CN104582293A - Manufacturing method of ceramic-based circuit board - Google Patents
Manufacturing method of ceramic-based circuit board Download PDFInfo
- Publication number
- CN104582293A CN104582293A CN201410795235.4A CN201410795235A CN104582293A CN 104582293 A CN104582293 A CN 104582293A CN 201410795235 A CN201410795235 A CN 201410795235A CN 104582293 A CN104582293 A CN 104582293A
- Authority
- CN
- China
- Prior art keywords
- compoboard
- carry out
- carried out
- circuit board
- ceramic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Abstract
The invention discloses a manufacturing method of a ceramic-based circuit board. The manufacturing method comprises the following steps: step 1, manufacturing a construction document and a flash plotted film; step 2, performing rough shape cutting, drilling and hole metallization; step 3, manufacturing a surface pattern; step 4, performing electroplating and etching; step 5, performing solder masking and surface weldability treatment; step 6, molding. The manufacturing method disclosed by the invention has the advantages of manufacturing the product with high precision, and effectively improving the product quality and the working efficiency; furthermore, the manufactured circuit board is stable in performance.
Description
Technical field
The present invention relates to a kind of making of circuit board, especially relate to a kind of ceramic base circuit board manufacturing method.
Background technology
High-frequency circuit board is the special circuit board that electromagnetic frequency is higher, and in general, high frequency may be defined as frequency at more than 1GHz.Its physical properties, precision, technical parameter require very high, are usually used in the fields such as car collision avoidance System, satellite system, radio system; Poor heat resistance, the poor radiation of common high-frequency circuit board, there is no enough stability, and not there is high frequency.
Summary of the invention
For overcoming the problems referred to above, the present invention adopts following technical scheme:
A kind of ceramic base circuit board manufacturing method, is characterized in that, comprising:
(1) project file, light are painted the film and are made: first carry out graphic designs to template, the figure designed is carried out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked;
(2) making of sawing sheet, boring, hole metallization: first with CNC milling machine by flow process list requirement size electric router go out produce required for the thick ceramic base copper-clad plate of 8.0mm, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got at the minor face position dowel driving machine of compoboard, the compoboard accomplishing fluently pin hole is fixed on CNC milling machine work top, then numerical control hole milling is carried out, burr and batch cutting edge of a knife or a sword of the complete Kong Houzai effects on surface of milling process, and check; After the compoboard checked is carried out hole process, after deburring nog plate, carry out PTH, then carry out a copper facing, after plating is good, carry out cleaning, drying, inspection;
(3) making of surfacial pattern: first polish-brush process is carried out to the surface of compoboard, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and compoboard are carried out figure contraposition, exposure; Finally adopt volume ratio be 0.9-1.2% sodium carbonate liquor the compoboard after exposure is developed, and to overhaul;
(4) making of electroplating, etching: pre-electroplating treatment is carried out on the compoboard surface completed by Graphic transitions, then electro-coppering thickening process and zinc-plated anti-etching process are carried out successively to patterned surface; Again by the compoboard surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the compoboard after etching, repaiies plate; Then by the anti-etching tin layers stripping on the compoboard surfacial pattern of passed examination;
(5) anti-welding, surperficial solderability process: slight polish-brush process is carried out on compoboard surface, then the compoboard after polish-brush is carried out anti-solder ink printing, be put into low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then by combination board to explosure good for contraposition, adopt volume ratio be 1.0-1.2% sodium carbonate liquor the compoboard after exposure is developed, and to overhaul; After carrying out anti-welding compoboard silk-screen character, carry out hot setting process, then carry out heavy tin process, complete after washing and dry and check;
(6) shaping making: first adopt the shape fabricating of numerical control mill software to compoboard to programme, and simulation test is carried out to the profile path after programming, adopt CNC milling machine to carry out shaping making; Shaping complete after use jetting machine circuit board is cleaned, dry, check, obtain the thick ceramic base printed wiring board of 8.0mm.
Resolution is adopted to be that the high precision laser drawing mechanism of 20240dpi makes black egative film in described step one; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.
When holing in described step 2, getting out pin hole aperture in the minor face position of compoboard is that then 3.2mm adopts two blade milling cutter hole millings with CNC milling machine, and the drilling hole amount of milling cutter is less than 200 holes, and during boring, each hole is divided and got into position four times; The sand paper of more than 2000 orders is used to process the burr on the compoboard surface after boring, batch cutting edge of a knife or a sword.
500 object running roller scrubbers are adopted to carry out polish-brush process to the surface of compoboard in described step 3; 5KW exposure machine is used to carry out graph exposure.
In described step 4 pre-electroplating treatment process headed by first carry out acid deoiling, through two-stage washing after alligatoring, then through two-stage washing, last pickling.
800 object running roller scrubbers are adopted to carry out slight polish-brush process to compoboard surface in described step 5; 7KW exposure machine is adopted to expose anti-welding figure; Then develop with the sodium carbonate liquor that volume ratio is 1.0-1.2%.
The CNC milling cutter that in described step 6, CNC milling machine adopts is two blade milling cutters, and for preventing plate bursting phenomenon, the electric router time-division, five millings put in place.
Advantage of the present invention is: not only can produce the high product of precision, effectively improve product quality and operating efficiency, and the stable performance of obtained circuit board.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Embodiment
As shown in Figure 1, a kind of ceramic base circuit board manufacturing method, comprise the following steps: step one: project file, light are painted the film and made: first carry out graphic designs to template, the figure designed is carried out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked.Step 2: the making of sawing sheet, boring, hole metallization: first with CNC milling machine by flow process list requirement size electric router go out produce required for the thick ceramic base copper-clad plate of 8.0mm, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got at the minor face position dowel driving machine of compoboard, the compoboard accomplishing fluently pin hole is fixed on CNC milling machine work top, then numerical control hole milling is carried out, burr and batch cutting edge of a knife or a sword of the complete Kong Houzai effects on surface of milling process, and check; After the compoboard checked is carried out hole process, after deburring nog plate, bay carries out PTH, then carries out a copper facing, carries out cleaning, drying, inspection after plating is good; Step 3: the making of surfacial pattern: first polish-brush process is carried out to the surface of compoboard, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and compoboard are carried out figure contraposition, exposure; Finally adopt volume ratio be 0.9-1.2% sodium carbonate liquor the compoboard after exposure is developed, and to overhaul; Step 4: the making of plating, etching: pre-electroplating treatment is carried out on the compoboard surface completed by Graphic transitions, then electro-coppering thickening process and zinc-plated anti-etching process are carried out successively to patterned surface; Again by the compoboard surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the compoboard after etching, repaiies plate; Then by the anti-etching tin layers stripping on the compoboard surfacial pattern of passed examination; Step 5: anti-welding and surperficial solderability process: slight polish-brush process is carried out on compoboard surface, then the compoboard after polish-brush is carried out anti-solder ink printing, be put into low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then by combination board to explosure good for contraposition, adopt volume ratio be 1.0-1.2% sodium carbonate liquor the compoboard after exposure is developed, and to overhaul; After carrying out anti-welding compoboard silk-screen character, carry out hot setting process, then carry out heavy tin process, complete after washing and dry and check; Step 6: shaping making: first adopt the shape fabricating of numerical control mill software to compoboard to programme, and simulation test is carried out to the profile path after programming, adopt CNC milling machine to carry out shaping making; Shaping complete after use jetting machine circuit board is cleaned, dry, check, obtain the thick ceramic base printed wiring board of 8.0mm.
Claims (7)
1. a ceramic base circuit board manufacturing method, is characterized in that, comprising:
(1) project file, light are painted the film and are made: first carry out graphic designs to template, the figure designed is carried out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked;
(2) making of sawing sheet, boring, hole metallization: first with CNC milling machine by flow process list requirement size electric router go out produce required for the thick ceramic base copper-clad plate of 8.0mm, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got at the minor face position dowel driving machine of compoboard, the compoboard accomplishing fluently pin hole is fixed on CNC milling machine work top, then numerical control hole milling is carried out, burr and batch cutting edge of a knife or a sword of the complete Kong Houzai effects on surface of milling process, and check; After the compoboard checked is carried out hole process, after deburring nog plate, carry out PTH, then carry out a copper facing, after plating is good, carry out cleaning, drying, inspection;
(3) making of surfacial pattern: first polish-brush process is carried out to the surface of compoboard, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and compoboard are carried out figure contraposition, exposure; Finally adopt volume ratio be 0.9-1.2% sodium carbonate liquor the compoboard after exposure is developed, and to overhaul;
(4) making of electroplating, etching: pre-electroplating treatment is carried out on the compoboard surface completed by Graphic transitions, then electro-coppering thickening process and zinc-plated anti-etching process are carried out successively to patterned surface; Again by the compoboard surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the compoboard after etching, repaiies plate; Then by the anti-etching tin layers stripping on the compoboard surfacial pattern of passed examination;
(5) anti-welding, surperficial solderability process: slight polish-brush process is carried out on compoboard surface, then the compoboard after polish-brush is carried out anti-solder ink printing, be put into low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then by combination board to explosure good for contraposition, adopt volume ratio be 1.0-1.2% sodium carbonate liquor the compoboard after exposure is developed, and to overhaul; After carrying out anti-welding compoboard silk-screen character, carry out hot setting process, then carry out heavy tin process, complete after washing and dry and check;
(6) shaping making: first adopt the shape fabricating of numerical control mill software to compoboard to programme, and simulation test is carried out to the profile path after programming, adopt CNC milling machine to carry out shaping making; Shaping complete after use jetting machine circuit board is cleaned, dry, check, obtain the thick ceramic base printed wiring board of 8.0mm.
2. a kind of ceramic base circuit board manufacturing method according to claim 1, is characterized in that adopting in described step one resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.
3. a kind of ceramic base circuit board manufacturing method according to claim 1, when it is characterized in that holing in described step 2, getting out pin hole aperture in the minor face position of compoboard is that then 3.2mm adopts two blade milling cutter hole millings with CNC milling machine, the drilling hole amount of milling cutter is less than 200 holes, and during boring, each hole is divided and got into position four times; The sand paper of more than 2000 orders is used to process the burr on the compoboard surface after boring, batch cutting edge of a knife or a sword.
4. a kind of ceramic base circuit board manufacturing method according to claim 1, is characterized in that adopting 500 object running roller scrubbers to carry out polish-brush process to the surface of compoboard in described step 3; 5KW exposure machine is used to carry out graph exposure.
5. a kind of ceramic base circuit board manufacturing method according to claim 1, it is characterized in that in described step 4 pre-electroplating treatment process headed by first carry out acid deoiling, through two-stage washing after alligatoring, then through two-stage washing, last pickling.
6. a kind of ceramic base circuit board manufacturing method according to claim 1, is characterized in that adopting 800 object running roller scrubbers to carry out slight polish-brush process to compoboard surface in described step 5; 7KW exposure machine is adopted to expose anti-welding figure; Then develop with the sodium carbonate liquor that volume ratio is 1.0-1.2%.
7. a kind of ceramic base circuit board manufacturing method according to claim 1, it is characterized in that the CNC milling cutter that in described step 6, CNC milling machine adopts is two blade milling cutters, for preventing plate bursting phenomenon, the electric router time-division, five millings put in place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410795235.4A CN104582293A (en) | 2014-12-19 | 2014-12-19 | Manufacturing method of ceramic-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410795235.4A CN104582293A (en) | 2014-12-19 | 2014-12-19 | Manufacturing method of ceramic-based circuit board |
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| Publication Number | Publication Date |
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| CN104582293A true CN104582293A (en) | 2015-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410795235.4A Pending CN104582293A (en) | 2014-12-19 | 2014-12-19 | Manufacturing method of ceramic-based circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851994A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of preparation method of high heat-conducting ceramic printed circuit board |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
| WO2018058761A1 (en) * | 2016-09-27 | 2018-04-05 | 惠州市金百泽电路科技有限公司 | Manufacturing method for 77 ghz high-precision radio frequency radar printed circuit board |
| CN108161253A (en) * | 2017-11-13 | 2018-06-15 | 上海申和热磁电子有限公司 | A kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil |
| CN114423173A (en) * | 2021-12-13 | 2022-04-29 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066889A (en) * | 1998-09-22 | 2000-05-23 | International Business Machines Corporation | Methods of selectively filling apertures |
| CN102638937A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of copper-base printed wiring board |
-
2014
- 2014-12-19 CN CN201410795235.4A patent/CN104582293A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066889A (en) * | 1998-09-22 | 2000-05-23 | International Business Machines Corporation | Methods of selectively filling apertures |
| CN102638937A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of copper-base printed wiring board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018058761A1 (en) * | 2016-09-27 | 2018-04-05 | 惠州市金百泽电路科技有限公司 | Manufacturing method for 77 ghz high-precision radio frequency radar printed circuit board |
| CN106851994A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of preparation method of high heat-conducting ceramic printed circuit board |
| CN108161253A (en) * | 2017-11-13 | 2018-06-15 | 上海申和热磁电子有限公司 | A kind of method of trepanning on double-sided copper-clad ceramic substrate single side copper foil |
| CN108161253B (en) * | 2017-11-13 | 2019-10-15 | 上海申和热磁电子有限公司 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
| CN107817774B (en) * | 2017-11-21 | 2019-12-17 | 吉安市满坤科技有限公司 | intelligent manufacturing process of printed circuit board |
| CN114423173A (en) * | 2021-12-13 | 2022-04-29 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
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Application publication date: 20150429 |
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