JP2007214338A - Manufacturing method of one-side polyimide wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a one-side polyimide wiring board capable of forming a metal wiring, excellent in adhesion property and high in pattern accuracy. <P>SOLUTION: In the manufacturing method of the one-side polyimide wiring board, a laminate 101 made by bonding two sheets of polyimide films 1A, 1B through an intermediate layer 14 is dipped into alkaline solution to make alkaline metal salt by hydrolyzing the surfaces of the polyimide films 1A, 1B, and the laminate 101 is dipped into metal ion containing solution to replace alkaline metal ion by metal ion contained in the metal ion containing solution. Electrolytic plating is effected by employing metal films 4A, 4B, obtained by reducing the metal ion on the surfaces of polyimide film 1A, 1B, as electric supply layers to form wiring pattern by plating films 6A, 6B and, thereafter, the polyimide films 1A, 1B are separated from the intermediate layer 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a single-sided polyimide wiring board having metal wiring on one surface.

  In recent years, electronic devices typified by portable information devices such as mobile phones have been required to be smaller and lighter. Along with this requirement, as a printed circuit board to be mounted on electronic equipment, a flexible printed circuit board (FPC (Flexible Printed Circuit)) that has flexibility, a rigid combination of FPC and a hard substrate such as a glass epoxy substrate -The amount of flexible wiring boards used is increasing. As a substrate material for FPC, a polyimide resin having excellent heat resistance, electrical insulation, and mechanical strength is widely used.

  As a method for forming a wiring on an FPC using a polyimide resin, a subtractive method is conventionally used in which a metal film attached to the entire surface of a substrate material via an adhesive is removed by etching and patterned.

  However, as the printed wiring board has been increased in density, a finer wiring pattern is required. Therefore, there is a wiring forming method that replaces the subtractive method, which has problems such as over-etching and poor adhesive adhesion. It is being considered.

  By the way, the additive method in which a metal film is selectively formed by using an electroless plating method to form a wiring is a wiring forming method that does not require an adhesive.

  However, in the conventional additive method, there is a problem that the adhesion between the metal film and the polyimide base material is poor, and the following method has been proposed to solve this problem.

  For example, an alkaline solution such as KOH or NaOH is selectively applied to the surface of the polyimide substrate, the imide ring is opened to form a carboxyl group, and a metal ion is coordinated to the carboxyl group to form a metal salt. A method of performing plating using a metal film obtained by reducing this metal salt as a plating precipitation nucleus has been proposed (Patent Document 1 (Japanese Patent Laid-Open No. 2005-45236)) and Patent Document 2 (Japanese Patent Laid-Open No. 2005-2005). -29735). Since a part of the metal film obtained by this method is deposited so as to be embedded in fine irregularities on the surface of the polyimide base material, high adhesion can be obtained.

  However, the above method has the following problems.

  For example, when a metal film is formed on the surface of a polyimide substrate by the above method, the metal film is formed on both surfaces of the polyimide substrate. Therefore, in order to form a single-sided wiring board in which wiring is formed only on one side by the subtractive method, a plating resist is formed on the entire surface on which no wiring is formed to prevent metal from being deposited in the electrolytic plating process. Thereafter, the plating resist was peeled off, and the entire formed metal film had to be removed by etching.

Moreover, since the surface layer of the polyimide base material that has undergone a hydrolysis reaction with an alkaline solution swells, the polyimide base material is likely to be warped, resulting in difficulty in handling.
JP 2005-45236 A JP-A-2005-29735

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a single-sided polyimide wiring board capable of forming a metal wiring with good adhesion and high pattern accuracy.

In order to solve the above problems, a method for producing a single-sided polyimide wiring board of the present invention includes a film laminating step of forming a film laminate by laminating two polyimide films with an intermediate layer interposed therebetween,
A hydrolysis step of treating both sides of the film laminate with an alkaline solution;
An ion exchange step of treating both surfaces of the film laminate with a metal ion-containing solution;
A reduction step of treating both sides of the film laminate with a reducing agent to deposit metal films on both sides of the film laminate;
A plating step of forming a plating film in a predetermined region of the metal film on both surfaces of the film laminate;
An etching step of removing the metal film in a region where the plating film is not formed in the plating step and leaving a metal film in a predetermined region where the plating film is formed;
Removing the intermediate layer from the two polyimide films;
It is characterized by having.

  According to the method for manufacturing a single-sided polyimide wiring board of the present invention, in the film bonding step, the surfaces of the two polyimide films that are not formed are bonded together with an intermediate layer interposed therebetween to form a film laminate. And the wiring by a metal film and a plating film is formed in both surfaces of the said film laminated body by a hydrolysis process, an ion exchange process, a reduction process, a plating process, and an etching process. Then, the intermediate layer is removed from the two polyimide films.

  Since the metal film of the wiring is deposited so as to be embedded in the fine irregularities on the surface of the polyimide film, high adhesion to the polyimide film can be obtained, and in a single step for forming the wiring, 2 Wiring of a single-sided polyimide wiring board can be formed, and the number of processes can be reduced.

  Further, since the two polyimide films are bonded to each other with the intermediate layer sandwiched by the film bonding step, the area of the region where the metal film is formed as a deposition nucleus of plating is halved. Therefore, the usage amount of the reactive species in the chemical solution used in the ion exchange step, the reduction step or the like can be halved, and the usage amount of the chemical solution or the number of chemical solution exchange steps can be reduced.

  In addition, a film laminate in which two polyimide films are bonded via an intermediate layer is less likely to warp than one polyimide film, and is easy to handle in the manufacturing process.

  Furthermore, the polyimide film after removing the intermediate layer is not swollen by the treatment with the alkaline solution on one surface of the both surfaces bonded to the intermediate layer. Therefore, compared with the case where both surfaces of the polyimide film are swollen, the polyimide film is less deformed in shape, can be easily handled in the subsequent steps, and can improve the dimensional accuracy of the manufactured polyimide wiring board. .

  Moreover, in the manufacturing method of the single-sided polyimide wiring board of one Embodiment, the said intermediate | middle layer has a support body and the adhesive material layer apply | coated on both surfaces of this support body.

  In this embodiment, since the intermediate layer has a support, the rigidity of the film laminate in which two polyimide films are bonded via the intermediate layer is increased. Therefore, handling of the film laminate is particularly easy.

  Moreover, in the manufacturing method of the single-sided polyimide wiring board of one Embodiment, the said intermediate | middle layer has a support body and two adhesive material layers which pinch | interpose this support body, and the adhesion of the said adhesive material layer with respect to the said support body The strength is higher than the adhesion strength of the pressure-sensitive adhesive layer to the polyimide film.

  In the method for producing a single-sided polyimide wiring board of this embodiment, the adhesive layer has a higher adhesive strength to the support than the adhesive strength to the polyimide film. Due to the difference in the adhesive strength of the adhesive material layer, the polyimide film can be peeled off from the intermediate layer.

  According to the method for producing a single-sided polyimide wiring board of the present invention, each step (hydrolysis step) for forming a wiring pattern in the state of a film laminate having a structure in which two polyimide films are bonded together with an intermediate layer interposed therebetween. , Ion exchange process, reduction process, plating process, etching process), and handling becomes easy. Moreover, since the wiring pattern of a single-sided polyimide wiring board can be formed simultaneously on two polyimide films, the number of steps can be reduced and the manufacturing efficiency can be improved.

  Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

(First embodiment)
In the manufacturing method of the single-sided polyimide wiring board of 1st Embodiment of this invention, the process of forming a wiring pattern on the surface of a polyimide film is performed in the state of the film laminated body which bonded two polyimide films together.

  A method of forming a metal pattern on a polyimide film in the first embodiment will be described with reference to FIGS. FIG. 1 is a manufacturing flow diagram of a method for manufacturing a single-sided polyimide wiring board according to the first embodiment. 2 to 9 are schematic cross-sectional views showing the respective manufacturing steps of the first embodiment.

  First, in the polyimide film laminating step of step (1) in FIG. 1, as shown in FIG. 2, two polyimide films 1 </ b> A and 1 </ b> B are pasted through an intermediate layer 14 to form a film laminate 101. The intermediate layer 14 is formed by sandwiching a support 3 made of a material having excellent alkali resistance such as polypropylene between adhesive material layers 2A and 2B made of an adhesive such as rubber or silicone.

  Next, in the hydrolysis step of step (2) in FIG. 1, the film laminate 101 is immersed in a strong alkaline solution, and then washed with water and dried. Examples of the strong alkali solution include KOH and NaOH. By this hydrolysis step, the surfaces of the polyimide films 1A and 1B represented by the following (Chemical Formula 1) are hydrolyzed to open an imide ring and bind to alkali metal ions in a strong alkali solution. Thereby, as shown in FIG. 3, the modified layers 104 </ b> A and 104 </ b> B are formed on both surfaces of the film laminate 101. The modified layers 104A and 104B have a structure represented by the following (Chemical Formula 2) when hydrolysis is performed using KOH, for example.

(化学式２)

(Chemical formula 1)

(Chemical formula 2)

Next, in the metal ion replacement step of step (3) in FIG. 1, the film laminate 101 is immersed in a metal ion-containing solution, washed with water, and dried. Examples of the metal ion-containing solution include aqueous solutions of metal salts such as Cu, Ni, Co, and Ag. For example, an aqueous solution of CuSO ₄ . Through this metal ion replacement step, the alkali metal ions coordinated in the modified layers 104A and 104B replace the metal ions in the metal ion-containing solution. Then, it is washed with water and dried.

  When the film laminate 101 is washed using an organic solvent such as isopropyl alcohol before the step (3) in FIG. 1, the poorly water-soluble amine attached to the surface of the film laminate 101 is removed. Can be removed. This is desirable because it does not change the pH of the metal ion solution in which the film laminate 101 is immersed in the next step.

Next, in the reduction step of step (4) in FIG. 1, as shown in FIG. 4, metal ions are reduced and deposited using a reducing agent, and the metal thin films 4A and 4B are formed on the modified layers 104A and 104B. Form. Examples of the reducing agent include sodium borohydride (NaBH ₄ ) and dimethylamine borane. When the metal ion substitution step is performed with an aqueous solution containing Ni ions, sodium hypophosphite (NaH ₂ PO ₂ ) can also be used. Thereafter, the film laminate 101 is washed with water and dried.

  Note that the metal thin films 4A and 4B may be thickened by repeating steps (2) to (4) in FIG. 1 a plurality of times.

  Next, in the plating resist formation step of step (5) in FIG. 1, as shown in FIG. 5, plating resists 5A and 5B are formed in predetermined regions of the metal films 4A and 4B on both surfaces of the film laminate 101. . The plating resists 5A and 5B are formed by first applying a resist film to both surfaces of the film laminate 101, and performing an exposure and development process. A liquid resist may be used instead of the resist film.

  Next, in the electrolytic plating step of step (6) in FIG. 1, as shown in FIG. 6, electrolytic plating is performed, and plating films 6A and 6B are formed on the surfaces of the metal films 4A and 4B on both surfaces of the film laminate 101. Precipitate. Examples of the electrolytic plating solution in this electrolytic plating step include a sulfate bath and a sulfamine bath when Cu is plated. After depositing plating films 6A and 6B having a necessary thickness, the film laminate 101 is taken out from the electrolytic plating solution, washed with water, and dried.

  Next, in the resist stripping step of step (7) in FIG. 1, the plating resists 5A and 5B are stripped as shown in FIG. This resist stripping is performed using a stripping agent suitable for the plating resists 5A and 5B. For example, when the plating resists 5A and 5B are resist films, they are stripped with an alkaline solution such as NaOH, and when they are liquid resists, a stripping agent containing an organic solvent such as propylene glycol methyl ether acetate or alkylbenzene sulfonic acid is used. .

  Next, in the etching step of step (8) in FIG. 1, as shown in FIG. 8, the film laminate 101 is immersed in an etching solution, and the metal in the region where the plating films 6A and 6B are not formed in the plating step is formed. The thin films 4A and 4B are etched to leave only the metal thin films 4A and 4B and the plating films 6A and 6B in the regions covered with the plating films 6A and 6B on the surface of the film laminate 101.

  Next, in the substrate peeling step of step (9) in FIG. 1, as shown in FIG. 9, the two polyimide films 1A and 1B are peeled from the adhesive material layers 2A and 2B of the intermediate layer. As a peeling method, an adhesive that forms the adhesive layers 2A and 2B is dissolved using an organic solvent, or the viscosity of the adhesive that forms the adhesive layers 2A and 2B is reduced by heating, and then a polyimide film The method of peeling 1A and 1B from the intermediate | middle layer 14 is mentioned. In addition, the adhesive layers 2A and 2B are prepared in advance from a material whose viscosity is lowered by irradiating ultraviolet rays, and the adhesive layers 2A and 2B are irradiated with ultraviolet rays to reduce the viscosity, and the polyimide films 1A and 1B. May be peeled off from the intermediate layer 14. Moreover, when only a part of the two polyimide films 1A and 1B is pasted by the intermediate layer, a part including the intermediate layer may be cut off. For example, this is a case where only the peripheral portions of the polyimide films 1A and 1B are pasted together by the intermediate layer.

図１の工程(１０)のカバーレイの形成工程や、めっき膜６Ａ,６Ｂのランド形成部分にＡｕフラッシュめっきなどの表面処理を行い、配線基板ごとの形状に打ち抜く工程(図１の工程(１１))や、他部材との貼り合わせ工程を行って、片面ポリイミド配線基板１５Ａ,１５Ｂを完成させる。 Thereafter, the polyimide films 1A and 1B are heated in a nitrogen atmosphere, and the modified layers 104A and 104B that have become polyamic acid as shown in Chemical Formula 3 are again converted into imide rings as shown in Chemical Formula 1. The structure is altered. In order for the polyamic acid to become polyimide again, it must be maintained at a temperature higher than the glass transition temperature of the polyamic acid.
(Chemical formula 3)

The process of forming the coverlay in the step (10) of FIG. 1 and the surface treatment such as Au flash plating on the land forming portions of the plating films 6A and 6B and punching into the shape of each wiring board (the step (11 of FIG. 1) )) And a bonding process with other members, to complete the single-sided polyimide wiring boards 15A and 15B.

  According to the first embodiment, since the metal thin films 4A and 4B of the wiring are deposited so as to be embedded in the fine irregularities on the surfaces of the polyimide films 1A and 1B, high adhesion to the polyimide films 1A and 1B is obtained. At the same time, wiring by the plating films 6A and 6B and the metal thin films 4A and 4B on the two single-sided polyimide wiring boards 15A and 15B is performed once in each of the steps (1) to (9) for forming the wiring. The number of steps can be reduced.

  Further, since the two polyimide films 1A and 1B are bonded together with the intermediate layer 14 sandwiched in the film bonding step of the above step (1), the area of the region in which the metal films 4A and 4B are formed as the deposition nuclei of plating is increased. Halved. Therefore, the usage amount of the reactive species in the chemical solution used in the ion exchange step of step (3) and the reduction step of step (4) is halved, and the usage amount of chemical solution and the number of chemical solution exchange steps can be reduced.

  In addition, the film laminate 101 in which the two polyimide films 1A and 1B are bonded via the intermediate layer 14 is less likely to warp than the single polyimide film, and is easy to handle in the manufacturing process. .

  Further, in the polyimide films 1A and 1B after the intermediate layer 14 is removed, one surface of the both surfaces bonded to the intermediate layer 14 is not swollen by the treatment with the alkaline solution. Therefore, compared with the case where both surfaces of the polyimide films 1A and 1B are swollen, the polyimide films 1A and 1B are less deformed in shape and are easy to handle in the subsequent process. The dimensional accuracy of 15B can be increased.

  Moreover, according to this 1st Embodiment, since the intermediate | middle layer 14 has the support body 3, the rigidity of the film laminated body 101 which bonded two polyimide films 1A and 1B through the intermediate | middle layer 14 increases. Therefore, handling of the film laminate 101 is particularly easy.

  In the first embodiment, the adhesive layers 2A and 2B have higher adhesion strength to the support 3 than the adhesion strength to the polyimide films 1A and 1B. The polyimide films 1A and 1B can be peeled off from the intermediate layer 14 due to the difference in adhesion strength between the adhesive material layers 2A and 2B.

  Next, although the manufacturing method of the single-sided polyimide wiring board of this invention is demonstrated in detail in the Example corresponding to the said 1st Embodiment, this invention is not limited to these Examples.

  In this example, a method for manufacturing a single-sided polyimide wiring board was formed by the steps described below.

  A film laminate 101 having a size of 100 mm × 100 mm was used as an object to be plated. As the film laminate 101, two polyimide films 1A and 1B having a thickness of 50 μm are provided on both surfaces of a support 3 made of polypropylene having a thickness of 100 μm via adhesive layers 2A and 2B made of a silicone-based adhesive. A pasted structure was used.

  Next, the film laminate 101 was immersed in a 50 ° C. aqueous KOH solution for 5 minutes, washed with water for 2 minutes, and then dried for 5 minutes. By this step, the imide ring is hydrolyzed on the surfaces of the polyimide films 1A and 1B that are not in contact with the adhesive layers 2A and 2B, and the modified layers 104A and 104B on the polyimide surface have carboxyl groups. Carboxylic acid potassium salt coordinated with potassium ion was formed.

Next, the carboxylate copper salt was formed by immersing the film laminate 101 in a CuSO ₄ aqueous solution at 30 ° C. for 5 minutes and replacing the potassium ions of the carboxylic acid potassium salts of the modified layers 104A and 104B with copper ions. . This was followed by 5 minutes of water washing.

Then, the film laminate 101 was immersed for 5 minutes NaBH ₄ aqueous solution 30 ° C., and further subjected to a 5 minute washing. At this point, copper ions of the carboxylic acid copper salt were reduced in the modified layers 104A and 104B, and copper was deposited, and metal thin films 4A and 4B were formed on the surfaces of the modified layers 104A and 104B.

  Next, a dry film resist having a thickness of 25 μm was attached to both surfaces of the film laminate 101, and exposure and development were performed to form plating resists 5A and 5B.

  Next, the film laminate 101 was immersed in a copper electroplating solution, and copper electroplating was performed using the metal thin films 4A and 4B as power feeding layers to deposit the plating films 6A and 6B to a thickness of about 20 μm.

  Next, a NaOH aqueous solution was spray-coated on the surface of the film laminate 101 to peel off the plating resists 5A and 5B, and then washed with water for 5 minutes. This process was repeated twice (for two resists 5A and 5B), and the plating resists 5A and 5B on both surfaces of the film laminate 101 were peeled off.

  Next, the film laminate 101 was immersed in a copper etching solution for 3 minutes to remove the metal thin films 4A and 4B in the region where the plating films 6A and 6B were not deposited. This was followed by 5 minutes of water washing.

  Next, 90 degreeC heat | fever was applied to the film laminated body 101, and polyimide film 1A, 1B was peeled off, reducing the adhesive force of adhesive material layer 2A, 2B. This process was also performed twice (for two polyimide films 1A and 1B) to obtain two polyimide films 1A and 1B on which plating films 6A and 6B were formed.

  Thereafter, the polyimide films 1A and 1B were held at a temperature of 350 ° C. for 2 hours in a nitrogen atmosphere. Next, a coverlay is formed on the surfaces of the polyimide films 1A and 1B on which the plating films 6A and 6B are formed, and surface treatment such as Au flash plating is performed on the portions corresponding to the land portions of the plating films 6A and 6B. The single-sided polyimide wiring boards 15A and 15B were fabricated by performing a step of punching into the above shape and a step of bonding with other members.

(Second embodiment)
Next, with reference to FIGS. 10A to 10D and FIGS. 11A to 11D in order, a method for manufacturing a single-sided polyimide wiring board according to the second embodiment of the present invention will be described. FIG. 10A to FIG. 10D and FIG. 11A to FIG. 11D are manufacturing flow diagrams of the method for manufacturing the single-sided polyimide wiring board of the second embodiment.

  In the second embodiment, a 100 mm × 100 mm film laminate 201 is used as an object to be plated. As shown in FIG. 10A, the film laminate 201 has a structure in which two polyimide films 21A and 21B having a thickness of 50 μm are bonded through an adhesive layer 202 as an intermediate layer made of an acrylic adhesive. Things were used.

  Next, the film laminate 201 was immersed in an aqueous KOH solution at 50 ° C. for 5 minutes, washed with water for 2 minutes, and then dried for 5 minutes. By this hydrolysis step, the imide ring is hydrolyzed on the surface of the both surfaces of the polyimide films 21A and 21B that are not in contact with the adhesive layer 102. Thereby, as shown in FIG. 10B, carboxylic acid potassium salts in which potassium ions were coordinated to the carboxyl groups were formed as the modified layers 204A and 204B on the surfaces of the polyimide films 21A and 21B.

Next, in the ion exchange step, the film laminate 201 is immersed in a 30 ° C. CuSO ₄ aqueous solution for 5 minutes, and the carboxylic acid is replaced by copper ions of the potassium ions of the carboxylic acid potassium salts of the modified layers 204A and 204B. A copper salt was formed. This was followed by 5 minutes of water washing.

Next, in the reduction step, the film laminate 201 was immersed in an aqueous NaBH ₄ solution for 5 minutes, and further washed with water for 5 minutes. At this point, copper ions of the carboxylic acid copper salt were reduced and copper was deposited on the surfaces of the modified layers 204A and 204B, and metal thin films 24A and 24B were formed as shown in FIG. 10C.

  Next, as shown in FIG. 10D, a 25 μm-thick dry film resist is applied to the metal thin films 24A and 24B on both surfaces of the film laminate 201, and exposure and development are performed. Plating resists 25A and 25B were formed in the region. Next, in the plating step, the film laminate 201 is immersed in a copper electrolytic plating solution, and copper is electroplated using the metal thin films 24A and 24B as power feeding layers. As shown in FIG. 11A, the metal thin films 24A and 24B Plating films 26A and 26B were deposited in a predetermined region with a thickness of about 20 μm.

  Next, an aqueous NaOH solution was spray applied to the plating resists 25A and 25B on the surface of the film laminate 201, and the plating resists 25A and 25B were peeled off as shown in FIG. 11B, and then washed with water for 5 minutes. . This process was repeated twice, and the plating resists 25A and 25B on both surfaces of the film laminate 101 were peeled off.

  Next, in the etching process, the film laminate 201 was immersed in a copper etching solution for 3 minutes, and as shown in FIG. 11C, the metal thin films 24A and 24B in regions where the plating films 26A and 26B were not deposited were removed. This was followed by 5 minutes of water washing.

  Next, as shown in FIG. 11D, the film laminate 201 was immersed in methyl ethyl ketone at 50 ° C. for 10 minutes, and the two polyimide films 21A and 21B were peeled off while dissolving the adhesive layer 202. Then, it was immersed in isopropyl alcohol for 5 minutes and washed.

  Thereafter, the polyimide films 1A and 1B were held at a temperature of 350 ° C. for 2 hours in a nitrogen atmosphere. Next, a coverlay (not shown) is formed on the surfaces of the polyimide films 21A and 21B on which the plating films 26A and 26B are formed, and surface treatment such as Au flash plating is performed on the portions corresponding to the land portions of the plating films 26A and 26B. A single-sided polyimide wiring board was fabricated by performing a punching process for each wiring board and a bonding process with other members.

  INDUSTRIAL APPLICABILITY The present invention can be widely used in the manufacture of circuit boards such as flexible wiring boards, and the manufacture of circuit boards incorporated in electronic devices typified by portable information devices such as mobile phones that are required to be reduced in size and weight. Useful as a method.

It is a flowchart which shows the manufacturing process by 1st Embodiment of the manufacturing method of the single-sided polyimide wiring board of this invention. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process of the said 1st Embodiment. It is a schematic sectional drawing explaining one manufacturing process by 2nd Embodiment of the manufacturing method of the single-sided polyimide wiring board by this invention. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment. It is a schematic sectional drawing explaining one manufacturing process by the said 2nd Embodiment.

Explanation of symbols

1A, 1B, 21A, 21B Polyimide film 2A, 2B Adhesive layer 3 Support body 4A, 4B, 24A, 24B Metal thin film 5A, 5B, 25A, 25B Plating resist 6A, 6B, 26A, 26B Plating film 14 Intermediate layer 101, 201 Film laminate 202 Adhesive layer 104A, 104B, 204A, 204B Modified layer

Claims (3)

A film laminating step of forming a film laminate by laminating two polyimide films across an intermediate layer;
A hydrolysis step of treating both sides of the film laminate with an alkaline solution;
An ion exchange step of treating both surfaces of the film laminate with a metal ion-containing solution;
A reduction step of treating both sides of the film laminate with a reducing agent to deposit metal films on both sides of the film laminate;
A plating step of forming a plating film in a predetermined region of the metal film on both surfaces of the film laminate;
An etching step of removing the metal film in a region where the plating film is not formed in the plating step and leaving a metal film in a predetermined region where the plating film is formed;
Removing the intermediate layer from the two polyimide films;
A method for producing a single-sided polyimide wiring board, comprising: In the manufacturing method of the single-sided polyimide wiring board of Claim 1,
The said intermediate | middle layer has a support body and the adhesive material layer apply | coated on both surfaces of this support body, The manufacturing method of the single-sided polyimide wiring board characterized by the above-mentioned. In the manufacturing method of the single-sided polyimide wiring board according to claim 1,
The intermediate layer has a support and two adhesive layers sandwiching the support,
The method for producing a single-sided polyimide wiring board, wherein the adhesive strength of the adhesive layer to the support is higher than the adhesive strength of the adhesive layer to the polyimide film.

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