CN102548226B - Process for treating crease phenomenon during flexible printed circuit machining - Google Patents
Process for treating crease phenomenon during flexible printed circuit machining Download PDFInfo
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- CN102548226B CN102548226B CN201210035011.4A CN201210035011A CN102548226B CN 102548226 B CN102548226 B CN 102548226B CN 201210035011 A CN201210035011 A CN 201210035011A CN 102548226 B CN102548226 B CN 102548226B
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Abstract
The invention discloses a process for treating a crease phenomenon during flexible printed circuit machining. The process comprises the following steps of: (1) putting products having the crease phenomenon into a tank containing a 55 percent sodium hydroxide solution, and soaking the products at the temperature of between 40 DEG C for 60 to 90 minutes; (2) cleaning and drying the soaked products, and performing hot pressing in 30 minutes at the setting temperature of between 130 DEG C under the pressure of 8 MPa for 100 minutes; and (3) putting the products into the prepared anti-oxygen buffering agent, soaking the products at the temperature of between 30 DEG C for 15 seconds, and cleaning and drying the products to ensure that the original material property of the products is recovered. According to the process, flexible printed circuit boards having the crease phenomenon are subjected to smooth recovery treatment, and the treating effect is good.
Description
Technical field
The present invention relates to a kind of flexible circuitry Treatment technique for processing, refer in particular to a kind for the treatment of process of crease phenomenon during flexible printed circuit machining.
Background technology
FPC(flexible circuit board) its feature is: removable, bending, reverse and can not damage wire, can bear the dynamic bendings of millions of times, can be applicable to well motion continuously or regularly motion in link in system.Because its installation accuracy is high, so its planarization is had to very high requirement, must not there is wrinkle phenomenon, to ensure the reliable of its function, become a part for product function, to ensure the normal operation of product.
But in production practices, because the manufacturing procedure of flexible circuit board is long, its process route comprises: blanking → subsides light-sensitive surface → exposure → development → etching → paste positive and negative facial mask → pressing → surface treatment → plating → performance test → die-cut → inspection → packaging.Inter process conveyance can be frequent, inevitably in each manufacturing procedure, all likely produces product wrinkle.Even very little wrinkle, also can affect the installation accuracy of flexible circuit board, affect the function of product, this part bad 3% left and right that produces product population that accounts for, causes a large amount of wastes to enterprise.
Prior art Zhong Ge producer does one's utmost to control in processing procedure that this is bad, but cannot stop wrinkle phenomenon completely, and cannot process the product that causes wrinkle phenomenon.
In view of this, the inventor provides a kind of has the smooth treatment process of efficient recovery to producing the flexible circuit board of wrinkle phenomenon, and this case produces thus.
Summary of the invention
The object of the present invention is to provide and a kind of the flexible circuit board that produces wrinkle phenomenon is effectively processed, make it reach the treatment process of the crease phenomenon during flexible printed circuit machining consistent with normal smooth product requirement.
For reaching above-mentioned purpose, solution of the present invention is:
A kind for the treatment of process of crease phenomenon during flexible printed circuit machining, comprise the following steps: 1. the product that produces wrinkle phenomenon is put into alkaline solution groove, under the condition of 40 DEG C of temperature, soak 60 minutes, the alkaline solution in this alkaline solution groove is that mass concentration is 55% sodium hydroxide solution; 2. the product after soaking is after water cleaning, drying, in 30 minutes, utilize pressing machine to carry out heat seal compacting, the process conditions of its heat seal compacting are: 130 DEG C of temperature, pressure 8Mpa, 100 minutes time, the product temperature after heat seal compacting is down to room temperature, and product is taken out; 3. the product of taking-up is put into anti-oxygen buffer, under the condition of 30 DEG C of temperature, soak 15 seconds, after water cleaning, drying, make product recover original material property, wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution, add solid-state potassium bichromate 100g, stirring is dissolved it completely, then to add mass concentration be 98% sulfuric acid 30ml, stirs evenly.
Further, step 1. in, first product is placed in the screen frame of separate layer, it is that 20-25 opens that every separate layer is placed product, retains between the layers the gap of 5-10mm, more whole screen frame product is put into alkaline solution groove.
Further, step 1. in, the product that produces wrinkle phenomenons is to obtain by the wrinkle product that before performance test, each operation produces is unified to collect.
Further, step 3. after, by the product after treated completing, according to one group of every folded 10 product, layering is placed in the baking oven that temperature setting is set to 120-130 DEG C, carries out disposal of stability, the processing time is 120-125 minute.
Further, step 2. in, will be one by one product separate with corrosion resistant plate, then after stacking, on pressing machine, carry out heat seal compacting.
Further, step 3. in, by the product of taking-up more one by one layering separate, then put into the screen frame of separate layer, whole screen frame product is put into the anti-oxygen buffer preparing.
Adopt after such scheme, it is that 55% sodium hydroxide solution makes the wrinkle of flexible circuit board softening that the present invention adopts mass concentration, then with anti-oxygen buffer, wrinkle is returned to consistent with normal smooth product, thereby makes wrinkle product be recovered use, its recovery rate can reach 93 ﹪, economizes on resources.
Secondly, step 1. in, first product is placed in the screen frame of separate layer, it is that 20-25 opens that every separate layer is placed product, retains between the layers the gap of 5-10mm, more whole screen frame product is put into alkaline solution groove, therefore, in treatment process of the present invention, can multiple products of single treatment, improve treatment effeciency.
Again, step 3. after, by the product after treated completing according to one group of every folded 10 product, layering is placed in the baking oven that temperature setting is set to 120-130 DEG C, carry out disposal of stability, the processing time is 120-125 minute, therefore, can effectively improve reliability and the long-time stability of product, in follow-up use procedure, can not produce any problem.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment mono-:
A treatment process for crease phenomenon during flexible printed circuit machining, it comprises the following steps:
To unified collection of wrinkle product that before performance test, each operation produces;
Product after collecting is placed in the screen frame of separate layer, it is 20 that every separate layer is placed product, retain between the layers the gap of 5mm, the object of this step is: improve the efficiency of the treatment process of crease phenomenon during flexible printed circuit machining, once can process multiple products;
Whole screen frame product is put into alkaline solution groove, under the condition of 40 DEG C of temperature, soak 60 minutes, the alkaline solution in this alkaline solution groove is that mass concentration is 55% sodium hydroxide solution;
Product after soaking is after water cleaning, drying, product is separated with corrosion resistant plate one by one, after stacking again, in 30 minutes, utilize pressing machine to carry out heat seal compacting, the process conditions of its heat seal compacting are: 130 DEG C of temperature, pressure 8Mpa, 100 minutes time, product temperature after heat seal compacting is down to room temperature, and product is taken out;
By the product of taking-up more one by one layering separate, then put into the screen frame of separate layer, whole screen frame product is put into the anti-oxygen buffer preparing, under the condition of 30 DEG C of temperature, soak 15 seconds, after water cleaning, drying, make product recover its original material property, wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution, add solid-state potassium bichromate 100g, stirring is dissolved it completely, then to add mass concentration be 98% sulfuric acid 30ml, stirs evenly;
By the product after treated completing, according to one group of every folded 10 product, layering is placed in the baking oven that temperature setting is set to 120 DEG C, carries out disposal of stability, and the processing time is 120 minutes, proceeds to the normal next procedure of flexible circuit board after processing.This disposal of stability refers to: because product is after soda acid and baking, the molecular structure of material, in fluctuation status, through the heat treatment of this step, makes its molecular state in no longer including large variation, thereby effectively improves reliability and the long-time stability of product.
Embodiment bis-:
A treatment process for crease phenomenon during flexible printed circuit machining, it comprises the following steps:
To unified collection of wrinkle product that before performance test, each operation produces;
Product after collecting is placed in the screen frame of separate layer, it is 25 that every separate layer is placed product, retain between the layers the gap of 10mm, the object of this step is: improve the efficiency of the treatment process of crease phenomenon during flexible printed circuit machining, once can process multiple products;
Whole screen frame product is put into alkaline solution groove, under the condition of temperature 45 C, soak 90 minutes, the alkaline solution in this alkaline solution groove is that mass concentration is 65% sodium hydroxide solution;
Product after soaking is after water cleaning, drying, product is separated with corrosion resistant plate one by one, after stacking again, in 30 minutes, utilize pressing machine to carry out heat seal compacting, the process conditions of its heat seal compacting are: 140 DEG C of temperature, pressure 10Mpa, 120 minutes time, product temperature after heat seal compacting is down to room temperature, and product is taken out;
By the product of taking-up more one by one layering separate, then put into the screen frame of separate layer, whole screen frame product is put into the anti-oxygen buffer preparing, under the condition of 35 DEG C of temperature, soak 20 seconds, after water cleaning, drying, make product recover its original material property, wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution, add solid-state potassium bichromate 100g, stirring is dissolved it completely, then to add mass concentration be 98% sulfuric acid 35ml, stirs evenly;
By the product after treated completing, according to one group of every folded 10 product, layering is placed in the baking oven that temperature setting is set to 130 DEG C, carries out disposal of stability, and the processing time is 125 minutes, proceeds to the normal next procedure of flexible circuit board after processing.Equally, this disposal of stability refers to: because product is after soda acid and baking, the molecular structure of material is in fluctuation status, through the heat treatment of this step, make its molecular state in no longer including large variation, thereby effectively improve reliability and the long-time stability of product.
It is consistent with normal smooth product that the present invention can make wrinkle return to, thereby make wrinkle product be recovered to use, and can not produce excessive glue, and concrete effect sees the following form:
The treatment process test data of wrinkle phenomenon and evaluation result table
As seen from the above table, when the mass concentration of sodium hydroxide solution is got 55%-65%, temperature is 40-45 DEG C, and product soaks 60-90 minute; After immersion, in 30 minutes, under temperature 130-140 DEG C, pressure 8-10Mpa, time 100-120 minute, on pressing machine, carry out heat seal compacting; Then, in the anti-oxygen buffer of temperature 30-35 DEG C, when soak time is 15-20 second, effect is best, and, within the scope of process conditions of the present invention, the effect that wrinkle product recovers is best, from the slip amesdial evenness test bias value 0.05 in table, this test value is less than the test value of other process conditions, therefore, uses process conditions of the present invention to make wrinkle product recover smooth degree better than using other process conditions.
In addition, the present invention is as follows to the requirement of technology point:
1, the product after alkaline solution soaks must carry out hot pressing in 30 minutes, and the time is more short better, and more than 30 minutes carries out hot pressing, and it is smooth that wrinkle are difficult to recover.
2, the concentration of the solution that configures is wanted accurately, and the temperature of technological requirement, time are wanted strict management and control.
The foregoing is only embodiments of the invention, the not restriction to this case, all equivalent variations of doing according to the key of this case, all fall into the protection range of this case.
Claims (6)
1. the treatment process of a crease phenomenon during flexible printed circuit machining, it is characterized in that: comprise the following steps: 1. the product that produces wrinkle phenomenon is put into alkaline solution groove, under the condition of 40 DEG C of temperature, soak 60 minutes, the alkaline solution in this alkaline solution groove is that mass concentration is 55% sodium hydroxide solution; 2. the product after soaking is after water cleaning, drying, in 30 minutes, utilize pressing machine to carry out heat seal compacting, the process conditions of its heat seal compacting are: 130 DEG C of temperature, pressure 8Mpa, 100 minutes time, the product temperature after heat seal compacting is down to room temperature, and product is taken out; 3. the product of taking-up is put into anti-oxygen buffer, under the condition of 30 DEG C of temperature, soak 15 seconds, after water cleaning, drying, make product recover original material property, wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution, add solid-state potassium bichromate 100g, stirring is dissolved it completely, then to add mass concentration be 98% sulfuric acid 30ml, stirs evenly.
2. the treatment process of a kind of crease phenomenon during flexible printed circuit machining as claimed in claim 1, it is characterized in that: step 1. in, first product is placed in the screen frame of separate layer, it is that 20-25 opens that every separate layer is placed product, retain between the layers the gap of 5-10mm, more whole screen frame product is put into alkaline solution groove.
3. the treatment process of a kind of crease phenomenon during flexible printed circuit machining as claimed in claim 1, is characterized in that: step 1. in, the product that produces wrinkle phenomenons is to obtain by the wrinkle product that before performance test, each operation produces is unified to collect.
4. the treatment process of a kind of crease phenomenon during flexible printed circuit machining as claimed in claim 1, it is characterized in that: step 3. after, by the product after treated completing according to one group of every folded 10 product, layering is placed in the baking oven that temperature setting is set to 120-130 DEG C, carry out disposal of stability, the processing time is 120-125 minute.
5. the treatment process of a kind of crease phenomenon during flexible printed circuit machining as claimed in claim 1, is characterized in that: step 2. in, will be one by one product separate with corrosion resistant plate, then after stacking, on pressing machine, carry out heat seal compacting.
6. the treatment process of a kind of crease phenomenon during flexible printed circuit machining as claimed in claim 1, it is characterized in that: step 3. in, by the product of taking-up more one by one layering separate, then put into the screen frame of separate layer, whole screen frame product is put into the anti-oxygen buffer preparing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210035011.4A CN102548226B (en) | 2012-02-16 | 2012-02-16 | Process for treating crease phenomenon during flexible printed circuit machining |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210035011.4A CN102548226B (en) | 2012-02-16 | 2012-02-16 | Process for treating crease phenomenon during flexible printed circuit machining |
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| CN102548226A CN102548226A (en) | 2012-07-04 |
| CN102548226B true CN102548226B (en) | 2014-08-06 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104244600B (en) * | 2014-07-25 | 2018-01-23 | 昆山圆裕电子科技有限公司 | A kind of notebook computer FPC plate face flatness technique |
| CN106535465B (en) * | 2016-11-15 | 2021-11-26 | 智恩电子(大亚湾)有限公司 | Impact-resistant printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5744759A (en) * | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
| CN1330509A (en) * | 2000-04-28 | 2002-01-09 | 福田金属箔粉工业株式会社 | Copper foil for printed circuit board and its surface treatment method |
| JP2011179078A (en) * | 2010-03-02 | 2011-09-15 | Fukuda Metal Foil & Powder Co Ltd | Treated copper foil |
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2012
- 2012-02-16 CN CN201210035011.4A patent/CN102548226B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5744759A (en) * | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
| CN1330509A (en) * | 2000-04-28 | 2002-01-09 | 福田金属箔粉工业株式会社 | Copper foil for printed circuit board and its surface treatment method |
| JP2011179078A (en) * | 2010-03-02 | 2011-09-15 | Fukuda Metal Foil & Powder Co Ltd | Treated copper foil |
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