CN111556662A - Flexible circuit board preparation method, flexible circuit board and electronic equipment - Google Patents
Flexible circuit board preparation method, flexible circuit board and electronic equipment Download PDFInfo
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- CN111556662A CN111556662A CN202010344371.7A CN202010344371A CN111556662A CN 111556662 A CN111556662 A CN 111556662A CN 202010344371 A CN202010344371 A CN 202010344371A CN 111556662 A CN111556662 A CN 111556662A
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- copper
- circuit board
- clad plate
- layer
- flexible circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a flexible circuit board preparation method, a flexible circuit board and electronic equipment, wherein the flexible circuit board preparation method comprises the following steps: drilling a hole on a pre-prepared copper-clad plate to form a via hole, wherein a copper ion layer covers the surface of the copper-clad plate; metallizing the through hole on the copper-clad plate to form a conductive metal layer; carrying out circuit manufacturing on the surface covered with the copper ion layer in the copper-clad plate to form a circuit pattern area and a dry film layer; electroplating the circuit pattern area and the conductive metal layer together to form an electroplated layer; performing film removal treatment on the copper-clad plate after electroplating treatment to remove a dry film layer on the copper-clad plate; and carrying out microetching treatment on the copper ion layer which is not covered by the electroplated layer to obtain the flexible circuit board. The method for manufacturing the flexible circuit board can solve the problems of long process flow and high cost of the existing method for manufacturing the flexible circuit board.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a flexible circuit board preparation method, a flexible circuit board and electronic equipment.
Background
A Flexible Printed Circuit (FPC), which is a printed circuit board made of a flexible insulating base material, is an important component in a circuit in the field of communications, and with the rapid development of the electronic industry, the FPC is gradually developed toward high density and high integration, which makes the processing requirement for the FPC higher and higher.
In the prior art, the flexible circuit board is mainly prepared by an etching subtractive method, but the flexible circuit board prepared by the etching subtractive method needs dozens of procedures of electroplating, exposure, development, copper etching and the like, so that the problems of long process flow, high cost and the like exist.
Therefore, how to improve the production efficiency of the flexible circuit board and reduce the production cost of the flexible circuit board is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In order to overcome the above disadvantages of the prior art, the present invention aims to provide a method for manufacturing a flexible printed circuit board, which aims to solve the problems of long process flow and high cost of the existing method for manufacturing a flexible printed circuit board.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a preparation method of a flexible circuit board comprises the following steps:
drilling a hole on a pre-prepared copper-clad plate to form a via hole, wherein a copper ion layer covers the surface of the copper-clad plate;
metallizing the through holes on the copper-clad plate to form a conductive metal layer;
carrying out circuit manufacturing on the surface covered with the copper ion layer in the copper-clad plate to form a circuit pattern area and a dry film layer;
carrying out electroplating treatment on the circuit pattern area and the conductive metal layer together to form an electroplated layer;
performing film removal treatment on the copper-clad plate after the electroplating treatment to remove the dry film layer on the copper-clad plate;
and carrying out microetching treatment on the copper ion layer which is not covered by the electroplated layer to obtain the flexible circuit board.
Further, the step of metallizing the via hole on the copper-clad plate includes:
and metallizing the through holes on the copper-clad plate in a chemical plating, black hole or shadow mode.
Further, the step of manufacturing the circuit on the surface covered with the copper ion layer in the copper-clad plate comprises:
and sequentially pasting a film, exposing and developing on the surface covered with the copper ion layer in the copper-clad plate.
Further, before the step of metallizing the via hole on the copper-clad plate, the method further comprises:
and cleaning the via hole on the copper-clad plate.
Further, before the step of drilling a hole in the pre-prepared copper-clad plate, the method further comprises the following steps:
and conveying the prepared circuit board substrate to a target chamber of an ion implanter for copper ion implantation through a coil conveying device so as to form the copper ion layer on the surface of the circuit board substrate and obtain the copper-clad plate.
Further, the substrate of the circuit board is made of any one of a liquid crystal polymer material, a polyimide material, a modified polyimide material and a PET material.
Further, the thickness of the copper ion layer is 0.5-3 microns.
Further, in the step of performing microetching treatment on the copper ion layer which is not covered by the electroplated layer, the microetching solution used in the microetching treatment is any one of a hydrogen peroxide-sulfuric acid system, an ammonium persulfate-sulfuric acid system, and a sodium persulfate-sulfuric acid system.
Correspondingly, the invention further provides a flexible circuit board which is prepared by the flexible circuit board preparation method.
Correspondingly, the invention further provides electronic equipment comprising the flexible circuit board.
Compared with the prior art, the invention has the beneficial effects that:
compared with the traditional etching subtractive method, the preparation method of the flexible circuit board provided by the invention not only effectively shortens the process flow of the flexible circuit board and saves the production cost, but also can avoid a large amount of copper etching, reduces the use of chemical liquid medicine and is more environment-friendly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a flexible printed circuit board according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a circuit board substrate coated with copper by an ion implantation method according to an embodiment of the present invention.
Description of reference numerals:
1-copper ion layer, 2-circuit board substrate, 3-conducting hole, 4-conducting metal layer, 5-dry film layer, 6-circuit pattern area, 7-electroplated layer, 8-coil conveying device and 9-copper target material.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention, and the described embodiments are merely a subset of the embodiments of the present invention, rather than a complete embodiment. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a flexible circuit board, including the following steps:
step S1, drilling a hole on a pre-prepared copper-clad plate to form a via hole 3, wherein the surface of the copper-clad plate is covered with a copper ion layer 1;
step S2, metallizing the via hole 3 on the copper-clad plate to form a conductive metal layer 4;
step S3, carrying out circuit manufacturing on the surface covered with the copper ion layer 1 in the copper-clad plate to form a circuit pattern area 6 and a dry film layer 5;
step S4, the circuit pattern area 6 and the conductive metal layer 4 are electroplated together to form an electroplated layer 7;
step S5, performing film removing treatment on the copper-clad plate after electroplating treatment to remove the dry film layer 5 on the copper-clad plate;
step S6, microetching the copper ion layer 1 not covered by the plating layer 7 to obtain a flexible circuit board.
In the step S1, the copper clad plate mainly includes a circuit board substrate 2 and a copper ion layer 1 covering the circuit board substrate 2, and may be a single-sided copper clad plate (that is, the copper ion layer 1 is disposed on the top surface or the bottom surface of the circuit board substrate 2), or a double-sided copper clad plate (that is, the copper ion layer 1 is disposed on both the top surface and the bottom surface of the circuit board substrate 2), where the circuit board substrate is a non-metal substrate known to those skilled in the art, and this embodiment is not particularly limited thereto, and in this embodiment, the material of the circuit board substrate 2 is preferably a liquid crystal Polymer (i.e., Liquid Crystal Polymer (LCP) material, a polyimide (i.e., polyimide film, PI) material, a Modified polyimide (i.e., Modified polyimide film, MPI) material, or a PET (Polyethylene terephthalate film, PT for short) material; the drilling is a machining method well known to those skilled in the art, and may be a mechanical drilling method, a laser drilling method, or other drilling methods; in this step, according to the design demand drill hole on the copper-clad plate, can form required one or more simultaneously through copper ion layer 1 and circuit board base member 2 conducting hole 3 on the copper-clad plate, conducting hole 3 can be the blind hole also can be the through-hole, wherein, when the copper-clad plate is the single face copper-clad plate, the structural style of conducting hole 3 can be the blind hole also can be the through-hole, and when the copper-clad plate is the two-sided copper-clad plate, the structural style of conducting hole 3 is the through-hole.
In the step S2, the metallization method is a metallization method known to those skilled in the art, and this embodiment is not particularly limited thereto, and in this embodiment, the via hole 3 on the copper-clad plate is preferably metallized by electroless plating, black hole or shadow. In this step, the conductive metal layer 4 formed on the wall of the via hole 3 is a conductive layer well known to those skilled in the art, and this embodiment is not limited to this, and in this embodiment, the conductive metal layer 4 is preferably a silver layer, a copper layer, an aluminum layer, a zinc layer, a nickel layer, a zinc layer or a tin layer, wherein, considering the combination of cost and conductive performance, the conductive metal layer 4 is more preferably a copper layer; the thickness of the conductive metal layer 4 is preferably 0.01-0.8 micrometers. In the step, the conducting hole 3 on the copper-clad plate is metallized, so that the printed conducting wires between the layers of the circuit board can be reliably communicated with each other through the conducting metal layer 4 attached to the inner wall of the conducting hole 3.
In the above step S3, the circuit manufacturing method may be a circuit pattern transferring process known to those skilled in the art, for example, the circuit pattern transferring process may be a printing process, an exposure and development process, and the present embodiment is not limited to this specifically, in the present embodiment, it is preferable that the circuit manufacturing is performed on the surface of the copper-clad plate covered with the copper ion layer 1 by using the exposure and development process, that is, the surface of the copper-clad plate covered with the copper ion layer 1 is sequentially subjected to film pasting, exposure and development, and the specific process is as follows:
film pasting: coating photosensitive ink on the surface of the copper ion layer 1 to form a photosensitive ink layer with uniform thickness;
exposure: laying a positive film with patterns on the photosensitive ink layer, and then exposing through an exposure machine to transfer the patterns on the positive film to the photosensitive ink layer;
and (3) developing: the pattern area in the photosensitive ink layer is removed by the developer to form the line pattern area 6, and the area in the photosensitive ink layer not removed by the developer is retained on the surface of the copper ion layer 1 to form the dry film layer 5.
In the step S4, by electroplating the circuit pattern region 6 and the conductive metal layer 4 attached to the inner wall of the via hole 3 at the same time, the electroplated layer 7 with uniform thickness can be formed in the circuit pattern region 6 and the via hole 3, so that the requirements of the circuit board for the high aspect ratio and the conductive layer plated in the small hole can be met, and the communication reliability of the via hole 3 is improved; the electroplated layer 7 is preferably a silver plated layer, a copper plated layer, an aluminum plated layer, a zinc plated layer, a nickel plated layer, a zinc plated layer or a tin plated layer, wherein the electroplated layer 7 is more preferably a copper plated layer in consideration of the comprehensive cost and the conductive performance; wherein, the thickness of the electroplated layer 7 is preferably 0.1 to 3 microns.
In the step S5, during the electroplating process, the film is sandwiched between the electroplated layers 7 due to the continuous thickening of the electroplated layers 7, so that the dry film layer 5 on the copper ion layer 1 needs to be removed by a film removing chemical, and after the dry film layer 5 is removed, the copper ion layer 1 and the electroplated layers 7 on the circuit pattern region 6 remain on the surface of the circuit board substrate.
In the above step S6, by performing microetching treatment on the copper ion layer 1 not covered by the plating layer 7 (i.e., the region of the copper ion layer 1 covered by the original dry film layer 5), the copper ion layer 1 not covered by the plating layer 7 can be removed, and the region from which the copper ion layer 1 is removed can expose the surface of the wiring board base body 2, and the remaining plating layer 7 is fused with the copper ion layer 1 covered by the plating layer 7 to form a conductive pattern layer, thereby producing a flexible wiring board; the microetching solution used for the microetching treatment can be selected according to the property of the copper ion layer 1, and in this embodiment, the microetching solution used for the microetching treatment is preferably a hydrogen peroxide-sulfuric acid system, an ammonium persulfate-sulfuric acid system, or a sodium persulfate-sulfuric acid system.
Further, in a preferred embodiment, before the step of metallizing the holes on the copper-clad plate, the method further comprises:
and cleaning the via hole 3 on the copper-clad plate.
In the embodiment, after the via hole 3 is drilled in the copper-clad plate, non-metallic residues may remain on the inner wall of the via hole 3, and the embodiment can remove the remaining non-metallic residues by cleaning the via hole 3 after drilling, so that the inner wall of the via hole 3 is smooth and clean, and the effect of subsequent hole metallization is improved; the cleaning process may be performed in a manner known to those skilled in the art, and this embodiment is not particularly limited thereto.
Further, referring to fig. 2, before the step of drilling a hole in the pre-prepared copper-clad plate, the method further includes:
and conveying the prepared circuit board substrate 2 to a target chamber of an ion implanter for copper ion implantation through a coil conveying device 8 to form a copper ion layer 1 on the surface of the circuit board substrate 2, thereby obtaining the copper-clad plate.
In this embodiment, the process of performing copper ion implantation specifically includes: under the action of an ion source in an ion implanter, copper ions are ionized from a copper target 9, the copper ions are accelerated by an accelerator in the ion implanter to obtain higher energy, and are focused by a four-stage lens in the ion implanter and then enter a target chamber of the ion implanter, when a coil conveying device 8 conveys a circuit board substrate 2 to the target chamber, the copper ions cover the surface of the circuit board substrate 2 to form a copper ion layer 1, and thus a single-sided copper-clad plate or a double-sided copper-clad plate is obtained (the copper-clad plate with the required size can be cut out as required in the subsequent preparation of a flexible circuit board). In the embodiment, the copper-clad plate with uniform thickness can be obtained by carrying out copper cladding on the circuit board base body 2 in an ion implantation mode, and meanwhile, the manufacturing efficiency of the copper-clad plate can be greatly improved by adopting a roll-to-roll continuous production mode, so that the production cost is further saved. In this embodiment, the conveying speed of the coil conveying device 8 is 0.1-10 m/s, and when the copper clad laminate is manufactured, the thickness of the copper ion layer 1 covering the surface of the circuit board substrate 2 can be controlled by controlling the conveying speed of the coil conveying device 8 to meet different product requirements, for example, when the thickness of the copper ion layer 1 on the surface of the circuit board substrate 2 needs to be increased, the speed of the coil conveying device 8 can be slowed, wherein, preferably, the thickness of the copper ion layer 1 is 0.5-3 micrometers.
According to the preparation method of the flexible circuit board, the via hole 3 is drilled on the copper-clad plate, and then the via hole 3 is metalized, so that printed leads among layers of the circuit board can be mutually communicated; then, a circuit pattern area 6 and a dry film layer 5 are manufactured on the copper-clad plate, and then the circuit pattern area 6 and the via hole 3 are electroplated together, so that an electroplated layer 7 with uniform thickness can be formed in the circuit pattern area 6 and the via hole 3; then removing the dry film layer 5, selectively micro-etching the copper ion layer 1 on the circuit board substrate 2 after removing the dry film layer 5, thereby obtaining the flexible circuit board with the line width and the line distance below 30/30 micrometers; compared with the traditional etching subtractive method, the method not only greatly shortens the process flow of the flexible circuit board and saves the production cost, but also can avoid etching a large amount of copper, reduces the use of chemical liquid medicine and is more environment-friendly; meanwhile, the manufacturing process is not influenced by the thickness of copper, and a circuit pattern with the line width and the line distance of below 30/30 micrometers can be processed, so that the integration degree of the flexible circuit board is improved.
Correspondingly, the embodiment of the invention also provides a flexible circuit board which is prepared by the flexible circuit board preparation method in any one of the embodiments.
In the embodiment, due to the improvement of the method for manufacturing the flexible circuit board, the flexible circuit board manufactured by the method has the advantages of fine lines and low cost.
Correspondingly, the embodiment of the invention also provides electronic equipment comprising the flexible circuit board.
In this embodiment, the electronic device may be a smart device such as a smart phone or a tablet computer.
It should be noted that, other contents of the flexible circuit board, the flexible circuit board and the electronic device disclosed by the present invention can be referred to in the prior art, and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. A preparation method of a flexible circuit board is characterized by comprising the following steps:
drilling a hole on a pre-prepared copper-clad plate to form a via hole, wherein a copper ion layer covers the surface of the copper-clad plate;
metallizing the through holes on the copper-clad plate to form a conductive metal layer;
carrying out circuit manufacturing on the surface covered with the copper ion layer in the copper-clad plate to form a circuit pattern area and a dry film layer;
carrying out electroplating treatment on the circuit pattern area and the conductive metal layer together to form an electroplated layer;
performing film removal treatment on the copper-clad plate after the electroplating treatment to remove the dry film layer on the copper-clad plate;
and carrying out microetching treatment on the copper ion layer which is not covered by the electroplated layer to obtain the flexible circuit board.
2. The method for preparing the flexible circuit board according to claim 1, wherein the step of metallizing the via holes on the copper-clad plate comprises:
and metallizing the through holes on the copper-clad plate in a chemical plating, black hole or shadow mode.
3. The method for preparing the high-frequency flexible circuit board according to claim 1, wherein the step of manufacturing the circuit on the surface of the copper-clad plate covered with the copper ion layer comprises the following steps:
and sequentially pasting a film, exposing and developing on the surface covered with the copper ion layer in the copper-clad plate.
4. The method for preparing the flexible circuit board according to claim 1, wherein before the step of metallizing the via holes on the copper-clad plate, the method further comprises:
and cleaning the via hole on the copper-clad plate.
5. The method for preparing the flexible circuit board according to claim 1, wherein before the step of drilling the pre-prepared copper-clad plate, the method further comprises the following steps:
and conveying the prepared circuit board substrate to a target chamber of an ion implanter for copper ion implantation through a coil conveying device so as to form the copper ion layer on the surface of the circuit board substrate and obtain the copper-clad plate.
6. The method for manufacturing the flexible circuit board according to claim 5, wherein the material of the circuit board substrate is any one of a liquid crystal polymer material, a polyimide material, a modified polyimide material and a PET material.
7. The method for manufacturing a flexible circuit board according to any one of claims 1 to 6, wherein the thickness of the copper ion layer is 0.5 to 3 μm.
8. The method for manufacturing a flexible circuit board according to any one of claims 1 to 6, wherein in the step of performing microetching treatment on the copper ion layer not covered by the plating layer, the microetching treatment uses a microetching solution selected from the group consisting of a hydrogen peroxide solution-sulfuric acid system, an ammonium persulfate-sulfuric acid system, and a sodium persulfate-sulfuric acid system.
9. A flexible circuit board produced by the flexible circuit board production method according to any one of claims 1 to 8.
10. An electronic device characterized by comprising the flexible circuit board according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010344371.7A CN111556662A (en) | 2020-04-27 | 2020-04-27 | Flexible circuit board preparation method, flexible circuit board and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010344371.7A CN111556662A (en) | 2020-04-27 | 2020-04-27 | Flexible circuit board preparation method, flexible circuit board and electronic equipment |
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| CN111556662A true CN111556662A (en) | 2020-08-18 |
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| CN202010344371.7A Pending CN111556662A (en) | 2020-04-27 | 2020-04-27 | Flexible circuit board preparation method, flexible circuit board and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115846646A (en) * | 2022-12-09 | 2023-03-28 | 开封夸克新材料有限公司 | Modified PET flexible circuit board, preparation method and application thereof |
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| CN102021576A (en) * | 2010-09-30 | 2011-04-20 | 深圳市信诺泰创业投资企业(普通合伙) | Method for continuously producing flexible copper clad laminates |
| CN202121860U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Flexible circuit board used for precision electronic device |
| JP2013004619A (en) * | 2011-06-14 | 2013-01-07 | Daitech Inc | Flexible wiring board and manufacturing method therefor |
| CN108718485A (en) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | A kind of semi-additive process technology of the two-sided FPC of manufacture filament thickness copper |
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2020
- 2020-04-27 CN CN202010344371.7A patent/CN111556662A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102021576A (en) * | 2010-09-30 | 2011-04-20 | 深圳市信诺泰创业投资企业(普通合伙) | Method for continuously producing flexible copper clad laminates |
| JP2013004619A (en) * | 2011-06-14 | 2013-01-07 | Daitech Inc | Flexible wiring board and manufacturing method therefor |
| CN202121860U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Flexible circuit board used for precision electronic device |
| CN108718485A (en) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | A kind of semi-additive process technology of the two-sided FPC of manufacture filament thickness copper |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115846646A (en) * | 2022-12-09 | 2023-03-28 | 开封夸克新材料有限公司 | Modified PET flexible circuit board, preparation method and application thereof |
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Application publication date: 20200818 |