CN106973515A - A kind of processing method unnet for circuit board etching - Google Patents
A kind of processing method unnet for circuit board etching Download PDFInfo
- Publication number
- CN106973515A CN106973515A CN201710211443.9A CN201710211443A CN106973515A CN 106973515 A CN106973515 A CN 106973515A CN 201710211443 A CN201710211443 A CN 201710211443A CN 106973515 A CN106973515 A CN 106973515A
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- Prior art keywords
- etching
- unnet
- etch
- point
- processing method
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of processing method unnet for circuit board etching, in interior outer-layer circuit manufacturing process, respectively spray etching is carried out with identical or different etching solution, the problem of to etching unnet, plate carried out second etch, and the second etch is that corresponding etching solution progress point se when using first time spray etching is carved.The problem of present invention is by etching unnet plate carries out rational second etch (point se is carved), and point se, which is carved, can handle the problem of etching is not net plate, it is ensured that production quality, it is to avoid do over again and scrap and cause cost to waste, and effectively improve production efficiency.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, and in particular to a kind of processing unnet for circuit board etching
Method.
Background technology
In printed wiring board manufacturing process, generally using the method for spray etching when internal outer-layer circuit is etched,
And in interior outer-layer circuit etching production process, inevitably occurring the unnet situation of slight etching, such as etching flash causes line
Road gap is small or short-circuit, the part in unit has thin residual copper of a floor etc.；There is following processing mode for the unnet situation of etching
(and its shortcoming)：(1) etching solution, is taken using the toothbrush libation at an ancient wedding ceremony, fault location processing is wiped by hand, its inefficiency is only suitable for simple line
Road plate；(2) repetition of, directly doing over again is etched, and can there is a situation where that quality hidden danger is big, is not suitable for precise circuit production；(3), positive
Plate patch dry film does negative film and done over again etching, its long flow path, rework cost height；(4), after visual inspection or AOI machine examinations, repaiied by hand with scalpel
Reason, its inefficiency, and there is leaky wave hidden danger；(5) processing, is directly scrapped, production cost is added, company's interest is damaged.
The content of the invention
The present invention for the unnet existing processing method of circuit board etching exist big inefficiency, quality hidden danger, long flow path,
The problem of cost is high is there is provided a kind of processing method unnet for circuit board etching, and this method, which can be handled, etches unnet ask
Inscribe plate, it is ensured that production quality, it is to avoid do over again and scrap and cause cost to waste, and effectively improve production efficiency.
In order to solve the above-mentioned technical problem, the invention provides a kind of processing method unnet for circuit board etching,
In inside and outside sandwich circuit manufacturing process, spray etching is carried out with identical or different etching solution respectively, plate the problem of unnet to etching
Second etch is carried out, the second etch is that corresponding etching solution when using spray etching carries out point se quarter.
Preferably, with negative film technique make circuit when, the second etch uses point se quarter on spray power for
1.2±0.2kg/cm2, under spray power for 1.0 ± 0.2kg/cm2。
Preferably, in circuit is made of negative film technique, production line linear speed when carrying out second etch is 8 ± 2m/min.
Preferably, with negative film technique make circuit when, the second etch uses point se carve point spray frequency for
1-2s is opened, stops 4-8s.
Preferably, when making outer-layer circuit with positive blade technolgy, sprayed on the point se quarter that the second etch is used
Power is 1.5 ± 0.5kg/cm2, under spray power for 1.0 ± 0.5kg/cm2。
Preferably, in outer-layer circuit is made of positive blade technolgy, production line linear speed when carrying out second etch is 8 ± 2m/
min。
Preferably, when making outer-layer circuit with positive blade technolgy, the point spray frequency that the point se that the second etch is used is carved
Rate stops 4-8s to open 1-2s.
Preferably, by first time spray etching it is unnet the problem of plate, carry out second etch when problem board should be etched
Unnet more serious face-down, serious end is facing forward.
Compared with prior art, the present invention has the advantages that：
The present invention is during circuit is made with negative film technique, and etching for the first time uses acidic etching liquid and lost
Carve, plate carries out second etch with identical acidic etching liquid the problem of unnet to etching；Circuit process is being made with positive blade technolgy
In, etching for the first time uses alkaline etching liquid and is etched, plate identical alkaline etching liquid the problem of unnet to etching
Carry out second etch；What the second etch of inside and outside sandwich circuit was used is that a se is carved, and when point se is carved, positive blade technolgy can not be moved back
Tin, negative film technique can not move back film, and problem board bay is placed, and lower etching pressure, reduce that etching pressure is excessive to bring lateral erosion；By will
Adjustment spray pressure is sought, turns off and etches spray, accelerates transmission speed, it is to avoid etching speed occurs etching excessive, line children slowly excessively
Problem；Problem board sprays according to a spray frequency requirement open and close etching completely into etching section, controls better se to carve frequency, it is ensured that
Issue handling quality；The present invention is carved by a se to occur slight etching not in effective, quick process circuit plate production process
Net the problem of, inefficient, low yield issues in traditional problem processing are avoided well, cost has been saved, has preferably retrieved enterprise
Industry is lost.
Embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with technical side of the specific embodiment to the present invention
Case is described further and illustrated.
Embodiment 1
A kind of preparation method of wiring board shown in the present embodiment, is especially wherein used for the unnet processing of circuit board etching
Method, successively including following treatment process：Sawing sheet → internal layer circuit making → pressing → drilling → heavy copper → electric plating of whole board → outer
Sandwich circuit making → welding resistance → silk-screen character → surface treatment → shaping, is comprised the following steps that：
A, sawing sheet：Core plate, core thickness 1.2mm H/H are outputed by jigsaw size 520mm × 620mm；
B, internal layer circuit make (negative film technique)：Inner figure is shifted, and light-sensitive surface is coated with vertical application machine, light-sensitive surface
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit exposure is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)；Internal layer
Spray etching, etches internal layer circuit with acidic etching liquid by the core plate after exposure imaging, moves back and internal layer circuit is checked before film
Quality, chooses plate by core plate the problem of etching unnet and sets, core plate carries out second etch, two the problem of unnet to etching
Secondary etching is that acidic etching liquid used when using first time spray etching carries out point se quarter, wherein, the second etch is used
Point se carve on spray power for 1.2 ± 0.2kg/cm2, under spray power for 1.0 ± 0.2kg/cm2, during progress second etch
Production line linear speed is 8 ± 2m/min, and point spray frequency stops 4-8s, after the completion of point se is carved, check problem core plate initial workpiece to open 1-2s
Treatment situation, confirm etching it is clean it is qualified after, parameter carries out the batch processing of problem board according to this, then moves back film, in AOI is checked
Sandwich circuit opens the defects such as short circuit, circuit breach, circuit pin hole, and defective to scrap processing, flawless product goes out to lower one stream
Journey；
C, pressing：Brown speed folds core plate, prepreg, outer copper foil according to the thick brown of bottom copper copper successively on request
Close, form superimposed sheet, then pressed superimposed sheet from appropriate lamination according to plate Tg, the production plate of formation；
D, drilling：According to existing drilling technique, Drilling operation is carried out on production plate according to design requirement；
E, heavy copper：Make the hole metallization on production plate, backlight tests 10 grades；
F, electric plating of whole board：With 1.8ASD current density electric plating of whole board 20min；
G, outer-layer circuit make (positive blade technolgy)：Outer graphics are shifted, using Full-automatic exposure machine and positive line film,
Outer-layer circuit exposure is completed with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), it is developed, form outer-layer circuit figure on production plate；
Outer graphics are electroplated, and then distinguish copper facing and tin plating on production plate, copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is to electroplate 10min with 1.2ASD current density, and tin is thick 3-5 μm；Then move back film successively again, etch for the first time,
Etch for the first time is that outer-layer circuit, the problem of first time is etched unnet by range estimation are etched on production plate using alkaline etching liquid
Production plate chooses bay setting, and production plate carries out second etch the problem of unnet to etching, and second etch is to use first
Alkaline etching liquid used carries out point se quarter during secondary spray etching, wherein, the upper spray that the point se that the second etch is used is carved
Pressure is 1.5 ± 0.5kg/cm2, under spray power for 1.0 ± 0.5kg/cm2, production line linear speed when carrying out second etch for 8 ±
2m/min, point spray frequency stops 4-8s, after the completion of point se is carved, checks that problem produces the treatment situation of plate initial workpiece, really to open 1-2s
Recognize etching it is clean it is qualified after, parameter carries out the batch processing of problem board according to this, then moves back tin, the copper thickness of outer-layer circuit is 130 μm；
H, welding resistance, silk-screen character：Solder mask and silk-screen word are made according to prior art and by design requirement on production plate
Symbol；
I, surface treatment, detection and shaping:It is surface-treated according to prior art and by design requirement on production plate, so
Test produces the electric property of plate, gong profile and the outward appearance for taking a sample test plate again afterwards, and circuit board finished product is made.
Embodiment 2
The present embodiment provides a kind of preparation method of wiring board, is especially wherein used for circuit board etching not net processing side
Method, including forming processes step, this method is essentially identical with embodiment 1, and difference is：Step g, outer-layer circuit
Make (negative film technique)：Outer graphics are shifted, and light-sensitive surface, 8 μm of the film thickness monitoring of light-sensitive surface, using complete are coated with vertical application machine
Automatic exposure machine, outer-layer circuit exposure is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)；Outer layer first time spray etching, will expose
Production plate after photodevelopment etches outer-layer circuit with acidic etching liquid, moves back inspection outer-layer circuit quality before film, unnet by etching
The problem of production plate choose plate setting, to etch it is unnet the problem of production plate carry out second etch, second etch is to adopt
Acidic etching liquid used carries out some se quarters during with first time spray etching, wherein, the point se that the second etch is used is carved
On spray power for 1.2 ± 0.2kg/cm2, under spray power for 1.0 ± 0.2kg/cm2, carry out production line linear speed during second etch
For 8 ± 2m/min, point spray frequency stops 4-8s, after the completion of point se is carved, checks that problem produces the processing shape of plate initial workpiece to open 1-2s
Condition, confirm etching it is clean it is qualified after, parameter carries out the batch processing that problem produces plate according to this, then moves back film, and AOI checks outer layer line
The defects such as short circuit, circuit breach, circuit pin hole are opened on road, and defective to scrap processing, flawless product goes out to downstream.
The present invention is during the second etch that interior outer-layer circuit is etched, and lower spray etch effect is better than upper spray etch effect,
The etching that problem core plate or problem should be produced to plate is unnet more serious face-down, and serious end is facing forward, it is ensured that the effect of etching.
The technical scheme provided above the embodiment of the present invention is described in detail, specific case used herein
Principle and embodiment to the embodiment of the present invention are set forth, and the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Simultaneously for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
It will change in formula and application, in summary, this specification content should not be construed as limiting the invention.
Claims (8)
1. a kind of processing method unnet for circuit board etching, it is characterised in that：In interior outer-layer circuit manufacturing process, respectively
Spray etching is carried out with identical or different etching solution, plate carries out second etch, the second etch the problem of unnet to etching
It is corresponding etching solution progress point se quarter when using spray etching.
2. the processing method unnet for circuit board etching according to claim 1, it is characterised in that：Using negative film technique
When making circuit, power is sprayed for 1.2 ± 0.2kg/cm on the point se quarter that the second etch is used2, under spray power for 1.0
±0.2kg/cm2。
3. the processing method unnet for circuit board etching according to claim 2, it is characterised in that：Using negative film technique
Make in circuit, production line linear speed when carrying out second etch is 8 ± 2m/min.
4. the processing method unnet for circuit board etching according to claim 3, it is characterised in that：Using negative film technique
When making circuit, the point that the point se that the second etch is used is carved sprays frequency to open 1-2s, stops 4-8s.
5. the processing method unnet for circuit board etching according to claim 1, it is characterised in that：Using positive blade technolgy
When making outer-layer circuit, power is sprayed for 1.5 ± 0.5kg/cm on the point se quarter that the second etch is used2, under spray power
For 1.0 ± 0.5kg/cm2。
6. the processing method unnet for circuit board etching according to claim 5, it is characterised in that：Using positive blade technolgy
Make in outer-layer circuit, production line linear speed when carrying out second etch is 8 ± 2m/min.
7. the processing method unnet for circuit board etching according to claim 6, it is characterised in that：Using positive blade technolgy
When making outer-layer circuit, the point that the point se that the second etch is used is carved sprays frequency to open 1-2s, stops 4-8s.
8. it is used for the unnet processing method of circuit board etching according to claim any one of 1-7, it is characterised in that：By
The problem of etching unnet after first time spray etching plate, should etch problem board when carrying out second etch in unnet more serious face
Down, serious end is facing forward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710211443.9A CN106973515A (en) | 2017-03-31 | 2017-03-31 | A kind of processing method unnet for circuit board etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710211443.9A CN106973515A (en) | 2017-03-31 | 2017-03-31 | A kind of processing method unnet for circuit board etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106973515A true CN106973515A (en) | 2017-07-21 |
Family
ID=59336623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710211443.9A Pending CN106973515A (en) | 2017-03-31 | 2017-03-31 | A kind of processing method unnet for circuit board etching |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
| CN108925057A (en) * | 2018-06-22 | 2018-11-30 | 江门崇达电路技术有限公司 | A kind of pair there are the processing methods of the not clean wiring board of circuit etching |
| CN110446363A (en) * | 2019-08-13 | 2019-11-12 | 广东达源设备科技有限公司 | A kind of circuit board etching method and wiring board |
| CN111800954A (en) * | 2020-06-16 | 2020-10-20 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
| CN114051326A (en) * | 2022-01-13 | 2022-02-15 | 广州添利电子科技有限公司 | Circuit board and processing method thereof |
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| CN102348331A (en) * | 2010-08-05 | 2012-02-08 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing tool and circuit board manufacturing method |
| CN106455325A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 77Ghz high-precision radio radar printed circuit board |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101590775A (en) * | 2008-05-28 | 2009-12-02 | Icf科技有限公司 | Surface treatment method of plastic components |
| CN102348331A (en) * | 2010-08-05 | 2012-02-08 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing tool and circuit board manufacturing method |
| CN106455325A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 77Ghz high-precision radio radar printed circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN108925057A (en) * | 2018-06-22 | 2018-11-30 | 江门崇达电路技术有限公司 | A kind of pair there are the processing methods of the not clean wiring board of circuit etching |
| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
| CN110446363A (en) * | 2019-08-13 | 2019-11-12 | 广东达源设备科技有限公司 | A kind of circuit board etching method and wiring board |
| CN111800954A (en) * | 2020-06-16 | 2020-10-20 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
| CN111800954B (en) * | 2020-06-16 | 2021-08-24 | 珠海杰赛科技有限公司 | Reworking method for manufacturing abnormal product of copper-clad plate line and printed circuit board |
| CN114051326A (en) * | 2022-01-13 | 2022-02-15 | 广州添利电子科技有限公司 | Circuit board and processing method thereof |
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Application publication date: 20170721 |