CN103906366A - Method for adding and manufacturing two-sided flexible printed circuit board on PI substrate - Google Patents
Method for adding and manufacturing two-sided flexible printed circuit board on PI substrate Download PDFInfo
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- CN103906366A CN103906366A CN201410131595.4A CN201410131595A CN103906366A CN 103906366 A CN103906366 A CN 103906366A CN 201410131595 A CN201410131595 A CN 201410131595A CN 103906366 A CN103906366 A CN 103906366A
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Abstract
The invention discloses a method for adding and manufacturing a two-sided flexible printed circuit board on a PI substrate. The method specially comprises the steps that holes are punched in the positions, required to be provided with through holes, of the PI substrate, and flash and burrs are removed; the surface of the PI substrate is cleaned up, a mask is printed on the surface of the PI substrate after the PI substrate is dried, a circuit figure and the through holes are exposed out, and the substrate with the mask printed is immersed in specific treating liquid for surface treatment; or after the PI substrate is cleaned and dried, the PI substrate is directly immersed in the treating liquid for surface treatment, and a mask is printed on the treated PI substrate again; the treated PI substrate is immersed in catalytic ion solutions, and catalytic ions are absorbed to the surface of the circuit figure and the inner walls of the through holes; the circuit figure and the through holes are metalized in a chemical plating mode; finally, a circuit is thickened in an electroplating mode. According to the method, the two-sided flexible printed circuit board can be directly manufactured on the PI substrate, and the method has the advantages of being simple in process, saving materials, reducing pollution, reducing the circuit width, lowering cost and the like. The method has great utilization potentiality in manufacturing of the flexible printed circuit board.
Description
Technical field
The invention belongs to flexible circuit board preparation field, be specially a kind of on PI substrate addition prepare the method for double-faced flexible printed circuit.
Background technology
In traditional PI, in flexible printed circuit board, the manufacture of conducting wire is to adopt the method that subtracts into corrosion.It is specially on PI substrate and adheres to Copper Foil, makes copper-clad plate, then applies mask in copper-clad plate, and under the covering of mask, etches line pattern in copper-clad plate.Double sided board is at the two-sided Copper Foil that all adheres to of PI substrate, make double face copper, corrosion obtains after double-sided circuit, then in the boring of the position of needs, and the metallization in hole is to soak to enclose one deck catalyst on the inwall of hole, and use the mode of chemical plating to obtain conductive through hole.This technique exists that waste of material is large, production process is many, environmental protection pressure is heavy, high in cost of production shortcomings.
In order to solve traditional preparation technology's the problems of flexible printed circuit conducting wire, we have invented a kind of method of directly preparing souble sided printed circuit on PI substrate.Printing technology is combined with ion-exchange theory, set up a kind of theoretical model of hydrolysis-ion-exchange-chemical plating, the catalytic metal that this theoretical model can form ionic bond or coordinate bond with carboxyl by silver, copper, nickel, palladium, platinum etc. is adsorbed on PI surface, and by the carrying out of this catalytic metal catalytic chemistry plating reaction, make circuit metallization.The fine and close adhesion of metal level obtaining is strong, and electrical property is good.
Summary of the invention
The object of the present invention is to provide a kind of prepare flexible double-sided printed circuit on PI substrate method.
PI substrate is used treatment fluid processing by the present invention, by the hydrolysis of layer molecule, obtains carboxylic ions, and by the mode of printing mask, expose required line pattern, by catalytic metal ion and carboxyl reaction, make catalysis ionic adsorption at circuit patterned surface by ion-exchange.Equally, hole by desired area on PI, hole inwall and circuit together carried out to surface hydrolysis and catalysis ionic adsorption, finally can a step by surface lines and via metal.Metallized circuit and through hole can use to electroplate circuit is thickened, and reduce overall resistance.Principle of the present invention is a kind of process of hydrolysis-ion-exchange-chemical plating.PI is a base polymer that contains imide ring (CO-N-CO-) on main chain, and it can be hydrolyzed under alkali condition, obtains carboxylic acid sodium or carboxylic acid potassium.Be placed in the metal ion solution processes such as silver, copper, nickel, palladium, carboxylic acid sodium, potassium can react with metal ion, generate silver carboxylate, copper, nickel etc.This is a kind of reaction of ion-exchange, makes catalysis ionic adsorption on PI surface.
A kind of method of preparing flexible double-sided printed circuit on PI substrate that the present invention proposes, concrete steps are as follows:
(1) use commercially available PI substrate, by the mode of machine drilling or laser drilling, need to prepare the position punching of through hole at substrate.After boring, remove burr on through hole, and the cleaning, drying that degreases;
(2) the PI substrate after cleaning step (2) being obtained immerses in treatment fluid to be processed.Treatment fluid comprises 1 ~ 10mol/L NaOH or potassium hydroxide, 0 ~ 10%wt ethylene glycol, propylene glycol, diglycol, phenol, and 0 ~ 1%wt polyvinylpyrrolidone, PEG-6000, Tween-80, Si Ban-20, solvent for use is water.Treatment temperature is 30 ~ 80 DEG C, and the processing time is 3 ~ 60min.After processing, take out cleaning-drying, at surface printing mask, expose required line pattern and through hole position, be then placed in the catalysis solion adsoption catalysis ion of 0.01mmol/L ~ 0.2mol/L to line pattern surface and through-hole wall.The temperature of ionic adsorption is 30 ~ 80 DEG C, and adsorption time is 5 seconds to 30 minutes.PI substrate surface printing mask after step (2) or the first cleaning obtaining in step (1), then immerses in treatment fluid and processes, and after processing, takes out cleaning-drying, then as for adsoption catalysis ion in catalysis solion;
(3) the PI substrate after adsoption catalysis ion step (2) being obtained takes out cleaning-drying, is placed in chemical plating fluid and carries out chemical plating.The temperature of chemical plating is 30 ~ 85 DEG C, and the time is 1 ~ 30min.After chemical plating, obtain metallized circuit and through hole;
(4) line pattern step (3) being obtained takes out, and cleaning-drying is placed in electroplate liquid and electroplates and thicken.Electroplating temperature is 10 ~ 80 DEG C, and electroplating time is 1 ~ 60min.After electroplating, take out PI substrate, cleaning-drying;
(5) step (4) is electroplated to the PI substrate thickening and be placed in organic solvent and wash away mask, then use clear water clean dry, obtain required double-faced flexible printed circuit board.
In the present invention, in step (2), printing mask mode of printing used is the one in silk screen printing, intaglio printing, ink jet printing, laser printing, offset printing, heat transfer printing or photoetching.
In the present invention, the catalysis solion using in step (2) is the one of the soluble-salt of copper, silver, palladium, platinum, nickel, gold, preferably the one in chlorine palladium acid sodium, sodium chloraurate, silver nitrate or palladium bichloride.
In the present invention, in step (3), chemical plating used is the one or more combination in electroless copper, chemical nickel plating, chemical gilding, chemical palladium-plating, chemical silvering, electroless cobalt plating, chemical nickel phosphorus plating, electroless copper phosphorus, electroless copper nickel, preferably one or more combination in electroless copper, chemical nickel plating, electroless copper phosphorus or chemical nickel phosphorus plating.
In the present invention, in step (4), plating used is the one or more combination in electronickelling, copper, gold, palladium, platinum, chromium, silver, cobalt.Preferably one or more combination in electro-coppering and electronickelling.
beneficial effect of the present invention is:
1. the present invention has the advantages such as operation is simple, material economy, pollution minimizing, cost compared to the etching process that subtracts into of conducting wire in traditional PI;
2. the present invention can directly prepare double-faced flexible printed circuit, does not need circuit and the preparation of through hole to separate, and greatly reduces technological process, has reduced equipment and material cost;
3. production efficiency of the present invention is high, with short production cycle, is beneficial to " volume to volume " production that realizes flexible printed circuit.
Brief description of the drawings
Fig. 1 represents the optical microscope image of 100 μ m through holes on PI substrate;
The cross section optical microscope image of 100 μ m through holes on the PI substrate of Fig. 2 surface.
Embodiment
The following examples are to further illustrate of the present invention, instead of limit the scope of the invention.
Embodiment 1:(1) use commercially available polyimide film (Dupont, Kapton
), thickness 0.1mm.Use the mode of machine drilling, on PI substrate, hole, after boring, go out the burr of through hole oil removing cleaning, drying;
(2) the PI substrate after oil removing is placed in to treatment fluid, processes 30min for 50 DEG C.Treatment fluid is 5mol/L NaOH, the propylene glycol of 1%wt, the aqueous solution of the PEG-6000 of 0.01%wt.After taking-up, clean with clear water, dry; The mode that uses laser printing, printing mask on PI substrate, exposes line pattern and through hole position; PI substrate after printing is immersed in 50mmol/L silver nitrate aqueous solution, at 50 DEG C, soak 5min, ion is fully exchanged, then take out with clear water cleaning, dry.
(3) the PI substrate after ion-exchange is placed in to chemical bronze plating liquid and carries out electroless copper.Electroless copper formula of liquid is as follows:
Substrate is immersed in chemical bronze plating liquid and at 40 DEG C, carries out electroless copper 10min, after copper facing finishes, by circuit board washed with de-ionized water, dry.
(4) after copper facing, use the mode of electronickelling that circuit is thickened.Electronickelling solution, fill a prescription as follows:
Temperature is 50 DEG C, and current density is 3A/dm
2, pH is 4;
To in substrate immersion plating nickel, electroplate 15min, after nickel plating finishes, by circuit board washed with de-ionized water, drying.
(5) the PI substrate after nickel plating is placed in the middle of ethyl acetate, washes away mask, and with clear water cleaning, dry.Just obtain required double-faced flexible printed circuit.
Embodiment 2:
(1) use commercially available polyimide film (Dupont, Kapton
), thickness 0.1mm.Use the mode of machine drilling, on PI substrate, hole, after boring, go out the burr of through hole oil removing cleaning, drying;
(2) use the mode of ink jet printing to print from the teeth outwards mask the PI substrate after oil removing, expose line pattern and through hole position; PI film after printing mask is placed in treatment fluid, processes 20min for 60 DEG C, and treatment fluid is 5mol/L potassium hydroxide, the ethylene glycol of 2%wt, and the aqueous solution of the polyvinylpyrrolidone of 0.02%wt, cleans with clear water after taking-up, dries; PI substrate after treatment is immersed in 30mmol/L palladium chloride aqueous solution, at 30 DEG C, soak 10min, ion is fully exchanged, then take out with clear water cleaning, dry.
(3) the PI substrate after ion-exchange is placed in to chemical nickel-plating liquid and carries out chemical nickel plating.Chemical nickel plating formula of liquid is as follows:
Substrate is immersed in chemical nickel-plating liquid and at 60 DEG C, carries out chemical nickel plating 10min, after copper facing finishes, by circuit board washed with de-ionized water, dry.
(4) after nickel plating, use the mode of electro-coppering that circuit is thickened.Copper electroplating solution formula is as follows:
Temperature is 40 DEG C, and current density is 1.2A/dm
2;
To in substrate immersion plating copper, electroplate 30min, after copper facing finishes, by circuit board washed with de-ionized water, dry.
(5) the PI substrate after copper facing is placed in the middle of ethyl acetate, washes away mask, and with clear water cleaning, dry.Just obtain required double-faced flexible printed circuit.
Claims (5)
1. on PI substrate, the method for double-faced flexible printed circuit is prepared in addition, it is characterized in that concrete steps are as follows:
(1) use commercially available PI substrate, by the mode of machine drilling or laser drilling, need to prepare the position punching of through hole at PI substrate, after boring, remove burr on through hole, wipe oil cleaning, drying;
(2) the PI substrate after cleaning step (1) being obtained immerses in treatment fluid to be processed, treatment temperature is 30 ~ 80 DEG C, processing time is 3 ~ 60min, after processing, take out cleaning-drying, at surface printing mask, expose required line pattern and through hole position, be then placed in the catalysis solion adsoption catalysis ion of 0.01mmol/L ~ 0.2mol/L to line pattern surface and through-hole wall; The temperature of ionic adsorption is 30 ~ 80 DEG C, and adsorption time is 5 seconds to 30 minutes;
Or: be the PI substrate surface printing mask after the cleaning first obtaining in step (1), then immerse in treatment fluid and process, after processing, take out cleaning-drying, then be placed in catalysis solion adsoption catalysis ion;
Wherein: treatment fluid comprises 1 ~ 10mol/L NaOH or potassium hydroxide, in 0 ~ 10%wt ethylene glycol, propylene glycol, diglycol or phenol any, in 0 ~ 1%wt polyvinylpyrrolidone, PEG-6000, Tween-80 or Si Ban-20 any, solvent for use is water;
(3) the PI substrate after adsoption catalysis ion step (2) being obtained takes out cleaning-drying, is placed in chemical plating fluid and carries out chemical plating, and the temperature of chemical plating is 30 ~ 85 DEG C, and the time is 1 ~ 30min, after chemical plating, obtains metallized line pattern and through hole;
(4) line pattern step (3) being obtained takes out, and cleaning-drying is placed in electroplate liquid and electroplates and thicken, and electroplating temperature is 10 ~ 80 DEG C, and electroplating time is 1 ~ 60min; After electroplating, take out PI substrate, cleaning-drying;
(5) step (4) is electroplated to the PI substrate thickening and be placed in organic solvent and wash away mask, then use clear water clean dry, obtain required double-faced flexible printed circuit board.
2. method according to claim 1, is characterized in that: in step (2), printing mask mode of printing used is the one in silk screen printing, intaglio printing, ink jet printing, laser printing, offset printing, heat transfer printing or photoetching.
3. method according to claim 1, is characterized in that: the catalysis solion using in step (2) is the one of the soluble-salt of copper, silver, palladium, platinum, nickel, gold.
4. method according to claim 1, is characterized in that: in step (3), chemical plating used is the one or more combination in electroless copper, chemical nickel plating, chemical gilding, chemical palladium-plating, chemical silvering, electroless cobalt plating, chemical nickel phosphorus plating, electroless copper phosphorus, electroless copper nickel.
5. method according to claim 1, is characterized in that: in step (4), plating used is the one or more combination in electronickelling, copper, gold, palladium, platinum, chromium, silver, cobalt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410131595.4A CN103906366A (en) | 2014-04-03 | 2014-04-03 | Method for adding and manufacturing two-sided flexible printed circuit board on PI substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410131595.4A CN103906366A (en) | 2014-04-03 | 2014-04-03 | Method for adding and manufacturing two-sided flexible printed circuit board on PI substrate |
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| CN201410131595.4A Pending CN103906366A (en) | 2014-04-03 | 2014-04-03 | Method for adding and manufacturing two-sided flexible printed circuit board on PI substrate |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390457A (en) * | 2015-10-19 | 2016-03-09 | 江苏稳润光电有限公司 | Low-cost and high-reliability chip scale package (CSP) and packaging method thereof |
| CN105657966A (en) * | 2016-03-17 | 2016-06-08 | 柏弥兰金属化研究股份有限公司 | Flexible metal laminated plate with micro-through-holes and manufacturing method thereof |
| CN105856792A (en) * | 2015-04-09 | 2016-08-17 | 柏弥兰金属化研究股份有限公司 | Method for manufacturing single-sided thin metal substrate |
| CN106937477A (en) * | 2017-03-30 | 2017-07-07 | 深圳橙子无线科技有限公司 | A kind of flexible circuit board and its manufacture craft |
| CN108156763A (en) * | 2016-12-05 | 2018-06-12 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and preparation method thereof |
| CN110082407A (en) * | 2019-03-29 | 2019-08-02 | 华东师范大学 | A kind of flexibility gold electrode and preparation method |
| CN113141719A (en) * | 2021-04-22 | 2021-07-20 | 江西新华盛电子电路科技有限公司 | Addition preparation method of LED double-sided board |
| CN113518516A (en) * | 2021-03-30 | 2021-10-19 | 新余市木林森线路板有限公司 | Manufacturing process of flexible circuit board |
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| US4645732A (en) * | 1982-12-23 | 1987-02-24 | Amp Incorporated | Method for manufacturing two-sided circuit board |
| CN101446037A (en) * | 2008-12-29 | 2009-06-03 | 中国科学院长春应用化学研究所 | Preparation method of electric-conducting polyimide fiber |
| CN103249255A (en) * | 2013-04-17 | 2013-08-14 | 复旦大学 | Method for directly preparing conducting circuit on resin baseplate |
| CN103648243A (en) * | 2013-12-13 | 2014-03-19 | 复旦大学 | Method for preparing multilayer board in additive mode |
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Patent Citations (4)
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| US4645732A (en) * | 1982-12-23 | 1987-02-24 | Amp Incorporated | Method for manufacturing two-sided circuit board |
| CN101446037A (en) * | 2008-12-29 | 2009-06-03 | 中国科学院长春应用化学研究所 | Preparation method of electric-conducting polyimide fiber |
| CN103249255A (en) * | 2013-04-17 | 2013-08-14 | 复旦大学 | Method for directly preparing conducting circuit on resin baseplate |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105856792A (en) * | 2015-04-09 | 2016-08-17 | 柏弥兰金属化研究股份有限公司 | Method for manufacturing single-sided thin metal substrate |
| CN105856792B (en) * | 2015-04-09 | 2018-02-27 | 柏弥兰金属化研究股份有限公司 | Method for manufacturing single-sided thin metal substrate |
| CN105390457A (en) * | 2015-10-19 | 2016-03-09 | 江苏稳润光电有限公司 | Low-cost and high-reliability chip scale package (CSP) and packaging method thereof |
| CN105657966A (en) * | 2016-03-17 | 2016-06-08 | 柏弥兰金属化研究股份有限公司 | Flexible metal laminated plate with micro-through-holes and manufacturing method thereof |
| CN105657966B (en) * | 2016-03-17 | 2019-06-21 | 柏弥兰金属化研究股份有限公司 | Flexible metal laminated plates and its manufacturing method with micro through hole |
| CN108156763A (en) * | 2016-12-05 | 2018-06-12 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and preparation method thereof |
| CN108156763B (en) * | 2016-12-05 | 2020-08-07 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
| CN106937477A (en) * | 2017-03-30 | 2017-07-07 | 深圳橙子无线科技有限公司 | A kind of flexible circuit board and its manufacture craft |
| CN110082407A (en) * | 2019-03-29 | 2019-08-02 | 华东师范大学 | A kind of flexibility gold electrode and preparation method |
| CN113518516A (en) * | 2021-03-30 | 2021-10-19 | 新余市木林森线路板有限公司 | Manufacturing process of flexible circuit board |
| CN113141719A (en) * | 2021-04-22 | 2021-07-20 | 江西新华盛电子电路科技有限公司 | Addition preparation method of LED double-sided board |
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Application publication date: 20140702 |