CN108289381A - A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer - Google Patents
A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer Download PDFInfo
- Publication number
- CN108289381A CN108289381A CN201810028381.2A CN201810028381A CN108289381A CN 108289381 A CN108289381 A CN 108289381A CN 201810028381 A CN201810028381 A CN 201810028381A CN 108289381 A CN108289381 A CN 108289381A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit
- etching
- etched
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production technologies of the fine and closely woven circuit board of multilayer comprising following steps：S1, the logicalnot circuit graphics field of circuit board surface is etched, etch depth is less than or equal to a quarter of the surface metal layer thickness of circuit board；S2, circuit board is cleaned；The circuit board is overturn, the another face-up of circuit board is made；S3, above-mentioned etching, cleaning and overturning step is repeated several times, until the surface metal-layer of the logicalnot circuit graphics field of circuit board surface is possible to determine when the sample has been completely etched removal, forms required line pattern.The present invention is using the technical solution repeatedly etched, each etch phase, etch depth is less than or equal to a quarter of the surface metal layer thickness of circuit board, through multiple etch phases, just ultimately form required line pattern, the final uniformity for improving etching on the whole reduces open circuit or short circuit and the underproof possibility of line width between fine and closely woven circuit, and then improves circuit board product impedance qualification rate as far as possible.
Description
Technical field
The present invention relates to a kind of production technology of the fine and closely woven circuit board of multilayer and circuit board processing systems.
Background technology
Application of the fine and closely woven circuit in circuit board product is more and more.When making fine and closely woven circuit, if the unevenness of etching
It is even, it may appear that corrosion is owed in the excessive erosion of circuit, causes open circuit or short circuit between fine and closely woven circuit, line width is unqualified, in turn results in
Circuit board product impedance is unqualified.
In conventional fine and closely woven circuit etching technique, to prevent the uneven of etching, generally use positive and negative etch process into
Row improves, or is improved using the inconsistent dynamic compensation scheme of different zones line build-out.
The low production efficiency of positive and negative etch process, it is troublesome in poeration；Moreover, when copper is thick relatively thin, positive and negative etch process
It possibly can not operate.Dynamic compensation scheme is then long in consuming time engineering production phase, and is susceptible to actual conditions and theory
The incongruent problem of situation and cause repeatedly to compensate；And when fine and closely woven circuit spacing is too small, dynamic compensation is probably due to circuit
Spacing is too small to be operated.Therefore a kind of production technology of the fine and closely woven circuit board of multilayer is researched and developed to ask as technology urgently to be resolved hurrily
Topic.
Invention content
The technical problem to be solved by the present invention is to overcome the defects of the prior art, provide a kind of fine and closely woven circuit board of multilayer
Production technology and circuit board processing system.
In order to solve the above technical problem, the present invention provides the following technical solutions：
One aspect of the present invention discloses a kind of production technology of the fine and closely woven circuit board of multilayer comprising following step
Suddenly：
S1, the logicalnot circuit graphics field of circuit board surface is etched, etch depth is less than or equal to the table of circuit board
The a quarter of face metal layer thickness；
S2, circuit board is cleaned；The circuit board is overturn, the another face-up of circuit board is made；
S3, above-mentioned etching, cleaning and overturning step is repeated several times, until the logicalnot circuit graphics field of circuit board surface
Surface metal-layer is possible to determine when the sample has been completely etched removal, forms required line pattern.
Another aspect of the present invention discloses a kind of circuit board processing system comprising：At least four groups of etching section apparatus；
Wherein each group of etching section apparatus includes：
Etching groove equipment is used to be etched the logicalnot circuit graphics field of circuit board surface；
Cleaning equipment cleans the circuit board after etching groove setting etching；
Tipping arrangement, the circuit board cleaned for overturning cleaned equipment make the another face-up of circuit board.
Further, the depth that etching groove equipment is etched the logicalnot circuit graphics field of circuit board surface is less than or waits
In a quarter of the surface metal layer thickness of circuit board.
The advantageous effect that is reached of the present invention is：
The present invention is less than or equal to circuit board using the technical solution repeatedly etched, each etch phase, etch depth
The a quarter of surface metal layer thickness just ultimately forms required line pattern through multiple etch phases, in this way, due to
In each etch phase, etch depth very little, so that it may to reduce the inhomogeneities of etching, finally improve the uniform of etching on the whole
Property, open circuit or short circuit and the underproof possibility of line width between fine and closely woven circuit are reduced as far as possible, and then improve circuit board product
Impedance qualification rate.Also, due to being not necessarily to positive and negative facet etch, production efficiency is improved, production operation is simplified；Due to being not necessarily to dynamic
Compensation, has saved engineering Production Time；Especially, small-pitch in the thick relatively thin or circuit of copper, it solves as far as possible
It opens a way between fine and closely woven circuit or short circuit and line width is unqualified in turn results in the problems such as circuit board product impedance is unqualified.
Specific implementation mode
Hereinafter, preferred embodiments of the present invention will be described, it should be understood that preferred embodiment described herein is only used
In the description and interpretation present invention, it is not intended to limit the present invention.
A kind of production technology of the fine and closely woven circuit board of multilayer comprising following steps：
S1, the logicalnot circuit graphics field of circuit board surface is etched, etch depth is less than or equal to the table of circuit board
The a quarter of face metal layer thickness；
S2, circuit board is cleaned；The circuit board is overturn, the another face-up of circuit board is made；
S3, above-mentioned etching, cleaning and overturning step is repeated several times, until the logicalnot circuit graphics field of circuit board surface
Surface metal-layer is possible to determine when the sample has been completely etched removal, forms required line pattern.
A kind of circuit board processing system comprising：At least four groups of etching section apparatus；Wherein each group of etching section apparatus packet
It includes：
Etching groove equipment is used to be etched the logicalnot circuit graphics field of circuit board surface；
Cleaning equipment cleans the circuit board after etching groove setting etching；
Tipping arrangement, the circuit board cleaned for overturning cleaned equipment make the another face-up of circuit board.
Wherein, etching groove equipment is less than or equal to electricity to the depth that the logicalnot circuit graphics field of circuit board surface is etched
The a quarter of the surface metal layer thickness of road plate.
The present invention is less than or equal to circuit board using the technical solution repeatedly etched, each etch phase, etch depth
The a quarter of surface metal layer thickness just ultimately forms required line pattern through multiple etch phases, in this way, due to
In each etch phase, etch depth very little, so that it may to reduce the inhomogeneities of etching, finally improve the uniform of etching on the whole
Property, open circuit or short circuit and the underproof possibility of line width between fine and closely woven circuit are reduced as far as possible, and then improve circuit board product
Impedance qualification rate.Also, due to being not necessarily to positive and negative facet etch, production efficiency is improved, production operation is simplified；Due to being not necessarily to dynamic
Compensation, has saved engineering Production Time；Especially, small-pitch in the thick relatively thin or circuit of copper, it solves as far as possible
It opens a way between fine and closely woven circuit or short circuit and line width is unqualified in turn results in the problems such as circuit board product impedance is unqualified.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in the present invention's
Within protection domain.
Claims (3)
1. a kind of production technology of the fine and closely woven circuit board of multilayer, which is characterized in that include the following steps：
S1, the logicalnot circuit graphics field of circuit board surface is etched, etch depth is less than or equal to the surface gold of circuit board
Belong to a quarter of layer thickness；
S2, circuit board is cleaned；The circuit board is overturn, the another face-up of circuit board is made；
S3, above-mentioned etching, cleaning and overturning step is repeated several times, until the surface of the logicalnot circuit graphics field of circuit board surface
Metal layer is possible to determine when the sample has been completely etched removal, forms required line pattern.
2. a kind of circuit board processing system, which is characterized in that including：At least four groups of etching section apparatus；Wherein each group of etching section
Device includes：
Etching groove equipment is used to be etched the logicalnot circuit graphics field of circuit board surface；
Cleaning equipment cleans the circuit board after etching groove setting etching；
Tipping arrangement, the circuit board cleaned for overturning cleaned equipment make the another face-up of circuit board.
3. a kind of circuit board processing system according to claim 2, which is characterized in that etching groove equipment is to circuit board surface
The depth that is etched of logicalnot circuit graphics field be less than or equal to circuit board surface metal layer thickness a quarter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810028381.2A CN108289381A (en) | 2018-01-11 | 2018-01-11 | A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810028381.2A CN108289381A (en) | 2018-01-11 | 2018-01-11 | A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108289381A true CN108289381A (en) | 2018-07-17 |
Family
ID=62835103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810028381.2A Pending CN108289381A (en) | 2018-01-11 | 2018-01-11 | A kind of production technology and circuit board processing system of the fine and closely woven circuit board of multilayer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108289381A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051326A (en) * | 2022-01-13 | 2022-02-15 | 广州添利电子科技有限公司 | Circuit board and processing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101652A (en) * | 2014-05-22 | 2015-11-25 | 深南电路有限公司 | Fine line circuit board processing method and circuit board processing system |
| CN106206286A (en) * | 2015-05-29 | 2016-12-07 | 东京毅力科创株式会社 | Engraving method |
| CN106283055A (en) * | 2016-08-31 | 2017-01-04 | 河源西普电子有限公司 | A kind of engraving method of printed panel |
-
2018
- 2018-01-11 CN CN201810028381.2A patent/CN108289381A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101652A (en) * | 2014-05-22 | 2015-11-25 | 深南电路有限公司 | Fine line circuit board processing method and circuit board processing system |
| CN106206286A (en) * | 2015-05-29 | 2016-12-07 | 东京毅力科创株式会社 | Engraving method |
| CN106283055A (en) * | 2016-08-31 | 2017-01-04 | 河源西普电子有限公司 | A kind of engraving method of printed panel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051326A (en) * | 2022-01-13 | 2022-02-15 | 广州添利电子科技有限公司 | Circuit board and processing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180717 |