CN103582306A - Printed circuit board manufacturing method - Google Patents
Printed circuit board manufacturing method Download PDFInfo
- Publication number
- CN103582306A CN103582306A CN201310007239.7A CN201310007239A CN103582306A CN 103582306 A CN103582306 A CN 103582306A CN 201310007239 A CN201310007239 A CN 201310007239A CN 103582306 A CN103582306 A CN 103582306A
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- Prior art keywords
- dry film
- copper foil
- pth
- double
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Abstract
A printed circuit board manufacturing method is provided to reduce a copper plating thickness deviation by processing light exposure and copper plating on only one side without removing a release paper of the other side. CONSTITUTION: A developing solution is permeated into a PTH(Plated Through Hole). A dry film coated on the other side is removed(S50). Electric copper plating is performed on a double-sided flexible copper foil laminating plate(S60). The dry film and a release paper on both sides of the flexible copper foil laminating plate are peeled(S70). A circuit is formed on the flexible copper foil laminating plate(S80). [Reference numerals] (AA) Start; (BB) End; (S10) 1st process processing a PTH; (S20) 2nd process performing an electroless copper plating; (S30) 3rd process coating a dry film and release paper; (S40) 4th process performing an exposure process; (S50) 5th process penetrating a developing solution and removing a dry film on the other side; (S60) 6th process performing an electric copper plating; (S70) 7th process peeling a dry film and a release paper on both sides of the flexible copper foil laminating plate; (S80) 8th process forming a circuit
Description
Technical field
The manufacture method of printed circuit board (PCB) of the present invention, more particularly, the present invention relates to for improving the manufacture method of the printed circuit board (PCB) of fine pattern (FINE PATTERN) and bendability on the mobile phone of lightweight day by day, thin type or the printed circuit board (PCB) of these products of LCD.
Background technology
Printed circuit board (PCB), for example, the high-precision densification of flexible (flexible) printed circuit board (PCB), change and lightweight aspect has obtained remarkable progress as thin as a wafer, therefore high-precision densification and the miniaturization of formed circuit pattern (circuit pattern) are obvious especially.
And, on printed circuit board (PCB), be formed with a lot of fine vias (through hole) for conducting double-sided circuit pattern and installation semiconductor device.
But, manufacture and the conducting (electrical conduction) of relevant this via in the manufacturing process of printed circuit board (PCB), use representative method is the gold-plated method of full plate (panelplating method) and the gold-plated method of button (button plating method) always.
The gold-plated method > > of the full plate of < <
In the complete gold-plated method of plate, at two-sided (surface and the back side) of insulation material (insulating material), distinguish the base material of copper foil (copper foil), first, get out after the perforation that a plurality of vias use, perforation inside is done after conductive treatment (conductive process) (electrically conduct), whole base material is done electro-coppering (copper electroplating), and, gold-plated according to this full plate, the base material that forms conducting after the copper facing of perforation internal electrical passes through known exposure (exposure) in order, develop (development), etching (etching), the wiring step (patterningstep) of peeling off striping (stripping) forms circuit pattern, manufacture thus printed circuit board (PCB).
But, the gold-plated method of this full plate is noted, because not only perforation is inner, two-sided Copper Foil is also all by copper facing, the printed circuit board (PCB) double-sided circuit pattern producing is also by copper facing, its flexibility of reduction and bendability that like this can be relative, the difficult problem that weight is also increased in addition, and be considered to a very important problem for this point of flexible print wiring board.
< < is new, the gold-plated method > > of old button
Therefore, overcome a difficult problem for these autofrettages, and develop the gold-plated method of button, paying attention to flexibility and bendability, even in the field of light weight, just become main flow at present.
The gold-plated method of this button, first on base material, get out after the perforation that a plurality of vias use, conductive processing is done in perforation inside, next base material is covered with to photosensitive dry film (photosensitive dry film), in its outside, add the light shield (photo mask) of negative photomask (negative mask), after photosensitive dry film as resist plating (plating resist) exposes, develops thus, the perforation of opening is inner becomes button portion with the electro-coppering of button (button) shape generally with the around openings of perforation.And according to the gold-plated method of this button, the base material that the copper facing such as perforation form, forms circuit pattern through wiring step, manufactures thus printed circuit board (PCB).
But for the gold-plated method of this existing button (hereinafter to be referred as the gold-plated method of old button), the inconsistent situation in position (concrete plating position) that is noted each corresponding position on each punch position of base material and light shield has a lot.
Both, in the aobvious gold-plated method of button having, flexible and the operator of base material or light shield is difficult to the with the naked eye check and correction reasons such as position between the two the inconsistent situation in position is had a lot, the inconsistent reasons such as bad (disconnection defect) that opens circuit that becomes of this position.
Fig. 1 to Fig. 2 is the artwork of existing board, printed circuit board manufacturing method.
By Fig. 1, describe, first get out after the perforation that a plurality of vias use, for described perforation additional guide is electrically done without electrolytics copper and processed.Next in both sides coatings dry film and release liners exposure, then remove the release liners on two-sided.Next carry out removing the dry film that there is no sclerosis, the making of completing circuit plate after copper facing.
, although the described aobvious manufacture method having is conducive to form meticulous (FINE) pattern, when exposing, in order to prevent inclined to one side hole, the size that forms pad with respect to the size in hole is larger, therefore has the shortcoming that reduces design freedom.
By Fig. 2, describe, first get out after the perforation that a plurality of vias use, for described perforation additional guide is electrically done without electrolytics copper and processed.Next only at coated on one side dry film to develop, then expose, then remove release liners.Next the same dry film of coating overleaf develops, then exposes, and then removes release liners.
Next carry out after copper facing, remove the dry film that there is no sclerosis, the making of completing circuit plate.
Manufacture method as above is hole partially, and the size that can reduce pad has advantages of freely and design, still increases process sequences and is unfavorable for stretching, and has the productive problem of reduction.
Prior art document
Patent documentation
(patent documentation 1) Koran Office's registered patent is announced No. 10-0700272
Summary of the invention
The technical problem to be addressed by invention
The present invention will solve the aobvious problem that has as above, the object of the invention is to provide and once forms the button (BUTTON) that button (BUTTON) can form again sizes, while forming button (BUTTON) with little size, manufacture method that can free designing printed circuit board.
In addition, the invention provides and do not removing under the state of back side release liners, carry out exposure and the copper plating treatment of one side, can remove the manufacture method that produces the printed circuit board (PCB) of copper facing deviation at the less position of pad size.
Solve the technical scheme of problem
The present invention, in order to reach foregoing object, realizes by having the embodiment forming as follows.
Feature of the present invention is included in a double-faced flexible copper foil laminates and bores processing for the PTH hole (HOLE of BVH with ultraviolet laser brill or CNC, 1) the 1st operation (S10), with without electrolytics copper facing to the hole (HOLE forming on a described double-faced flexible copper foil laminates, 1) the 2nd electrical operation (S20) of additional guide, the 3rd operation (S30) of the double spread dry film of a described double-faced flexible copper foil laminates and release liners, the one side of a double-faced flexible copper foil laminates of manufacturing in described the 3rd operation is by the 4th operation (S40) of the part exposure beyond the PTH for BVH, dry film and release liners that removal exposes in described the 4th operation, open PTH is soaked into developer solution and remove the 5th operation (S50) at the dry film of another side coating, the 6th operation (S60) that the double-faced flexible copper foil laminates forming in described the 5th operation (S50) carries out electro-coppering, a double-faced flexible copper foil laminates in the 6th operation (S60) after copper facing is peeled off the 7th operation (S70) of two-sided dry film and release liners, on a double-faced flexible copper foil laminates of manufacturing, form the 8th operation (S80) of circuit in the 7th operation (S70).
In described the 4th operation (S40), it is characterized in that the egative film location that is placed in one side makes the part printing opacity beyond PTH expose, to form the PTH of open form.
In described the 5th operation (S50), it is characterized in that soaking at PTH the operation of developer solution, described developer solution soaks into the PTH of substrate (E), to dissolve, remove the dry film (3) that is positioned at another side, therefore once form the button (BUTTON) that button (BUTTON) can form again sizes.
In described the 6th operation (S60), it is characterized in that carrying out copper facing under the state of another side placement release liners, therefore at the little position of pad size, can prevent from forming copper facing deviation.
Beneficial effect
The present invention is according to providing following effect as this front formation.
According to the manufacture method of printed circuit board (PCB) of the present invention, after thering is the stability in hole and forming button, in pattern process, can form the effect of fine pattern (FINE PATTERN), and copper-plated thickness deviation is little, electroplating thickness by each model does not have significant difference, has the effect that is easy to set early development product condition.
In addition, there is no inclined to one side hole when the present invention exposes, pad diminishes and has the effect freely designing, and simplifies technique and increases productive effect.
Accompanying drawing explanation
Fig. 1 to Fig. 2 is the artwork of the manufacture method of existing printed circuit board (PCB).
Fig. 3 is according to one embodiment of the invention, the flow chart of the manufacture method of printed circuit board (PCB).
Fig. 4 is according to one embodiment of the invention, the artwork of the manufacture method of printed circuit board (PCB).
The explanation > of the main pictorial symbolization of <
1: hole 2: conductive membrane
3: dry film 4: release liners
5: copper facing
Embodiment
Below in conjunction with accompanying drawing, the manufacture method according to printed circuit board (PCB) of the present invention is described in detail.Be noted that in these accompanying drawings same inscape is represented with unified number anywhere as far as possible.To emphasis of the present invention, can produce the unnecessary known function of obscuring and formation in addition, the description thereof will be omitted.
Fig. 3 is according to one embodiment of the invention, the flow chart of the manufacture method of printed circuit board (PCB), and Fig. 4 is according to one embodiment of the invention, the artwork of the manufacture method of printed circuit board (PCB).
The manufacture method of printed circuit board (PCB) according to an embodiment of the invention, it is included in, and a double-faced flexible copper foil laminates bores with ultraviolet laser or CNC bores processing for the PTH hole (HOLE of BVH, 1) the 1st operation (S10), with without electrolytics copper facing to the hole (HOLE forming on a described double-faced flexible copper foil laminates, 1) the 2nd electrical operation (S20) of additional guide, the 3rd operation (S30) of the double spread dry film of a described double-faced flexible copper foil laminates and release liners, the one side of a double-faced flexible copper foil laminates of manufacturing in described the 3rd operation is by the 4th operation (S40) of the part exposure beyond the PTH for BVH, dry film and release liners that removal exposes in described the 4th operation, open PTH is soaked into developer solution and remove the 5th operation (S50) at the dry film of another side coating, the 6th operation (S60) that the double-faced flexible copper foil laminates forming in described the 5th operation (S50) carries out electro-coppering, a double-faced flexible copper foil laminates in the 6th operation (S60) after copper facing is peeled off the 7th operation (S70) of two-sided dry film and release liners, on a double-faced flexible copper foil laminates of manufacturing, form the 8th operation (S80) of circuit in the 7th operation (S70).
Described the 1st operation (S10) is the operation at printed circuit board (PCB) machining hole, general printed circuit board (PCB) is that the two-sided lamination Copper Foil at dielectric film forms and (is referred to as below " substrate ", as shown in Figure 4, the drawing symbol of substrate is called (E)), in the 1st operation (S10), the hole (HOLE, 1) of processing is in a printed circuit board, to form the most minute apertures (minutes pore) that run through between two-sided (surface and the back side) (one side and another side).Also have, described hole (HPOLE, 1) is for the two-sided circuit pattern of conducting, or (and) for sticking together assembling (mounting) at the semiconductor device of circuit pattern etc.The aperture in hole (HOLE, 1) be 0.2mm above～more and more below 0.5mm, also there is the 0.1mm left and right with boring method, with the hole of the 0.05mm left and right of laser drill method.
Described the 2nd operation (S20) is the operation of carrying out chemical copper processing, carries out chemical copper process and form conductive membrane (2) at the substrate of machining hole (HOLE, 1).Described chemical copper is processed and is referred to electroless plating process for copper, also referred to as chemistry or catalyst copper facing.It is electrical that the inwall in described hole (HOLE, 1) is covered with conductive copper additional guide, and copper-plated thickness is 0.3～1.0 μ m, and catalyst is mainly used Pd.In addition, instead of chemical copper carries out Direct Electrolysis copper facing (Direct plating) and processes that also it doesn't matter in the 2nd operation (S20) of the present invention.
Described the 3rd operation (S30) is the operation of coating dry film (3) and release liners (4), in the two-sided heat with appointment of substrate (E) and the coating of pressure compression of doing chemical copper processing, dry film (3) and release liners (4) is close on printed circuit board (PCB).
The operation that substrate (E) one side that described the 4th operation (S40) is double spread dry film (3) and release liners (4) is exposed, the upper coupling egative film of described dry film (3) and release liners (4), luminous energy is provided between exposure period, so that the pattern image needing develops, now do not have the release liners (4) of sclerosis to remove with medicine.
Described the 5th operation (S50) is to hole (HOLE, 1) operation that the PTH that additional guide electrically forms soaks into developer solution, as as described in the 4th operation record, dry film (3) and release liners (4) settle egative film that PTH part in addition can be exposed by printing opacity above, to form the described PTH of open form.In order to remove, do not have the release liners (4) of sclerosis to utilize developer solution to peel off, now, the PTH that developer solution soaks into substrate makes to dissolve the dry film (3) that is placed in the back side.
Described the 6th operation (S60) is to the copper-plated operation of PTH, so as described conductive membrane (2) form above copper facing (5).Electro-coppering is that the inwall in pattern and hole is used electroprecipitation method to plate 2 copper facing operations of specific thickness copper, and its precipitation capacity is decided by current density and sedimentation time.Now, the dry film (3) due to the developer solution back side of soaking in described the 5th operation (S50) dissolves, so copper facing (5) is processed rear copper facing to the copper layer of quilt cover.
Described the 7th operation (S70) is the two-sided operation of peeling off dry film and release liners in flexible copper foil laminated plates, by peeling off as mentioned above, removes dry film (3) and release liners (4), makes can easily form microfine circuit on the surface of copper laminated plates.
Described the 8th operation (S80) is the operation that finally forms the pad formation circuit in P/T and hole on substrate.
Above, although various embodiments of the present invention is illustrated, these embodiment only realize an embodiment of the technology of the present invention thought, and natural, any modification or the fixed case that realize the technology of the present invention thought all belong to scope of the present invention.
Claims (4)
1. the manufacture method of printed circuit board (PCB), is characterized in that comprising:
At a double-faced flexible copper foil laminates, with ultraviolet laser brill or CNC, bore processing for the PTH hole (HOLE of BVH, 1) the 1st operation (S10), with without electrolytics copper facing to the hole (HOLE forming on a described double-faced flexible copper foil laminates, 1) the 2nd electrical operation (S20) of additional guide, the 3rd operation (S30) of the double spread dry film of a described double-faced flexible copper foil laminates and release liners, the one side of a double-faced flexible copper foil laminates of manufacturing in described the 3rd operation is by the 4th operation (S40) of the part exposure beyond the PTH for BVH, dry film and release liners that removal exposes in described the 4th operation, open PTH is soaked into developer solution and remove the 5th operation (S50) at the dry film of another side coating, the 6th operation (S60) that the double-faced flexible copper foil laminates forming in described the 5th operation (S50) carries out electro-coppering, a double-faced flexible copper foil laminates in the 6th operation (S60) after copper facing is peeled off the 7th operation (S70) of two-sided dry film and release liners, on a double-faced flexible copper foil laminates of manufacturing, form the 8th operation (S80) of circuit in the 7th operation (S70).
2. the manufacture method of printed circuit board (PCB) according to claim 1, is characterized in that the egative film location that is placed in one side in described the 4th operation (S40) makes the part printing opacity beyond PTH expose, to form the PTH of open form.
3. the manufacture method of printed circuit board (PCB) according to claim 1, it is characterized in that described the 5th operation (S50) is at PTH, to soak into the operation of developer solution, described developer solution soaks into the PTH of substrate (E), to dissolve, remove the dry film (3) that is positioned at another side, therefore once form the button (BUTTON) that button (BUTTON) can form again sizes.
4. the manufacture method of printed circuit board (PCB) according to claim 1, is characterized in that in described the 6th operation (S60) it being to carry out copper facing under the state of another side placement release liners, therefore at the little position of pad size, can prevent from forming copper facing deviation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120085597A KR101201948B1 (en) | 2012-08-06 | 2012-08-06 | The printed circuit board manufacturing method |
| KR10-2012-0085597 | 2012-08-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103582306A true CN103582306A (en) | 2014-02-12 |
| CN103582306B CN103582306B (en) | 2016-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310007239.7A Active CN103582306B (en) | 2012-08-06 | 2013-01-09 | The manufacture method of printed circuit board (PCB) |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101201948B1 (en) |
| CN (1) | CN103582306B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105714277A (en) * | 2014-12-03 | 2016-06-29 | 珠海方正科技多层电路板有限公司 | Dry film, electrical device element metal-plating method and circuit preparation method for circuit board |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211600B (en) * | 2016-07-28 | 2019-03-05 | 陈国富 | The production method that the LED printed wiring board of copper etching area can be saved |
| CN114286526B (en) * | 2021-12-02 | 2023-08-25 | 宜兴硅谷电子科技有限公司 | Copper reduction process of printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1798484A (en) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
| US20070261234A1 (en) * | 2006-05-10 | 2007-11-15 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing build-up printed circuit board |
| CN100482046C (en) * | 2004-10-04 | 2009-04-22 | 株式会社丸和制作所 | Printed circuit board manufacturing method |
| KR20120007909A (en) * | 2010-07-15 | 2012-01-25 | 주식회사 에스아이 플렉스 | Printed wiring board manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4099501B2 (en) | 2004-10-04 | 2008-06-11 | 株式会社丸和製作所 | Printed circuit board manufacturing method |
-
2012
- 2012-08-06 KR KR1020120085597A patent/KR101201948B1/en active IP Right Grant
-
2013
- 2013-01-09 CN CN201310007239.7A patent/CN103582306B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100482046C (en) * | 2004-10-04 | 2009-04-22 | 株式会社丸和制作所 | Printed circuit board manufacturing method |
| CN1798484A (en) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
| US20070261234A1 (en) * | 2006-05-10 | 2007-11-15 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing build-up printed circuit board |
| KR20120007909A (en) * | 2010-07-15 | 2012-01-25 | 주식회사 에스아이 플렉스 | Printed wiring board manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105714277A (en) * | 2014-12-03 | 2016-06-29 | 珠海方正科技多层电路板有限公司 | Dry film, electrical device element metal-plating method and circuit preparation method for circuit board |
| CN105714277B (en) * | 2014-12-03 | 2019-08-30 | 珠海方正科技多层电路板有限公司 | The circuit manufacturing method of dry film, the method for plating metal of electric elements and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103582306B (en) | 2016-08-10 |
| KR101201948B1 (en) | 2012-11-16 |
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