CN113543501A - Method for producing carbon ink circuit board positive and negative films with electroplated through holes - Google Patents
Method for producing carbon ink circuit board positive and negative films with electroplated through holes Download PDFInfo
- Publication number
- CN113543501A CN113543501A CN202110795831.2A CN202110795831A CN113543501A CN 113543501 A CN113543501 A CN 113543501A CN 202110795831 A CN202110795831 A CN 202110795831A CN 113543501 A CN113543501 A CN 113543501A
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- China
- Prior art keywords
- copper
- film
- carbon ink
- circuit board
- clad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for producing a carbon ink circuit board positive and negative film with electroplated through holes, which comprises the following production steps in sequence: cutting a plate, drilling, primary film pressing, primary exposure and development, electroplating a drilling area, primary film stripping, secondary film pressing, secondary exposure and development, etching, secondary film stripping and carbon ink printing. By adopting the design scheme of the invention, the existing thinking of directly carrying out whole-plate copper-clad electroplating is changed, the copper-clad area is changed through twice film pressing by a unique production process, the copper-clad layer in the etching area is thinned, the height difference of the connecting position of the carbon ink and the adjacent copper layer during printing can be effectively reduced, the uniformity of the carbon ink is improved, and the scrap rate is reduced.
Description
Technical Field
The invention relates to a carbon ink printing mode, in particular to a method for producing a positive film and a negative film of a carbon ink circuit board with electroplated through holes.
Background
The existing carbon ink printing process comprises the following steps: cutting the board, drilling, whole board is electroplated, the press mold, exposure development, etching, the deciduate and printing carbon black, but very audio-visual, we just can understand, because cut the board itself and have first copper layer that covers, after carrying out positive version electroplating, we are just in the top on first copper layer that covers, directly formed, the second covers the copper layer, make holistic copper layer more thicker, even follow-up modes such as adopting etching to get rid of unnecessary copper layer that covers, but the thickness that covers the copper layer surplus region still can be thicker for first copper layer that covers, and carbon black's printing requirement is very strict again, when covering the printing carbon black on the copper layer more thickly, very easily can lead to the yield to reduce because of tiny difference in height.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to solve the problem that the copper-clad layer becomes thick in the existing carbon ink printing process, and further the defect increase is caused by printing carbon ink on the thicker copper-clad layer.
The technical scheme is as follows: in order to achieve the purpose, the invention provides the following technical scheme:
a production method of a carbon ink circuit board positive and negative film with electroplated through holes comprises the following production steps in sequence:
1): plate cutting: cutting the circuit board into required size;
2): drilling: drilling holes at corresponding positions on the circuit board to enable the front side and the back side of the circuit board to have conducting spaces;
3) primary film pressing: a whole board press polishing film engraving mode is adopted;
4) primary exposure and development: exposing and developing the edges in the hole of the drilling area and corresponding to the inner wall of the hole to expose the edges of the first copper-clad layers on the hole and the holes on the upper and lower plate surfaces;
5) electroplating the drilling area: copper is coated on the inner wall of the hole and the edge of the first copper-coated layer on the hole again in an electroplating mode through the unique shape of the hole formed by one-time exposure and development to form a second copper-coated layer, so that the front side and the back side of the circuit board can be conducted;
6) primary demoulding;
7) secondary film pressing: continuously adopting a whole-plate film pressing mode;
8) secondary exposure and development: for the position of the first copper-clad layer to be removed, exposing and developing the pressed film to expose the first copper-clad layer to be removed;
9) etching: etching the exposed first copper-clad layer to remove the first copper-clad layer at a specific position and form a specific copper-clad connection pattern on the board;
10) secondary demoulding: removing the photoetching film of the secondary pressing film to expose the remaining copper-clad pattern;
11) printing carbon ink: and printing carbon ink at the specific position of the copper-clad pattern of the residual part.
Further, in the step 3) and the step 7), the adopted pressing film is a photoetching film formed by a dry film.
Further, in the step 4), the hole to be plated and the edge of the first copper-clad layer are exposed by adopting a mapping transfer mode, and the copper-clad layer areas of other circuits are still covered by the pressed film.
By the mode, the symmetrical shape printing of the small area can be realized, meanwhile, if only the through hole part is directly remained on the edge of the first copper-clad layer of the remained part, partial false welding is probably caused according to the current printing means, and further the conduction effect of the front side and the back side is deteriorated, and the yield of the whole board is influenced.
Further, in the step 5), after copper is further coated on the edge of the first copper-coated layer, the total thickness of the first copper-coated layer and the second copper-coated layer is not more than 42 μm.
According to international standards, the thickness of the first copper clad layer is 0.7mil, 0.0254mm is 1mil, and 17 μm is 0.7mil, and the thickness of the second copper clad layer can be calculated to be about 25 μm by the total thickness not exceeding 42 μm, so that the only first copper clad layer exists at the position where the carbon ink is printed, namely the height difference is about 17 μm, and the height difference is improved by 25 μm relative to 42 μm after the carbon ink is superimposed.
Further, in the step 6) and the step 10), a weak alkaline solution is used for removing the photoetching film.
Has the advantages that: compared with the prior art, the invention has the advantages that:
by adopting the design scheme of the invention, the existing thinking of directly carrying out whole-plate copper-clad electroplating is changed, the copper-clad area is changed through twice film pressing by a unique production process, the copper-clad layer in the etching area is thinned, the height difference of the connecting position of the carbon ink and the adjacent copper layer during printing can be effectively reduced, the uniformity of the carbon ink is improved, and the scrap rate is reduced.
Drawings
FIG. 1 is a state diagram of the present invention after completion of step 1);
FIG. 2 is a state diagram of the present invention after completion of step 2);
FIG. 3 is a state diagram of the present invention after completion of step 3);
FIG. 4 is a state diagram of the present invention after completion of step 4);
FIG. 5 is a state diagram of the present invention after completion of step 5);
FIG. 6 is a state diagram of the present invention after completion of step 6);
FIG. 7 is a state diagram of the present invention after completion of step 7);
FIG. 8 is a state diagram of the present invention after completion of step 8);
FIG. 9 is a state diagram of the present invention after completion of step 9);
FIG. 10 is a state diagram of the present invention after completion of step 10);
FIG. 11 is a state diagram of the present invention after completion of step 11);
fig. 12 is a schematic view of a conventional manufacturing process.
Detailed Description
The present invention is further illustrated by the following figures and specific examples, which are to be understood as illustrative only and not as limiting the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.
Examples
As shown in fig. 1 to 11, a method for producing a carbon ink circuit board positive and negative film with plated through holes comprises the following steps in sequence:
1): plate cutting: cutting the circuit board 1 into a required size;
2): drilling: drilling holes at corresponding positions on the circuit board, so that the front side and the back side of the circuit board have conducting spaces, and drilling holes at the positions of the labels 2;
3) primary film pressing: adopting a mode of pressing and engraving the film 3 by a whole plate;
4) primary exposure and development: exposing and developing the edges in the holes of the drilling area and corresponding to the inner walls of the holes to expose the edges of the first copper-clad layers 4 on the holes and the holes on the upper and lower plate surfaces;
5) electroplating the drilling area: copper is coated on the inner wall of the hole and the edge of the first copper-coated layer 4 on the hole again in an electroplating mode through the unique shape of the hole formed by one-time exposure and development to form a second copper-coated layer 5, so that the front side and the back side of the circuit board can be conducted;
6) primary demoulding;
7) secondary film pressing: continuing to adopt a whole-plate film pressing mode, and similarly adopting a reference numeral 3 to represent a photoetching film;
8) secondary exposure and development: exposing and developing the position of the first copper-clad layer 4 to be removed, so that the first copper-clad layer 4 to be removed is exposed;
9) etching: etching the exposed first copper-clad layer 4, so that the first copper-clad layer 4 at a specific position is removed, and forming a specific copper-clad connection pattern on the board;
10) secondary demoulding: removing the photoetching film 3 of the secondary pressing film to expose the remaining part of the copper-clad pattern;
11) printing carbon ink: the carbon ink 6 is printed at a specific position of the copper-clad pattern remaining.
In the steps 3) and 7), the adopted pressed films are all photoetching films formed by dry films.
In the step 4), the image transfer mode is adopted to expose the hole to be electroplated and the edge of the first copper-clad layer, and the copper-clad layer areas of other circuits are still covered by the pressed film.
By the mode, the symmetrical shape printing of the small area can be realized, meanwhile, if only the through hole part is directly remained on the edge of the first copper-clad layer of the remained part, partial false welding is probably caused according to the current printing means, and further the conduction effect of the front side and the back side is deteriorated, and the yield of the whole board is influenced.
In the step 5), after the edge of the first copper-clad layer is coated with copper again, the total thickness of the first copper-clad layer and the second copper-clad layer is not more than 42 μm.
According to international standards, the thickness of the first copper clad layer is 0.7mil, 0.0254mm is 1mil, and 17 μm is 0.7mil, and the thickness of the second copper clad layer can be calculated to be about 25 μm by the total thickness not exceeding 42 μm, so that the only first copper clad layer exists at the position where the carbon ink is printed, namely the height difference is about 17 μm, and the height difference is improved by 25 μm relative to 42 μm after the carbon ink is superimposed.
And 6) removing the photoetching film by using weak alkali liquid medicine in the step 10).
After the final practical use, the improvement is found to improve the yield of the carbon ink coating by 4-6%.
Comparative example
As shown in fig. 12, the conventional carbon ink printing process includes: cut out the board, drill hole, whole board is electroplated, the press mold, exposure development, etching, deciduate and printing carbon black, from figure 12, we just can be very audio-visual sees, because cut out the board itself and have had first copper clad layer, after carrying out positive version electroplating, we just directly formed in the top on first copper clad layer, the second copper clad layer for holistic copper clad layer is thicker, the coating is to covering the copper layer also thicker, make the yield reduce.
Claims (5)
1. A method for producing a positive film and a negative film of a carbon ink circuit board with electroplated through holes is characterized by comprising the following steps: comprises the following production steps in sequence:
1): plate cutting: cutting the circuit board into required size;
2): drilling: drilling holes at corresponding positions on the circuit board to enable the front side and the back side of the circuit board to have conducting spaces;
3) primary film pressing: a whole board press polishing film engraving mode is adopted;
4) primary exposure and development: exposing and developing the edges in the hole of the drilling area and corresponding to the inner wall of the hole to expose the edges of the first copper-clad layers on the hole and the holes on the upper and lower plate surfaces;
5) electroplating the drilling area: copper is coated on the inner wall of the hole and the edge of the first copper-coated layer on the hole again in an electroplating mode through the unique shape of the hole formed by one-time exposure and development to form a second copper-coated layer, so that the front side and the back side of the circuit board can be conducted;
6) primary demoulding;
7) secondary film pressing: continuously adopting a whole-plate film pressing mode;
8) secondary exposure and development: for the position of the first copper-clad layer to be removed, exposing and developing the pressed film to expose the first copper-clad layer to be removed;
9) etching: etching the exposed first copper-clad layer to remove the first copper-clad layer at a specific position and form a specific copper-clad connection pattern on the board;
10) secondary demoulding: removing the photoetching film of the secondary pressing film to expose the remaining copper-clad pattern;
11) printing carbon ink: and printing carbon ink at the specific position of the copper-clad pattern of the residual part.
2. The method for producing a through-hole plated carbon ink circuit board positive and negative film according to claim 1, wherein: in the step 3) and the step 7), the adopted pressed films are all photoetching films formed by dry films.
3. The method for producing a through-hole plated carbon ink circuit board positive and negative film according to claim 1, wherein: in the step 4), the image transfer mode is adopted, the hole to be electroplated and the edge of the first copper-clad layer are exposed, and the copper-clad layer areas of other circuits are still covered by the pressed film.
4. The method for producing a through-hole plated carbon ink circuit board positive and negative film according to claim 1, wherein: in the step 5), after the edge of the first copper-clad layer is coated with copper again, the total thickness of the first copper-clad layer and the second copper-clad layer is not more than 42 μm.
5. The method for producing a through-hole plated carbon ink circuit board positive and negative film according to claim 1, wherein: and in the step 6) and the step 10), removing the photoetching film by using weak base liquid medicine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110795831.2A CN113543501A (en) | 2021-07-14 | 2021-07-14 | Method for producing carbon ink circuit board positive and negative films with electroplated through holes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110795831.2A CN113543501A (en) | 2021-07-14 | 2021-07-14 | Method for producing carbon ink circuit board positive and negative films with electroplated through holes |
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| Publication Number | Publication Date |
|---|---|
| CN113543501A true CN113543501A (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110795831.2A Pending CN113543501A (en) | 2021-07-14 | 2021-07-14 | Method for producing carbon ink circuit board positive and negative films with electroplated through holes |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891568A (en) * | 2021-10-27 | 2022-01-04 | 高德（江苏）电子科技有限公司 | Processing technology for improving hole breakage of printed circuit board reverse etching dry film |
| CN114745859A (en) * | 2022-06-10 | 2022-07-12 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board drilling device and processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135151A (en) * | 2004-11-08 | 2006-05-25 | Hitachi Chem Co Ltd | Method of manufacturing wiring board |
| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN106817840A (en) * | 2017-02-08 | 2017-06-09 | 苏州维信电子有限公司 | A kind of FPC and its manufacture method without orifice ring |
-
2021
- 2021-07-14 CN CN202110795831.2A patent/CN113543501A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006135151A (en) * | 2004-11-08 | 2006-05-25 | Hitachi Chem Co Ltd | Method of manufacturing wiring board |
| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN106817840A (en) * | 2017-02-08 | 2017-06-09 | 苏州维信电子有限公司 | A kind of FPC and its manufacture method without orifice ring |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891568A (en) * | 2021-10-27 | 2022-01-04 | 高德（江苏）电子科技有限公司 | Processing technology for improving hole breakage of printed circuit board reverse etching dry film |
| CN113891568B (en) * | 2021-10-27 | 2024-05-17 | 高德(江苏)电子科技股份有限公司 | Processing technology for improving hole breaking of printed circuit board etching-back dry film |
| CN114745859A (en) * | 2022-06-10 | 2022-07-12 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board drilling device and processing method |
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Application publication date: 20211022 |
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| RJ01 | Rejection of invention patent application after publication |