CN102340933A - Manufacturing method of circuit board - Google Patents
Manufacturing method of circuit board Download PDFInfo
- Publication number
- CN102340933A CN102340933A CN2010102352717A CN201010235271A CN102340933A CN 102340933 A CN102340933 A CN 102340933A CN 2010102352717 A CN2010102352717 A CN 2010102352717A CN 201010235271 A CN201010235271 A CN 201010235271A CN 102340933 A CN102340933 A CN 102340933A
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- conductive layer
- circuit board
- circuit
- manufacture method
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Abstract
The invention relates to a manufacturing method of a circuit board, which comprises the steps that: two circuit substrates are provided; each circuit substrate comprises a middle layer and a first conductive layer and a second conductive layer which are respectively formed on both sides of the middle layer; each circuit substrate comprises a processing area and an edge area which surrounds and is connected with the processing area; an adhesive tablet is provided and is provided with openings which correspond to the processing areas; the adhesive tablet is pressed between the two circuit substrates to form a pressure board, and the second conductive layers in the processing areas of the two circuit substrates are exposed in the openings; the two first conductive layers of the pressure board are manufactured into first conductive lines; and areas in the pressure board which correspond to the edge areas of the circuit substrates are cut and removed, so that two separated circuit boards are obtained.
Description
Technical field
The present invention relates to the circuit board technology field, the manufacture method of the circuit board that particularly a kind of thickness is less.
Background technology
(Printed Circuit Board PCB) is widely used in the encapsulation of various electronic products to printed circuit board (PCB) as the carrier of various electronic components.Along with electronic product constantly develops along trend light, thin, short, little, power saving, the manufacture craft of printed circuit board (PCB) also faces more challenges.
For reducing the thickness of electronic product, the thickness that is used to make the flexible copper-clad base material of double-sided PCB is reduced to 36 microns from 100 microns, and this development all makes troubles for each step of circuit board making.Especially after experiencing repeatedly wet process such as painting photoresist, exposure imaging, etching, the removal of photoresist layer and plating, the flexible copper-clad base material serious backfin can occur and hinder.In addition, at electroplating work procedure, at the bottom of the flexible copper-clad base material very easily drops to electroplating bath from tool, and cause product rejection.At selective electroplating, that is, attach dry film on a surface of flexible copper-clad base material, only another surface to be electroplated, products obtained therefrom also can curl, and brings difficulty to stripping, and it is serious to curl, and the entire circuit plate will be scrapped.And for example, with after forming outer-layer circuit, the products obtained therefrom gauffer is serious at etching flexible copper-clad base material.Above phenomenon all is unfavorable for enhancing productivity or the product yield.
Summary of the invention
Therefore, be necessary to provide a kind of manufacture method of circuit board, to enhance productivity and the product yield.
A kind of manufacture method of circuit board; Comprise step: two circuit substrates are provided; Each circuit substrate includes the intermediate layer and is formed at first conductive layer and second conductive layer of both sides, said intermediate layer respectively, each circuit substrate include the processing district with around the marginal zone that is connected said processing district; An adhesive sheet is provided, and it has and the corresponding opening in said processing district; Said adhesive sheet is pressed between said two circuit substrates to form force fit plate, and second conductive layer in the processing district of said two circuit substrates all is exposed to said opening; Two first conductive layers of said force fit plate all are made into first conducting wire; And cut the zone corresponding in the said force fit plate of removal, thereby obtain the circuit board of two separation with the marginal zone of said circuit substrate.
The manufacture method of the circuit board that the present technique scheme provides is pressed on two circuit substrates and processes force fit plate with an adhesive sheet; Because the thickness of the force fit plate of gained is bigger, the situation that follow-up wet process all can not cause force fit plate gauffer to occur, curl or scrap.Help improving the yield of product.
Description of drawings
Fig. 1 is the structural representation of a circuit substrate providing of present technique scheme implementation example.
Fig. 2 is the generalized section after the foregoing circuit substrate forms a plurality of first holes.
Fig. 3 is the generalized section after second conductive layer of foregoing circuit substrate is made into second conducting wire.
Fig. 4 is the generalized section after the foregoing circuit substrate forms a plurality of second holes and obtains blind hole.
Fig. 5 is the structural representation of the adhesive sheet that provides of present technique scheme implementation example.
Fig. 6 is the generalized section of gained force fit plate.
Fig. 7 is the generalized section after the hole wall of the blind hole of above-mentioned force fit plate forms the hole wall conductive layer.
Fig. 8 is the generalized section after all forming conductive coating on two first conductive layers of above-mentioned force fit plate.
Fig. 9 is the generalized section after two first conductive layers with above-mentioned force fit plate all are made into first conducting wire.
Figure 10 is the marginal zone of removing above-mentioned force fit plate, the generalized section of a circuit substrate that obtains.
Figure 11 is the generalized section after the both sides of foregoing circuit substrate form first cover layer and second cover layer respectively.
Figure 12 removes the bonding pad of foregoing circuit substrate, the generalized section of a circuit board unit that obtains.
The main element symbol description
First conductive layer 12
First conducting wire 123
Second conductive layer 13
Second conducting wire 130
Hole wall 106
Force fit plate 107
Hole wall conductive layer 108
Conducting blind hole 109
Embodiment
To combine the manufacture method of the circuit board that accompanying drawing and embodiment provide the present technique scheme to do further explain below.
Present technique scheme implementation example provides a kind of manufacture method of circuit board, and it may further comprise the steps:
The first step provides two circuit substrates as shown in Figure 1 10, first conductive layer 12 and second conductive layer 13 that it comprises intermediate layer 11 and is formed at 11 both sides, said intermediate layer respectively.
Said circuit substrate 10 can be double-sided copper-clad substrate or multi-layer sheet.Said intermediate layer 11 can be insulating barrier or multiple-plate inner plating.In the present embodiment, said circuit substrate 10 is the double-sided copper-clad substrate, and said intermediate layer 11 is polyester (PET) film or polyimides (PI) film.Said first conductive layer 12 and second conductive layer 13 can be the copper layer.Said circuit substrate 10 is a cuboid, and its thickness is about 36 microns.Said circuit substrate 10 comprises processing district 101 and around the marginal zone that is connected in said processing district 101 102.Said processing district 101 is positioned at the center of said circuit substrate 10.Said processing district 101 comprises a plurality of product zone 103 and a bonding pad 104.Said bonding pad 104 is connected between said a plurality of product zone 103.Said marginal zone 102 is an annular.In the present embodiment, said processing district 101 is square.Said marginal zone 102 is square framework.The quantity of said product zone 103 is four, and said four product zone 103 are array and arrange.Said bonding pad 104 is " ten " font.Said first conductive layer 12 and second conductive layer 13 can be Copper Foil.
In second step, said first conductive layer 12 of etching forms a plurality of first holes 120 with precalculated position in said first conductive layer 12, obtains structure as shown in Figure 2.Said a plurality of first hole 120 forms through image transfer and etch process.Particularly, can on said first conductive layer 12, attach the photoresist layer earlier, remove the partially conductive material of said first conductive layer 12 again through technologies such as overexposure, development, etchings, the rest parts electric conducting material promptly surrounds and forms a plurality of first holes 120.Each first hole 120 all has first side 121 that is connected between two relative surfaces of said first conductive layer 12.
The 3rd step was made into second conducting wire 130 with said second conductive layer 13, obtained structure as shown in Figure 3.Particularly, can remove the partially conductive material of said second conductive layer 13 again through technologies such as overexposure, development, etchings earlier at the side formation photoresist layer of said second conductive layer 13, the rest parts electric conducting material promptly constitutes second conducting wire 130.
Be appreciated that above-mentioned the 3rd step and second step also can transposing in proper order, perhaps carry out simultaneously.
The 4th step; In said intermediate layer 11, form a plurality of second holes 110 that are communicated with one by one with said a plurality of first holes 120; Thereby in said two circuit substrates 10, all form a plurality of blind holes 105 that run through said first conductive layer 12 and intermediate layer 11, obtain structure as shown in Figure 4.Said second conductive layer, 13 parts are exposed to said blind hole 105.In the present embodiment, said a plurality of second holes 110 form through laser ablation.Particularly, can adopt the carbon dioxide laser said intermediate layer 11 of ablating.Said second hole 110 has second side 111 between two facing surfaces that are connected in said intermediate layer 11.Said second side 111 and first side, the 121 common hole walls 106 that constitute blind hole 105.
The 5th step provided an adhesive sheet as shown in Figure 5 14, and it has and said processing district 101 corresponding openings 140.
The main material of said adhesive sheet 14 can be acrylic or epoxy resin.The both sides of said adhesive sheet 14 have release diaphragm usually.The thickness range of said adhesive sheet 14 is 12.5 microns to 50 microns.Particularly, can provide earlier one with the roughly the same cuboid sheet of said circuit substrate 10 shapes size, form opening 140 in heart place therein through modes such as stamps again, can obtain the adhesive sheet 14 of annular.The length of said opening 140 and width are all more than or equal to the length and the width of said processing district 101.
The 6th step was pressed between said two circuit substrates 10 said adhesive sheet 14 to form force fit plate as shown in Figure 6 107, and second conductive layer 13 in the processing district 101 of said two circuit substrates 10 all is exposed to said opening 140.
When making said force fit plate 107, can earlier said adhesive sheet 14 be fitted in the marginal zone 102 of second conductive layer 13 of a circuit substrate 10.Make the marginal zone 102 of second conductive layer 13 of another circuit substrate 10 fit in said adhesive sheet 14 then, obtain jointing plate.At last said jointing plate is moved to and carry out pressing in the pressing machine, said adhesive sheet 14 forms adhesive linkage 141, promptly obtains force fit plate 107.The thickness range of said force fit plate 107 is 80 microns to 120 microns, and its both sides are first conductive layer 12.
In the 7th step, the hole wall 106 of the blind hole 105 in said Fig. 6 forms hole wall conductive layer 108, obtains conducting blind hole 109, and is as shown in Figure 7.
Particularly, can adopt electroless copper plating technology or shadow technology, in the present embodiment, hole wall conductive layer 108 is to form through shadow technology, and its material is a carbon.Said shadow technology is only at the material surface depositing conducting layer that insulate, so said hole wall conductive layer 108 only is formed at second side 111 in second hole 110 of blind hole 105.
The 8th step; The surface that is exposed to said a plurality of conducting blind holes 109 through hole wall conductive layer 108 surfaces and said second conductive layer of electroplating in the surface of two first conductive layers 12 of said force fit plate 107, said a plurality of conducting blind holes 109 13 forms conductive coating 122, and is as shown in Figure 8.
The 9th step was made into first conducting wire 123 with said first conductive layer 12, obtained structure as shown in Figure 9.In this step, said conductive coating 122 is made into first conducting wire 123 with said first conductive layer 12.Can be earlier form the photoresist layer in a side of said conductive coating 122; Remove the partially conductive material of said first conductive layer 12 and conductive coating 122 again through technologies such as overexposure, development, etchings, the rest parts electric conducting material promptly constitutes first conducting wire 123.
In the tenth step, the zone corresponding with the marginal zone of said circuit substrate 10 102 removed in the said force fit plate 107 in cutting, obtains the circuit board shown in figure 10 16 of two separation.Can adopt make-up machine that said force fit plate 107 is cut.Because the length of said opening 140 and width are all more than or equal to the length and the width of said processing district 101; The adhesive linkage 141 that is formed at said marginal zone 102 after the pressing also breaks away from said force fit plate 107 with marginal zone 102, can obtain circuit board 16 two separation, that be formed with first conducting wire 123, conducting blind hole 109 and second conducting wire 130.
The 11 step formed first cover layer 150 and second cover layer 151 that covers said first conducting wire 123 and second conducting wire 130 respectively in the both sides of foregoing circuit plate 16, obtained structure shown in figure 11.In the present embodiment, first cover layer 150 that covers said first conducting wire 123 is reserved opening at corresponding conducting blind hole 109 places, can at this place electronic component be installed as required.Second cover layer 151 covers the lead of said second conducting wire 130 and the space between the partially filled lead.
In the 12 step, the bonding pad 104 of removing said circuit board 16 obtains and a plurality of one to one circuit board units 17 of said a plurality of product zone 103, and is shown in figure 12.In each circuit board unit 17, said first conducting wire 123 is connected with said second conducting wire 130 signals through said conducting blind hole 109.
The manufacture method of the circuit board that the present technique scheme provides is pressed on two circuit substrates 10 and processes force fit plate 107 with adhesive sheet 14; Because the thickness of the force fit plate 107 of the 6th step gained is bigger, the electroless copper plating technology in follow-up the 7th step to the 9th step or the situation that processes such as shadow technology, electroplating technology, image transfer and etch process all can not cause force fit plate 107 gauffer to occur, curl or scrap.Help improving the yield of product.In addition; After forming force fit plate 107, can electroplate first conductive layer 12 of its both sides simultaneously, carry out the way of selective electroplating compared to traditional needs to some surfaces of each circuit substrate 10; Can save the step that attaches diaphragms and follow-up removal diaphragm at second conductive layer 13; Not only save operation, helped enhancing productivity, also avoided circuit substrate 10 to fall into the risk in the electroplating bath because of thickness is little, helped improving the product yield.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. the manufacture method of a circuit board comprises step:
Two circuit substrates are provided, and each circuit substrate includes the intermediate layer and is formed at first conductive layer and second conductive layer of both sides, said intermediate layer respectively, each circuit substrate include the processing district with around the marginal zone that is connected said processing district;
An adhesive sheet is provided, and it has and the corresponding opening in said processing district;
Said adhesive sheet is pressed between said two circuit substrates to form force fit plate, and second conductive layer in the processing district of said two circuit substrates all is exposed to said opening;
Two first conductive layers of said force fit plate all are made into first conducting wire; And cut the zone corresponding in the said force fit plate of removal, thereby obtain the circuit board of two separation with the marginal zone of said circuit substrate.
2. the manufacture method of circuit board as claimed in claim 1; It is characterized in that; Before said adhesive sheet being pressed between said two circuit substrates; Etching first conductive layer is to form a plurality of first holes in first conductive layer, second conductive layer of etching simultaneously is to process second conducting wire with second conductive layer.
3. the manufacture method of circuit board as claimed in claim 2; It is characterized in that; After in first conductive layer, forming a plurality of first holes; Before said adhesive sheet being pressed between said two circuit substrates, also in the intermediate layer, form a plurality of second holes that are communicated with one by one with said a plurality of first holes, in circuit substrate, to form a plurality of blind holes that run through said first conductive layer and intermediate layer.
4. the manufacture method of circuit board as claimed in claim 2 is characterized in that, said circuit substrate is the double-sided copper-clad substrate, and said a plurality of second holes form through laser ablation.
5. the manufacture method of circuit board as claimed in claim 1 is characterized in that, before said adhesive sheet being pressed between said two circuit substrates, second conductive layer of said two circuit substrates all is made into second conducting wire.
6. the manufacture method of circuit board as claimed in claim 3 is characterized in that, after forming said force fit plate, two first conductive layers of said force fit plate is made into before first conducting wire, forms the hole wall conductive layer at the hole wall of said a plurality of blind holes.
7. the manufacture method of circuit board as claimed in claim 6 is characterized in that, the material of said hole wall conductive layer is a carbon.
8. the manufacture method of circuit board as claimed in claim 6; It is characterized in that; After the hole wall of said a plurality of blind holes forms the hole wall conductive layer; Said first conductive layer is made into before first conducting wire; The surface that is exposed to said a plurality of blind holes through hole wall conductive layer surface and said second conductive layer of electroplating in two first conductive layer surfaces of said force fit plate, said a plurality of blind holes forms conductive coating, and when said first conductive layer was made into first conducting wire, the conductive coating of said first conductive layer surface was etched with first conductive layer.
9. the manufacture method of circuit board as claimed in claim 1 is characterized in that, after the circuit board that obtains two separation, forms first cover layer and second cover layer respectively in the both sides of each circuit board.
10. the manufacture method of circuit board as claimed in claim 1; It is characterized in that; The processing district of said circuit substrate comprises a plurality of product zone and a bonding pad, and said bonding pad is connected between said a plurality of product zone, after zone corresponding with the marginal zone of said circuit substrate in the said force fit plate is removed in cutting; Also remove said bonding pad, thereby obtain and a plurality of one to one circuit board units of said a plurality of product zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010235271 CN102340933B (en) | 2010-07-23 | 2010-07-23 | Manufacturing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010235271 CN102340933B (en) | 2010-07-23 | 2010-07-23 | Manufacturing method of circuit board |
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| CN102340933A true CN102340933A (en) | 2012-02-01 |
| CN102340933B CN102340933B (en) | 2013-10-09 |
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| CN 201010235271 Active CN102340933B (en) | 2010-07-23 | 2010-07-23 | Manufacturing method of circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
| CN108200737A (en) * | 2017-12-22 | 2018-06-22 | 深圳市景旺电子股份有限公司 | A kind of production method of high frequency mixed pressure HDI plates |
| CN111010808A (en) * | 2019-12-31 | 2020-04-14 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111031690A (en) * | 2019-12-31 | 2020-04-17 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112584622A (en) * | 2019-09-27 | 2021-03-30 | 睿明科技股份有限公司 | Thin circuit manufacturing method |
| CN112911837A (en) * | 2021-01-21 | 2021-06-04 | 盐城维信电子有限公司 | Synchronous processing method for inner layer and outer layer of flexible circuit board |
| CN113038718A (en) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | Ultra-thin PCB laminating process |
| CN113873786A (en) * | 2020-06-30 | 2021-12-31 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
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| CN101287339A (en) * | 2007-04-13 | 2008-10-15 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit board with differential break structure |
| CN101494957A (en) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | Method and substrate for producing multi-layer circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
| CN108200737A (en) * | 2017-12-22 | 2018-06-22 | 深圳市景旺电子股份有限公司 | A kind of production method of high frequency mixed pressure HDI plates |
| CN108200737B (en) * | 2017-12-22 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method of high frequency mixed pressure HDI plate |
| CN112584622A (en) * | 2019-09-27 | 2021-03-30 | 睿明科技股份有限公司 | Thin circuit manufacturing method |
| CN111010808A (en) * | 2019-12-31 | 2020-04-14 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111031690A (en) * | 2019-12-31 | 2020-04-17 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN113873786A (en) * | 2020-06-30 | 2021-12-31 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN113873786B (en) * | 2020-06-30 | 2023-12-29 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN112911837A (en) * | 2021-01-21 | 2021-06-04 | 盐城维信电子有限公司 | Synchronous processing method for inner layer and outer layer of flexible circuit board |
| CN113038718A (en) * | 2021-01-27 | 2021-06-25 | 红板（江西）有限公司 | Ultra-thin PCB laminating process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102340933B (en) | 2013-10-09 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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Effective date of registration: 20170315 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |