CN109136928A - A kind of PCB alkaline etching process - Google Patents
A kind of PCB alkaline etching process Download PDFInfo
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- CN109136928A CN109136928A CN201811229193.2A CN201811229193A CN109136928A CN 109136928 A CN109136928 A CN 109136928A CN 201811229193 A CN201811229193 A CN 201811229193A CN 109136928 A CN109136928 A CN 109136928A
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- Prior art keywords
- etching
- alkaline
- pcb
- pcb board
- liquid
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention discloses a kind of PCB alkaline etching process, includes the following steps, using chloride ion content for the content of 160-200 grams per liter, bivalent cupric ion is that 120-160 grams per liter, pH value are maintained at the alkaline etching liquid of 8.2-9.0；Then it is added using the alkaline etching liquid in the etching cylinder of etching machine, allows etching machine that the temperature of the alkaline etching liquid to be maintained between 45 degrees Celsius to 55 degrees Celsius；Then pressure and the upper pressure of spray on the spray of setting etching machine；Finally the pcb board that development is completed is put into etching machine and is etched.Compared with prior art, the etching solution that the present invention uses is alkaline etching liquid, under the same conditions, alkaline etching liquid increases by 20% compared to acidic etching liquid, etching speed fast 20%, the opposite production capacity that produces, production efficiency can be significantly increased, improve the benefit of factory；And alkali etching liquor ratio acidic etching liquid, when producing same plate, cost reduces 30-50%, and production cost reduces, and is conducive to the profit of factory.
Description
Technical field
The invention belongs to PCB etching technique fields, particularly, are related to a kind of PCB etch process.
Background technique
During producing PCB circuit board, needs to be transferred to the circuit diagram on the film by developing procedure and cover copper foil
On laminate, a kind of anticorrosive or anti-plate exposure mask is formed, therefore the place not being covered by the mask will be easy by liquid medicine corruption
Circuit is exposed in erosion.Then, after the completion of development work, need to carry out the etching work procedure of pcb board, i.e., with etching machine to development
Pcb board afterwards is etched.Etching machine is typically all that spray head spray liquid medicine is used to be etched PCB, and liquid medicine used is acid
Property etching solution, but use the higher cost of acidic etching liquid, and etching speed is slow, and production capacity is lower, so as to cause pcb board
Production cost it is higher, be unfavorable for the operation of factory.
Summary of the invention
For overcome the deficiencies in the prior art, a kind of embodiment of the invention provides a kind of increase production capacity, reduces cost, mentions
The PCB alkaline etching process of high yield.
An embodiment of the present invention solves technical solution used by its technical problem:
A kind of PCB alkaline etching process, which is characterized in that include the following steps,
(a) alkaline etching liquid is modulated, wherein the chloride ion content of the alkaline etching liquid is 160-200 grams per liter, cupric
The content of ion is 120-160 grams per liter, and makes the pH value of the alkaline etching liquid be maintained at 8.2-9.0 using ammonium hydroxide；
(b) alkaline etching liquid modulated is added in the etching cylinder of etching machine, etching machine is allowed to lose the alkalinity
The temperature for carving liquid is maintained between 45 degrees Celsius to 55 degrees Celsius；
(c) it is thousand grams/cm of 1.5-2.5 that pressure on the spray of etching machine, which is arranged, and pressure is 1.3-2.3 thousand on spray
Gram/cm, wherein it is 0.2 thousand grams/cm big to spray pressure under upper pressure ratio spray when pressure adjustment；
(d) pcb board that development is completed is put into etching machine and is etched；
(e) pcb board that etching is completed is subjected to multiple washing, then checks whether pcb board is qualified.
As an improvement of the above scheme, etching machine controls the specific gravity of etching solution liquid medicine in etching cylinder by added automatically system
Between 1.19-1.23；When liquid medicine specific gravity is less than 1.2, copper chloride liquid medicine and ammonium hydroxide will be added to be automatic；When liquid medicine specific gravity arrives
Then stop the addition of liquid medicine when up to 1.21.
As a further improvement of the foregoing solution, when etching bottom copper copper thickness is the pcb board of 17.5um, etching machine transports PCB
The speed of plate is 3.0-4.0 ms/min.
Further, when etching bottom copper copper thickness is the pcb board of 35.0um, the speed that etching machine transports pcb board is 2.0-3.0
M/min.
Further, when etching bottom copper copper thickness is the pcb board of 70.0um, the speed that etching machine transports pcb board is 1.0-2.0
M/min.
Further, the multiple washing in the step e included that water cleaning, overflow washing, clear water wash three scavengers
Sequence.
An embodiment of the present invention the utility model has the advantages that compared with prior art, the etching solution that the present invention uses is alkalinity erosion
Liquid is carved, under the same conditions, alkaline etching liquid increases compared to acidic etching liquid, etching speed fast 20%, the opposite production capacity that produces
Add 20%, production efficiency can be significantly increased, improves the benefit of factory；And alkali etching liquor ratio acidic etching liquid is in life
When producing same plate, cost reduces 30-50%, and production cost reduces, and is conducive to the profit of factory.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the flow chart of an embodiment of the present invention.
Specific embodiment
Referring to Fig.1, a kind of PCB alkaline etching process, includes the following steps,
(a) alkaline etching liquid is modulated, wherein the chloride ion content of the alkaline etching liquid is 160-200 grams per liter, cupric
The content of ion is 120-160 grams per liter, and makes the pH value of the alkaline etching liquid be maintained at 8.2-9.0 using ammonium hydroxide；
(b) alkaline etching liquid modulated is added in the etching cylinder of etching machine, etching machine is allowed to lose the alkalinity
The temperature for carving liquid is maintained between 45 degrees Celsius to 55 degrees Celsius；
(c) it is thousand grams/cm of 1.5-2.5 that pressure on the spray of etching machine, which is arranged, and pressure is 1.3-2.3 thousand on spray
Gram/cm, wherein it is 0.2 thousand grams/cm big to spray pressure under upper pressure ratio spray when pressure adjustment；
(d) pcb board that development is completed is put into etching machine and is etched；
(e) pcb board that etching is completed is subjected to multiple washing, then checks whether pcb board is qualified.
The etching mechanism of the alkaline etching liquid are as follows:
CuCl2+4NH3→Cu(NH3)4Cl2
Cu(NH3)4Cl2+Cu→2Cu(NH3)2Cl
When etching using alkaline etching liquid, etching solution and copper face generate the small protective film Cu (NH of solubility3)2 +Or Cu
(OH)2Deng such protective film physical property is weak, and side solution rate is slower than vertically losing copper, therefore then when free ammonium ion is few
Having reduces lateral erosion function, and PH high means that free ammonium ion is more, and protective film is then easy the big Cu (NH of chemical conversion solubility at this time3)2 +From
Son and leave copper face, therefore in PH high or low copper content etching, often easily caused erosion phenomenon.When pH value 8.2-9.0 it
Between, when the content of bivalent cupric ion is 120-160 grams per liter, not only etching speed is fast, but also lateral erosion is small.Wherein etching solution
Temperature be 45 degrees Celsius to 55 degrees Celsius between, be optimally exactly between 48 degrees Celsius to 50 degrees Celsius；When temperature is more than 55
Degree Celsius when, temperature is excessively high to cause casing wall to be easily deformed, and etch too fast, the excessive influence product quality of side etching quantity；But
Temperature is too low, will affect etching efficiency.And additive can also be added in etching solution, i.e. addition polymer electrolyte and nitrogenous
The interfacial agent of type works as wetting agent, can be with using cuprous complexing agent or organic matter using strong sulfur-bearing, nitrogenous shore protection agent
Cuprous complex salt generates additive derivative, reaches the effect for changing erosion copper speed and shore protection, and effective PH buffer stablizes PH.
The requirement of pressure: pressure is thousand grams/cm of 1.5-2.5 on the spray of etching machine, and pressure is 1.3- on spray
2.3 thousand grams/cm, push Tai Gaoyi and interrupt protective film, above plank can ponding and have pool effect, press above than
Push it is slightly higher, the higher circuit surface of degree of difficulty preferably downward, and route along walk lateral erosion be greater than it is horizontal walk direction.And in order to avoid
Lateral erosion is excessively serious, and lateral erosion inhibitor can also be added into alkaline etching liquid, can maintain certain protective film in copper side,
The low protective film of such solubility forms very great talent in pressure great disparity and has difference, is just easily broken off when pressure is big, lateral erosion pressure
It is not easy to break when power is less than certain value, therefore lateral erosion can reduce 20-30%.
Preferably, in order to keep constantly etching cylinder in liquid medicine content, etching machine by added automatically system control erosion
The specific gravity of etching solution liquid medicine in cylinder is carved between 1.19-1.23；It is equipped in etching cylinder and adds than re-detection controller, and also
The addition pipeline of medicine adding will add copper chloride liquid medicine and ammonium hydroxide when liquid medicine specific gravity is less than 1.2 to be automatic；When liquid medicine specific gravity
Then stop the addition of liquid medicine when reaching 1.21.
Preferably, in order to preferably etch and control the speed etched, the pcb board that copper copper thickness in bottom is 17.5um is etched
When, the speed that etching machine transports pcb board is 3.0-4.0 ms/min.When etching the pcb board that copper copper thickness in bottom is 35.0um, etching machine
The speed for transporting pcb board is 2.0-3.0 ms/min.When etching the pcb board that copper copper thickness in bottom is 70.0um, etching machine transports pcb board
Speed be 1.0-2.0 ms/min.The pcb board of different-thickness is etched, the travelling speed of etching line is different, to guarantee to etch
Effect and the efficiency of etching.
Preferably, more clean in order to clean, the multiple washing in the step e included water cleaning, overflow wash,
Clear water washes three cleaning process.Wherein crossing water cleaning is residual cleaning, and overflow washing is that clean water rinses always, and clear water, which is washed, is
The cleaning in last portion.With drying and can collect after washing, the next step is carried out.Compared with prior art, originally
The etching solution used is invented as alkaline etching liquid, under the same conditions, alkaline etching liquid is compared to acidic etching liquid, etching speed
Fast 20% is spent, the opposite production capacity that produces increases by 20%, and production efficiency can be significantly increased, improve the benefit of factory；And alkali
Property etching solution than acidic etching liquid when producing same plate, cost reduce 30-50%, production cost reduce, be conducive to factory
Profit.
The above only better embodiment of the invention, but the present invention is not limited to above-described embodiments, if its with
Any same or similar means reach technical effect of the invention, should all fall under the scope of the present invention.
Claims (6)
1. a kind of PCB alkaline etching process, which is characterized in that include the following steps,
(a) alkaline etching liquid is modulated, wherein the chloride ion content of the alkaline etching liquid is 160-200 grams per liter, bivalent cupric ion
Content be 120-160 grams per liter, and make the pH value of the alkaline etching liquid be maintained at 8.2-9.0 using ammonium hydroxide；
(b) alkaline etching liquid modulated is added in the etching cylinder of etching machine, allows etching machine by the alkaline etching liquid
Temperature be maintained between 45 degrees Celsius to 55 degrees Celsius；
(c) be arranged etching machine spray on pressure be thousand grams/cm of 1.5-2.5, on spray pressure for 1.3-2.3 kilograms/
Square centimeter, wherein it is 0.2 thousand grams/cm big to spray pressure under upper pressure ratio spray when pressure adjustment；
(d) pcb board that development is completed is put into etching machine and is etched；
(e) pcb board that etching is completed is subjected to multiple washing, then checks whether pcb board is qualified.
2. a kind of PCB alkaline etching process according to claim 1, it is characterised in that: etching machine passes through addition system automatically
The specific gravity of etching solution liquid medicine is between 1.19-1.23 in system control etching cylinder；It will be to add automatically when liquid medicine specific gravity is less than 1.2
Chlorination chemical corroding copper water and ammonium hydroxide；Then stop the addition of liquid medicine when liquid medicine specific gravity reaches 1.21.
3. a kind of PCB alkaline etching process according to claim 1, it is characterised in that: etching bottom copper copper thickness is 17.5um
Pcb board when, etching machine transport pcb board speed be 3.0-4.0 ms/min.
4. a kind of PCB alkaline etching process according to claim 1, it is characterised in that: etching bottom copper copper thickness is 35.0um
Pcb board when, etching machine transport pcb board speed be 2.0-3.0 ms/min.
5. a kind of PCB alkaline etching process according to claim 1, it is characterised in that: etching bottom copper copper thickness is 70.0um
Pcb board when, etching machine transport pcb board speed be 1.0-2.0 ms/min.
6. -5 any a kind of PCB alkaline etching process according to claim 1, it is characterised in that: more in the step e
Secondary washing included that water cleaning, overflow washing, clear water wash three cleaning process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811229193.2A CN109136928A (en) | 2018-10-22 | 2018-10-22 | A kind of PCB alkaline etching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811229193.2A CN109136928A (en) | 2018-10-22 | 2018-10-22 | A kind of PCB alkaline etching process |
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| Publication Number | Publication Date |
|---|---|
| CN109136928A true CN109136928A (en) | 2019-01-04 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811229193.2A Pending CN109136928A (en) | 2018-10-22 | 2018-10-22 | A kind of PCB alkaline etching process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598210A (en) * | 2023-07-12 | 2023-08-15 | 江苏富乐华半导体科技股份有限公司 | Method for manufacturing retaining dam for DPC product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102808181A (en) * | 2011-06-01 | 2012-12-05 | 莆田市佳宜电子有限公司 | Alkaline etching process of printed circuit board |
| CN104862703A (en) * | 2014-06-16 | 2015-08-26 | 叶涛 | Printed circuit board alkaline copper chloride etching liquid with high quality, high efficiency and safety |
| CN107155264A (en) * | 2017-06-02 | 2017-09-12 | 江门崇达电路技术有限公司 | A kind of method for lifting alkali etching uniformity |
-
2018
- 2018-10-22 CN CN201811229193.2A patent/CN109136928A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102808181A (en) * | 2011-06-01 | 2012-12-05 | 莆田市佳宜电子有限公司 | Alkaline etching process of printed circuit board |
| CN104862703A (en) * | 2014-06-16 | 2015-08-26 | 叶涛 | Printed circuit board alkaline copper chloride etching liquid with high quality, high efficiency and safety |
| CN107155264A (en) * | 2017-06-02 | 2017-09-12 | 江门崇达电路技术有限公司 | A kind of method for lifting alkali etching uniformity |
Non-Patent Citations (1)
| Title |
|---|
| 顾涵 主编: "《EDA技术实践教程》", 31 May 2017, 西安电子科技大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598210A (en) * | 2023-07-12 | 2023-08-15 | 江苏富乐华半导体科技股份有限公司 | Method for manufacturing retaining dam for DPC product |
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Application publication date: 20190104 |
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