CN114051326A - Circuit board and processing method thereof - Google Patents

Circuit board and processing method thereof Download PDF

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Publication number
CN114051326A
CN114051326A CN202210035857.1A CN202210035857A CN114051326A CN 114051326 A CN114051326 A CN 114051326A CN 202210035857 A CN202210035857 A CN 202210035857A CN 114051326 A CN114051326 A CN 114051326A
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China
Prior art keywords
etching
dry film
circuit
copper surface
core plate
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CN202210035857.1A
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Chinese (zh)
Inventor
王胜军
唐兵英
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Guangzhou Ttm Electronic Technologies Co ltd
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Guangzhou Ttm Electronic Technologies Co ltd
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Priority to CN202210035857.1A priority Critical patent/CN114051326A/en
Publication of CN114051326A publication Critical patent/CN114051326A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A circuit board and a processing method thereof relate to the technical field of printed circuit boards; a circuit board processing method comprises the following steps: preprocessing a core plate; pasting a DI dry film on the metal surface of the core plate; exposing and developing the DI dry film by adopting an LDI exposure machine to obtain a circuit image; preliminarily etching the copper surface of the core plate according to the circuit image; carrying out secondary etching on the copper surface of the core board according to the circuit image; removing the DI dry film; the second etching is carried out by adding 4-6 kg/cm2Compressed gas and 2kg/cm after pressurization2Etching liquid medicine is stirred and mixed into atomized fine etching liquid drops, and then the atomized fine etching liquid drops are sprayed out, so that the copper surface of the core plate after preliminary etching is accurately etched; the pattern precision is controlled by using a special DI dry film when a dry film is pasted on a core plate and simultaneously carrying out circuit pattern exposure by matching with an LDI exposure machine, and a micro-molecular process of etching and pulling up is utilized toThe lateral erosion of the edge of the circuit is eliminated, and the line width precision after etching can be obviously improved.

Description

Circuit board and processing method thereof
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a circuit board and a processing method thereof.
Background
In the manufacturing process of the characteristic impedance circuit board, the following three influencing factors need to be controlled: the line width precision, the copper thickness and the thickness of the insulating dielectric layer after the inner layer is etched so as to meet the requirement of controlling the characteristic impedance in the circuit board. The line width precision after the inner layer etching is the first among the three influence factors, the line precision requirements of different positions of the same layer of line are controlled most strictly in a layout diagram of the circuit board, and the deviation of the line precision can directly cause the product to become a waste product.
In the prior art, a common characteristic impedance circuit board production process is a processing process based on a black film negative film, namely a processing process including a plurality of steps of preprocessing a core plate, pressing a photosensitive film, exposing, developing, etching and removing the dry film, and a pattern is generally transferred to an original plate through the black film negative film during pattern exposure manufacturing. Although the common processing technology can meet certain production requirements, the common processing technology still has great defects. In the processing process, the width of the graphic circuit on the core board is easy to change and deviates from the original theoretical design value, so that the width of the circuit on the exposed board is greatly deviated from the original design value, and the circuit width after the circuit board is etched cannot meet the requirement and becomes a waste product.
Disclosure of Invention
The present invention is directed to overcome at least one of the deficiencies of the prior art, and to provide a method for processing a circuit board, which effectively improves the accuracy of the circuit width and reduces the influence of the side etching.
The technical scheme adopted by the invention is that the circuit board processing method comprises the following steps:
s1: preprocessing a core plate;
s2: pasting a DI dry film on the copper surface of the core plate;
s3: exposing and developing the DI dry film by adopting an LDI exposure machine to obtain a circuit image;
s4: preliminarily etching the copper surface of the core plate according to the circuit image;
s5: carrying out secondary etching on the copper surface of the core board according to the circuit image;
s6: removing the DI dry film;
in step S5, the second etching is performed by adding 4-6 kg/cm2Compressed gas and 2kg/cm after pressurization2Etching liquid medicine is stirred and mixed into atomized fine etching liquid drops, and then the atomized fine etching liquid drops are sprayed out, so that the copper surface of the core plate after primary etching is accurately etched.
In the traditional processing process of the inner layer of the circuit board, the optical drawing machine has 3 processes in the process of manufacturing a black film negative film: photo-drawing, developing and drying. The optical drawing machine is influenced by the resolution when the black film negative film is used for engraving the line image, the lower the resolution is, the higher the line precision is, and otherwise, the worse the line precision is; the line deviation of the circuit on the black film negative film in the engraving step is 0.2 mil. In the developing step, the negative film is subjected to special developing solution and fixing solution to clean the circuit image, the circuit deviation is 0.2mil, and the drying step is only to blow dry the negative film, so that the circuit image is not influenced. Therefore, the image precision on the negative film will have + -0.2 mil deviation in the photo-drawing and developing process.
And this application adopts DI exposure machine, can cancel to use the black film, and uses the laser beam direct exposure formation of image of DMD head on the board, has eliminated the image deviation that the film brought. Compared with the traditional UV exposure machine which uses UV exposure lamps to irradiate the board surface comprehensively, the scattered UV rays reach the copper surface and further generate diffuse reflection, so that an exposure circuit becomes large; its laser beam of DI exposure machine that this application adopted concentrates and arrives the face, and exposure circuit image accuracy is high.
Before the circuit is manufactured, according to the application, a special DI dry film is firstly pasted on a core plate, and then a DI exposure machine is used for exposure to manufacture a circuit pattern; the circuit pattern precision deviation of the black film negative film during photoplotting and developing manufacturing can be eliminated through the matching of the DI dry film and the DI exposure machine; meanwhile, the problem of increased deviation of a circuit caused by diffuse reflection of the circuit to form a pattern circuit when a scattering light source reaches a copper surface in the exposure process of a traditional UV exposure machine can be effectively solved.
This application adopts etching twice, and preliminary etching is traditional etching mode, can etch out circuit image probably, but, because the accuracy of this etching is not high, leads to the linewidth and the actual linewidth of circuit image to deviate from a bit, and preliminary etching's circuit is peripheral still to etch not to the metal copper of position, influences the performance of circuit board, and the basis is still connected with the metal copper of another circuit to probably, finally leads to the circuit board directly to scrap probably.
Aiming at the problem of large line width deviation caused by poor primary etching accuracy, the invention adopts micro-molecular etching to carry out secondary etching; specifically, the etching liquid medicine is atomized into fine liquid drops through high-pressure gas, and then the fine liquid drops are sprayed to the part which is not etched in place during primary etching to be etched, so that a line image with small line width deviation is obtained. According to the invention, the etching liquid medicine is atomized into fine liquid drops and then is sprayed out at a higher speed, so that the etching of a line with a small gap is facilitated, and the effect of accurate etching is achieved.
According to the invention, firstly, a relatively accurate circuit image is obtained through the matching of the DI dry film and the LDI exposure machine, an approximate circuit is obtained through primary etching, and then the circuit with insufficient primary etching or small gap is accurately etched through secondary micro-molecular etching, so that the circuit accuracy on the circuit board is high, and the yield of the circuit board is greatly improved.
Specifically, the micro-molecular etching nozzle is used for compressing gas to atomize etching liquid medicine into fine etching liquid medicine droplets, the micro-molecular etching nozzle comprises a first inlet, a second inlet, a mixing cavity and a spraying port, the first inlet is used for inputting compressed gas, the second inlet is used for inputting etching liquid medicine, the mixing cavity is used for mixing the compressed gas and the etching liquid medicine which are respectively fed from the first inlet and the second inlet, and the spraying port is used for outputting the gas atomized etching liquid medicine formed after mixing. The micro molecular etcher was purchased from aerospace Circuit Board Equipment, Inc. of Dongguan, model number 19DES35DNAA 09.
Preferably, the DI dry film is a dry film of hunter HD233L DI in hunan. 1.2mil in thickness, and primarily absorbs 365nm UV energy at a wavelength to initiate polymerization of the monomers, the composition comprising: the outermost layer is a PE film, the middle layer is a corrosion resistant film (composed of acrylic resin, a light curing agent monomer and a photoinitiator), and the innermost layer is a PET film.
Further, in step S1, the specific steps include: the core plate is pretreated, including removing impurities on the copper surface of the core plate, and is oxidized and washed; then carrying out micro-etching and water washing; and finally, carrying out acid washing, water washing and drying. The micro-etching can coarsen the copper surface to increase the roughness, which is beneficial to the adhesion of a film, and the acid washing can remove the oxidation.
Further, in step S2, the specific steps include: heating the DI dry film to 100-14 deg.C by a film sticking machine0oC, pasting the core plate on the copper surface of the core plate at a pasting speed of 2.0-2.8m/min and a pasting pressure of 4-6 kg/cm2。
Further, in step S3, the line image is exposed by a DI exposure machine with 6 to 8 exposure scales. Specifically, the LDI exposure process: upper plate-shifting initial positioning-LDI table surface alignment-exposure-shifting-lower plate. The exposure energy is 10 mj-120 mj, and the tolerance of contraposition is 50 um.
Further, in step S4, the specific steps include: the preliminary etching is divided into three times, the first etching develops the exposed copper surface, the second etching of the residual copper, the third etching of the residual copper on the substrate, only the residual DI dry film covers the circuit, and the circuit is basically molded.
Further, in step S6, the specific steps include: spraying sodium hydroxide liquid medicine on the surface of the DI dry film to enable the dry film to expand and soften; soaking the DI dry film in a sodium hydroxide liquid medicine, and stripping the DI dry film from the copper surface after the DI dry film is cracked; and continuously removing the residual glue stain on the copper surface by using a sodium hydroxide liquid medicine.
Further, the method also comprises the following steps:
s7: and (3) line width testing: the width of the bottom of the line was measured using a 100 times magnifier.
S8: and (6) AOI inspection.
Specifically, the line width testing process is as follows: taking a board, placing the board to be measured on a machine, inquiring MI requirements and measuring position diagrams, measuring specific positions, and judging whether the result meets the MI requirements or not; the AOI inspection process is as follows: the method comprises the steps of removing dust from a board to be detected, loading the board to a host, scanning and adjusting the machine, handwriting board edge tracing numbers, loading the board to an extension, passing the machine for verification, repairing defects and loading the board.
A circuit board prepared by the circuit board processing method is provided.
Compared with the prior art, the invention has the beneficial effects that: the special DI dry film is used when the dry film is pasted on the core plate, the line pattern exposure is carried out by matching with an LDI exposure machine to control the pattern precision, the etching pulling micro-molecular process is utilized to eliminate the side etching of the line edge, and the line width deviation risk after etching is reduced. Through the combination of a plurality of steps, the problem that the width of a circuit in the same layer is extremely poor in a circuit board is solved, and the line width precision after etching can be obviously improved, so that a finished product meets the original design requirement, and the corresponding function of the circuit board is realized.
Drawings
FIG. 1 is a prior art process flow
FIG. 2 shows the processing flow of example 1 of the present invention.
Detailed Description
The examples of the present invention are provided for illustrative purposes only and are not to be construed as limiting the invention.
Example 1
As shown in fig. 2, a method for processing a circuit board includes the following steps:
s1, removing impurities on the copper surface of the core plate, and oxidizing and washing; then carrying out micro-etching and water washing; finally, carrying out acid washing, water washing and drying;
s2, pasting a DI dry film on the copper surface of the core plate: heating HD233L DI dry film to 120 deg.C by film sticking machine, and sticking on the copper surface of the core board at sticking speed of 2.8m/min and sticking pressure of 5kg/cm2；
S3, adjusting the energy of 7 grids of the 21-level exposure ruler to expose and develop the DI dry film by adopting an LDI exposure machine to obtain a circuit image;
s4 adopts a cosmic vacuum etching machine (19 DES35DNAA 09), the speed is 5.2m/min, and the spraying pressure is 1.8kg/cm2At a downward pressure of 1.3kg/cm2The temperature is 50.2 ℃, the concentration of copper ions is 142g/L, and the acidity is 1.52N;
s5 adopts a cosmic vacuum etching machine (19 DES35DNAA 09), the speed is 5.2m/min, and the spraying pressure is 2.0kg/cm2At a downward pressure of 2.0kg/cm2The inlet pressure of the compressed air is 4kg/cm2；
S6 adopts 3% sodium hydroxide solution, speed is 4.0m/min, and spray pressure is 2.0kg/cm2At a downward pressure of 1.7kg/cm2The temperature is 50.2 ℃;
s7 linewidth test: the bottom of the line was measured using Vision Gauge 200X;
s8 AOI inspection.
This implementationExample compressed gas was 4kg/cm2The amount of the pressurized etching solution was 2kg/cm2。
Example 2
The compressed gas in this example was 4.5 kg/cm2The amount of the pressurized etching solution was 2kg/cm2。
Example 3
The compressed gas in this example was 6kg/cm2The amount of the pressurized etching solution was 2kg/cm2。
Comparative example 1
This comparative example is different from example 1 in that it does not employ the secondary etching, and is otherwise the same as example 1.
Comparative example 2
This comparative example is different from example 1 in that the compressed gas of this comparative example was 3kg/cm2The amount of the pressurized etching solution was 2kg/cm2。
Comparative example 3
This comparative example is different from example 1 in that the compressed gas of this comparative example was 4kg/cm2The amount of the pressurized etching solution was 3kg/cm2。
Comparative example 4
This comparative example differs from example 3 in that the compressed gas of this comparative example was 7kg/cm2The amount of the pressurized etching solution was 2kg/cm2。
Comparative example 5
This comparative example differs from example 3 in that the compressed gas of this comparative example was 6kg/cm2The amount of the pressurized etching solution is 1kg/cm2。
The technical schemes of the embodiments 1-3 and the comparative examples 1-5 are respectively adopted to process the circuit board, and the line width deviation value of the processed circuit board is tested. By processing the circuit boards by adopting the different methods, the line width deviation value of each circuit board is as follows: example 1< example 2< example 3< comparative example 2< comparative example 3< comparative example 4< comparative example 5< comparative example 1. In the embodiments 1 to 3, secondary etching, namely micro-molecular etching is adopted, and the atomization effect of the liquid medicine is better and accurate etching can be carried out by controlling the pressure of gas and etching liquid medicine; among them, the liquid medicine of example 1 had the best atomization effect, and the line width deviation from the corresponding wiring board was the smallest. Obviously, comparative example 1 does not adopt the secondary etching, and the linewidth deviation is the biggest, and comparative examples 2~5, though adopted the secondary etching, the pressure control of gas and etching liquid medicine is improper, leads to the liquid medicine that jets out either granule too big, or the flow is too big, perhaps spouts the pressure inadequately again, all can influence the effect of etching.
Specifically, the wiring boards were processed using the methods of example 1 and comparative example 1 to obtain 25 sets of experimental data as follows:
table 1 line width tolerance comparison of example 1 and comparative example 1
Serial number Example 1 (opening micro molecular etching um) Comparative example 1 (off micro molecular etching um)
1 50.17 51.10
2 52.08 49.17
3 51.10 47.35
4 50.23 52.95
5 48.32 49.25
6 50.23 54.77
7 51.10 51.98
8 50.13 50.17
9 50.17 54.86
10 49.25 54.81
11 49.20 48.68
12 51.10 52.62
13 50.23 49.87
14 50.23 52.62
15 50.17 52.62
16 50.23 56.15
17 49.20 55.02
18 49.39 50.64
19 50.17 53.84
20 48.28 53.93
21 50.31 53.93
22 50.23 49.25
23 48.25 50.10
24 50.13 48.24
25 49.20 49.18
max 52.08 56.15
min 48.25 47.35
Range 3.83 8.81
From the above, the line width tolerance of the opened micro-molecular etching is 4.98um smaller than that of the closed micro-molecular etching, and exceeds the control tolerance requirement of 5um, namely, the line width deviation is smaller when the micro-molecular etching is adopted in the method for processing the circuit board compared with the method without the micro-molecular etching.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.

Claims (8)

1. A circuit board processing method is characterized by comprising the following steps:
s1: preprocessing a core plate;
s2: pasting a DI dry film on the copper surface of the core plate;
s3: exposing and developing the DI dry film by adopting an LDI exposure machine to obtain a circuit image;
s4: preliminarily etching the copper surface of the core plate according to the circuit image;
s5: carrying out secondary etching on the copper surface of the core board according to the circuit image;
s6: removing the DI dry film;
in step S5, the second etching is performed by adding 4-6 kg/cm2Compressed gas and 2kg/cm after pressurization2Etching liquid medicine is stirred and mixed into atomized fine etching liquid drops, and then the atomized fine etching liquid drops are sprayed out, so that the copper surface of the core plate after primary etching is accurately etched.
2. The method of claim 1, wherein in step S1, the core board is pretreated by removing impurities on the copper surface of the core board, and is oxidized and washed with water; then carrying out micro-etching and water washing; and finally, carrying out acid washing, water washing and drying.
3. The method for processing a circuit board according to claim 1, wherein in the step S2, the specific steps are as follows: heating the DI dry film to 100-140 deg.C by a film sticking machineoC, pasting the core plate on the copper surface of the core plate at a pasting speed of 2.0-2.8m/min and a pasting pressure of 4-6 kg/cm2。
4. The method of claim 1, wherein in step S3, the exposure of the circuit image is performed by a DI exposure machine with 6-8 grids of exposure rule.
5. The method as claimed in claim 1, wherein in step S4, the preliminary etching is divided into three steps, the first etching develops the exposed copper surface, the second etching the residual copper, and the third etching the residual copper on the substrate to leave only DI dry film covering the circuit, so that the circuit is substantially formed.
6. The method for processing a circuit board according to claim 1, wherein in the step S6, the specific steps are as follows: spraying sodium hydroxide liquid medicine on the surface of the DI dry film to enable the dry film to expand and soften; soaking the DI dry film in a sodium hydroxide liquid medicine, and stripping the DI dry film from the copper surface after the DI dry film is cracked; and continuously removing the residual glue stain on the copper surface by using a sodium hydroxide liquid medicine.
7. The circuit board processing method according to claim 1, further comprising the steps of:
s7: and (3) line width testing: measuring the width of the bottom of the line by adopting a magnifying lens of 100 times;
s8: and (6) AOI inspection.
8. A circuit board produced by the circuit board processing method according to any one of claims 1 to 7.
CN202210035857.1A 2022-01-13 2022-01-13 Circuit board and processing method thereof Pending CN114051326A (en)

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277281A (en) * 1989-04-18 1990-11-13 Fuji Kiko:Kk Etching method for printed board and device therefor
CN103188879A (en) * 2011-12-29 2013-07-03 深圳玛斯兰电路科技实业发展有限公司 Preparation method of inner layer of thick copper thin circuit board of printed circuit board
CN204761845U (en) * 2015-07-07 2015-11-11 深圳市翔宇电路有限公司 Can improve PCB board etching machine of etching homogeneity
CN105357892A (en) * 2015-10-29 2016-02-24 广州兴森快捷电路科技有限公司 Printed circuit board and making method thereof
CN106255325A (en) * 2016-08-24 2016-12-21 山东蓝色电子科技有限公司 A kind of special-shaped compensation method of the circuit pads considering etching factor
CN206212446U (en) * 2016-09-22 2017-05-31 宇宙电路板设备(深圳)有限公司 A kind of Etaching device
CN106973515A (en) * 2017-03-31 2017-07-21 江门崇达电路技术有限公司 A kind of processing method unnet for circuit board etching
CN108289381A (en) * 2018-01-11 2018-07-17 昆山华晨电子有限公司 A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer
CN110035619A (en) * 2019-04-22 2019-07-19 健鼎（湖北）电子有限公司 A kind of internal layer dry film production method
CN110446363A (en) * 2019-08-13 2019-11-12 广东达源设备科技有限公司 A kind of circuit board etching method and wiring board
CN110719697A (en) * 2019-10-28 2020-01-21 深圳市兴森快捷电路科技股份有限公司 PCB etching uniformity detection and adjustment method
TWI708537B (en) * 2019-08-26 2020-10-21 健鼎科技股份有限公司 Method for producing circuit patterns

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277281A (en) * 1989-04-18 1990-11-13 Fuji Kiko:Kk Etching method for printed board and device therefor
CN103188879A (en) * 2011-12-29 2013-07-03 深圳玛斯兰电路科技实业发展有限公司 Preparation method of inner layer of thick copper thin circuit board of printed circuit board
CN204761845U (en) * 2015-07-07 2015-11-11 深圳市翔宇电路有限公司 Can improve PCB board etching machine of etching homogeneity
CN105357892A (en) * 2015-10-29 2016-02-24 广州兴森快捷电路科技有限公司 Printed circuit board and making method thereof
CN106255325A (en) * 2016-08-24 2016-12-21 山东蓝色电子科技有限公司 A kind of special-shaped compensation method of the circuit pads considering etching factor
CN206212446U (en) * 2016-09-22 2017-05-31 宇宙电路板设备(深圳)有限公司 A kind of Etaching device
CN106973515A (en) * 2017-03-31 2017-07-21 江门崇达电路技术有限公司 A kind of processing method unnet for circuit board etching
CN108289381A (en) * 2018-01-11 2018-07-17 昆山华晨电子有限公司 A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer
CN110035619A (en) * 2019-04-22 2019-07-19 健鼎（湖北）电子有限公司 A kind of internal layer dry film production method
CN110446363A (en) * 2019-08-13 2019-11-12 广东达源设备科技有限公司 A kind of circuit board etching method and wiring board
TWI708537B (en) * 2019-08-26 2020-10-21 健鼎科技股份有限公司 Method for producing circuit patterns
CN110719697A (en) * 2019-10-28 2020-01-21 深圳市兴森快捷电路科技股份有限公司 PCB etching uniformity detection and adjustment method

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