CN104640378A - Manufacturing method for improving holing yield of high-frequency circuit board - Google Patents
Manufacturing method for improving holing yield of high-frequency circuit board Download PDFInfo
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- CN104640378A CN104640378A CN201310548299.XA CN201310548299A CN104640378A CN 104640378 A CN104640378 A CN 104640378A CN 201310548299 A CN201310548299 A CN 201310548299A CN 104640378 A CN104640378 A CN 104640378A
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- high frequency
- plate
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method for improving the holing yield of a high-frequency circuit board. The method comprises a first step of manufacturing engineering and light painting materials, a second step of performing cutting, drilling and through hole plating, a third step of manufacturing a surface pattern, a fourth step of electroplating and etching, a fifth step of performing solder mask and surface solderability treatment, and a sixth step of forming. By adopting the method of the invention, a high-frequency circuit board product with high holing yield and high-precision lines can be manufactured, the product quality and working efficiency are effectively improved, and a high-frequency circuit board manufactured by the method has more stable performance.
Description
Technical field
The present invention relates to circuit board technology field, especially a kind of manufacture method improving high frequency plate hole yield.
Background technology
Along with electronic product is to the future development of miniaturization, digitlization, high frequency, high reliability, the application of high-frequency circuit board is more and more extensive.And high frequency plate is due to the particularity of sheet material, cause it very difficult when hole metallization is produced, traditional handicraft is produced the easy PTH that occurs and is done over again number of times too much, causes copper thickness ununiformity, etching difficulty, product to be difficult to debug even to cause scrap.
Summary of the invention
The invention provides a kind of manufacture method improving high frequency plate hole yield, it is high that it not only makes precision, and the disposable yield of holeization reaches 99.99%, effectively improves product quality and operating efficiency, and the stable performance of obtained high-frequency circuit board.
Present invention employs following technical scheme: a kind of manufacture method improving high frequency plate hole yield, it comprises the following steps: step one: carry out engineering, light paints data make: first carry out graphic designs to template, the figure designed is carried out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked, finally again with the egative film checked for female parent carries out diazo sheet copy, and the diazo sheet copied to be checked; Step 2: the making of sawing sheet, boring, hole metallization: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got at the minor face position dowel driving machine of compoboard, the compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then digital control hole drilling is carried out, the burr and the burr that have bored Kong Houzai effects on surface process, and check; The high frequency plate checked is carried out hole pre-treatment, and after sandblasting nog plate, bay carries out PTH, then carries out a copper facing, carries out cleaning, drying, inspection after plating is good; Step 3: the making of surfacial pattern: first polish-brush process is carried out to the surface of high frequency plate, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and compoboard are carried out figure contraposition, exposure; Finally adopt the sodium carbonate liquor of 0.9-1.1% to develop to the high frequency plate after exposure, and overhaul; Step 4: the making of plating, etching: pre-electroplating treatment is carried out on the high frequency plate surface completed by Graphic transitions, then electro-coppering thickening process and zinc-plated anti-etching process are carried out successively to patterned surface; Again by the high frequency plate surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the high frequency plate after etching, repaiies plate; Finally the anti-etching tin layers on the high frequency plate surfacial pattern checked is stripped; Step 5: anti-welding and surperficial solderability process: slight polish-brush process is carried out on high frequency plate surface, then the high frequency plate after polish-brush is placed in plasma machine and directly carries out anti-solder ink printing after process, be put into low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then by high frequency board to explosure good for contraposition, adopt the sodium carbonate liquor of 1.0-1.2% to develop to the high frequency plate after exposure, and overhaul; Carrying out hot setting process by carrying out anti-welding high frequency plate, spraying tin after then carrying out the pre-treatment of spray tin, completing after washing and dry and check; Step 6: shaping making: first adopt the shape fabricating of numerical control mill software to high frequency plate to programme, and simulation test is carried out to the external form path after programming, adopt CNC milling machine to carry out shaping making; Shaping complete after use jetting machine circuit board is cleaned, dry, check, obtain the high-frequency circuit board of high hole yield.
Resolution is adopted to be that the high precision laser drawing mechanism of 20240dpi makes black egative film in described step one; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet; When holing in described step 2, compoboard thickness is between 2-4PNL, getting out pin hole aperture in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the drill of 110 degree, the drilling hole amount of drill is less than 500 holes, uses the sand paper of more than 2000 orders to process the burr on high frequency plate surface after boring, burr; Kong Huaqian first uses analytical pure sulfuric acid to carry out process in immersion 5-10 minute to the hole wall of high frequency plate, then adopts sandblasting Plate grinder to carry out nog plate process; 500 object running roller scrubbers are adopted to carry out polish-brush process to the surface of high frequency plate in described step 3; 5KW exposure machine is used to carry out graph exposure; First acid deoiling is carried out, alligatoring after two-stage washing headed by the process of the pre-electroplating treatment in described step 4, then through two-stage washing, last pickling; 800 object running roller scrubbers are adopted to carry out slight polish-brush process to high frequency plate surface in described step 5; 7KW exposure machine is adopted to expose anti-welding figure; The hot setting of anti-postwelding adopts segmentation baking method to carry out; The CNC milling cutter that in described step 6, CNC milling machine adopts is two blade milling cutters.
The present invention has following beneficial effect: the present invention not only can produce the product of high hole yield and high accuracy circuit, effectively improves product quality and operating efficiency, and the stable performance of obtained high-frequency circuit board.
Embodiment
The present invention is a kind of manufacture method improving high frequency plate hole yield, and it comprises the following steps: step one adopts resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet; When holing in step 2, compoboard thickness is between 2-4PNL, getting out pin hole aperture in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the drill of 110 degree, the drilling hole amount of drill is less than 500 holes, uses the sand paper of more than 2000 orders to process the burr on high frequency plate surface after boring, burr; Kong Huaqian first uses analytical pure sulfuric acid to carry out process in immersion 5-10 minute to the hole wall of high frequency plate, then adopts sandblasting Plate grinder to carry out nog plate process; 500 object running roller scrubbers are adopted to carry out polish-brush process to the surface of compoboard in step 3; 5KW exposure machine is used to carry out graph exposure; First acid deoiling is carried out, alligatoring after two-stage washing headed by the process of the pre-electroplating treatment in step 4, then through two-stage washing, last pickling; 800 object running roller scrubbers are adopted to carry out slight polish-brush process to high frequency plate surface in step 5; 7KW exposure machine is adopted to expose anti-welding figure; The hot setting of anti-postwelding adopts segmentation baking method to carry out; The CNC milling cutter that in step 6, CNC milling machine adopts is two blade milling cutters.
Claims (7)
1. improve a manufacture method for high frequency plate hole yield, it comprises the following steps:
Step one: carry out engineering, light paints data make: first graphic designs is carried out to template, the figure designed is carried out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked, finally again with the egative film checked for female parent carries out diazo sheet copy, and the diazo sheet copied to be checked;
Step 2: the making of sawing sheet, boring, hole metallization: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got at the minor face position dowel driving machine of compoboard, the compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then digital control hole drilling is carried out, the burr and the burr that have bored Kong Houzai effects on surface process, and check; The compoboard checked is carried out hole pre-treatment, and then after sandblasting nog plate, bay carries out PTH, then carries out a copper facing, carries out cleaning, drying, inspection after plating is good;
Step 3: the making of surfacial pattern: first polish-brush process is carried out to the surface of high frequency plate, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and high frequency plate are carried out figure contraposition, exposure; Finally adopt the sodium carbonate liquor of 0.9-1.1% to develop to the high frequency plate after exposure, and overhaul;
Step 4: the making of plating, etching: pre-electroplating treatment is carried out on the high frequency plate surface completed by Graphic transitions, then electro-coppering thickening process and zinc-plated anti-etching process are carried out successively to patterned surface; Again by the high frequency plate surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the high frequency plate after etching, repaiies plate; Finally the anti-etching tin layers on the high frequency plate surfacial pattern checked is stripped;
Step 5: anti-welding and surperficial solderability process: slight polish-brush process is carried out on high frequency plate surface, then the high frequency plate after polish-brush is placed in plasma machine and directly carries out anti-solder ink printing after process, be put into low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then by high frequency board to explosure good for contraposition, adopt the sodium carbonate liquor of 1.0-1.2% to develop to the high frequency plate after exposure, and overhaul; Carrying out hot setting process by carrying out anti-welding high frequency plate, spraying tin after then carrying out the pre-treatment of spray tin, completing after washing and dry and check;
Step 6: shaping making: first adopt the shape fabricating of numerical control mill software to high frequency plate to programme, and simulation test is carried out to the external form path after programming, adopt CNC milling machine to carry out shaping making; Shaping complete after use jetting machine circuit board is cleaned, dry, check, obtain the high-frequency circuit board of high hole yield.
2. the manufacture method of high-frequency circuit board according to claim 1, is characterized in that adopting in described step one resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.
3. the manufacture method of high-frequency circuit board according to claim 1, when it is characterized in that holing in described step 2, compoboard thickness is between 2-4PNL, getting out pin hole aperture in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the drill of 110 degree, the drilling hole amount of drill is less than 500 holes, uses the sand paper of more than 2000 orders to process the burr on high frequency plate surface after boring, burr; Kong Huaqian first uses analytical pure sulfuric acid to carry out process in immersion 5-10 minute to the hole wall of high frequency plate, then adopts sandblasting Plate grinder to carry out nog plate process.
4. the manufacture method of high-frequency circuit board according to claim 1, is characterized in that adopting 500 object running roller scrubbers to carry out polish-brush process to the surface of compoboard in described step 3; 5KW exposure machine is used to carry out graph exposure.
5. the manufacture method of high-frequency circuit board according to claim 1, first carries out acid deoiling headed by the process that it is characterized in that the pre-electroplating treatment in described step 4, alligatoring after two-stage washing, then through two-stage washing, last pickling.
6. the manufacture method of high-frequency circuit board according to claim 1, is characterized in that adopting 800 object running roller scrubbers to carry out slight polish-brush process to compoboard surface in described step 5; 7KW exposure machine is adopted to expose anti-welding figure; The hot setting of anti-postwelding adopts segmentation baking method to carry out.
7. the manufacture method of high-frequency circuit board according to claim 1, is characterized in that the CNC milling cutter that in described step 6, CNC milling machine adopts is two blade milling cutters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548299.XA CN104640378A (en) | 2013-11-06 | 2013-11-06 | Manufacturing method for improving holing yield of high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548299.XA CN104640378A (en) | 2013-11-06 | 2013-11-06 | Manufacturing method for improving holing yield of high-frequency circuit board |
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| CN104640378A true CN104640378A (en) | 2015-05-20 |
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| CN201310548299.XA Pending CN104640378A (en) | 2013-11-06 | 2013-11-06 | Manufacturing method for improving holing yield of high-frequency circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517360A (en) * | 2015-12-18 | 2016-04-20 | 景旺电子科技(龙川)有限公司 | Method for improving flashes at bottom of copper base of copper-based copper-clad laminate in drilling |
| CN109195334A (en) * | 2018-10-16 | 2019-01-11 | 江苏迪飞达电子有限公司 | A kind of 5G communication manufacture craft of high frequency plate |
| CN110769618A (en) * | 2019-11-05 | 2020-02-07 | 东莞市科佳电路有限公司 | Method for plating copper in PCB hole |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
Citations (6)
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| DE3041551A1 (en) * | 1980-11-04 | 1982-06-09 | Siemens AG, 1000 Berlin und 8000 München | ELECTRODES FOR PLASMA EQUIPMENT |
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102281716A (en) * | 2011-05-31 | 2011-12-14 | 蔡新民 | Manufacturing method for high frequency super-thick circuit board |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
| CN102638937A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of copper-base printed wiring board |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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2013
- 2013-11-06 CN CN201310548299.XA patent/CN104640378A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3041551A1 (en) * | 1980-11-04 | 1982-06-09 | Siemens AG, 1000 Berlin und 8000 München | ELECTRODES FOR PLASMA EQUIPMENT |
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102281716A (en) * | 2011-05-31 | 2011-12-14 | 蔡新民 | Manufacturing method for high frequency super-thick circuit board |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
| CN102638937A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of copper-base printed wiring board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517360A (en) * | 2015-12-18 | 2016-04-20 | 景旺电子科技(龙川)有限公司 | Method for improving flashes at bottom of copper base of copper-based copper-clad laminate in drilling |
| CN105517360B (en) * | 2015-12-18 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | A method of improving copper-based copper-clad laminate and drills copper-based bottom peak |
| CN109195334A (en) * | 2018-10-16 | 2019-01-11 | 江苏迪飞达电子有限公司 | A kind of 5G communication manufacture craft of high frequency plate |
| CN110769618A (en) * | 2019-11-05 | 2020-02-07 | 东莞市科佳电路有限公司 | Method for plating copper in PCB hole |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
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