CN102159030A - Making method of high-frequency ultrathin circuit board - Google Patents
Making method of high-frequency ultrathin circuit board Download PDFInfo
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- CN102159030A CN102159030A CN 201110066584 CN201110066584A CN102159030A CN 102159030 A CN102159030 A CN 102159030A CN 201110066584 CN201110066584 CN 201110066584 CN 201110066584 A CN201110066584 A CN 201110066584A CN 102159030 A CN102159030 A CN 102159030A
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Abstract
The invention discloses a making method of a high-frequency ultrathin circuit board, which comprises the following steps of: 1, making engineering and optical drawing information; 2, cutting and drilling; 3, making surface patterns; 4, electroplating and etching; and 5, forming. The making method of the high-frequency ultrathin circuit board can be used for making the high-frequency ultrathin circuit board with high precision and effectively improving product quality and working efficiency; and the made high-frequency ultrathin circuit board has stable performance.
Description
Technical field
The present invention relates to the manufacture method of the ultra-thin circuit board of a kind of high frequency.
Background technology
Along with the direction of electronic product to miniaturization, digitlization, lightening, high frequencyization, high reliabilityization develops, the ultra-thin circuit board of high frequency is except having the good high-fire resistance of common high-frequency circuit board, high-cooling property, excellent size stability, have more high frequencyization, lightening, insulating medium layer has good intensity, pliability and anti-high puncture voltage.But the production method of the ultra-thin circuit board of high frequency is appointed manufacture method and the technology of so continuing to use the ultra-thin circuit board of ordinary epoxy resin at present, but the characteristic of the ultra-thin Teflon material of its incompatibility high frequency, the demand of incompatibility high-frequency microwave product.
Summary of the invention
The invention provides the manufacture method of the ultra-thin circuit board of a kind of high frequency, it not only makes the precision height, has effectively improved product quality and operating efficiency, and the stable performance of the ultra-thin circuit board of high frequency that makes.
The present invention has adopted following technical scheme: the manufacture method of the ultra-thin circuit board of a kind of high frequency, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first adopt template is carried out graphic designs, to design figure then and carry out the project file processing according to processing parameter, according to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the ultra-thin copper-clad plate of needed high frequency with electronic plate shearing machine; Form the ultra-thin compoboard of high frequency according to the ultra-thin plate of high frequency being carried out wrapper sheet then, get pin hole in the minor face position of the ultra-thin compoboard of high frequency; The ultra-thin compoboard of the high frequency of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, again the burr on the ultra-thin compoboard of high frequency surface and batch cutting edge of a knife or a sword are handled after the boring, check at last; Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of the ultra-thin compoboard of high frequency and handle, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and the ultra-thin compoboard of high frequency are carried out figure contraposition, exposure; Adopt the sodium carbonate liquor of 0.9-1.0% that the ultra-thin compoboard of high frequency after exposing is developed at last, the ultra-thin compoboard of high frequency after developing is overhauled; Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the ultra-thin compoboard of the high frequency surface that figure transfer is finished, again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Aluminium base surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the ultra-thin compoboard of the high frequency after the etching at last with unwanted partially-etched removal in the surfacial pattern then; Step 5: moulding is made: at first adopt numerical control to mill software the shape fabricating of the ultra-thin plate of high frequency is programmed, and simulation test is carried out in the profile path after the programming, simulate errorless back and adopt CNC milling machine to carry out the moulding making; Use cleaning machine to clean, dry, check after moulding is finished, obtain the ultra-thin circuit board of high frequency.
Adopting resolution in the described step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 200 times of magnifying glasses that egative film is checked, use 3KW exposure machine copy diazo sheet; Boring in the described step 2 is the boring of 3-4 sheet, the pin hole aperture that gets out in the minor face position of the ultra-thin compoboard of high frequency is 3.2mm, numerical control drilling machine adopts the brill cutter of 45 degree, the drilling hole amount that bores cutter is less than 1000 holes, and the boring back uses the above sand paper of 2000 orders that the ultra-thin compoboard of high frequency surface burr, batch cutting edge of a knife or a sword are handled; Adopt 800 purpose running roller polish-brush machines that polish-brush is carried out on the surface of the ultra-thin compoboard of high frequency in the described step 3 and handle, and need use rigid plate to carry out traction during nog plate, use the 5KW exposure machine to carry out graph exposure; Carry out acid deoiling headed by the process of the pre-electroplating treatment in the described step 4 earlier, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; When carrying out the moulding making in the described step 5, ultra-thin plate two-layer use aluminium flake is up and down reinforced.
The present invention has following beneficial effect: the present invention adopts the highest drilling hole amount that bores cutter to be controlled at below 1000 holes in manufacturing process, can effectively solve the aperture burr like this, hole wall is coarse and the generation of aperture displacement problem, improve and make precision, and the stable performance of circuit board.The present invention adopts rigid plate that ultra-thin plate is reinforced laggard line number control electric router in manufacturing process, and the generation that can effectively solve the ultra-thin panel edges burr phenomena of polytetrafluoroethylene guarantees that its milling edge is smooth.
Description of drawings
Fig. 1 is a process chart of the present invention
Embodiment
In Fig. 1, the present invention is the manufacture method of the ultra-thin circuit board of a kind of high frequency, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first adopt template is carried out graphic designs, to design figure then and carry out the project file processing according to processing parameter, according to working condition the file of handling well being carried out layout, adopts resolution then is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Use 200 times of magnifying glasses that egative film is checked to the egative film of completing again, last serves as that the maternal 3KW of use exposure machine copy diazo sheet carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked.Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the ultra-thin copper-clad plate of needed high frequency with electronic plate shearing machine; Form the ultra-thin compoboard of high frequency according to the ultra-thin plate of high frequency being carried out wrapper sheet then, get pin hole in the minor face position of the ultra-thin compoboard of high frequency, the pin hole aperture is 3.2mm; The ultra-thin compoboard of the high frequency of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, numerical control drilling machine adopts the brill cutter of 45 degree, the drilling hole amount that bores cutter is less than 1000 holes, carry out digital control hole drilling then, re-use the above sand paper of 2000 orders after the boring the ultra-thin compoboard of high frequency surface burr, batch cutting edge of a knife or a sword are handled, check at last.Step 3: the making of surfacial pattern: at first adopt 800 purpose running roller polish-brush machines that polish-brush is carried out on the surface of the ultra-thin compoboard of high frequency and handle, and need use rigid plate to carry out traction during nog plate, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and the ultra-thin compoboard of high frequency are carried out the figure contraposition, use the 5KW exposure machine to carry out the graph exposure exposure; Adopt the sodium carbonate liquor of 0.9-1.0% that the ultra-thin compoboard of high frequency after exposing is developed at last, the ultra-thin compoboard of high frequency after developing is overhauled.Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the ultra-thin compoboard of the high frequency surface that figure transfer is finished, carries out acid deoiling earlier headed by the process of pre-electroplating treatment, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; Again patterned surface is carried out electro-coppering thickening processing and gold-plated successively; Aluminium base surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the ultra-thin compoboard of the high frequency after the etching at last with unwanted partially-etched removal in the surfacial pattern then; Step 5: moulding is made: at first adopt numerical control to mill software the shape fabricating of the ultra-thin plate of high frequency is programmed, and to the programming after the profile path carry out simulation test, simulating errorless back adopts CNC milling machine to carry out the moulding making, when carrying out the moulding making, ultra-thin plate two-layer use aluminium flake is up and down reinforced; Use cleaning machine to clean, dry, check after moulding is finished, obtain the ultra-thin circuit board of high frequency.
Claims (6)
1. the manufacture method of the ultra-thin circuit board of high frequency, it may further comprise the steps:
Step 1: carry out engineering, light is painted data make: at first adopt template is carried out graphic designs, to design figure then and carry out the project file processing according to processing parameter, according to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked;
Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the ultra-thin copper-clad plate of needed high frequency with electronic plate shearing machine; Form the ultra-thin compoboard of high frequency according to the ultra-thin plate of high frequency being carried out wrapper sheet then, get pin hole in the minor face position of the ultra-thin compoboard of high frequency; The ultra-thin compoboard of the high frequency of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, again the burr on the ultra-thin compoboard of high frequency surface and batch cutting edge of a knife or a sword are handled after the boring, check at last;
Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of the ultra-thin compoboard of high frequency and handle, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and the ultra-thin compoboard of high frequency are carried out figure contraposition, exposure; Adopt the sodium carbonate liquor of 0.9-1.0% that the ultra-thin compoboard of high frequency after exposing is developed at last, the ultra-thin compoboard of high frequency after developing is overhauled;
Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the ultra-thin compoboard of the high frequency surface that figure transfer is finished, again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Aluminium base surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the ultra-thin compoboard of the high frequency after the etching at last with unwanted partially-etched removal in the surfacial pattern then;
Step 5: moulding is made: at first adopt numerical control to mill software the shape fabricating of the ultra-thin plate of high frequency is programmed, and simulation test is carried out in the profile path after the programming, simulate errorless back and adopt CNC milling machine to carry out the moulding making; Use cleaning machine to clean, dry, check after moulding is finished, obtain the ultra-thin circuit board of high frequency.
2. the manufacture method of the ultra-thin circuit board of high frequency according to claim 1, it is characterized in that in the described step 1 adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 200 times of magnifying glasses that egative film is checked, use 3KW exposure machine copy diazo sheet.
3. the manufacture method of the ultra-thin circuit board of high frequency according to claim 1, it is characterized in that the boring in the described step 2 is the boring of 3-4 sheet, the pin hole aperture that gets out in the minor face position of the ultra-thin compoboard of high frequency is 3.2mm, numerical control drilling machine adopts the brill cutter of 45 degree, the drilling hole amount that bores cutter is less than 1000 holes, and the boring back uses the above sand paper of 2000 orders that the ultra-thin compoboard of high frequency surface burr, batch cutting edge of a knife or a sword are handled.
4. the manufacture method of the ultra-thin circuit board of high frequency according to claim 1, it is characterized in that adopting in the described step 3 800 purpose running roller polish-brush machines that polish-brush is carried out on the surface of the ultra-thin compoboard of high frequency handles, and need use rigid plate to carry out traction during nog plate, use the 5KW exposure machine to carry out graph exposure.
5. the manufacture method of the ultra-thin circuit board of high frequency according to claim 1 is characterized in that carrying out acid deoiling earlier headed by the process of the pre-electroplating treatment in the described step 4, through two-stage washing back alligatoring, and again through the two-stage washing, last pickling.
6. the manufacture method of the ultra-thin plate of high frequency according to claim 1, when it is characterized in that carrying out in the described step 5 moulding making, ultra-thin plate two-layer use aluminium flake is up and down reinforced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201110066584 CN102159030A (en) | 2011-03-16 | 2011-03-16 | Making method of high-frequency ultrathin circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110066584 CN102159030A (en) | 2011-03-16 | 2011-03-16 | Making method of high-frequency ultrathin circuit board |
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| CN102159030A true CN102159030A (en) | 2011-08-17 |
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| CN 201110066584 Pending CN102159030A (en) | 2011-03-16 | 2011-03-16 | Making method of high-frequency ultrathin circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638936A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of LED (light-emitting diode) lighting type aluminum-based circuit board with super heat conduction and high voltage resistance |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
| CN102711379A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency microwave super-long circuit soft board |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
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| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN101902883A (en) * | 2010-07-16 | 2010-12-01 | 施吉连 | Method for manufacturing microwave high-frequency ceramic circuit board |
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2011
- 2011-03-16 CN CN 201110066584 patent/CN102159030A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN101902883A (en) * | 2010-07-16 | 2010-12-01 | 施吉连 | Method for manufacturing microwave high-frequency ceramic circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638936A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of LED (light-emitting diode) lighting type aluminum-based circuit board with super heat conduction and high voltage resistance |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
| CN102711379A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency microwave super-long circuit soft board |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
| CN103619124B (en) * | 2013-11-25 | 2016-06-29 | 广东依顿电子科技股份有限公司 | A kind of production method of wiring board thin plate |
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Application publication date: 20110817 |