CN107155264A - A kind of method for lifting alkali etching uniformity - Google Patents
A kind of method for lifting alkali etching uniformity Download PDFInfo
- Publication number
- CN107155264A CN107155264A CN201710409114.5A CN201710409114A CN107155264A CN 107155264 A CN107155264 A CN 107155264A CN 201710409114 A CN201710409114 A CN 201710409114A CN 107155264 A CN107155264 A CN 107155264A
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- CN
- China
- Prior art keywords
- etching
- alkali etching
- spray
- plate
- alkali
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of method for lifting alkali etching uniformity, with during positive blade technolgy making outer-layer circuit on production plate, before being etched with alkaline etching liquid to production plate, the step of first compensating etching, the compensation etching is to carry out spray etching to production plate with the sub- liquid of alkali etching, upper spray that the compensation is etched and under to spray power be 2.0 3.0kg/cm2；During alkali etching, it is pressed on plate direction, the region of alkali etching cylinder centre 60% and sprays power for 2.6kg/cm2, power is sprayed on each 20% region of both sides for 2.1kg/cm2, the inventive method increases compensation etching step before alkali etching, and adjusts alkali etching pressure distribution, improves the etch uniformity of circuit, and production quality is stable, reduces scrappage and then reduces production cost.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, and in particular to a kind of side of lifting alkali etching uniformity
Method.
Background technology
The Making programme of existing wiring board is：Sawing sheet → making internal layer circuit → pressing → drilling → heavy copper → full plate electricity
Plating → making outer-layer circuit → making solder mask → surface treatment → shaping.It is existing when making internal layer circuit and outer-layer circuit
Engraving method be to unify setting etching pressure respectively for top and bottom, the spray pressure on same surface is identical, and in etching
Circuit is more intensive on production plate one is face-down；All it is dry plate before being etched in existing industry or leading portion is washing.
Above-mentioned engraving method can have following defect：
(1) the circuit etching uniformity of production plate one side upward can only achieve 75-85%, not reach required by production
Uniformity >=90%, percent defective is high, influences production efficiency, and cost of idleness；
(2) the uniform performance of circuit etching of production plate one side down reaches 90-98%, and the etching on upper and lower plates upper thread road is uniform
Property extreme difference is big；
(3) quality of etching is unstable, and precise circuit etch capabilities are poor, and alkali etching can only produce more than 4mil circuit
Plate.
The content of the invention
The present invention is carried out after circuit etching for existing engraving method, the etch uniformity extreme difference on upper and lower plates upper thread road
Greatly, the problem of circuit of upper face does not reach the uniformity >=90% required by production, there is provided one kind lifting alkali etching is uniform
Property method, this method alkalescence and alkali etching before respectively increase compensation etching step, improve the etch uniformity of circuit,
And production quality is stable.
In order to solve the above-mentioned technical problem, the invention provides a kind of method for lifting alkali etching uniformity, in production
With during positive blade technolgy making outer-layer circuit on plate, before being etched with alkaline etching liquid to production plate, erosion is first compensated
The step of quarter, the compensation etching is to carry out spray etching, the upper spray of the compensation etching to production plate with the sub- liquid of alkali etching
It is 2.0-3.0kg/cm that power is sprayed with2。
Preferably, when carrying out spray etching to production plate with alkaline etching liquid, power is above sprayed for 2.1-3.1kg/cm2,
Under spray power for 0.8-1.8kg/cm2。
Preferably, when carrying out spray etching to production plate with alkaline etching liquid, alkali etching pressure distribution is adjusted, is pressed into
Power is sprayed for 2.6kg/cm on plate direction, the region of alkali etching cylinder centre 60%2, spray on each 20% region of both sides
Power is 2.1kg/cm2；Under spray power for 1.3kg/cm2。
Preferably, when being etched, non-board- electricity folder point one end is as entering plate direction on production plate.
Preferably, the component of the sub- liquid of the alkali etching includes ammoniacal liquor, sal-ammoniac and water.
Compared with prior art, the present invention has the advantages that：
The present invention added before alkali etching the step of compensation etching during outer-layer circuit is made of positive blade technolgy
Suddenly, compensation etching carries out spray etching to production plate using the sub- liquid of existing alkali etching, and the effect of compensation etching is that moistening is stung
Plate face is lost, the problem of direct impact of the later stage alkali etching decoction with drying plate face causes circuit etching lack of homogeneity is reduced, protects
The stabilization of rear process alkali etching cylinder inner liquid medicine content is held, the etch uniformity of outer-layer circuit on wiring board can be effectively lifted extremely
More than 90%, and be distributed by adjusting etching pressure during later stage alkali etching, further lift outer-layer circuit on wiring board
Etch uniformity to more than 95%, hence it is evident that improve the problem of wiring board upper and lower plates facet etch uniformity extreme difference is big, also improve
Etch process ability, makes the capability improving of alkali etching precise circuit of the present invention, and alkali etching can produce line width 2mil's
Wiring board.
Embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with technical side of the specific embodiment to the present invention
Case is described further and illustrated.
Embodiment
A kind of preparation method of wiring board of the present embodiment offer, the method for especially wherein lifting alkali etching uniformity,
Include following treatment process successively：Outside sawing sheet → internal layer circuit making → pressing → drilling → one → electric plating of whole board of heavy copper → making
Sandwich circuit → welding resistance → silk-screen character → surface treatment → shaping, is comprised the following steps that：
A, sawing sheet：Core plate, core thickness 1.2mmH/H are outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit make (negative film technique)：Inner figure is shifted, and light-sensitive surface is coated with vertical application machine, light-sensitive surface
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit exposure is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule), development is gone
Fall the light-sensitive surface of non-internal layer circuit part, acidic etching liquid spray etching is used afterwards, the core plate after exposure imaging is etched interior
Sandwich circuit, it is 3mil that internal layer line width, which is measured,；Internal layer AOI, then check internal layer circuit opens short circuit, circuit breach, circuit pin hole
Defective to scrap processing etc. defect, flawless product goes out to downstream.
C, pressing：Brown speed folds core plate, prepreg, outer copper foil according to the thick brown of bottom copper copper successively on request
Close, then pressed superimposed sheet from appropriate lamination according to the characteristic of plate, form production plate.
D, drilling：According to existing drilling technique, holes drilled through is carried out on production plate according to design requirement.
E, heavy copper：Make all via metals on production plate, backlight tests 10 grades, the heavy copper thickness in hole is 0.5 μm.
F, electric plating of whole board：, can 10-15 μm of copper facing with 1.2ASD current density electric plating of whole board 60min.
G, outer-layer circuit make (positive blade technolgy)：Outer graphics are shifted, using Full-automatic exposure machine and positive line film,
Outer-layer circuit exposure is completed with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), it is developed, form outer-layer circuit figure on production plate；
Outer graphics are electroplated, and then distinguish copper facing and tin plating on production plate, and copper facing is to electroplate 60min with 1.8ASD current density,
Tin plating is to electroplate 10min with 1.2ASD current density, and tin is thick 3-5 μm, then moves back film, and plate is produced afterwards and compensates etching step
Suddenly, compensation etching is to carry out spray etching to production plate with the sub- liquid of alkali etching, the production plate alkalescence after being etched through overcompensation
Etching solution spray etching, most retreats tin, outer-layer circuit is etched on production plate, it is 2mil that outer layer line width, which is measured,；Outer layer AOI,
Then check outer-layer circuit opens the defects such as short circuit, circuit breach, circuit pin hole, defective to scrap processing, flawless product
Go out to downstream.
When outer-layer circuit is etched, one end of non-board- electricity folder point when graphic plating (i.e. clamping plate end) is as entering on production plate
Plate direction；When wherein compensation is etched, spray pressure 2.0-3.0kg/cm2；When using alkaline etching liquid spray etching again, power is above sprayed
For 2.1-3.1kg/cm2, under spray power for 0.8-1.8kg/cm2, specially it is pressed into 60% in the middle of plate direction, alkali etching cylinder
Power is sprayed on region for 2.6kg/cm2, power is sprayed on each 20% region of both sides for 2.1kg/cm2, under spray power and be
1.3kg/cm2；When with alkaline etching liquid spray etching, the component of the sub- liquid of alkali etching includes ammoniacal liquor, sal-ammoniac and water.
H, welding resistance, silk-screen character：Solder mask and silk-screen word are made according to prior art and by design requirement on production plate
Symbol；
I, surface treatment, detection and shaping:It is surface-treated according to prior art and by design requirement on production plate, so
Test produces the electric property of plate, gong profile and the outward appearance for taking a sample test plate again afterwards, and circuit board finished product is made.
500 pieces of circuit board finished products, eventually through inspection, outer-layer circuit are made with the preparation method of wiring board in embodiment
Uniformity reaches more than 95%, solves when being etched in making outer-layer circuit a face circuit lack of homogeneity upward and up and down
The problem of two sides circuit uniformity extreme difference is big.
In other embodiments, the sub- liquid of etching used can be water during compensation etching.
The technical scheme provided above the embodiment of the present invention is described in detail, specific case used herein
Principle and embodiment to the embodiment of the present invention are set forth, and the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Simultaneously for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
It will change in formula and application, in summary, this specification content should not be construed as limiting the invention.
Claims (5)
1. a kind of method for lifting alkali etching uniformity, it is characterised in that make outer layer line with positive blade technolgy on production plate
During road, before being etched with alkaline etching liquid to production plate, the step of first compensating etching, the compensation etching is to use
The sub- liquid of alkali etching carries out spray etching to production plate, the upper spray of compensation etching and under to spray power be 2.0-3.0kg/
cm2。
2. the method for lifting alkali etching uniformity according to claim 1, it is characterised in that with alkaline etching liquid pair
When producing plate progress spray etching, power is above sprayed for 2.1-3.1kg/cm2, under spray power for 0.8-1.8kg/cm2。
3. the method for lifting alkali etching uniformity according to claim 2, it is characterised in that with alkaline etching liquid pair
When producing plate progress spray etching, alkali etching pressure distribution is adjusted, in the middle of plate direction, alkali etching cylinder 60% region is pressed into
On spray power for 2.6kg/cm2, power is sprayed on each 20% region of both sides for 2.1kg/cm2；Under spray power for 1.3kg/
cm2。
4. the method for lifting alkali etching uniformity according to claim 1, it is characterised in that raw when being etched
Non-board- electricity folder point one end is as entering plate direction on production plate.
5. the method for lifting alkali etching uniformity according to claim 1, it is characterised in that the sub- liquid of alkali etching
Component include ammoniacal liquor, sal-ammoniac and water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409114.5A CN107155264A (en) | 2017-06-02 | 2017-06-02 | A kind of method for lifting alkali etching uniformity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409114.5A CN107155264A (en) | 2017-06-02 | 2017-06-02 | A kind of method for lifting alkali etching uniformity |
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| Publication Number | Publication Date |
|---|---|
| CN107155264A true CN107155264A (en) | 2017-09-12 |
Family
ID=59795746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710409114.5A Pending CN107155264A (en) | 2017-06-02 | 2017-06-02 | A kind of method for lifting alkali etching uniformity |
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| Country | Link |
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| CN (1) | CN107155264A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109136928A (en) * | 2018-10-22 | 2019-01-04 | 东莞泰山电子有限公司 | A kind of PCB alkaline etching process |
| CN111668141A (en) * | 2020-07-24 | 2020-09-15 | 山东新恒汇电子科技有限公司 | Etching process of lead frame |
| CN115003042A (en) * | 2022-05-19 | 2022-09-02 | 胜宏科技（惠州）股份有限公司 | Ammonia water assisted film stripping method |
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| US6632575B1 (en) * | 2000-08-31 | 2003-10-14 | Micron Technology, Inc. | Precision fiducial |
| US20070092829A1 (en) * | 2005-10-21 | 2007-04-26 | Christoph Noelscher | Photosensitive coating for enhancing a contrast of a photolithographic exposure |
| CN103327746A (en) * | 2013-05-02 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Method for etching PCB outer layer circuit of fine circuit |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
| CN104411105A (en) * | 2014-11-21 | 2015-03-11 | 深圳崇达多层线路板有限公司 | Method for improving excessive circuit etching of circuit board |
| TW201621970A (en) * | 2014-12-03 | 2016-06-16 | Advanced Micro Fab Equip Inc | Device and method for compensating non-uniformity of etching rate in ICP etching, and ICP etching device |
-
2017
- 2017-06-02 CN CN201710409114.5A patent/CN107155264A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632575B1 (en) * | 2000-08-31 | 2003-10-14 | Micron Technology, Inc. | Precision fiducial |
| US20070092829A1 (en) * | 2005-10-21 | 2007-04-26 | Christoph Noelscher | Photosensitive coating for enhancing a contrast of a photolithographic exposure |
| CN103327746A (en) * | 2013-05-02 | 2013-09-25 | 深圳崇达多层线路板有限公司 | Method for etching PCB outer layer circuit of fine circuit |
| CN104080275A (en) * | 2014-03-12 | 2014-10-01 | 博敏电子股份有限公司 | Method for manufacturing stepped circuit board |
| CN104411105A (en) * | 2014-11-21 | 2015-03-11 | 深圳崇达多层线路板有限公司 | Method for improving excessive circuit etching of circuit board |
| TW201621970A (en) * | 2014-12-03 | 2016-06-16 | Advanced Micro Fab Equip Inc | Device and method for compensating non-uniformity of etching rate in ICP etching, and ICP etching device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109136928A (en) * | 2018-10-22 | 2019-01-04 | 东莞泰山电子有限公司 | A kind of PCB alkaline etching process |
| CN111668141A (en) * | 2020-07-24 | 2020-09-15 | 山东新恒汇电子科技有限公司 | Etching process of lead frame |
| CN115003042A (en) * | 2022-05-19 | 2022-09-02 | 胜宏科技（惠州）股份有限公司 | Ammonia water assisted film stripping method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170912 |
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