CN110545634A - Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper - Google Patents
Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper Download PDFInfo
- Publication number
- CN110545634A CN110545634A CN201910809143.XA CN201910809143A CN110545634A CN 110545634 A CN110545634 A CN 110545634A CN 201910809143 A CN201910809143 A CN 201910809143A CN 110545634 A CN110545634 A CN 110545634A
- Authority
- CN
- China
- Prior art keywords
- hole
- plated
- copper
- conductive film
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a method for manufacturing a multilayer fine circuit board with a circuit firstly and then plated with hole copper, and belongs to the technical field of fine circuit boards. Firstly, conducting line etching on a product, then coating a conductive film and then coating a plating resistant layer on the area except the electroplated lead, and then forming a through hole by drilling, hole conduction, hole copper plating, plating resistant layer stripping and conductive film stripping. The invention has the beneficial effects that: the circuit is etched when the hole copper is plated, so that the problems of open circuit caused by permeation of etching solution due to poor combination of a dry film and a product caused by a hole step and micro-short or short circuit caused by film clamping due to a tip effect can be avoided; the invention can not be etched and micro-etched after the hole copper is plated, namely the thickness of the hole copper can not be thinned due to etching and micro-etching so as not to influence the electrical reliability of the product, thereby saving the electroplating time and improving the production efficiency; the product manufactured by the invention is superior to the multilayer fine circuit board manufactured by the traditional pattern electroplating process in the aspects of yield and quality.
Description
Technical Field
The invention relates to a method for manufacturing a multilayer fine circuit board with a circuit firstly and then plated with hole copper, and belongs to the technical field of fine circuit boards.
Background
with the rapid improvement of electronic product technology, electronic products tend to develop towards multifunction, miniaturization and lightness, and old processes cannot continuously meet the requirements of industries and are continuously eliminated, so that urgent needs are provided for new processes with good quality and low cost. For example, due to the characteristics of the process, the conventional pattern electroplating process is prone to open circuit caused by permeation of etching solution due to poor bonding between the dry film and the product caused by the hole step, and to micro-short or short circuit caused by film clamping due to the tip effect, and thus cannot meet the requirements of yield and quality of fine circuit boards. In view of the above, it is desirable to provide a method for manufacturing a multilayer fine circuit board capable of solving the defects of the pattern plating process to improve the product quality and yield.
in order to manufacture a fine circuit, the existing pattern electroplating process of firstly manufacturing a through hole and then manufacturing a circuit can generate a point effect to cause film clamping, a hollow step to cause a hole and an open circuit between circuits and cause a short circuit between the circuits and the circuits, and the flow of the pattern electroplating process comprises drilling, hole electroconduction, primary dry film pressing, primary exposure, primary development, hole copper plating, primary dry film stripping, secondary dry film pressing, secondary exposure, secondary development, etching and secondary film removing. On one hand, when the circuit is subjected to secondary dry film pressing, the dry film at the position cannot be well pressed on the product due to the height difference formed between the step and the periphery of the step, a gap is easily generated, etching liquid can easily permeate into the lower part of the dry film during etching, and if the etching liquid just permeates into the lower part of the dry film on the circuit, part or all of the circuit can be etched, so that a short circuit is generated. On the other hand, when the hole copper is plated, because the curvature of the edge of the hole disc is larger than that of other areas, the surface charge density and the electric field intensity are correspondingly larger than that of other areas, the growth speed of the copper at the edge of the hole disc is also larger than that of other areas, so that the risk that the dry film is wrapped by the plated copper at the position, namely the film clamping is generated, the copper at the position obstructs the reaction of the film stripping liquid and the film clamping when the film is stripped, the film stripping is difficult to achieve, the film stripping is not complete, the residual influence on etching is generated, and the short circuit is caused due to incomplete. In addition, in the process, after the hole copper is formed, etching is carried out when a circuit is made, and both the hole copper and the surface copper are etched during etching, so that the hole copper needs to be plated to be thick enough (normally, the hole is fully plated) during hole copper plating to avoid the risk of conductivity failure of the hole caused by etching, namely, the electroplating line body needs to be long enough or the electroplating time needs to be long enough, so that the production efficiency is influenced.
Disclosure of Invention
in order to overcome the defects of the prior art, the invention provides a method for manufacturing a multilayer fine circuit board by firstly manufacturing a circuit and then plating hole copper.
the invention is realized by the following technical scheme: a manufacturing method of a multilayer fine circuit board with a circuit firstly and then plated with hole copper is characterized in that: firstly, conducting line etching on a product, then coating a conductive film and then coating a plating resistant layer on the area except the electroplated lead, and then forming a through hole by drilling, hole conduction, hole copper plating, plating resistant layer stripping and conductive film stripping.
The method comprises the following steps:
Step A: laminating a layer of dry film on the outer side of the product copper foil;
and B: carrying out exposure and development;
And C: etching is carried out;
Step D: stripping the film;
Step E: coating a layer of conductive film on the product;
step F: coating a layer of anti-plating layer on the conductive film;
Step G: laser is carried out to form a through hole;
step H: conducting treatment is carried out on the through hole, and a layer of conducting substance is formed on the hole wall;
step I: plating hole copper;
Step J: stripping the plating resist;
step K: and stripping the conductive film.
The product is a multilayer fine circuit board.
And E, coating the conductive film to avoid electroplating leads.
and step J, stripping the plating resistant layer by using a strong alkali solution.
and step K, stripping the conductive film by an organic solvent or strong alkali.
And the step E and the step F can combine the conductive film and the anti-plating layer and press the conductive film and the anti-plating layer onto a product in a pressing mode.
The invention has the beneficial effects that: the invention relates to a method for manufacturing a multilayer fine circuit board by first plating a circuit and then plating a hole copper, wherein the circuit is etched when plating the hole copper, and the hole copper is plated without passing through the circuit forming processes such as dry film pressing, developing, etching and the like, so that the problems of open circuit caused by permeation of etching solution due to poor combination of a dry film and a product caused by hole steps and micro-short or short circuit caused by film clamping caused by a tip effect in a pattern electroplating process can be completely avoided. In conclusion, the invention can manufacture the multilayer fine circuit board with the yield and the quality superior to those of the multilayer fine circuit board manufactured by the traditional pattern electroplating process.
Drawings
the invention is further illustrated below with reference to the figures and examples.
FIG. 1 is a flow chart of a method of making the present invention.
In the figure: 1. a polyimide; 2. gluing; 3. copper foil; 4. a through hole; 5. a conductive substance; 6. drying the film; 7. copper hole; 8. Plating resistance; 9. and a conductive film.
Detailed Description
The manufacturing method of the multilayer fine circuit board with the circuit firstly and then plated with the hole copper as shown in figure 1 is characterized in that: firstly, conducting line etching on a product, then coating a conductive film and then coating a plating resistant layer on the area except the electroplated lead, and then forming a through hole by drilling, hole conduction, hole copper plating, plating resistant layer stripping and conductive film stripping.
The method comprises the following steps:
Step A: laminating a dry film 6 on the outer side of the product copper foil 3;
And B: exposing and developing, transferring the pattern on the negative film to the product of the pressed dry film 6 by ultraviolet irradiation, dissolving the unexposed dry film 6 by using a weak alkali solution to expose the copper foil 3, and preparing for the next etching;
and C: etching is carried out, and the etching solution reacts with the exposed copper foil 3 to bite the copper foil;
Step D: stripping, namely reacting a strong alkali solution with the residual exposed dry film 6 on the product to expand, split and dissolve the dry film, and stripping to expose the circuit pattern under the action of spraying pressure;
Step E: coating a conductive film 9 on a product, coating a conductive film 9 on the area of the product with a circuit except for a plating lead, wherein the conductive film 9 is coated to play a role of a bridge when plating hole copper 7 so as to ensure that the product is conducted and copper plating can be carried out;
step F: a layer of plating resist 8 is coated on the conductive film 9, and a layer of plating resist 8 is coated on the conductive film 9 to prevent copper from depositing on the conductive film 9;
step G: laser emitting the through holes 4, wherein the through holes 4 are laser emitted at corresponding positions according to a design drawing of a product;
step H: conducting treatment is carried out on the through hole 4, a layer of conducting substance 5 is formed on the hole wall, and a layer of conducting substance 5 is formed on the hole wall of the product through processes such as black hole or copper deposition;
Step I: plating copper 7, depositing copper on the hole wall through electrolysis;
step J: the plating resist layer 8 is peeled off, and the plating resist layer 8 is peeled off with a strong alkali solution.
step K: the conductive film 9 is peeled off, and the conductive film 9 is peeled off with an organic solvent or strong alkali.
the product is a multilayer fine circuit board. The step E is to avoid the plated lead when coating the conductive film 6.
and step J, stripping the plating resisting layer 8 by using a strong alkali solution.
In the step K, the conductive film 9 is peeled off by an organic solvent or strong alkali.
and the step E and the step F can combine the conductive film 9 and the anti-plating layer 8, and then press the conductive film onto a product in a pressing mode.
The invention relates to a method for manufacturing a multilayer fine circuit board by firstly plating a circuit and then plating a hole copper, wherein the circuit is etched when the hole copper 7 is plated, and the hole copper 7 is not subjected to circuit forming processes such as dry film pressing, developing, etching and the like, so that the problems of open circuit caused by permeation of etching liquid due to poor combination of a dry film and a product caused by hole steps and micro-short or short circuit caused by film clamping caused by a tip effect in a pattern electroplating process can be completely avoided. In conclusion, the invention can manufacture the multilayer fine circuit board with the yield and the quality superior to those of the multilayer fine circuit board manufactured by the traditional pattern electroplating process.
Claims (7)
1. A manufacturing method of a multilayer fine circuit board with a circuit firstly and then plated with hole copper is characterized in that: firstly, conducting line etching on a product, then coating a conductive film and then coating a plating resistant layer on the area except the electroplated lead, and then forming a through hole by drilling, hole conduction, hole copper plating, plating resistant layer stripping and conductive film stripping.
2. The method for manufacturing the multilayer fine circuit board with the circuits plated and the holes plated with copper according to claim 1, is characterized by comprising the following steps:
Step A: laminating a dry film (6) on the outer side of the product copper foil (3);
and B: carrying out exposure and development;
and C: etching is carried out;
Step D: stripping the film;
step E: coating a conductive film (9) on the product;
step F: coating a layer of anti-plating layer (8) on the conductive film (9);
step G: laser is carried out on the through hole (4);
Step H: conducting treatment is carried out on the through hole (4), and a layer of conducting substance (5) is formed on the hole wall;
Step I: a hole-plated copper (7);
step J: stripping the plating resist layer (8);
Step K: the conductive film (9) is peeled off.
3. the method for manufacturing a multilayer fine circuit board with a circuit being plated with copper and a hole being plated with copper according to claim 1, wherein the method comprises the following steps: the product is a multilayer fine circuit board.
4. the method for manufacturing a multilayer fine circuit board with a circuit being plated with copper and a hole being plated with copper according to claim 2, wherein the method comprises the following steps: and E, coating the conductive film (6) while avoiding the electroplated lead.
5. The method for manufacturing a multilayer fine circuit board with a circuit being plated with copper and a hole being plated with copper according to claim 2, wherein the method comprises the following steps: and step J, stripping the plating resisting layer (8) by using a strong alkali solution.
6. The method for manufacturing a multilayer fine circuit board with a circuit being plated with copper and a hole being plated with copper according to claim 2, wherein the method comprises the following steps: and the step K, stripping the conductive film (9) by an organic solvent or strong alkali.
7. the method for manufacturing a multilayer fine circuit board with a circuit being plated with copper and a hole being plated with copper according to claim 2, wherein the method comprises the following steps: and the step E and the step F can combine the conductive film (9) and the anti-plating layer (8) and press the conductive film and the anti-plating layer onto a product in a pressing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910809143.XA CN110545634A (en) | 2019-08-29 | 2019-08-29 | Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910809143.XA CN110545634A (en) | 2019-08-29 | 2019-08-29 | Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110545634A true CN110545634A (en) | 2019-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910809143.XA Pending CN110545634A (en) | 2019-08-29 | 2019-08-29 | Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110545634A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056117A (en) * | 2021-03-15 | 2021-06-29 | 德中（天津）技术发展股份有限公司 | Method for metalizing and electroplating hole wall only |
| CN113133224A (en) * | 2021-04-07 | 2021-07-16 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3675318A (en) * | 1969-05-14 | 1972-07-11 | Siemens Ag | Process for the production of a circuit board |
| CN102171804A (en) * | 2008-11-25 | 2011-08-31 | 英特尔公司 | Method of enabling selective area plating on a substrate |
| CN104105361A (en) * | 2014-05-07 | 2014-10-15 | 深圳市环基实业有限公司 | Method for selective plating of conductive hole of circuit board |
-
2019
- 2019-08-29 CN CN201910809143.XA patent/CN110545634A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3675318A (en) * | 1969-05-14 | 1972-07-11 | Siemens Ag | Process for the production of a circuit board |
| CN102171804A (en) * | 2008-11-25 | 2011-08-31 | 英特尔公司 | Method of enabling selective area plating on a substrate |
| CN104105361A (en) * | 2014-05-07 | 2014-10-15 | 深圳市环基实业有限公司 | Method for selective plating of conductive hole of circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056117A (en) * | 2021-03-15 | 2021-06-29 | 德中（天津）技术发展股份有限公司 | Method for metalizing and electroplating hole wall only |
| CN113133224A (en) * | 2021-04-07 | 2021-07-16 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191206 |