders the flowing of glue to become low gummosis, industry
Generally use the second way, however, such mode produce in inside low gummosis PP there are bubble, when drilling, is easy by break flour
It scratches and loosens, it is thick to occur very serious hole after Desmear, PTH and plating, after slice, and pleat plating is even presented and hole in some
It is broken.
The folded structure thickness of such quality problem low gummosis PP in two is particularly evident in the Rigid Flex of 40 ~ 60mil,
Binding force itself is weak after low gummosis PP pressing in two, and the break flour generated in boring procedure cannot be discharged in time, remains in hole,
The high speed rotation of drill point drives break flour to scratch PP, and PP is caused to loosen, to reduce the macromolecular particle of gummosis addition itself intolerant to removing
Glue, which is stung, to be bitten, while High Tg material will be except glue twice, so except to be presented apparent hole thick for hole wall after glue plating, specifically
Prior art flow chart is as shown in Figure 3.
Summary of the invention
The purpose of the present invention is change original life for the Rigid Flex using High Tg material with special folded structure
Process is produced, solves the problems, such as to be electroplated that metapore is thick, a kind of removing for the Rigid Flex of high glass transition temperature containing Dummy layers is provided
Adhesive process.
Technical solution of the present invention, it is a kind of containing whether there is or not the Rigid Flexs of the high glass transition temperature of copper base layer, including top
Layer copper foil, Dummy are without copper base layer, copper foil base material, prepreg and bottom copper foil, and the top layer copper foil, Dummy are without copper
Substrate layer, copper foil base material, prepreg and bottom copper foil are set gradually from top to bottom in sequence, are formed after pressing
Whole Rigid Flex；Through-hole is provided among the whole Rigid Flex.
It is described containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer remove adhesive process, process flow are as follows:
It is transmitted using horizontal line, after pressing first by Pin lam, carries out the drilling flash removal of via hole, it is then soft using leavening agent
Change glass fibre, be added potassium permanganate reduction macromolecule resin carry out de-smear operation, then by preneutralization and neutralize into
One step is cleaned；It completes entirely to remove glue work finally by the change copper operation of whole hole, microetch, preimpregnation, activation, reduction and chemical copper
Skill.
It is described containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer remove adhesive process, the specific steps are, with
Lower concentration is according to reactive tank stereometer:
(1) it drills: being transmitted using horizontal line, taken containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer,
It drills on drilling machine, specifically: upper Pin, drilling machine drilling, move back Pin and inspection；
(2) plated-through-hole: being transmitted using horizontal line, and Rigid Flex carries out the process of plated-through-hole after drilling is completed, specifically
Including flash removal, de-smear and PTHization copper；
A, flash removal process: using high-speed rotating brush wheel brushing first, and brush wheel revolving speed is 1200 ~ 1800r/min；Then
Using ultrasonic vibrating, Supersonic wave frequency rate is 50Hz, 1.5 ~ 2.5A of electric current；Bore edges, hydraulic giant pressure are rinsed using giant
For 50 ~ 70kg/cm2, thoroughly remove burr completely；Finally dried at 70 ~ 90 DEG C, the speed control of sliver 1.5 ~
2.0m/min；
B, de-smear process: being added leavening agent in clean reactive tank, and according to reactive tank stereometer, the amount of leavening agent is
Every liter of 200 ~ 300mL/；Rigid Flex after flash removal in step a is put into reactive tank, leavening agent submerges soft or hard combination
Plate softens the glass fibre in drilling at a temperature of 60 ~ 80 DEG C, stings and bite out cellular hole；It is every then to add 30 ~ 50g/
The transmission speed of the potassium permanganate risen, stirring and dissolving, sliver is controlled in 1.2 ~ 1.8m/min；
C, preneutralization, neutralization, whole hole, microetch, preimpregnation, activation, reduction and chemical copper process PTHization copper: are specifically included；It adopts
Transmitted with horizontal line, concentration according to reactive tank stereometer,
C1, preneutralization: the sulfuric acid of every liter of concentration of 5 ~ 15mL/ and pair of every liter of 5 ~ 15mil/ are added in clean reactive tank
Rigid Flex is put into reactive tank by oxygen water, and the transmission speed of sliver is controlled in 1.2 ~ 1.5m/min；
C2: it neutralizes: every liter of the hydrogen peroxide and 20 ~ 30mil/ of addition every liter of concentration of 10 ~ 15mL/ in clean reactive tank
Neutralizer, in slot temperature control at 25 ~ 30 DEG C, by Rigid Flex be put into the transmission speed control of reactive tank sliver 1.2 ~
1.5m/min；
C3, whole hole: the conditioner of every liter of concentration of 30 ~ 50mL/ is added in clean reactive tank, Rigid Flex is put into
Hole wall surface is cleaned in reactive tank, the transmission speed of sliver is controlled in 1.2 ~ 1.5m/min；
C4, microetch: the sodium peroxydisulfate of every liter of 110 ~ 120g/, the sulphur of every liter of 10 ~ 20mL/ are added in clean reactive tank
Rigid Flex is put into the removal of progress film and hole wall in reactive tank and further cleaned by the micro-etching agent of acid, the intracorporal biography of slot
Sending speed is 1.2 ~ 1.5m/min；
C5, preimpregnation: every liter of 20 ~ 30mL/ pre- preserved material is added in clean reactive tank, Rigid Flex is put into reactive tank
In to reduce the surface tension of hole wall, the intracorporal transmission speed of slot is 1.2 ~ 1.5m/min；
C6, activation: being added the activator of every liter of concentration of 200 ~ 300mL/ in clean reactive tank, pH value control 8 ~
10, Rigid Flex is put into reactive tank, the reaction time is that the intracorporal transmission speed of slot is 1.2 ~ 1.5m/min；
C7, reduction: the reducing agent of every liter of 3 ~ 8mL/ and the boric acid of every liter of 20 ~ 30g/, boron are added in clean reactive tank
The mass concentration of acid is 16 ~ 26g/L；Rigid Flex is put into reactive tank, the intracorporal transmission speed of slot is 1.2 ~ 1.5m/min,
To remove the tin Sn being coated on outside palladium colloid, the process of the stripping naked palladium of tin is completed；
C8, chemical copper: at 25 ~ 35 DEG C, in clean reactive tank be added every liter of 70 ~ 90mL/ build bath agent, 40 ~
The sodium hydroxide of the copper additives of every liter of 60mL/, every liter of the formaldehyde of every liter of 10 ~ 20mL/ and 5 ~ 15g/；Rigid Flex is put into
Reactive tank, the intracorporal transmission speed of slot are 1.2 ~ 1.5m/min, and containing after finally obtaining de-smear, whether there is or not the high glass of copper base layer
The Rigid Flex of glass temperature.
Leavening agent described in step 2b is leavening agent Sweller.
Neutralizer described in step 2c is Netralizer PC；The conditioner is conditioner 950H；The micro-etching agent is
Micro-etching agent L；The pre- preserved material is pre- preserved material PC-64H；The activator is activator PC-65H；The reducing agent is reducing agent
PC-66H；It is described to build bath agent to build bath agent MB；The copper additives are additive MB.
Beneficial effects of the present invention: the present invention will be reduced to once remove glue except glue twice, substantially increase production efficiency drop
Low production cost；The thick quality abnormal in the Rigid Flex hole of special folded structure is further improved, quality is improved.
Detailed description of the invention
Fig. 1 is the present invention containing whether there is or not the Rigid Flex structural schematic diagrams of the high glass transition temperature of copper base layer.
Fig. 2 is process flow chart of the invention.
Fig. 3 is prior art flow chart.
Description of symbols: 1, top layer copper foil；2, Dummy is without copper base layer；3, copper foil base material；4, prepreg；
5, bottom copper foil；6, through-hole.
Specific embodiment
Reagent employed in following embodiment is purchased from super special (Wuxi) chemical Science and Technology Ltd., each section of corresponding addition liquid medicine
Model name it is as shown in table 1.
Table 1
Embodiment 1
As shown in Figure 1, it is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer, including top layer copper foil 1,
Dummy sets gradually Pin lam without copper base layer 2, copper foil base material 3, prepreg 4 and bottom copper foil 5 from top to bottom
Rigid Flex is formed after pressing；Through-hole 6 is provided among the Rigid Flex.
The folded structure for the product type that the present invention is applicable in, the suitable plate of the technological process of production of the invention will meet following simultaneously
Three conditions
(1) High Tg material is used；
(2) containing Dummy without copper base layer；
(3) Rigid Flex.
It is described containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer remove adhesive process, process flow are as follows:
It is transmitted using horizontal line, after pressing first by Pin lam, carries out the drilling flash removal of via hole, it is then soft using leavening agent
Change glass fibre, be added potassium permanganate reduction macromolecule resin carry out de-smear operation, then by preneutralization and neutralize into
One step is cleaned；It completes entirely to remove glue work finally by the change copper operation of whole hole, microetch, preimpregnation, activation, reduction and chemical copper
Skill.
The technological process of production of the invention, for such plate due to using High Tg material, original production process removes glue twice, and one
It is secondary to remove glue to be independent, it is Desmear+ chemical copper for the second time, commonly referred to as PTH is completely produced, otherwise had except the not clean internal layer of glue
(Inner combine defect, ICD) risk of interconnection failure, and meet the plate containing Dummy stacking structure, due to not having
Internal layer copper ring does not have smear and remains on orifice ring, after electric plating of whole board, under certain high temperature (288 DEG C) float tin it is certain when
Between (10s), for several times after (>=6 times) all there is no ICD quality problem, PTH and copper electroplating layer to contact with substrate well.
Above type of plate carries out the drilling of via hole after Pin lam pressing, and drilling processing procedure refers in special brill
On the machine of hole, high-speed rotating drill point onboard drills out the process of circular hole, mainly includes upper Pin, drilling machine drilling, moves back Pin and inspection
It looks into, carries out plated-through-hole (Plated Through Hole, PHT) after drilling, the purpose is to make the numerical value of hole wall conductive portion
It metallizes with glass fibre, to carry out subsequent plating copper wiring, due to the high temperature generated when drilling, resin is more than Tg value
Molten glue residue is formed, this glue residue must remove completely before metallization, otherwise cause P.I. (Poor
Interconnection)。
Permanganimetric method is because generating micropore with bonding solvent processing procedure at present, simultaneously because the popularization of reducing electrode keeps tank liquor stable
Property be easier to control, be to be commonly used except gluing method, it is first soft by leavening agent Sweller when permanganimetric method removes glue
Change glass fibre, reduce high molecular bond energy, sting and bite out micropore, then the potassium permanganate with strong oxidizing property restores macromolecule
Resin achievees the purpose that desmear, subsequent neutralization only further cleaning, bulk, except glue, preneutralization and neutralize general be referred to as
For de-smear process.Except electric polarity is presented in the hole after glue, it is necessary to be conducive to hole wall in electropositive by whole hole processing subsequent negative
The absorption of ion cluster, the purpose of microetch is the film formed when removing whole hole while cleaning the remaining oxide of copper face, and activation is led
If the adsorption process of palladium colloid, the catalyst that the palladium colloid adsorbed on hole wall is taken advantage of the occasion as chemical copper, catalytic electrolysis copper and first
The reaction of aldehyde makes copper deposition complete metallization processes, whole hole, microetch, activation and chemical copper being referred to as copper on hole wall, and connects
It is known as PTH with except the general industry of glue process.
The material of high glass transition temperature, due to high Tg point, the more difficult removal of the glue residue of formation, in order to avoid internal layer hole
On ring glue residue removal it is not clean caused by ICD, it is therefore desirable to except glue twice, and except glue twice after, the low gummosis PP of Rigid Flex
It will appear to sting to bite and the thick problem in hole be excessively presented, in the present invention, since Rigid Flex contains Dummy plate (no copper layer, only PP
Layer), the problem of overlaying on glue residue on internal layer copper ring is not had, and except glue is primary, resin can be stung by potassium permanganate and bite out good bee
Nest shape, change copper after the via hole can be verified by reliability, while avoid twice except glue it is excessive caused by the thick problem in hole.
Embodiment 2
It is described containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer remove adhesive process, the specific steps are, with
Lower concentration is according to reactive tank stereometer:
(1) it drills: being transmitted using horizontal line, taken containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer,
It drills on drilling machine, specifically: upper Pin, drilling machine drilling, move back Pin and inspection；
(2) plated-through-hole: being transmitted using horizontal line, and Rigid Flex carries out the process of plated-through-hole after drilling is completed, specifically
Including flash removal, de-smear and PTHization copper；
A, flash removal process: using high-speed rotating brush wheel brushing first, and brush wheel revolving speed is 1200r/min；Then it uses
Ultrasonic vibrating, Supersonic wave frequency rate are 50Hz, electric current 1.5A；Bore edges are rinsed using giant, hydraulic giant pressure is 50kg/
cm2, thoroughly remove burr completely；It is finally dried at 70 DEG C, the speed control of sliver is in 1.5m/min；
B, de-smear process: being added leavening agent in clean reactive tank, and according to reactive tank stereometer, the amount of leavening agent is
Every liter of 200mL/；Rigid Flex after flash removal in step a is put into reactive tank, leavening agent submerges Rigid Flex,
Soften the glass fibre in drilling at a temperature of 60 DEG C, stings and bite out cellular hole；Then add the permanganic acid of every liter of 30g/
The transmission speed of potassium, stirring and dissolving, sliver is controlled in 1.2m/min；
C, preneutralization, neutralization, whole hole, microetch, preimpregnation, activation, reduction and chemical copper process PTHization copper: are specifically included；It adopts
Transmitted with horizontal line, concentration according to reactive tank stereometer,
C1, preneutralization: being added the sulfuric acid of every liter of concentration of 5mL/ and the hydrogen peroxide of every liter of 5mil/ in clean reactive tank,
Rigid Flex is put into reactive tank, the transmission speed of sliver is controlled in 1.2m/min；
C2: neutralize: in clean reactive tank be added every liter of concentration of 10mL/ every liter of hydrogen peroxide and 20mil/ in and
Agent, temperature control controls the transmission speed that Rigid Flex is put into reactive tank sliver in 1.2m/min at 25 DEG C in slot；
C3, whole hole: the conditioner of every liter of concentration of 30mL/ is added in clean reactive tank, Rigid Flex is put into instead
It answers and cleans hole wall surface in slot, the transmission speed of sliver is controlled in 1.2m/min；
C4, microetch: the microetch of the sodium peroxydisulfate of every liter of 110g/, the sulfuric acid of every liter of 10mL/ is added in clean reactive tank
Rigid Flex is put into the removal of progress film and hole wall in reactive tank and further cleaned by agent, and the intracorporal transmission speed of slot is
1.2m/min；
C5, preimpregnation: every liter of 20mL/ pre- preserved material is added in clean reactive tank, Rigid Flex is put into reactive tank
To reduce the surface tension of hole wall, the intracorporal transmission speed of slot is 1.2m/min；
C6, activation: being added the activator of every liter of concentration of 200 ~ 300mL/ in clean reactive tank, and pH value control, will 8
Rigid Flex is put into reactive tank, and the reaction time is that the intracorporal transmission speed of slot is 1.2m/min；
C7, reduction: the reducing agent of every liter of 3mL/ and the boric acid of every liter of 20g/, the matter of boric acid are added in clean reactive tank
Amount concentration is 16g/L；Rigid Flex is put into reactive tank, the intracorporal transmission speed of slot is 1.2m/min, is coated on removal
Tin Sn outside palladium colloid completes the process of the stripping naked palladium of tin；
C8, chemical copper: at 25 DEG C, every liter of 70mL/ is added in the clean reactive tank builds bath agent, every liter of 40mL/
The sodium hydroxide of copper additives, every liter of the formaldehyde of every liter of 10mL/ and 5g/；Rigid Flex is put into reactive tank, the intracorporal biography of slot
Sending speed is 1.2m/min, and containing after finally obtaining de-smear, whether there is or not the Rigid Flexs of the high glass transition temperature of copper base layer.
Embodiment 3
It is described containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer remove adhesive process, the specific steps are, with
Lower concentration is according to reactive tank stereometer:
(1) it drills: being transmitted using horizontal line, taken containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer,
It drills on drilling machine, specifically: upper Pin, drilling machine drilling, move back Pin and inspection；
(2) plated-through-hole: being transmitted using horizontal line, and Rigid Flex carries out the process of plated-through-hole after drilling is completed, specifically
Including flash removal, de-smear and PTHization copper；
A, flash removal process: using high-speed rotating brush wheel brushing first, and brush wheel revolving speed is 1800r/min；Then it uses
Ultrasonic vibrating, Supersonic wave frequency rate are 50Hz, electric current 2.5A；Bore edges are rinsed using giant, hydraulic giant pressure is 70kg/
cm2, thoroughly remove burr completely；It is finally dried at 90 DEG C, the speed control of sliver is in 2.0m/min；
B, de-smear process: being added leavening agent in clean reactive tank, and according to reactive tank stereometer, the amount of leavening agent is
Every liter of 300mL/；Rigid Flex after flash removal in step a is put into reactive tank, leavening agent submerges Rigid Flex,
Soften the glass fibre in drilling at a temperature of 80 DEG C, stings and bite out cellular hole；Then add the permanganic acid of every liter of 50g/
The transmission speed of potassium, stirring and dissolving, sliver is controlled in 1.8m/min；
C, preneutralization, neutralization, whole hole, microetch, preimpregnation, activation, reduction and chemical copper process PTHization copper: are specifically included；It adopts
Transmitted with horizontal line, concentration according to reactive tank stereometer,
C1, preneutralization: the sulfuric acid of every liter of concentration of 15mL/ and the dioxygen of every liter of 15mil/ are added in clean reactive tank
Rigid Flex is put into reactive tank by water, and the transmission speed of sliver is controlled in 1.5m/min；
C2: neutralize: in clean reactive tank be added every liter of concentration of 15mL/ every liter of hydrogen peroxide and 30mil/ in and
Agent, temperature control controls the transmission speed that Rigid Flex is put into reactive tank sliver in 1.5m/min at 30 DEG C in slot；
C3, whole hole: the conditioner of every liter of concentration of 50mL/ is added in clean reactive tank, Rigid Flex is put into instead
It answers and cleans hole wall surface in slot, the transmission speed of sliver is controlled in 1.5m/min；
C4, microetch: the microetch of the sodium peroxydisulfate of every liter of 120g/, the sulfuric acid of every liter of 20mL/ is added in clean reactive tank
Rigid Flex is put into the removal of progress film and hole wall in reactive tank and further cleaned by agent, and the intracorporal transmission speed of slot is
1.5m/min；
C5, preimpregnation: every liter of 30mL/ pre- preserved material is added in clean reactive tank, Rigid Flex is put into reactive tank
To reduce the surface tension of hole wall, the intracorporal transmission speed of slot is 1.5m/min；
C6, activation: being added the activator of every liter of concentration of 300mL/ in clean reactive tank, and pH value is controlled 10, will be soft
Scleroma plywood is put into reactive tank, and the reaction time is that the intracorporal transmission speed of slot is 1.5m/min；
C7, reduction: the reducing agent of every liter of 8mL/ and the boric acid of every liter of 30g/, the matter of boric acid are added in clean reactive tank
Amount concentration is 26g/L；Rigid Flex is put into reactive tank, the intracorporal transmission speed of slot is 11.5m/min, is coated on removal
Tin Sn outside palladium colloid completes the process of the stripping naked palladium of tin；
C8, chemical copper: at 35 DEG C, every liter of 90mL/ is added in the clean reactive tank builds bath agent, every liter of 60mL/
The sodium hydroxide of copper additives, every liter of the formaldehyde of every liter of 20mL/ and 15g/；Rigid Flex is put into reactive tank, slot is intracorporal
Transmission speed is 1.5m/min, and containing after finally obtaining de-smear, whether there is or not the soft or hard combinations of the high glass transition temperature of copper base layer
Plate.
Embodiment 4
It is described containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer remove adhesive process, the specific steps are, with
Lower concentration is according to reactive tank stereometer:
(1) it drills: being transmitted using horizontal line, taken containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer,
It drills on drilling machine, specifically: upper Pin, drilling machine drilling, move back Pin and inspection；
(2) plated-through-hole: being transmitted using horizontal line, and Rigid Flex carries out the process of plated-through-hole after drilling is completed, specifically
Including flash removal, de-smear and PTHization copper；
A, flash removal process: using high-speed rotating brush wheel brushing first, and brush wheel revolving speed is 1500r/min；Then it uses
Ultrasonic vibrating, Supersonic wave frequency rate are 50Hz, electric current 2A；Bore edges are rinsed using giant, hydraulic giant pressure is 60kg/cm2,
Thoroughly remove burr completely；It is finally dried at 80 DEG C, the speed control of sliver is in 1.7m/min；
B, de-smear process: being added leavening agent in clean reactive tank, and according to reactive tank stereometer, the amount of leavening agent is
Every liter of 250mL/；Rigid Flex after flash removal in step a is put into reactive tank, leavening agent submerges Rigid Flex,
Soften the glass fibre in drilling at a temperature of 70 DEG C, stings and bite out cellular hole；Then add the permanganic acid of every liter of 40g/
The transmission speed of potassium, stirring and dissolving, sliver is controlled in 1.6m/min；
C, preneutralization, neutralization, whole hole, microetch, preimpregnation, activation, reduction and chemical copper process PTHization copper: are specifically included；It adopts
Transmitted with horizontal line, concentration according to reactive tank stereometer,
C1, preneutralization: the sulfuric acid of every liter of concentration of 10mL/ and the dioxygen of every liter of 10mil/ are added in clean reactive tank
Rigid Flex is put into reactive tank by water, and the transmission speed of sliver is controlled in 1.4m/min；
C2: neutralize: in clean reactive tank be added every liter of concentration of 13mL/ every liter of hydrogen peroxide and 25mil/ in and
Agent, temperature control controls the transmission speed that Rigid Flex is put into reactive tank sliver in 1.4m/min at 28 DEG C in slot；
C3, whole hole: the conditioner of every liter of concentration of 40mL/ is added in clean reactive tank, Rigid Flex is put into instead
It answers and cleans hole wall surface in slot, the transmission speed of sliver is controlled in 1.4m/min；
C4, microetch: the microetch of the sodium peroxydisulfate of every liter of 115g/, the sulfuric acid of every liter of 15mL/ is added in clean reactive tank
Rigid Flex is put into the removal of progress film and hole wall in reactive tank and further cleaned by agent, and the intracorporal transmission speed of slot is
1.4m/min；
C5, preimpregnation: every liter of 25mL/ pre- preserved material is added in clean reactive tank, Rigid Flex is put into reactive tank
To reduce the surface tension of hole wall, the intracorporal transmission speed of slot is 1.4m/min；
C6, activation: being added the activator of every liter of concentration of 250mL/ in clean reactive tank, and pH value is controlled 9, will be soft or hard
Board is put into reactive tank, and the reaction time is that the intracorporal transmission speed of slot is 1.4m/min；
C7, reduction: the reducing agent of every liter of 5mL/ and the boric acid of every liter of 25g/, the matter of boric acid are added in clean reactive tank
Amount concentration is 20g/L；Rigid Flex is put into reactive tank, the intracorporal transmission speed of slot is 1.3m/min, is coated on removal
Tin Sn outside palladium colloid completes the process of the stripping naked palladium of tin；
C8, chemical copper: at 20 DEG C, every liter of 80mL/ is added in the clean reactive tank builds bath agent, every liter of 50mL/
The sodium hydroxide of copper additives, every liter of the formaldehyde of every liter of 15mL/ and 10g/；Rigid Flex is put into reactive tank, slot is intracorporal
Transmission speed is 1.4m/min, and containing after finally obtaining de-smear, whether there is or not the soft or hard combinations of the high glass transition temperature of copper base layer
Plate.
Claims (1)
1. containing adhesive process is removed whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer, it is characterized in that the specific steps are,
Following concentration is according to reactive tank stereometer:
(1) it drills: being transmitted using horizontal line, take containing whether there is or not the Rigid Flexs of the high glass transition temperature of copper base layer, drilling
It drills on machine, specifically: upper Pin, drilling machine drilling, move back Pin and inspection；
(2) plated-through-hole: being transmitted using horizontal line, and Rigid Flex carries out the process of plated-through-hole after drilling is completed, is specifically included
Flash removal, de-smear and PTHization copper；
A, flash removal process: using high-speed rotating brush wheel brushing first, and brush wheel revolving speed is 1200 ~ 1800r/min；Then it uses
Ultrasonic vibrating, Supersonic wave frequency rate are 50Hz, 1.5 ~ 2.5A of electric current；Using giant rinse bore edges, hydraulic giant pressure be 50 ~
70kg/cm2, thoroughly remove burr completely；It is finally dried at 70 ~ 90 DEG C, the speed control of sliver is in 1.5 ~ 2.0m/
min；
B, de-smear process: being added leavening agent in clean reactive tank, according to reactive tank stereometer, the amount of leavening agent is 200 ~
Every liter of 300mL/；Rigid Flex after flash removal in step a is put into reactive tank, leavening agent submerges Rigid Flex,
Soften the glass fibre in drilling at a temperature of 60 ~ 80 DEG C, stings and bite out cellular hole；Then add every liter of 30 ~ 50g/'s
The transmission speed of potassium permanganate, stirring and dissolving, sliver is controlled in 1.2 ~ 1.8m/min；
C, preneutralization, neutralization, whole hole, microetch, preimpregnation, activation, reduction and chemical copper process PTHization copper: are specifically included；Using water
Horizontal line transmission, concentration according to reactive tank stereometer,
C1, preneutralization: the sulfuric acid of every liter of concentration of 5 ~ 15mL/ and the dioxygen of every liter of 5 ~ 15mil/ are added in clean reactive tank
Rigid Flex is put into reactive tank by water, and the transmission speed of sliver is controlled in 1.2 ~ 1.5m/min；
C2: it neutralizes: the neutralization of every liter of the hydrogen peroxide and 20 ~ 30mil/ of every liter of concentration of 10 ~ 15mL/ being added in clean reactive tank
Agent, in slot temperature control at 25 ~ 30 DEG C, by Rigid Flex be put into the transmission speed control of reactive tank sliver 1.2 ~
1.5m/min；
C3, whole hole: the conditioner of every liter of concentration of 30 ~ 50mL/ is added in clean reactive tank, Rigid Flex is put into reaction
Hole wall surface is cleaned in slot, the transmission speed of sliver is controlled in 1.2 ~ 1.5m/min；
C4, microetch: the sulfuric acid of the sodium peroxydisulfate of every liter of 110 ~ 120g/, every liter of 10 ~ 20mL/ is added in clean reactive tank
Rigid Flex is put into the removal of progress film and hole wall in reactive tank and further cleaned by micro-etching agent, the intracorporal transmission speed of slot
Degree is 1.2 ~ 1.5m/min；
C5, preimpregnation: in clean reactive tank be added every liter of 20 ~ 30mL/ pre- preserved material, by Rigid Flex be put into reactive tank with
The surface tension of hole wall is reduced, the intracorporal transmission speed of slot is 1.2 ~ 1.5m/min；
C6, activation: being added the activator of every liter of concentration of 200 ~ 300mL/ in clean reactive tank, and pH value control, will 8 ~ 10
Rigid Flex is put into reactive tank, and the reaction time is that the intracorporal transmission speed of slot is 1.2 ~ 1.5m/min；
C7, reduction: being added the reducing agent of every liter of 3 ~ 8mL/ and the boric acid of every liter of 20 ~ 30g/ in clean reactive tank, boric acid
Mass concentration is 16 ~ 26g/L；Rigid Flex is put into reactive tank, the intracorporal transmission speed of slot is 1.2 ~ 1.5m/min, to go
Except the tin Sn being coated on outside palladium colloid, the process of the stripping naked palladium of tin is completed；
C8, chemical copper: at 25 ~ 35 DEG C, be added in clean reactive tank every liter of 70 ~ 90mL/ to build bath agent, 40 ~ 60mL/ every
Copper additives, the formaldehyde of every liter of 10 ~ 20mL/ and the sodium hydroxide of every liter of 5 ~ 15g/ risen；Rigid Flex is put into reactive tank,
The intracorporal transmission speed of slot is 1.2 ~ 1.5m/min, and containing after finally obtaining de-smear, whether there is or not the high glass transition temperatures of copper base layer
Rigid Flex.
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|---|---|---|---|
| CN201610192412.9A CN105682382B (en) | 2016-03-30 | 2016-03-30 | It is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its remove adhesive process |
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| CN201610192412.9A CN105682382B (en) | 2016-03-30 | 2016-03-30 | It is a kind of containing whether there is or not the Rigid Flex of the high glass transition temperature of copper base layer and its remove adhesive process |
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| CN108601243A (en) * | 2018-02-09 | 2018-09-28 | 深圳市赛孚科技有限公司 | A kind of heavy copper method of pcb board |
| CN109219274A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | Four layers a kind of or less Rigid Flex and its production method |
| CN110856348A (en) * | 2019-10-09 | 2020-02-28 | 广东利尔化学有限公司 | Neutralizing and reducing agent for PCB (printed circuit board) glue removal post-treatment |
| CN112165772B (en) * | 2020-09-30 | 2021-10-01 | 生益电子股份有限公司 | Mixed-pressing PCB (printed Circuit Board) glue removing process |
| CN114206031A (en) * | 2021-12-13 | 2022-03-18 | 欣强电子（清远）有限公司 | Double-sided 35um copper thick soft and hard board pressing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104219900A (en) * | 2013-05-31 | 2014-12-17 | 信利光电股份有限公司 | Rigid-flexible printed circuit board and method for manufacturing same |
| CN104582309A (en) * | 2013-10-14 | 2015-04-29 | 北大方正集团有限公司 | Rigid-flex circuit board and production method thereof |
| CN105307407A (en) * | 2015-10-22 | 2016-02-03 | 安捷利电子科技（苏州）有限公司 | Semi-additive process wire copper surface pinhole manufacturing mode |
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| CN103124472B (en) * | 2011-11-18 | 2015-12-16 | 北大方正集团有限公司 | A kind of rigid/flexible combined printed circuit board manufacture method and rigid/flexible combined printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219900A (en) * | 2013-05-31 | 2014-12-17 | 信利光电股份有限公司 | Rigid-flexible printed circuit board and method for manufacturing same |
| CN104582309A (en) * | 2013-10-14 | 2015-04-29 | 北大方正集团有限公司 | Rigid-flex circuit board and production method thereof |
| CN105307407A (en) * | 2015-10-22 | 2016-02-03 | 安捷利电子科技（苏州）有限公司 | Semi-additive process wire copper surface pinhole manufacturing mode |
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Effective date of registration: 20230915 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: No.32 Chunhui East Road, Xishan Economic Development Zone, Xishan District, Wuxi City, Jiangsu Province Patentee before: Gultech (Wuxi) Electronics Co.,Ltd. |