CN114007343B - Printed circuit board electro-thick gold, printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board electro-thick gold, printed circuit board and manufacturing method thereof Download PDFInfo
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- CN114007343B CN114007343B CN202111231869.3A CN202111231869A CN114007343B CN 114007343 B CN114007343 B CN 114007343B CN 202111231869 A CN202111231869 A CN 202111231869A CN 114007343 B CN114007343 B CN 114007343B
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- copper
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- 229910052737 gold Inorganic materials 0.000 title claims abstract description 170
- 239000010931 gold Substances 0.000 title claims abstract description 170
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 168
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 259
- 239000011889 copper foil Substances 0.000 claims abstract description 159
- 229910052802 copper Inorganic materials 0.000 claims abstract description 100
- 239000010949 copper Substances 0.000 claims abstract description 100
- 238000005530 etching Methods 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 43
- 238000009713 electroplating Methods 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000725 suspension Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 371
- 230000008021 deposition Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000011161 development Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- 239000012670 alkaline solution Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003929 acidic solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to an electric thick gold of a printed circuit board, the printed circuit board and a manufacturing method thereof. The manufacturing method of the electrical thick gold of the printed circuit board comprises the following steps: providing a plate substrate, wherein the plate substrate comprises a copper foil layer, and a non-electric gold site and an electric gold site are arranged on the copper foil layer; forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-gold position, etching a first circuit pattern layer on the electroplated copper layer, and thinning the thickness of the copper layer at the position corresponding to the gold position; forming a thick gold layer on the surface of the copper foil layer corresponding to the gold level, and etching a second circuit pattern layer on the thick gold layer. The printed circuit board electric thick fitting provided by the invention has the advantages of difficult occurrence of copper suspension, good product quality, simple manufacturing method and easy industrialization realization.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to an electric thick gold of a printed circuit board, the printed circuit board and a manufacturing method thereof.
Background
The copper suspension phenomenon often occurs to the electro-thick gold formed by the existing printed circuit board due to the influence of etching of alkaline liquid medicine on the copper layer at the bottom of the electro-thick gold, so that the quality problems of uneven electro-coppering, incapability of welding in the assembly process, abnormal high-speed signal transmission and the like are caused.
How to reduce the influence of the copper suspension phenomenon on the quality of printed circuit board products is becoming an urgent problem to be solved in the field of printed circuit board manufacturing.
Disclosure of Invention
The present application aims to solve at least one of the technical problems in the prior art described above. Therefore, the embodiment of the application provides a printed circuit board electro-thick gold, a printed circuit board and a manufacturing method thereof, so as to improve the influence of the existing copper suspension phenomenon on the quality of the printed circuit board product.
A first aspect of an embodiment of the present application provides a method for manufacturing an electrical thick gold of a printed circuit board, including the steps of:
Providing a plate substrate, wherein the plate substrate comprises a copper foil layer, and a non-electric gold site and an electric gold site are arranged on the copper foil layer;
Forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-electric gold position, etching a first circuit pattern layer on the electroplated copper layer, and thinning the thickness of the copper foil layer corresponding to the electric gold position;
And forming a thick gold layer on the surface of the copper foil layer corresponding to the gold level, and etching a second circuit pattern layer on the thick gold layer.
According to some embodiments of the application, the etching rate of the second circuit pattern layer is 6.5-8m/min. According to some embodiments of the application, the etching rate of the second circuit pattern layer is 7m/min.
According to some embodiments of the application, the etching rate of the first line pattern layer is 4-5.5m/min. According to some embodiments of the application, the etching rate of the first line pattern layer is 5m/min.
According to some embodiments of the present application, the forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-gold level, and etching a first circuit pattern layer on the electroplated copper layer, and simultaneously thinning the thickness of the copper foil layer corresponding to the gold level, includes: providing a first dry film, and pressing and pasting the first dry film on the surface of the copper foil layer corresponding to the electrogilding position; providing a first film, exposing and developing a pattern of the first film, and transferring the pattern to the surface of the copper foil layer corresponding to the non-electrogilding position to form a first circuit pattern; forming the electroplated copper layer on the surface of the first circuit pattern, and forming an electroplated tin layer on the surface of the electroplated copper layer; removing the first dry film; performing first etching treatment, forming the first circuit pattern layer on the electroplated copper layer, and simultaneously thinning the thickness of the copper foil layer corresponding to the electrogilding position; and (5) carrying out tin stripping treatment.
According to some embodiments of the application, the etching speed of the first circuit pattern layer is 5m/min, and the spraying parameter is 3.0kg/cm 2; the downward blowing speed was 2.2kg/cm 2.
According to some embodiments of the application, the tin stripping treatment is followed by a grind plate treatment. According to some embodiments of the application, the abrasive sheet process is a ceramic abrasive sheet process.
According to some embodiments of the application, during the formation of the electroplated copper layer, the total thickness of the copper foil layer and the electroplated copper layer corresponding to the electroless gold sites is controlled to be between 100 and 110 μm.
According to some embodiments of the application, after the thickness of the copper foil layer corresponding to the gold level is thinned, the thickness of the copper foil layer corresponding to the gold level is between 5 and 15 μm.
According to some embodiments of the application, the etching rate of the second circuit pattern is 6.5-8m/min.
According to some embodiments of the application, the etching rate of the first line pattern is 4-5.5m/min.
According to some embodiments of the present application, the forming a thick gold layer on the surface of the copper foil layer corresponding to the gold level, and etching a second circuit pattern layer on the thick gold layer, includes: performing silk-screen wet film printing, developing and exposing treatment on the surface of the plate substrate; providing a second dry film, and pressing and pasting the second dry film on the surface of the copper foil layer corresponding to the non-electrogilding position; providing a second film, exposing and developing a pattern of the second film, and transferring the pattern to the surface of the copper foil layer corresponding to the electrogilding position to form a second circuit pattern; forming a first gold layer on the surface of the second circuit pattern by adopting an electroplating mode; removing the wet film and the second dry film; providing a second film, exposing and developing a pattern of the second film, and transferring the pattern to the surface of the first gold layer; forming a second gold layer on the surface of the first gold layer by adopting an electroplating mode; and performing second etching treatment, and forming the second circuit pattern layer on the first gold layer and the second gold layer.
According to some embodiments of the application, the second dry film fade rate is 2.6m/min; the etching speed of the second etching is 7m/min, and the spraying parameter is 3.0kg/cm 2; the downward blowing speed was 2.2kg/cm 2.
According to a second aspect of the embodiment of the present application, there is provided a printed circuit board electro-thick gold, which is manufactured by the above-mentioned manufacturing method of the printed circuit board electro-thick gold.
A third aspect of the embodiment of the present application provides a method for manufacturing a printed circuit board, where the method for manufacturing a printed circuit board includes the method for manufacturing an electrical thick gold of a printed circuit board.
A fourth aspect of the embodiments of the present application provides a printed circuit board, which is manufactured by using the method for manufacturing a printed circuit board described above.
According to some embodiments of the application, the printed circuit board comprises: an inner layer plate, a copper foil layer and a thick gold layer; the copper foil layer is arranged on the outer surface of the inner layer plate; the thick gold layer is formed in a local area of the copper foil layer, and the thickness of the copper foil layer corresponding to the local area is 5-15 mu m.
According to some embodiments of the application, the copper foil layer comprises a first copper foil layer and a second copper foil layer connected to each other; the thickness of the first copper foil layer is lower than that of the second copper foil layer; the thick gold layer is formed on the outer surface of the first copper foil layer.
According to some embodiments of the application, the copper foil layer further comprises an electroplated copper layer; the electroplated copper layer is formed on the outer surface of the second copper foil layer.
According to some embodiments of the application, the electroplated copper layer is formed with a first circuit pattern layer; the first circuit pattern layer penetrates through the electroplated copper layer.
According to some embodiments of the application, the thick gold layer comprises a first gold layer and a second gold layer; the first gold layer is respectively connected with the first copper foil layer and the second gold layer.
According to some embodiments of the application, the thick gold layer is formed with a second line pattern layer that penetrates through the first and second gold layers.
According to some embodiments of the application, the first copper foil layer has a thickness of 5-15 μm; the thickness of the second copper foil layer is 30-40 mu m; the thickness of the electroplated copper layer is 60-90 mu m.
According to some embodiments of the application, the printed circuit board further comprises a via hole and a copper deposition layer; the via hole penetrates through the copper foil layer and the inner layer plate; the copper deposition layer is formed on the hole wall of the via hole.
According to some embodiments of the application, the thickness of the copper deposition layer is not less than 10 μm.
A fifth aspect of an embodiment of the present application provides an electronic device, including the above-mentioned printed circuit board.
According to some embodiments of the application, the electronic device includes an inner layer board, a copper foil layer, and a thick gold layer; the copper foil layer is arranged on the outer surface of the inner layer plate; the thick gold layer is formed in a local area of the copper foil layer, and the thickness of the copper foil layer corresponding to the local area is 5-15 mu m.
According to some embodiments of the application, the copper foil layer comprises a first copper foil layer and a second copper foil layer connected to each other; the thickness of the first copper foil layer is lower than that of the second copper foil layer; the thick gold layer is formed on the outer surface of the first copper foil layer.
According to some embodiments of the application, the copper foil layer further comprises an electroplated copper layer; the electroplated copper layer is formed on the outer surface of the second copper foil layer.
According to some embodiments of the application, the electroplated copper layer is formed with a first circuit pattern layer; the first circuit pattern layer penetrates through the electroplated copper layer.
According to some embodiments of the application, the thick gold layer comprises a first gold layer and a second gold layer; the first gold layer is respectively connected with the first copper foil layer and the second gold layer.
According to some embodiments of the application, the thick gold layer is formed with a second line pattern layer that penetrates through the first and second gold layers.
According to some embodiments of the application, the first copper foil layer has a thickness of 5-15 μm; the thickness of the second copper foil layer is 30-40 mu m; the thickness of the electroplated copper layer is 60-90 mu m.
According to some embodiments of the application, the printed circuit board further comprises a via hole and a copper deposition layer; the via hole penetrates through the copper foil layer and the inner layer plate; the copper deposition layer is formed on the hole wall of the via hole.
According to some embodiments of the application, the thickness of the copper deposition layer is not less than 10 μm.
Therefore, the beneficial effects of the embodiment of the application include:
1. According to the manufacturing method of the electric thick gold of the printed circuit board, through mutual matching of the copper foil layer, the electroplated copper layer, the first circuit pattern layer, the thick gold layer and the second circuit pattern layer, the electric thick gold of the printed circuit board is not easy to generate a copper suspension phenomenon, and the product quality of the electric thick gold of the printed circuit board is improved;
2. The manufacturing method of the printed circuit board electro-thick gold provided by the embodiment of the application is simple and is easy to realize industrialization.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 is a schematic diagram showing a method for preparing electrically thick gold on a printed circuit board according to some embodiments of the present invention;
fig. 2 is a schematic diagram of a printed circuit board according to some embodiments of the invention.
The drawings in the drawings are identified as:
100-inner layer board; 210-a first copper foil layer; 220-a second copper foil layer; 300-electroplating copper layer; 410-a first gold layer;
420-a second gold layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.
The following describes the technical scheme provided by the embodiment of the application with reference to the attached drawings.
As shown in fig. 1, an embodiment of the present application provides a method for manufacturing an electro-thick gold of a printed circuit board, which includes the following steps:
s100, providing a plate substrate, wherein the plate substrate comprises a copper foil layer, and a non-electric gold site and an electric gold site are arranged on the copper foil layer;
s200, forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-gold position, etching a first circuit pattern layer on the electroplated copper layer, and simultaneously thinning the thickness of the copper foil layer corresponding to the gold position;
s300, forming a thick gold layer on the surface of the copper foil layer corresponding to the gold level, and etching a second circuit pattern layer on the thick gold layer.
According to the manufacturing method of the electric thick gold of the printed circuit board, through interaction of the copper foil layer, the first circuit pattern layer, the electroplated copper layer, the second circuit pattern layer and the thick gold layer, the electric thick gold of the printed circuit board is not easy to generate copper suspension phenomenon in the etching process, and the product quality of the electric thick gold of the printed circuit board is improved; meanwhile, the manufacturing method of the printed circuit board electro-thick gold provided by the embodiment of the application has the advantages of simple process and easy industrialization realization.
Specifically, in some embodiments of the present application, the method for manufacturing the electrically thick gold of the printed circuit board includes the steps of:
s100, providing a plate substrate, wherein the plate substrate comprises a copper foil layer, and a non-electric gold site and an electric gold site are arranged on the copper foil layer;
Specifically, the plate substrate comprises an inner layer plate, a copper foil layer arranged on the outer surface of the inner layer plate, and a through hole penetrating through the copper foil layer and the inner layer plate, wherein the copper foil layer is provided with a non-electric gold site and an electric gold site; a copper deposition layer connected with the copper foil layer is formed on the hole wall of the via hole;
The inner layer plate is a double-layer substrate and is a double-sided copper-clad plate.
It will be appreciated that the inner layer board may be a single layer substrate or a multi-layer circuit board; the plate substrate can be a single-sided copper-clad plate (namely, a copper foil layer is formed on one surface of the inner layer plate) or a double-sided copper-clad plate (namely, a copper foil layer is formed on two opposite surfaces of the inner layer plate); the electric gold position is a position of preset electric thick gold, and a conductive lead can be formed in the subsequent electric thick gold process.
Specifically, the step S100 includes:
s101, cutting;
the thickness of the core plate obtained by cutting is 0.13mm 2/2oz;
In some embodiments of the application, a baking process is also included after the blanking step.
In this step, the thickness of the core plate is not limited.
S102, an inner layer;
Adopting a 21-grid exposure ruler, completing the exposure of the inner layer circuit by 6-8 grids, and etching an inner layer circuit pattern after development;
s103, inner layer AOI (full name: automatic Optic Inspection, automatic optical detection);
Checking defects such as open and short circuit of the inner layer and making correction;
s104, laminating;
after the plate is browned, appropriate lamination conditions are selected for lamination according to the Tg of the plate, so that a plate substrate is formed;
specifically, the thickness of the plate substrate was 2.22mm, and the thickness of the copper foil layer was 34.3 μm.
It should be noted that the thickness of the copper foil layer is not limited to the thickness of the plate material substrate, and the thickness of the copper foil layer may be 28-40 μm.
S105, drilling an outer layer;
drilling the plate material base material by using drilling data through a laser drilling method to form a via hole penetrating through the plate material base material;
the drilling method may be any of a pre-punching method, a mechanical drilling method, a laser drilling method, a plasma etching method, and a chemical etching method.
S106, copper deposition is performed on the outer layer;
In the embodiment of the application, copper deposition treatment is carried out on the via hole, a copper deposition layer electrically connected with the copper foil layer is formed on the hole wall of the via hole so as to metalize the via hole, and backlight test is carried out for more than 9 stages;
It can be appreciated that the copper-deposited layer can electrically connect the inner layer board and the copper foil layer, thereby ensuring the conduction of each circuit in the plate substrate.
S107, electroplating the whole plate;
And (3) carrying out whole-plate electroplating on the plate base material with the outer layer subjected to copper deposition, and forming a copper plating layer between the copper foil layer and the copper deposition layer.
It is understood that this step can lead to a uniform copper layer thickness distribution and a uniform circuit distribution of the base material of the sheet material.
Specifically, the whole plate is electroplated for 90min with the current density of 15ASF, and the thickness of the hole copper is 10-28 mu m;
S200, forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-gold position, forming a first circuit pattern layer on the electroplated copper layer through first etching, and thinning the thickness of the copper foil layer corresponding to the gold position;
Specifically, the method comprises the following steps:
s201, providing a first dry film, and pressing and pasting the first dry film on the surface of the copper foil layer corresponding to the electrogilding position;
the first dry film can protect the copper foil layer corresponding to the electric gold position and prevent the copper foil layer from being damaged in the process of electroplating various metals so as to influence the circuit performance.
Specifically, a film sticking machine is adopted to stick the first dry film on the surface of the copper foil layer corresponding to the electrogilding position in a hot sticking mode through a press roller; the first dry film is a resist film having a photosensitive substance.
Specifically, the first dry film is an HD250 dry film, the temperature of the press roller is 110-120 ℃, the pressure is 4.5-5.5kg/cm 2, the speed is 1.2m/min, and the temperature of the press wheel is 90+/-5 ℃.
S202, providing a first film, and transferring a pattern of the first film to the surface of a copper foil layer corresponding to a non-electrogilding position through exposure and development to form a first circuit pattern;
Specifically, before providing the first film, the method further comprises: and forming a circuit pattern on the pattern of the first film according to the actual demand, namely forming the circuit pattern with the actual demand on the pattern of the first film.
It can be understood that the exposure and development are performed to perform photochemical reaction on the photosensitive substance of the first dry film by using the energy of ultraviolet light, selectively and locally bridge-hardening to achieve the purpose of image transfer, and the first dry film of the unexposed portion is dissolved and washed under the action of the liquid medicine, leaving the photosensitive portion, and forming the required outer layer circuit pattern (i.e. the first circuit pattern) on the copper foil layer corresponding to the non-electrogalvanized position.
In some embodiments of the present application, the step is to use a 21-grid exposure rule to expose the outer layer line of the first film pattern with 7-9 grids, and develop the outer layer line, so as to expose only the required gold level.
S203, forming an electroplated copper layer on the outer surface of the first circuit pattern in an electroplating manner, and forming an electroplated tin layer on the surface of the electroplated copper layer;
It can be understood that the electroplated copper layer and the copper foil layer form the actually required copper layer thickness, so that the electric connection of the circuit patterns can be ensured, and the copper layers of the circuit patterns are uniformly distributed; the electroplated tin layer is used as a barrier layer of the electroplated copper layer, so that mutual diffusion between the electroplated copper layer and the copper foil layer corresponding to the electrogalvanized site in the subsequent first etching process can be prevented.
Specifically, firstly, forming an electroplated copper layer on the surfaces of the first circuit pattern and the copper deposition layer in an acid copper electroplating mode, wherein the electroplated copper layer is formed on a copper foil layer exposed outside the first dry film (namely, a copper foil layer corresponding to a non-electrogalvanized position), thickening the thickness of the copper foil layer, and controlling the total thickness from the copper foil layer corresponding to the non-electrogalvanized position to the electroplated copper layer to be 100-110 mu m; and then forming an electroplated tin layer on the surface of the electroplated copper layer by adopting a tin plating solution.
Specifically, in the step of forming the electroplated copper layer, microetching is firstly carried out on the surface of the first circuit pattern so as to ensure the cleanliness and the roughness of the surface of the first circuit pattern; then, copper plating was performed at a current density of 1.6ASF for 180 minutes, and the copper plating thickness was controlled to be about 90. Mu.m.
S204, removing the first dry film;
and tearing off the first dry film, specifically, dissolving and cleaning by adopting a sodium hydroxide solution with higher concentration, so that the copper foil layer corresponding to the gold level is exposed.
Specifically, the speed of removing the first dry film was 2.6m/min.
S205, performing first etching treatment, forming a first circuit pattern layer on the electroplated copper layer, and thinning the thickness of the copper foil layer corresponding to the electroplated gold position;
In the embodiment of the application, the thickness of the copper foil layer corresponding to the etched gold level is controlled to be about 10 mu m in the etching process.
It should be noted that the controlled thickness of the copper foil layer can be any value between 5 and 15 μm, and the substrate is not exposed
Specifically, the etching speed of the first etching is 4.8m/min, and the upward spraying parameter is 3.0kg/cm 2; the downward blowing speed was 2.2kg/cm 2.
S206, carrying out tin stripping treatment;
and removing the electroplated tin layer corresponding to the non-electroplated gold position through tin stripping treatment.
S207, performing ceramic grinding treatment.
Copper particles on the surface of the copper foil layer are removed through ceramic grinding plate treatment, and the flatness of the surface of the copper foil layer is improved.
S300, forming a thick gold layer on the surface of the copper foil layer corresponding to the gold level, and etching a second circuit pattern layer on the thick gold layer.
Specifically, the method comprises the following steps:
s301, performing silk-screen wet film printing, developing and exposure treatment on the surface of a plate substrate;
Specifically, a wet film is provided, which is printed on the surface of a plate substrate, especially the surface of a groove generated in the above etching process; and then CCD exposure and development are performed.
S302, providing a second dry film, and pressing and pasting the second dry film on the surface of the wet film corresponding to the non-electrogilding position;
Specifically, the second dry film is a thick gold dedicated dry film, such as a GPM220 dedicated dry film.
S303, providing a second film, and transferring the pattern of the second film to the surface of the copper foil layer corresponding to the gold level through exposure and development to form a second circuit pattern;
s304, forming a first gold layer on the outer surface of the second circuit pattern by adopting an electroplating mode;
The first gold layer is a thin gold layer. Specifically, the method comprises forming a thin gold layer on the outer surface of the second circuit pattern to increase the binding force between gold and copper when the second gold layer is formed later, so as to avoid the separation of the gold layer and the copper layer; forming a thin gold layer on the outer surface of the second circuit pattern with an electroplating parameter of 0.8ASD 50 s;
s305, removing the wet film and the second dry film;
Tearing the dehumidifying film and the second dry film, specifically, dissolving and cleaning by adopting a sodium hydroxide solution with higher concentration, so that the copper foil layer corresponding to the non-electrogilding position is exposed.
S306, providing a third dry film, and pressing and pasting the third dry film on the surface of the electroplated copper layer corresponding to the non-electrogilding position;
specifically, the third dry film is a special dry film for thick gold, and can be the same as or the same type of dry film as the second dry film.
Specifically, the third dry mill is a GPM220 specific dry film.
Specifically, the temperature of the pressing paste is 110+/-5 ℃, the pressure is 4.0-5.0kg/cm 2, the speed is 1.0-1.2m/min, the plate inlet temperature is 40-60 ℃, and the plate outlet temperature is 70-85 ℃.
It is understood that the third dry film is any type of dry film among alkali-resistant etched dry films.
S307, providing a second film, and transferring the pattern of the second film to the surface of the first gold layer through exposure and development to form a second circuit pattern;
specifically, a 21-grid exposure rule is adopted, pattern exposure is completed by 6-8 grids, development is carried out, and the copper deposition layer is completely covered.
S308, forming a second gold layer on the surface of the first gold layer in an electroplating mode;
the second gold layer and the first gold layer together form a thick gold layer. The second gold layer has a thickness substantially greater than the first gold layer.
Specifically, a second gold layer of 1.8mm or more is formed on the outer surface of the second wiring pattern at a gold concentration of 4 to 6g/L and a plating parameter of 1.0ASD 1H.
It will be appreciated that the thickness of the thick gold layer may be specifically set according to the needs of the user.
S309, removing the third dry film;
the film removing liquid medicine can adopt alkaline sodium hydroxide solution. Specifically, the removal rate of the third dry film may be 2.6m/min;
S310, performing a second etching treatment to form a second circuit pattern layer on the thick gold layer.
The second etch is a flash etch that is faster than the first etch;
Specifically, the etching speed is 7m/min, and the spraying parameter is 3.0kg/cm 2; the downward blowing speed was 2.2kg/cm 2.
In some embodiments of the application, the etched aqueous solution includes an acidic solution and an alkaline solution, the acidic solution may be an acidic copper chloride solution; the alkaline solution may be an aqueous ammonia solution.
In order to achieve the above objective, the embodiment of the present application further provides a printed circuit board electro-thick gold, which is manufactured by the method for manufacturing the printed circuit board electro-thick gold according to any one of the foregoing embodiments.
In order to achieve the above objective, the embodiment of the present application further provides a method for manufacturing a printed circuit board, where the method for manufacturing a printed circuit board includes the method for manufacturing an electro-thick gold of a printed circuit board described above.
In order to achieve the above objective, the embodiment of the present application further provides a printed circuit board, and the printed circuit board is manufactured by the method for manufacturing a printed circuit board.
In some embodiments of the present application, the printed circuit board, as shown in fig. 2, includes an inner layer board 100; copper foil layers, namely, a first copper foil layer 210, a second copper foil layer 220, and an electroplated copper layer 300; thick gold layers, i.e., first gold layer 410 and second gold layer 420. The first copper foil layer 210 and the second copper foil layer 220 are both provided on the outer surface of the inner laminate 100; the thick gold layer is formed on a partial region of the copper foil layer (i.e., the first copper foil layer), and the thickness of the copper foil layer in the partial region (i.e., the thickness of the first copper foil layer) is 5-15 μm. The thickness of the copper foil layer at the bottom of the thick gold layer is adjusted through the interaction of the inner layer plate 100, the copper foil layer and the thick gold layer, so that the printed circuit board can avoid the phenomenon of copper suspension, and has the advantages of high finished product quality, simple structure, easiness in production and the like.
In some embodiments of the application, the printed circuit board further comprises a via and a copper deposit; the via hole penetrates through the copper foil layer and the inner layer board 100; the via hole penetrates through the copper foil layer and the inner layer plate; the copper deposition layer is formed on the wall of the through hole and connected with the copper foil layers on two sides of the inner layer plate.
In some embodiments of the present application, the inner layer board 100 is a single layer substrate or a multi-layer circuit board.
In some embodiments of the present application, the inner layer board is formed with an inner layer wiring pattern. The inner layer circuit pattern is obtained by adopting a 21-lattice exposure ruler and performing inner layer circuit exposure and development by 6-8 lattices and etching.
In some embodiments of the present application, the copper foil layers are formed on opposite surfaces of the inner layer board 100.
It should be noted that the copper foil layer may be formed on one surface or both opposite surfaces of the inner layer board 100.
In some embodiments of the present application, the copper deposition layer is formed on the via hole, and is obtained by copper deposition treatment, so that the via hole can be metallized. The copper-deposited layer may be electrically connected to the inner layer board 100 and the copper foil layer, respectively, thereby ensuring the conduction of each circuit.
The thickness of the copper deposition layer is not less than 10 μm.
In some embodiments of the present application, the copper foil layer includes a first copper foil layer 210 and a second copper foil layer 220 connected to each other; the first copper foil layer 210 has a thickness lower than that of the second copper foil layer 220; the thick gold layer is formed on the outer surface of the first copper foil layer 210; the thickness of the second copper foil layer 220 is 34.3 μm; the thickness of the first copper foil layer 210 was 10 μm, and the first copper foil layer 210 was obtained by an etching process.
It should be noted that the thickness of the second copper foil layer 220 may be any value from 30 μm to 40 μm, and the thickness of the first copper foil layer 210 may be any value from 5 μm to 15 μm.
In some embodiments of the present application, the copper foil layer further includes an electroplated copper layer, the electroplated copper layer 300 having a thickness of 60-90 μm; the electroplated copper layer 300 is formed on the outer surface of the second copper foil layer 220. The sum of the copper thicknesses of the electroplated copper layer 300 and the second copper foil layer 220 is any value in the range of 100 to 120 μm. The copper thickness of the electroplated copper layer 300 and the second copper foil layer 220 is the thickness between the inner surface of the electroplated copper layer 300 and the outer surface of the second copper foil layer 220
In some embodiments of the present application, the first copper foil layer is obtained by thinning a region corresponding to the first copper foil layer after the electroplated copper foil layer is formed.
In some embodiments of the present application, the second copper foil layer 220 has a first circuit pattern layer formed on an outer surface thereof; the first circuit pattern layer is formed on the electroplated copper layer 300 and penetrates the electroplated copper layer 300. The first circuit pattern layer is obtained by etching with an alkaline solution.
In some embodiments of the present application, the outer surface of the second copper foil layer 220 is formed with a first circuit pattern; the first line pattern is etched in a region corresponding to the first line pattern by an alkaline solution.
In some embodiments of the present application, the thick gold layer includes a first gold layer 410 and a second gold layer 420, the first gold layer 410 being formed on an outer surface of the first copper foil layer 210; the second gold layer 420 is formed on the outer surface of the first gold layer 410.
In some embodiments of the present application, the outer surface of the first copper foil layer 210 is formed with a second circuit pattern layer; the second circuit pattern layer is formed on the first gold layer 410 and the second gold layer 420 and penetrates through the first gold layer 410 and the second gold layer 420. The second circuit pattern layer is obtained by etching with an alkaline solution.
In some embodiments of the present application, the outer surface of the first copper foil layer 210 is formed with a second circuit pattern, and the region of the outer surface of the first gold layer 410 corresponding to the second circuit pattern is formed with a second circuit pattern again, wherein the second circuit pattern layer is obtained by etching the region corresponding to the second circuit pattern with an alkaline solution.
In order to achieve the above object, an embodiment of the present application further provides an electronic device, which includes the printed circuit board in any one of the above embodiments. Specifically, the printed circuit board includes: an inner layer board 100, a copper foil layer, a thick gold layer; the copper foil layer is provided on the outer surface of the inner laminate 100; the thick gold layer is formed in a local area of the copper foil layer, and the thickness of the local area is 5-15 mu m. The electronic equipment has the beneficial effects of high product quality, simple structure, easy production and the like by the interaction of the inner layer plate 100, the copper foil layer and the thick gold layer and limiting the thickness of the copper foil layer at the bottom of the thick gold layer, so that the phenomenon of copper suspension is avoided in the electronic equipment.
In order to achieve the above object, an embodiment of the present application further provides an electronic device, where the electronic device includes the printed circuit board in the above embodiment.
Finally, it should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present application, and that although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solutions of the present application.
Claims (8)
1. The method for manufacturing the electrical thick gold of the printed circuit board is characterized by comprising the following steps of:
Providing a plate substrate, wherein the plate substrate comprises a copper foil layer, and a non-electric gold site and an electric gold site are arranged on the copper foil layer;
Forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-electric gold position, etching a first circuit pattern layer on the electroplated copper layer, and thinning the thickness of the copper foil layer corresponding to the electric gold position; after the thickness of the copper foil layer corresponding to the electro-gold position is thinned, the thickness of the copper foil layer corresponding to the electro-gold position is between 5 and 15 mu m;
forming a thick gold layer on the surface of the copper foil layer corresponding to the gold level, and etching a second circuit pattern layer on the thick gold layer, wherein the method comprises the following steps:
performing silk-screen wet film printing, developing and exposing treatment on the surface of the plate substrate;
Providing a second dry film, and pressing and pasting the second dry film on the surface of the copper foil layer corresponding to the non-electrogilding position;
providing a second film, exposing and developing a pattern of the second film, and transferring the pattern to the surface of the copper foil layer corresponding to the electrogilding position to form a second circuit pattern;
forming a first gold layer on the surface of the second circuit pattern by adopting an electroplating mode;
Removing the wet film and the second dry film; providing the second film, exposing and developing the pattern of the second film, and transferring the pattern to the surface of the first gold layer;
Forming a second gold layer on the surface of the first gold layer by adopting an electroplating mode;
and performing second etching treatment to form a second circuit pattern layer on the first gold layer and the second gold layer.
2. The method according to claim 1, wherein,
Forming an electroplated copper layer on the surface of the copper foil layer corresponding to the non-gold position, etching a first circuit pattern layer on the electroplated copper layer, and thinning the thickness of the copper foil layer corresponding to the gold position, wherein the method comprises the following steps:
providing a first dry film, and pressing and pasting the first dry film on the surface of the copper foil layer corresponding to the electrogilding position;
Providing a first film, exposing and developing a pattern of the first film, and transferring the pattern to the surface of the copper foil layer corresponding to the non-electrogilding position to form a first circuit pattern;
Forming the electroplated copper layer on the surface of the first circuit pattern, and forming an electroplated tin layer on the surface of the electroplated copper layer;
Removing the first dry film;
Performing first etching treatment, forming the first circuit pattern layer on the electroplated copper layer, and simultaneously thinning the thickness of the copper foil layer corresponding to the electrogilding position;
And (5) carrying out tin stripping treatment.
3. The method of manufacturing according to claim 2, wherein,
After the electroplated copper layer is formed, the total thickness of the copper foil layer corresponding to the non-electric gold position and the electroplated copper layer is 100-110 mu m.
4. The method according to claim 1, wherein,
The etching speed of the second circuit pattern layer is 6.5-8m/min;
the etching speed of the first circuit pattern layer is 4-5.5m/min.
5. An electrical thick gold for a printed circuit board, characterized in that it is produced by the method for producing an electrical thick gold for a printed circuit board according to any one of claims 1 to 4.
6. A method for manufacturing a printed circuit board, characterized by comprising the method for manufacturing an electrically thick gold for a printed circuit board according to any one of claims 1 to 4.
7. A printed circuit board produced by the method for producing a printed circuit board according to claim 6.
8. An electronic device comprising the printed circuit board of claim 7.
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