CN103144378A - Copper-clad laminate, PCB board and manufacturing method thereof of a kind of PN curing system - Google Patents

Abstract

The invention relates to a copper-clad plate and a PCB (printed Circuit Board) of a PN curing system and a manufacturing method thereof, wherein the copper-clad plate of the PN curing system is in an incomplete curing state, and the curing factor delta Tg of the copper-clad plate is more than or equal to 15 ℃ or the peel strength of the copper-clad plate is less than or equal to 0.8N/mm; the manufacturing method comprises the following steps of 1, overlapping a certain number of prepregs of a PN curing system, and covering copper foils on two sides or one side of the outermost layer to form a material overlapping structure; step 2, heating and pressurizing the stacked structure in a laminating machine, and performing rheological reaction on a prepreg; and stopping heating after the prepreg flows and before the prepreg is completely cured to form the incompletely cured PN curing system copper-clad plate. The PCB of the PN curing system is provided with a honeycomb rough hole wall; the manufacturing method comprises a drilling process, a glue removing process and an electroplating process, wherein the PCB of the PN curing system is in an incomplete curing state before the glue removing process is finished, and a honeycomb rough hole wall is formed by the glue removing process.

Description

Copper-clad laminate, PCB board and manufacturing method thereof of a kind of PN curing system

technical field

The invention relates to the technical field of printed circuit boards, in particular to a copper-clad laminate of a PN curing system, a PCB board and a manufacturing method thereof.

Background technique

PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. PCB boards in the industry have gradually developed from traditional double-sided PCB boards to multi-layer PCB boards and HDI boards.

Double-sided PCB boards are processed on the basis of copper-clad laminates. The traditional process is: cutting → drilling → deglue → copper plating → pattern transfer → pattern plating → etching → solder mask → surface treatment → forming processing etc.

Multi-layer PCB board is made of copper clad laminate and prepreg as the basic material. Its traditional process is as follows: inner layer process (cutting→graphic transfer→graphic plating→etching)→pressing→outer layer process (drilling →Glue removal→Immersion copper electroplating→Graphic transfer→Graphic electroplating→Etching→Solder mask→Surface treatment→Molding processing, etc.).

HDI board is made of copper clad laminate and prepreg as the basic material. Its traditional process is: inner layer process (cutting→drilling→removing glue→immersion copper plating→graphic transfer→graphic circuit→etching)→pressing Combination→outer layer process (drilling→glue removal→immersion copper plating→graphic transfer→graphic plating→etching→solder mask→surface treatment→forming processing, etc.).

Wherein, the lamination process specifically includes: the inner layer core plate obtained after etching in the inner layer process is covered with a certain number of prepregs on both sides, and the outermost sides of both sides are covered with copper foil. The materials are stacked, and then pushed into the laminator for heating and pressing for lamination.

Among them, the copper-clad laminate is generally a product of a copper-clad laminate manufacturer. It uses a certain number of prepregs, and the outermost sides of the prepreg are laminated with copper foil, and then pushed into a laminator for heating and pressure. Laminate. The lamination process principle and equipment for making copper clad laminates are basically the same as the lamination process principles and equipment for making multi-layer PCB boards and HDI boards.

Wherein, the prepreg is a semi-finished product of a copper clad laminate factory, and can also be sold as a commodity to PCB manufacturers as a raw material for making multilayer PCB boards and HDI boards. The traditional processing technology of prepreg is: glass fiber cloth, non-woven fabric, wood pulp paper and other reinforcing materials are impregnated with thermosetting resin composition, and then baked. The characteristics of the thermosetting resin composition largely determine the performance of the prepreg, copper clad laminate and its PCB.

In the copper clad laminate industry, the traditional thermosetting resin formula adopts DICY (dicyandiamide) curing system, but as the PCB industry has higher and higher heat resistance requirements for copper clad laminates and PCB boards, the copper clad laminate industry gradually turns to PN (Phenol Novolac) curing system, the crosslinking density of PN curing system is significantly increased, and its heat resistance is significantly improved. However, it also brings corresponding negative effects in the process of PCB processing: in the glue removal process, due to the high cross-linking density of the resin, it is difficult to be bitten by the liquid medicine, and the rough hole walls of the honeycomb cannot be formed, resulting in the hole copper on the sinking copper plating. The bonding force with the hole wall is relatively poor. Especially in the large and irregular holes of the PCB board, after the PCB board processing and heat treatment in the subsequent use process, it is easy to form the hole copper separation problem. As shown in FIG. 4 , the separation problem of the hole copper 200 is the situation that the hole copper 200 is separated from the hole wall 400 , which brings serious quality problems to the circuit conduction between layers.

At present, in order to avoid the problem of hole copper separation in the process of PCB board manufacturing with PN curing system, the industry often adopts the method of increasing the amount of corrosion in the degumming process, or changing the traditional one-time degumming method to multiple degumming methods. This method easily leads to the problem of excessive biting in the deglue process, resulting in rough hole walls (hole thickness); the problem of copper wicking in holes and the resulting CAF (ConductiveAnodic Filament: ion migration) conduction problem between adjacent holes , especially in the case of small hole spacing, the probability of CAF conduction between holes is greatly increased.

Contents of the invention

One of the objects of the present invention is to provide a copper-clad laminate of a PN curing system in an incompletely cured state, which is in an incompletely cured state, which facilitates the formation of honeycomb-shaped rough hole walls in the deglue process in the subsequent PCB processing process, and increases the The bonding force between hole copper and hole wall.

The second object of the present invention is to provide a method for manufacturing a copper-clad laminate with a PN curing system in an incompletely cured state. The copper-clad laminate produced by this method is in an incompletely cured state, which is convenient for the deglue process in the subsequent PCB processing process to form a honeycomb The rough hole wall, and increase the bonding force between the hole copper and the hole wall.

The third object of the present invention is to provide a PCB board with a PN curing system. The PCB board has a honeycomb rough hole wall. The hole copper separation problem of the PCB board of the curing system, especially the problem of hole copper separation on the large hole and irregular hole structure, and also effectively avoids the situation of thick hole, hole copper plating, and CAF conduction failure between holes .

The fourth object of the present invention is to provide a PCB board manufacturing method with a honeycomb-shaped rough hole wall and a PN curing system. The prepared PCB board can have a honeycomb rough hole wall, and the bonding force between the hole copper and the hole wall on the immersion copper plating is relatively good, which can well solve the problem of hole copper separation of the PCB board of the PN curing system, especially The problem of hole copper separation occurs on large holes and irregular hole structures, and it also effectively avoids the situation of thick holes, hole copper plating, and failure of CAF conduction between holes.

In order to achieve the above object, the technical scheme adopted by the present invention is as follows.

The present invention provides a copper-clad laminate with a PN curing system. The copper-clad laminate with a PN curing system is in an incompletely cured state, that is, its curing factor ΔTg≥15°C or its peeling strength≤0.8N/mm.

The invention provides a method for manufacturing a copper-clad laminate with a PN curing system, comprising the following steps:

Step 1, laminate a certain number of prepregs of PN curing system and cover the outermost two sides or one side with copper foil to form a laminated structure;

Step 2, heat and press the laminated structure in a laminator, and the prepreg undergoes a rheological reaction; stop heating after the prepreg flows and before it is completely cured, forming an incompletely cured PN curing system copper clad laminate ;

Preferably, the curing conditions for lamination in step 2 are as follows: the maximum temperature of heating is 170°C-175°C, the maximum pressure of pressurization is 140-420PSI, and the time of holding at this maximum temperature and maximum pressure is 10-30min.

The present invention also provides a PCB board with a PN curing system. The PCB board with a PN curing system has a honeycomb-shaped rough hole wall, and the porosity of the honeycomb-shaped rough hole wall is 10-40%.

The honeycomb-like rough hole walls are formed after the degumming process; the PCB board of the PN curing system is in an incompletely cured state before the degumming process is completed.

The present invention also provides a method for making a PCB board with a PN curing system, including a drilling process, a degumming process, and an electroplating process. The PCB board of the PN curing system is in an incompletely cured state before the degumming process is completed. The degumming process is processed to form a honeycomb-shaped rough cell wall.

During the degumming process, the bite depth is controlled at 3~15um.

Before the glue removal process is completed, the curing factor ΔTg of the PCB board of the PN curing system is ≥ 15° C. or the peeling strength is ≤ 0.8 N/mm.

Preferably, after the electroplating process, a post-curing process of completely curing the PN curing system PCB board is also included.

The post-curing process is heating and baking, and the post-curing process conditions are that the maximum heating temperature is 180-190° C., and the holding time is 40-60 minutes.

The post-curing process is lamination by using a laminator to heat and press. In the post-curing process, the maximum temperature for heating is 180-190°C, the maximum pressure for pressurization is 140-420PSI, and the maximum temperature And keep it under the highest pressure for 40~60min.

Beneficial effects of the present invention: the copper-clad laminate of the PN curing system provided by the present invention is in an incompletely cured state, which facilitates the formation of honeycomb rough hole walls in the deglue process in the subsequent PCB processing process, and increases the hole copper and hole wall binding. The manufacturing method of the PCB board of the PN curing system provided by the present invention is to deliberately make the PCB board of the PN curing system before the glue removal process into an incompletely cured state, and then go through traditional PCB processing processes such as glue removal and copper plating. processing. Since the PN curing system substrate used is in an incompletely cured state, the crosslinking density of the resin is relatively small compared with that in the fully cured state. Under this condition, the glue removal process is performed, and the honeycomb rough structure is easy to occur when the potion is bitten. Its specific surface area is larger, and the bonding force between the deposited copper and electroplated copper layer and the hole wall is enhanced. At the same time, the PN curing system substrate used is in a state of incomplete curing, the crosslinking reaction of the resin has not been completed, and it has a certain chemical bonding activity. Under this condition, the copper plating process is carried out, and the hole copper and the hole wall In addition to being physically bonded, high-quality resins are also chemically bonded to make the bond stronger. Therefore, the problem of hole copper separation during the subsequent heat treatment process can be avoided. It is also possible to form a fully cured PCB board under the post-curing process after the electroplating process, which can avoid the delamination problem when the finished PCB board is still in an incompletely cured state due to poor heat resistance and SMT loading.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings.

In the attached picture,

Fig. 1 is the production method flowchart of the copper-clad laminate of the incompletely cured PN curing system of the present invention;

Fig. 2 is the schematic diagram of the honeycomb rough hole wall of the PCB board of the PN curing system of the present invention;

Fig. 3 is the schematic diagram of the block hole wall of the PCB board of the traditional fully cured PN curing system;

Figure 4 is a schematic diagram of the problem of copper separation in large holes on the PCB;

Fig. 5 is the traditional double-sided PCB board production flowchart of comparative example;

Fig. 6 is the production flowchart of the double-sided PCB board of embodiment 1 of the present invention;

Fig. 7 is the production flowchart of the multilayer PCB board of embodiment 2 of the present invention;

FIG. 8 is a flow chart of manufacturing an HDI-type PCB board according to Embodiment 3 of the present invention.

Detailed ways

In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

The invention provides a copper-clad laminate with PN curing system, which is in an incompletely cured state, and adopts the IPC~TM~650 test method for Tg (DSC) test, and its curing factor ΔTg≥15°C; or adopts the IPC~TM~650 test method Carry out peel strength test, its peel strength ≤ 0.8N/mm.

This kind of copper clad laminate with incomplete curing PN curing system is easy to form a honeycomb rough hole wall in the glue removal process during the process of making PCB boards, with a large specific surface area and better bonding force between hole copper and hole wall , can effectively solve the hole copper separation problem.

Please refer to Figure 1 for the manufacturing method of the above-mentioned incompletely cured PN curing system copper clad laminate, the manufacturing process is:

Step 1, stacking a certain number of prepregs of PN curing system and covering the outermost sides with copper foil to form a laminated structure;

In step 2, the laminated structure is heated and pressurized in a laminator, the prepreg undergoes a rheological reaction, and the heating is stopped after the prepreg flows and before it is completely cured, forming an incompletely cured copper clad laminate.

For the traditional fully cured PN curing system copper clad laminate, the curing conditions are: the maximum temperature of heating ≥ 180 ℃ and the holding time ≥ 60min, the fully cured PN curing system copper clad laminate ΔTg ≤ 5 ℃, the peel strength PS ≥1.05N/mm.

However, the curing process conditions for making copper clad laminates with incompletely cured PN curing system are: the maximum temperature of heating is 170°C~175°C, the maximum pressure of pressurization is 140~420PSI, and the maximum temperature, the maximum Hold time under pressure for 10~30min. The ΔTg of the incompletely cured PN curing system copper-clad laminate prepared under this curing condition is ≥ 15°C, and the peel strength is between 0.5N/mm and 0.8N/mm. Under this curing condition, an incompletely cured copper clad laminate is formed, and its overall rigidity and other physical properties are basically the same as those of a fully cured copper clad laminate. However, in the deglue process of PCB processing, the honeycomb hole wall formed has the best effect and can Solve the hole copper separation problem.

Please refer to Figure 2, the present invention provides a PCB board with PN curing system, with a honeycomb rough hole wall, the honeycomb rough hole wall is formed after the process of removing glue, and the honeycomb shape The porosity of the rough pore wall is 10-40%.

The PCB substrate of the PN curing system before the glue removal process is deliberately made into an incompletely cured state. At this time, the PCB substrate of the incompletely cured PN curing system has completed the glue flow stage, which has basically the same substrate as the fully cured PCB substrate. The same rigidity and other physical properties. At the same time, the incompletely cured PN curing system PCB substrate has not been completely cured, and its crosslinking density is relatively low, which is convenient for the liquid of the glue removal process to bite and erode, so that it is easy to form a honeycomb rough hole wall. Please refer to Figure 3 and Figure 4, the PCB substrate using the traditional fully cured PN curing system can only form a blocky hole wall 400 after being bitten by the potion of the glue removal process, and its specific surface area is small, which is not conducive to the hole copper 200 and the hole wall 400, at this time, it is easy to separate the hole copper 200 from the hole wall 400.

The present invention also provides a method for making the PCB board of the PN curing system. The PCB board of the PN curing system is in an incompletely cured state before the degumming process is completed, and the honeycomb-shaped rough hole wall is formed after the degumming process.

Preferably, in the degumming process, the bite depth is controlled at 3-15um. This makes it easy to form a honeycomb-shaped rough hole wall, which has better hole-copper bonding force and can avoid the problem of hole-copper separation in large holes and irregular holes. When the erosion depth is less than 3um, the erosion condition of the pore wall is not good, and it is difficult to form a honeycomb rough pore wall. When the bite depth is greater than 15um, there is a risk of copper penetration in the hole, and the CAF conduction failure between the holes is likely to occur.

The PCB board of the PN curing system is in an incompletely cured state before the glue removal process is completed. Preferably, the Tg (DSC) test is performed using the IPC~TM~650 test method, and the curing factor ΔTg≥15°C; or IPC~ TM~650 test method for peel strength test, the peel strength is between 0.5N/mm and 0.8N/mm. This kind of incompletely cured PCB board with PN curing system is easy to form a honeycomb rough hole wall in the glue removal process during the process of making the PCB board. The specific surface area is larger, and the bonding force between the hole copper and the hole wall is better. , can effectively solve the hole copper separation problem.

Further, in order to avoid the delamination problem when the finished PCB board is still in an incompletely cured state due to poor heat resistance, a post-cure treatment process can be added after the glue removal process to process the PCB board of the PN curing system become fully cured. For PCB boards with PN curing system in a fully cured state, use IPC~TM~650 test method for Tg (DSC) test, and its curing factor ΔTg≤5°C; or use IPC~TM~650 test method for peel strength test, its Peel strength ≥ 1.05N/mm. The post-curing treatment process may be heating and baking, and the post-curing process conditions are that the maximum heating temperature is 180-190° C., and the holding time is 40-60 minutes. The post-curing process can also be carried out by using a laminator to heat and press the lamination method. The maximum temperature for heating is 180~190°C, the maximum pressure for pressurization is 140~420PSI, and at this maximum temperature and maximum pressure Keep it for 40~60 minutes, the effect is better.

For the copper-clad laminate and PCB board of the present invention, the ΔTg, PS, and hole copper separation were tested. The test results are further illustrated and described in detail in the following examples.

comparative example

As shown in Figure 5, the traditional double-sided PCB board manufacturing method is used to make a S1170 double-sided PCB board. Select a company's PN curing system prepreg S0701 and copper clad laminate S1170.

Step 1.1, prepare fully cured S1170 substrate,

Lamination: Laminate 16 prepregs with resin content RC=43%S07017628, and cover with 1OZ copper foil on both sides;

Lamination: Push the laminated structure in step 1 into a laminator for heating and pressure to form a fully cured copper clad laminate. The curing conditions are controlled as follows: time temperature 185°C~190°C and holding time 60min.

The incompletely cured S11703.21/1 copper clad laminate was prepared, and its curing factor ΔTg, peel strength PS and other parameters were tested.

Step 1.2, PCB processing on the fully cured S1170 substrate,

PCB outer layer process: The fully cured S11703.21/1 substrate is drilled→glue removal→copper plating→graphic transfer→graphic circuit→etching→solder mask→forming.

The drilling process described therein includes large holes with drilling diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm, and slotted holes of Φ1.6mm×6.4mm

The S1170 double-sided PCB board was prepared by PCB processing technology, and its curing factor ΔTg, peeling strength PS and other parameters were tested. At the same time, observe the large holes with diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm on the double-sided PCB board, as well as the separation of copper in the slot holes of Φ1.6mm×6.4mm.

Example 1

As shown in FIG. 6 , the process flow of manufacturing a S1170 double-sided PCB board is adopted by the PCB board method of the present invention. Select a company's PN curing system prepreg S0701 and copper clad laminate S1170.

Step 2.1, preparing an incompletely cured S1170 substrate,

Lamination: Laminate 16 prepregs with resin content RC=50%S07017628, and cover with 1OZ copper foil on both sides;

Lamination: Push the laminated structure into the laminator for heating and pressure, and stop heating after the prepreg flows and before it is fully cured to form an incompletely cured copper clad laminate. The curing conditions are controlled as follows: time temperature 170°C and holding time 10min.

The incompletely cured S11703.21/1 copper clad laminate was prepared, and its curing factor ΔTg, peel strength PS and other parameters were tested.

Step 2.2, PCB processing on the incompletely cured S1170 substrate,

PCB outer layer process: The incompletely cured S11703.21/1 substrate is drilled → glue removed → copper plating → graphic transfer → graphic circuit → etching → solder mask → molding.

The drilling process described therein includes large holes with drilling diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm, and grooved holes of Φ1.6mm×6.4mm.

Step 2.3, post-curing treatment, the prepared S1170 double-sided PCB board,

After completing the PCB processing process, the S1170 substrate will be heated and baked for post-curing treatment. The conditions are: the temperature is 190 ° C, and the holding time is 60 minutes. The prepared S1170 double-sided PCB board is tested for its curing factor ΔTg, peeling Intensity PS and other parameters. At the same time, observe the large holes with diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm on the double-sided PCB board, as well as the separation of copper in the slot holes of Φ1.6mm×6.4mm.

Example 2

As shown in FIG. 7 , the present invention produces a process flow of a S1170 four-layer PCB board. Select a company's PN curing system prepreg S0701 and copper clad laminate S1170.

Step 3.1, preparing an incompletely cured S1170 substrate,

Lamination: Laminate 8 prepregs with resin content RC=43%S07017628, and cover with 1OZ copper foil on both sides;

Lamination: Push the laminated structure into the laminator for heating and pressure, and stop heating after the prepreg flows and before it is fully cured to form an incompletely cured copper clad laminate. The curing conditions are controlled as follows: time temperature 175°C and holding time 20min.

The incompletely cured S11701.61/1 copper clad laminate was prepared, and its curing factor ΔTg, peel strength PS and other parameters were tested.

Step 3.2, carry out PCB processing on the incompletely cured S1170 substrate to form an incompletely cured S11703.21/1 four-layer board,

The incompletely cured S11701.61/1 copper clad laminate is subjected to pattern transfer, pattern circuit, and etching processes to obtain an incompletely cured S1170 inner core board.

Lamination: Cover both sides of the incompletely cured inner core board with 4 prepregs of RC=43%S07017628, and cover the outermost layer of both sides with 1OZ copper foil; push it into the laminator for heating and pressure, Stop heating after the prepreg flow and before complete curing to form an incompletely cured S11703.21/1 four-layer board, and test its curing factor ΔTg, peel strength PS and other parameters.

PCB outer layer process: the PN curing system substrate is drilled → glue removal → copper plating → graphic transfer → graphic circuit → etching → solder mask → surface treatment → molding processing.

The drilling process described therein includes large holes with drilling diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm, and grooved holes of Φ1.6mm×6.4mm.

The surface treatment process described therein is tin spraying treatment.

Step 3.3, post-curing treatment to form a S1170 four-layer PCB board,

After completing the PCB processing process, the S1170 substrate will be heated and baked for post-curing treatment. The conditions are: the temperature is 190 ° C, and the holding time is 60 minutes. The prepared S1170 four-layer PCB board is tested for its curing factor ΔTg, peeling Intensity PS and other parameters. At the same time, observe the large holes with diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm on the double-sided PCB board, as well as the separation of copper in the slot holes of Φ1.6mm×6.4mm.

Example 3

As shown in Fig. 8, the process flow of the present invention to manufacture a S1170 four-layer HDI PCB board. Select a company's PN curing system prepreg S0701 and copper clad laminate S1170.

Step 4.1, preparing an incompletely cured S1170 substrate,

Lamination: Laminate 8 prepregs with resin content RC=43%S07017628, and cover with 1OZ copper foil on both sides;

Lamination: Push the laminated structure into the laminator for heating and pressure, and stop heating after the prepreg flows and before it is fully cured to form an incompletely cured copper clad laminate. The curing conditions are controlled as follows: time temperature 175°C and holding time 10~30min.

The incompletely cured S11701.61/1 copper clad laminate was prepared, and its curing factor ΔTg, peel strength PS and other parameters were tested.

Step 4.2, carry out PCB processing on the incompletely cured S1170 substrate to form an incompletely cured S11703.21/1 four-layer HDI board,

The incompletely cured S11701.61/1 copper-clad laminate is subjected to drilling, glue removal, copper plating, pattern transfer, pattern circuit, and etching processes to obtain an incompletely cured inner core board.

Lamination: cover both sides of the incompletely cured inner core board with a prepreg sheet of RC=68%S07011080, and cover the outermost layer of both sides with 1OZ copper foil; push it into the laminator for heating and pressure, Stop the heating after the prepreg flows and before it is completely cured to form an incompletely cured S11703.21/1 four-layer HDI board, and test its curing factor ΔTg, peel strength PS and other parameters.

PCB outer layer process: the PN curing system substrate is drilled → glue removal → copper plating → graphic transfer → graphic circuit → etching → solder mask → surface treatment → molding processing.

The drilling process described therein includes large holes with drilling diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm, and grooved holes of Φ1.6mm×6.4mm.

The surface treatment process described therein is tin spraying treatment.

Step 4.3, post-curing treatment to form a S1170 four-layer HDI PCB board,

After completing the PCB processing process, the S11703.21/1 four-layer HDI board is heated and baked for post-curing treatment. The conditions are: the temperature is 190 ° C, and the holding time is 60 minutes. The PCB of the prepared S1170 four-layer HDI board is board, and test its curing factor ΔTg, peel strength PS and other parameters. At the same time, observe the large holes with diameters of 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, and 6.0mm on the double-sided PCB board, as well as the separation of copper in the slot holes of Φ1.6mm×6.4mm.

The test results are compared as shown in Table 1.

Table 1

Among them, ΔTg is an index commonly used in the industry to characterize the basic characteristics of the plate, which is the difference between the plate Tg1 tested by the differential scanning calorimeter DSC for the first time and the plate Tg2 tested for the second time, that is, ΔTg=Tg1- Tg2, the international standard of its test method is IPC~TM~6502.4.25.

Among them, PS is an index commonly used in the industry to characterize the basic characteristics of the board, which is the abbreviation of PeelStrength, and the international standard of its test method is IPC~TM~6502.4.25.

Among them, the separation of the copper in the hole is observed by vertical grinding and sectioning of the hole. The separation of the copper in the hole and the wall of the hole is NG, and the combination of the copper in the hole and the wall of the hole is OK.

It can be seen from the above table that the copper clad laminate, PCB board and manufacturing method thereof provided by the present invention can effectively increase the bonding force between the hole copper and the hole wall, and solve the problem of separation between the hole copper and the hole wall.

The above inventive method is also applicable to other types of copper clad laminates with PN curing system, such as S1000, S1000-2 products, IT158, IT180A products and EM825, EM827 products well known in the industry.

In summary, the copper-clad laminate of the PN curing system provided by the present invention is in an incompletely cured state, which facilitates the formation of honeycomb-shaped rough hole walls in the deglue process in the subsequent PCB processing process, and increases the hole copper and hole walls. combination. The manufacturing method of the PCB board of the PN curing system provided by the present invention is to deliberately make the PCB board of the PN curing system before the glue removal process into an incompletely cured state, and then go through traditional PCB processing processes such as glue removal and copper plating. processing. Since the PN curing system substrate used is in an incompletely cured state, the crosslinking density of the resin is relatively small compared with that in the fully cured state. Under this condition, the glue removal process is performed, and the honeycomb rough structure is easy to occur when the potion is bitten. Its specific surface area is larger, and the bonding force between the deposited copper and electroplated copper layer and the hole wall is enhanced. At the same time, the PN curing system substrate used is in a state of incomplete curing, the crosslinking reaction of the resin has not been completed, and it has a certain chemical bonding activity. Under this condition, the copper plating process is carried out, and the hole copper and the hole wall In addition to being physically bonded, high-quality resins are also chemically bonded to make the bond stronger. Therefore, the problem of hole copper separation during the subsequent heat treatment process can be avoided. It is also possible to form a fully cured PCB board under the post-curing process after the electroplating process, which can avoid the delamination problem when the finished PCB board is still in an incompletely cured state due to poor heat resistance and SMT loading.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical scheme and technical concept of the present invention, and all these changes and deformations should belong to the protection scope of the claims of the present invention .

Claims (10)

1. A copper clad laminate with a PN curing system, characterized in that the copper clad laminate with a PN curing system is in an incompletely cured state, and its curing factor ΔTg≥15°C or peel strength≤0.8N/mm. 2. A method for making a copper-clad laminate of a PN curing system, characterized in that, comprising the following steps: Step 1, laminate a certain number of prepregs of PN curing system and cover the outermost two sides or one side with copper foil to form a laminated structure; Step 2, heat and press the laminated structure in a laminator, and the prepreg undergoes a rheological reaction; stop heating after the prepreg flows and before it is completely cured, forming an incompletely cured PN curing system copper clad laminate ; Preferably, the curing conditions for lamination in step 2 are as follows: the maximum temperature of heating is 170°C-175°C, the maximum pressure of pressurization is 140-420PSI, and the time of holding at this maximum temperature and maximum pressure is 10-30min. 3. A PCB board of a PN curing system, characterized in that, the PCB board of the PN curing system has a honeycomb rough hole wall, and the porosity of the honeycomb rough hole wall is 10% to 40%. 4. the PCB board of PN curing system as claimed in claim 3 is characterized in that, the rough hole wall of described honeycomb is formed after processing through deglue process; The PCB board of described PN curing system is degumming It is not fully cured until the process is completed. 5. a manufacturing method of the PCB board of a PN curing system, comprising drilling process, deglue process, electroplating process, it is characterized in that, the PCB board of described PN curing system is incompletely cured state before the process of degumming is finished , After the glue removal process, the honeycomb rough hole wall is formed. 6. The manufacturing method of the PCB board of PN solidification system as claimed in claim 5, is characterized in that, during the process of degumming process, its bite depth is controlled at 3 ~ 15um. 7. The manufacturing method of the PCB board of the PN curing system as claimed in claim 5 or 6, is characterized in that, the curing factor ΔTg of the PCB board of the PN curing system before the processing of the deglue process is completed ≥ 15°C or peel strength ≤0.8N/mm. 8. The manufacture method of the PCB board of the PN curing system as claimed in any one of claims 5 to 7, is characterized in that, after the electroplating process, also comprises the post-curing process that described PN curing system PCB board is fully cured . 9. The manufacture method of the PCB board of PN solidification system as claimed in claim 8, is characterized in that, described post-curing process is heating and baking, and the maximum temperature of heating is that the maximum temperature of heating is 180 ~ 190 ℃, the holding time is 40~60min. 10. the manufacture method of the PCB board of PN solidification system as claimed in claim 8, is characterized in that, described post-curing process is the lamination that adopts laminator to heat and press, post-curing process, heating The maximum temperature is 180~190°C, the maximum pressurized pressure is 140~420PSI, and the time is kept at this maximum temperature and maximum pressure for 40~60min.

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