CN106793517A - A kind of pcb board filling holes with resin electroplates preparation method - Google Patents
A kind of pcb board filling holes with resin electroplates preparation method Download PDFInfo
- Publication number
- CN106793517A CN106793517A CN201611241588.5A CN201611241588A CN106793517A CN 106793517 A CN106793517 A CN 106793517A CN 201611241588 A CN201611241588 A CN 201611241588A CN 106793517 A CN106793517 A CN 106793517A
- Authority
- CN
- China
- Prior art keywords
- resin
- filling holes
- copper
- pcb board
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of pcb board filling holes with resin plating preparation method, using galvanoplastic copper facing in the via of PCB, then filling holes with resin is used, using ceramic brush grind resin after consent, then chemistry removing glue, plug socket resin is stung and loses into cellular, the last via nose end copper using galvanoplastic after filling holes with resin.Layers of copper will not fall off at the pad of filling holes with resin top of the present invention, and client upper part quality is guaranteed, and will not fall to normal price influence quality because of pad, and filling holes with resin plating increases chemistry removing glue flow, and manufacturing scrap is few, effectively improves pcb board factory production yield.
Description
Technical field
The present invention relates to PCB plate production method field, specifically a kind of pcb board filling holes with resin plating preparation method.
Background technology
With the continuous fast development of electronics industry, the printed circuit board institute bearing space as electronic product carrier is more next
Design requirement cannot more be met, therefore the multilayer circuit board requirement via having has been more than turning on linkage function, while on hole
Side will also undertake patch function, and this improves the requirement to circuit board manufacturing process, and traditional handicraft cannot meet.There is PCB for this
Plate factory proposes that flow will be electroplated after filling holes with resin, and by pad locations hole, plated with copper reaches wanting for welding function again after filling holes with resin
Ask.Problems with is electroplate with after current filling holes with resin：1st, Direct Electroplating does not walk de-smear flow after filling holes with resin, and copper plate takes off
Fall.
2nd, resin is not polished, and hole top layers of copper is protruded, pad out-of-flatness
3rd, Kong Wei fills up, and has cavity, pad depression.
4th, copper is not gone up herein, influences patch quality.
The content of the invention electroplates preparation method it is an object of the invention to provide a kind of pcb board filling holes with resin, to solve existing skill
The problem that re-plating is present after art pcb board filling holes with resin.
In order to achieve the above object, the technical solution adopted in the present invention is：
A kind of pcb board filling holes with resin electroplates preparation method, it is characterised in that：Comprise the following steps：
（1）, outer copper foil is pressed on pcb board first, during pressing from JOZ or increase subtract copper flow, make Copper Foil rear end reduce
To 4-7um；
（2）, using galvanoplastic copper facing in the via of PCB, current density value is set to 11-15 amperes/squares of English during plating
Chi, the copper facing time is set as 25-31 minutes, and plating copper thickness is within 15um；
（3）, using filling holes with resin, require that the height of plug socket resin reaches 100-the 120% of via after consent, that is, require consent
Resin end at least flushes with nose end；
（4）, using ceramic brush grind resin, the partial mill by resin beyond via nose end is put down；
（5）, chemistry removing glue, plug socket resin is stung lose into it is cellular；
（6）, via nose end copper using galvanoplastic after filling holes with resin, during plating current value be set as 10-14 amperes/it is flat
Super superficial, the time is set as that copper facing thickness control is in 13-20um on 56-60 minutes, and nose end.
A kind of described pcb board filling holes with resin plating preparation method, it is characterised in that：Step（2）In, electric current is close during plating
Angle value is excellent to be set to 13 amperes/square feet, and the copper facing time is excellent to be set to 28 minutes.
A kind of described pcb board filling holes with resin plating preparation method, it is characterised in that：Step（6）In, current value during plating
Excellent to be set to 12 amperes/square feet, the time is excellent to be set to 58 minutes.
Compared with the prior art, beneficial effects of the present invention are embodied in：
1st, electroplated again after filling holes with resin, layers of copper will not fall off at the pad of filling holes with resin top.
2nd, holes of products copper, face copper thickness can reach customer requirement.
3rd, client upper part quality is guaranteed, and will not fall to normal price influence quality because of pad.
4th, filling holes with resin plating, increases chemistry removing glue flow, and manufacturing scrap is few, effectively improves pcb board factory production yield.
Brief description of the drawings
Fig. 1 is flow chart of the present invention.
Specific embodiment
As shown in figure 1, a kind of pcb board filling holes with resin plating preparation method, comprises the following steps：
（1）, outer copper foil is pressed on pcb board first, during pressing from JOZ or increase subtract copper flow, make Copper Foil rear end reduce
To 4-7um, it is easy to control electro-coppering thick, for etching work procedure production provides advantage.；
（2）, using galvanoplastic copper facing in the via of PCB, current density value is set to 11-15 amperes/squares of English during plating
Chi, the copper facing time is set as 25-31 minutes, and plating copper thickness is within 15um；
（3）, using filling holes with resin, before consent using light table check pcb board whether there is stopple phenomenon, it is ensured that do not leak consent or Kong Weisai
It is full, require that the height of plug socket resin reaches 100-the 120% of via after consent, that is, require plug socket resin end at least with nose end
Flush；
（4）, using ceramic brush grind resin, whether the partial mill by resin beyond via nose end is put down, and there is full inspection after grinding
Resin does not grind flat or resin and does not grind totally, there is residual, influences quality；
（5）, chemistry removing glue, plug socket resin is stung and loses into cellular, be conducive to heavy upper chemical copper；
（6）, via nose end copper using galvanoplastic after filling holes with resin, during plating current value be set as 10-14 amperes/it is flat
Super superficial, the time is set as that copper facing thickness control is in 13-20um on 56-60 minutes, and nose end.
Step（2）In, current density value is excellent during plating is set to 13 amperes/square feet, and the copper facing time is excellent to be set to 28 minutes.
Step（6）In, current value is excellent during plating is set to 12 amperes/square feet, and the time is excellent to be set to 58 minutes.
Claims (3)
1. a kind of pcb board filling holes with resin electroplates preparation method, it is characterised in that：Comprise the following steps：
（1）, outer copper foil is pressed on pcb board first, during pressing from JOZ or increase subtract copper flow, make Copper Foil rear end reduce
To 4-7um；
（2）, using galvanoplastic copper facing in the via of PCB, current density value is set to 11-15 amperes/squares of English during plating
Chi, the copper facing time is set as 25-31 minutes, and plating copper thickness is within 15um；
（3）, using filling holes with resin, require that the height of plug socket resin reaches 100-the 120% of via after consent, that is, require consent
Resin end at least flushes with nose end；
（4）, using ceramic brush grind resin, the partial mill by resin beyond via nose end is put down；
（5）, chemistry removing glue, plug socket resin is stung lose into it is cellular；
（6）, via nose end copper using galvanoplastic after filling holes with resin, during plating current value be set as 10-14 amperes/it is flat
Super superficial, the time is set as that copper facing thickness control is in 13-20um on 56-60 minutes, and nose end.
2. a kind of pcb board filling holes with resin according to claim 1 electroplates preparation method, it is characterised in that：Step（2）In,
Current density value is excellent during plating is set to 13 amperes/square feet, and the copper facing time is excellent to be set to 28 minutes.
3. a kind of pcb board filling holes with resin according to claim 1 electroplates preparation method, it is characterised in that：Step（6）In,
Current value is excellent during plating is set to 12 amperes/square feet, and the time is excellent to be set to 58 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611241588.5A CN106793517A (en) | 2016-12-29 | 2016-12-29 | A kind of pcb board filling holes with resin electroplates preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611241588.5A CN106793517A (en) | 2016-12-29 | 2016-12-29 | A kind of pcb board filling holes with resin electroplates preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793517A true CN106793517A (en) | 2017-05-31 |
Family
ID=58925544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611241588.5A Pending CN106793517A (en) | 2016-12-29 | 2016-12-29 | A kind of pcb board filling holes with resin electroplates preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793517A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235597A (en) * | 2018-02-08 | 2018-06-29 | 惠州奔达电子有限公司 | The production method and PCB of a kind of PCB |
| CN110831338A (en) * | 2019-11-28 | 2020-02-21 | 南京宏睿普林微波技术股份有限公司 | Process method for plugging holes with resin by using press |
| CN111182743A (en) * | 2020-01-06 | 2020-05-19 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103144378A (en) * | 2013-01-28 | 2013-06-12 | 广东生益科技股份有限公司 | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof |
| CN104349589A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing methods of printed circuit board and plate hole of printed circuit board |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
-
2016
- 2016-12-29 CN CN201611241588.5A patent/CN106793517A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103144378A (en) * | 2013-01-28 | 2013-06-12 | 广东生益科技股份有限公司 | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof |
| CN104349589A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing methods of printed circuit board and plate hole of printed circuit board |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235597A (en) * | 2018-02-08 | 2018-06-29 | 惠州奔达电子有限公司 | The production method and PCB of a kind of PCB |
| CN108235597B (en) * | 2018-02-08 | 2024-02-23 | 惠州奔达电子有限公司 | PCB manufacturing method and PCB |
| CN110831338A (en) * | 2019-11-28 | 2020-02-21 | 南京宏睿普林微波技术股份有限公司 | Process method for plugging holes with resin by using press |
| CN110831338B (en) * | 2019-11-28 | 2020-08-28 | 南京宏睿普林微波技术股份有限公司 | Process method for plugging holes with resin by using press |
| CN111182743A (en) * | 2020-01-06 | 2020-05-19 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN111182743B (en) * | 2020-01-06 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |