CN106604570A - Flexible laminated board and making method thereof - Google Patents
Flexible laminated board and making method thereof Download PDFInfo
- Publication number
- CN106604570A CN106604570A CN201611190800.XA CN201611190800A CN106604570A CN 106604570 A CN106604570 A CN 106604570A CN 201611190800 A CN201611190800 A CN 201611190800A CN 106604570 A CN106604570 A CN 106604570A
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- Prior art keywords
- flexible
- preparation
- demixing plate
- demixing
- plate according
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a flexible laminated board and a making method thereof. The making method comprises the following steps: after a plasma treatment process, carrying out black hole treatment, namely, forming a carbon film on the hole wall of a flexible laminated board; and after black hole treatment, carrying out VCP copper plating, inner-layer pattern making and AOI scanning. Through multiple treatments including engineering design optimization, laminated area pattern making control and process optimization, a multilayer flexible laminated board is made and the reliability thereof is ensured.
Description
Technical field
The present invention relates to flexible PCB field, more particularly to a kind of flexible demixing plate and preparation method thereof.
Background technology
With flexible PCB（FPC）The fast development of industry, market is required the function and structure of FPC flexible PCBs
Increasingly harsh, towards the trend development of how high sandwich circuit board, but for most of multi-layer flexible sheet, its flexility is required circuit board
Height, common two-sided FCCL（Copper foil base material）The market demand cannot be met, then new stepped construction design is arisen at the historic moment, i.e.,
" single sided board+epoxy thermosetting glue+single sided board " structure is replacing traditional dual platen.Such laminate structure, it is possible to achieve require
The layering of position and high flexility.However, such design brings very big problem to actual production：Demixing zone step problem
Dry film is set to press the very thin easy wrinkle of unreal and single sided board, circuit opens that the defects such as short circuit are more, and yield is low, it is impossible to realize that high-volume is raw
Produce.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of flexible demixing plate and its making side
Method, it is intended to the problems such as solving that existing layer flexible board defect is more, yield is low, cannot produce in batches.
Technical scheme is as follows：
A kind of preparation method of flexible demixing plate, wherein, including step：
Making to plasma treatment operation, carrying out black holes process：One layer of carbon film is formed in the hole wall of flexible demixing plate；
After black holes has been processed, VCP copper facing is carried out, then carry out inner figure making, then carry out AOI scannings.
The preparation method of described flexible demixing plate, wherein, the concrete steps of black holes process include successively：Put plate, pre- micro-
Erosion, first time overflow washing, ultrasonic degreasing, second overflow washing, the process of first time black holes, circulating water wash, whole hole, second
Secondary black holes process, microetch, third time overflow washing, anti-oxidant, the 4th overflow are washed, air-dry, take plate.
The preparation method of described flexible demixing plate, wherein, the epoxy thermosetting glue in the flexible demixing plate is using windowing
Process, make flexible demixing plate realize layering after hot-pressing.
The preparation method of described flexible demixing plate, wherein, when inner figure makes, paste by the way of along step position
Photosensitive dry film.
The preparation method of described flexible demixing plate, wherein, after having pasted photosensitive dry film, carry out hot-pressing processing.
The preparation method of described flexible demixing plate, wherein, it is exposed using CCD automatic exposure machines.
The preparation method of described flexible demixing plate, wherein, before plasma treatment, successively according to following order at
Reason：Sawing sheet, once drilling, lamination, hot pressing, solidification, secondary drilling, cutting edge.
The preparation method of described flexible demixing plate, wherein, the vacuum of plasma treatment is 30Pa, and temperature is 20 DEG C.
The preparation method of described flexible demixing plate, wherein, solidification temperature is 160 DEG C, and hardening time is 2h.
A kind of flexible demixing plate, wherein, made using the preparation method as above described in any one.
Beneficial effect：The present invention is optimized by engineering design, and the control of demixing zone graphic making, process optimization etc. are multi-party
The process of position is realizing making and its Reliability Assurance of layer flexible demixing plate.
Description of the drawings
Fig. 1 is a kind of structural representation of flexible demixing plate preferred embodiment of the present invention.
Specific embodiment
The present invention provides a kind of flexible demixing plate and preparation method thereof, to make the purpose of the present invention, technical scheme and effect
Clearer, clear and definite, below the present invention is described in more detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
A kind of preparation method preferred embodiment of flexible demixing plate provided by the present invention, it includes step：
Making to plasma treatment operation, carrying out black holes process：One layer of carbon film is formed in the hole wall of flexible demixing plate；
After black holes has been processed, VCP copper facing is carried out, then carry out inner figure making, then carry out AOI scannings.
The present invention replaces heavy copper process using black holes operation, while product reliability is ensured, by the heavy copper of vertical continuous
Operation is modified to horizontal wire type shadow operation.So, plate face planarization is fabulous, and VCP copper facing metapore copper connectivities are good.Through improving
Afterwards, circuit electrical connection is good, and reliability and flexility are obviously improved.
The concrete steps of black holes process include successively：Put plate, pre- microetch, first time overflow washing, ultrasonic degreasing, second
Secondary overflow washing, the process of first time black holes, circulating water wash, whole hole, second black holes process, microetch, third time overflow are washed, resisted
Oxidation, the 4th overflow are washed, air-dry, take plate.
The step of in the prior art black holes is processed originally is to carry out heavy Copper treatment, will flexible demixing plate be put in Hanging Basket,
The each liquid medicine tank of heavy copper cash is sent into using straddle truck, vertical continuous sink copper, and the action such as there are vibrations in liquid medicine tank, wave, inflate, meeting
The serious wrinkle of plate face are made, figure circuit yield is extremely low；It is horizontal line shadow operation after being changed to black holes flow process, plate face flatness
It is fabulous, provide reliable guarantee for VCP copper facing.
It is the hole wall one layer of carbon film of formation in flexible demixing plate in the purpose through black holes.
Before plate is put, process is also cleaned：Alkalescent cleaning agent is such as used, the greasy dirt of plate surface is removed, with true
Guarantor does not bring other impurities into and enters groove；
Pre- microetch is carried out after plate is put, that is, is roughened copper face, increase the adhesive force of follow-up electroplating process；Treatment fluid used by pre- microetch
Including persulfate and sulfuric acid.
First time overflow washing is carried out after pre- microetch, will hole wall and the flexible removing residues being layered in plate surface
Totally；
Then ultrasonic degreasing is carried out, wherein the degreasing agent for using can be CP-100S, concentration is 40 ~ 50g/L, and temperature is 70
℃；Purpose is to further remove the impurity such as surface and oil contaminant；
Then second overflow washing is carried out, removing residues that will be on hole wall and flexible layering plate surface are clean；
Then first time black holes process is carried out, the used treatment fluid of black holes process is hole blackening solution, is wrapped in hole blackening solution
Include carbon black, deionized water and surfactant.Wherein carbon black is the major part for constituting hole blackening solution, plays electric action,
Deionized water is to form uniform suspension liquid for dispersed graphite or carbon black.Surfactant is to improve stablizing for suspension liquid
Property and wettability, the pH value of hole blackening solution is 10 ~ 12, and temperature is room temperature.After by the process of hole blackening solution, just may be used
Based on physisorption, hole wall surface is set to adsorb the carbon black conductive layer of one layer of uniform and delicate, i.e. carbon film.
Then it is cleaned by way of circulating water wash, to clean to hole wall and plate face.
Then whole hole is carried out；Carbon black is with negative electrical charge in hole blackening solution, and the hole wall surface institute after drilling is negatively charged
Mutually repel, it is impossible to Electrostatic Absorption, directly affect the assimilation effect of carbon black.Processed by whole hole（Conditioner carries positive charge, such as
PSH COND-2810）Afterwards, the negative electrical charge of hole wall surface institute band can be neutralized or even hole wall positive charge can also be given, to adsorb carbon
It is black.
Second black holes process is carried out again；The technique of second black holes process is substantially similar with the process of first time black holes, no
Repeat again.
Then microetch is carried out；Microetch in this step is in order to remove the carbon colloid of hole wall residual and plate face, while also can
Roughening copper face, increases the adhesive force of follow-up electroplating process.If residual carbon colloid is removed not only, electro-coppering and internal layer copper can be caused
Separate.Treatment fluid used by microetch includes persulfate and sulfuric acid, and persulfate therein is sodium peroxydisulfate, and sodium peroxydisulfate concentration is
250g/L~300g/L。
Third time overflow washing is carried out again, and removing residues that will be on hole wall and flexible layering plate surface are clean；
Then anti-oxidant treatment is carried out；After black holes process, its clean copper face and internal layer copper ring are easy to oxidation, so needing antioxygen
Change is processed, and extends the resting period, prepares the antioxidant of mass concentration 1%, and concentration is unsuitable too high, prevents reduction outer layer from doing
Adhesive force between film and copper face.
The 4th overflow washing is carried out again；It is further that the removing residues on hole wall and flexible layering plate surface are clean；
Then air-dried；Operation temperature can be dried up for 45 ~ 55 DEG C, it is therefore intended that remove many on hole wall using operation is dried up
Remaining liquid, and hole wall is dried, increase the adhesive force of carbon colloid.
Finally take plate.
After black holes has been processed, carry out VCP copper facing, due to plate face flatness it is good, so VCP copper facing has reliable guarantee.
Then inner figure making is carried out, then carries out AOI scannings.
In inner figure manufacturing process, photosensitive dry film is pasted by the way of along step position, hot-pressing processing after patch（Return at pressure
Reason）, make step position dry film combine closely with copper face, bubble-free and space；Exposed using CCD automatic exposure machines simultaneously, it is ensured that right
Position precision.
After photosensitive dry film has been pasted, carry out returning pressure process, it is ensured that pressing tight ness rating.For example carry out 2 times and return pressure process, in case
Only demixing zone stepped locations have difference of height, and it is unreal dry film pressure easily occur, cause rejection film/fall film/ill-exposed to wait abnormal, finally
Cause circuit open circuit/short circuit defect.
In AOI scanning operations, flat scanning is carried out, choose open lines, short circuit, breach bad products.
Before plasma treatment, processed according to following order successively：Sawing sheet, once drilling, lamination, hot pressing, solidification,
Secondary drilling, cutting edge.
Wherein, in sawing sheet operation, the cutting machine edge of a knife and table top are cleaned in advance, it is ensured that material surface foreign, pressure point etc.；
Meanwhile, using the cold punching plate specification packing cleaned/handle well.
In lamination operation, single sided board did not allow Chemical cleaning line, using viscous spirituous non-dust cloth after manually unpacking
Wipe the foreign matters such as surface dust, both hands operation repetitive.
In curing process, clamped using steel plate, be placed in thousand layer frames, push oven cooking cycle solidification, wherein solidification temperature
Degree is preferably 160 DEG C, and hardening time is preferably 2h, to ensure excellent solidification effect.In addition, steel plate need to use alcohol using before
Wiped clean, prevents cull, foreign matter of surface of steel plate etc. to be transferred to plate face.
In plasma treatment operation, set of time is 20min, should not too long, and the vacuum of plasma treatment is preferably
30Pa, temperature is preferably 20 DEG C.
Further, as shown in figure 1, the epoxy thermosetting glue 30 in the flexible demixing plate is processed using windowing, flexible point is made
Laminate realizes after hot-pressing layering.I.e. in design by demixing zone 31（Flexable-broken area）Epoxy thermosetting glue 30 carry out windowing and set
Meter, to ensure hot pressing after, it is non-caked between flexible board and flexible board, realize layering and effect of destroying or force to yield.Wherein 10 be circuit copper, 20
For dielectric layer PI.
The windowing of the epoxy thermosetting glue, using the epoxy thermosetting glue 30 of thinner thickness during design（Such as 10 μm）As interlayer
Solid, while epoxy thermosetting glue 30 opens a window than target（The windowing for designing）Monolateral little 0.15mm；In addition, during graphic making,
Must be using the contraposition exposure of CCD automatic exposure machines, it is ensured that its precision.
The present invention preferably rolls the ED of copper or high ductibility without gum base materials, to ensure that the reliability and height of demixing plate are destroyed or force to yield
Property.
The present invention also provides a kind of flexible demixing plate preferred embodiment, and it adopts preparation method as above to make.
In sum, the present invention is optimized by engineering design, and the control of demixing zone graphic making, process optimization etc. are multi-party
The process of position is realizing making and its Reliability Assurance of layer flexible demixing plate.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, and for those of ordinary skills, can
To be improved according to the above description or be converted, all these modifications and variations should all belong to the guarantor of claims of the present invention
Shield scope.
Claims (10)
1. a kind of preparation method of flexible demixing plate, it is characterised in that including step：
Making to plasma treatment operation, carrying out black holes process：One layer of carbon film is formed in the hole wall of flexible demixing plate；
After black holes has been processed, VCP copper facing is carried out, then carry out inner figure making, then carry out AOI scannings.
2. the preparation method of flexible demixing plate according to claim 1, it is characterised in that the concrete steps of black holes process according to
It is secondary including：Put plate, pre- microetch, first time overflow washing, ultrasonic degreasing, second overflow washing, first time black holes process, follow
Ring washing, whole hole, second black holes process, microetch, third time overflow washing, anti-oxidant, the 4th overflow are washed, air-dry, taken
Plate.
3. the preparation method of flexible demixing plate according to claim 1, it is characterised in that the ring in the flexible demixing plate
Oxygen hot-setting adhesive is processed using windowing, makes flexible demixing plate realize layering after hot-pressing.
4. the preparation method of flexible demixing plate according to claim 1, it is characterised in that when inner figure makes, adopt
Photosensitive dry film is pasted with the mode along step position.
5. the preparation method of flexible demixing plate according to claim 4, it is characterised in that after having pasted photosensitive dry film, carry out
Hot-pressing processing.
6. the preparation method of flexible demixing plate according to claim 5, it is characterised in that entered using CCD automatic exposure machines
Row exposure.
7. the preparation method of flexible demixing plate according to claim 1, it is characterised in that before plasma treatment, successively
Processed according to following order：Sawing sheet, once drilling, lamination, hot pressing, solidification, secondary drilling, cutting edge.
8. the preparation method of flexible demixing plate according to claim 7, it is characterised in that the vacuum of plasma treatment is
30Pa, temperature is 20 DEG C.
9. the preparation method of flexible demixing plate according to claim 7, it is characterised in that solidification temperature is 160 DEG C, solidification
Time is 2h.
10. a kind of flexible demixing plate, it is characterised in that made using the preparation method as described in any one of claim 1 ~ 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611190800.XA CN106604570A (en) | 2016-12-21 | 2016-12-21 | Flexible laminated board and making method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611190800.XA CN106604570A (en) | 2016-12-21 | 2016-12-21 | Flexible laminated board and making method thereof |
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| CN106604570A true CN106604570A (en) | 2017-04-26 |
Family
ID=58600146
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| CN201611190800.XA Pending CN106604570A (en) | 2016-12-21 | 2016-12-21 | Flexible laminated board and making method thereof |
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Cited By (2)
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| CN107635361A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of electroplating processing method of Teflon pcb board |
| CN109518240A (en) * | 2018-11-20 | 2019-03-26 | 深圳市新宇腾跃电子有限公司 | A kind of Microvia electro-plating pre-treatment method |
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| CN109518240A (en) * | 2018-11-20 | 2019-03-26 | 深圳市新宇腾跃电子有限公司 | A kind of Microvia electro-plating pre-treatment method |
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Application publication date: 20170426 |