CN102917546A - Method for manufacturing polytetrafluoroethylene high-frequency circuit board - Google Patents
Method for manufacturing polytetrafluoroethylene high-frequency circuit board Download PDFInfo
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- CN102917546A CN102917546A CN2012104002670A CN201210400267A CN102917546A CN 102917546 A CN102917546 A CN 102917546A CN 2012104002670 A CN2012104002670 A CN 2012104002670A CN 201210400267 A CN201210400267 A CN 201210400267A CN 102917546 A CN102917546 A CN 102917546A
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Abstract
The invention discloses a method for manufacturing a polytetrafluoroethylene high-frequency circuit board. The method comprises the following steps of: 1, manufacturing engineering and light painting materials; 2, cutting the materials, drilling holes and metalizing the holes; 3, making surface patterns; 4, electroplating and etching; 5, carrying out solder mask and surface solderability treatment; and 6, molding. The method for manufacturing the polytetrafluoroethylene high-frequency circuit board, provided by the invention, has the advantages that not only is the manufacturing precision high and are product quality and working efficiency improved effectively, but also the manufactured high-frequency circuit board is stable in performance.
Description
Technical field
The present invention relates to a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board.
Background technology
High-frequency circuit board has more high frequency except the dimensional stability that has the good high-fire resistance of ordinary circuit board, high-cooling property, excellence, insulating medium layer has good intensity, pliability.Along with the future development of electronic product to miniaturization, digitlization, high frequency, high reliability, the wiring density of HF link plate also day by day increases, and is solder shorts and the compressive resistance of avoiding adjacent lines, and anti-welding making also is inexorable trend.And polytetrafluoroethylene circuit plate is because the particularity of material causes anti-welding disposable making difficulty; And disclosed polytetrafluoroethylene high frequency plate arranged anti-weldingly be made as twice anti-welding making, increased cost of manufacture and man-hour.For reducing cost, this department has developed a kind of anti-welding disposable manufacture method of polytetrafluoroethylene high frequency plate, thereby has reduced cost of manufacture and production progress and quality through constantly experiment.
Summary of the invention
The invention provides a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board, it is high that it not only makes precision, Effective Raise product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
The present invention has adopted following technical scheme: a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, the figure that designs is carried out project file according to processing parameter to be processed, then according to working condition the file of handling well is carried out layout, makes the black egative film, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked, copy as female parent carries out diazo sheet take the egative film that checks again at last, and the diazo sheet that copies is checked; Step 2: the making of opening material, boring, hole metallization: at first leave by singly requirement size of flow process with electric plate shearer and produce needed Copper Clad Laminates Based On Polytetrafluoroethylene, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got with dowel driving machine in minor face position at compoboard, the compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, then carry out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, and checked; After checking that good compoboard carries out the hole processing, carry out PTH through inserting frame behind the deburring nog plate, then carry out a copper facing, carry out cleaning, drying, inspection after plating is good; Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and process, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopting at last volume ratio is that 0.9-1.2% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Step 4: plating, etched making: figure is shifted the compoboard surface of finishing carry out pre-electroplating treatment, again patterned surface is carried out the electro-coppering thickening successively and process and zinc-plated anti-etching processing; The resist ink stripping on the compoboard surface after will processing again, then the figure of foundation design checks, repaiies plate to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern; To check at last the anti-etching tin layer stripping on the good compoboard surfacial pattern; Step 5: anti-welding and surperficial solderability is processed: will overhaul good compoboard through acid deoiling, two-stage washing, microetch, two-stage washing, and directly carry out the anti-solder ink printing after then processing with pickling machine, and be put into the low temperature baking oven after being completed for printing to toast; Carry out contraposition according to location hole and figure, the combination board to explosure that contraposition is good then, adopting volume ratio is that 1.0-1.2% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Carry out hot setting and process carrying out anti-welding compoboard, then carry out dip-coating oxidation-resistant film after the anti-oxidant pre-treatment, finish the after washing oven dry and check; Step 6: moulding is made: at first adopt numerical control mill software that the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding and make; The use jetting machine cleaned, dries, checks circuit board after moulding was finished, and obtained the polytetrafluoroethylene high-frequency circuit board.
Adopting resolution in the described step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet; When holing in the described step 2, getting out the pin hole aperture in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the brill cutter of 110 degree, and the drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword on the compoboard surface after holing are processed; Adopting 500 purpose running roller scrubbers that polish-brush is carried out on the surface of compoboard in the described step 3 processes; Use the 5KW exposure machine to carry out graph exposure.
Carry out first acid deoiling headed by the process of the pre-electroplating treatment in the described step 4, through microetch after the two-stage washing, again through the two-stage washing, last pickling; Adopt acid deoiling, washing, microetch, washing in the described step 5, and with pickling machine the welding resistance pre-treatment is carried out on the compoboard surface; Adopt the 7KW exposure machine that anti-welding figure is exposed; The hot setting of anti-postwelding adopts four sections roasting modes to carry out; The CNC milling cutter that CNC milling machine adopts in the described step 6 is two blade milling cutters.
The present invention has following beneficial effect: the present invention not only can produce the high product of precision, Effective Raise product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
Description of drawings
Fig. 1 is process chart of the present invention.
Embodiment
In Fig. 1, the present invention is a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, the figure that designs is carried out project file according to processing parameter to be processed, then according to working condition the file of handling well being carried out layout, adopts resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked, copy as the maternal 5KW of use exposure machine carries out diazo sheet take the egative film that checks again at last, and the diazo sheet that copies is checked; Step 2: open material, boring, the making of hole metallization: at first leave by singly requirement size of flow process with electric plate shearer and produce needed Copper Clad Laminates Based On Polytetrafluoroethylene, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got with dowel driving machine in minor face position at compoboard, the pin hole aperture is 3.2mm, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 800 holes, the compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, then carry out digital control hole drilling, bored the burr and batch cutting edge of a knife or a sword that re-use the above sand paper effects on surface of 2000 orders behind the hole and processed, and checked; After checking that good compoboard carries out the hole processing, carry out PTH through inserting frame behind the deburring nog plate, then carry out a copper facing, carry out cleaning, drying, inspection after plating is good; Step 3: the making of surfacial pattern: at first adopt 500 purpose running roller scrubbers that polish-brush is carried out on the surface of compoboard and process, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out the figure contraposition, use the 5KW exposure machine to carry out graph exposure; Adopting at last volume ratio is that 0.9-1.2% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Step 4: plating, etched making: figure is shifted the compoboard surface of finishing carry out pre-electroplating treatment, carry out first acid deoiling headed by the process of pre-electroplating treatment, through microetch after the two-stage washing, again through the two-stage washing, last pickling is carried out successively the electro-coppering thickening to patterned surface again and is processed and zinc-plated anti-etching processing; The resist ink stripping on the compoboard surface after will processing again, then the figure of foundation design checks, repaiies plate to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern; To check at last the anti-etching tin layer stripping on the good compoboard surfacial pattern; Step 5: anti-welding and surperficial solderability is processed: will overhaul good compoboard through acid deoiling, two-stage washing, microetch, two-stage washing, then with pickling machine the welding resistance pre-treatment is carried out on the compoboard surface, directly carry out the anti-solder ink printing after the processing, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then compoboard that contraposition is good adopts the 7KW exposure machine that anti-welding figure is exposed, and adopting volume ratio is that 1.0-1.2% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Carry out hot setting and process carrying out anti-welding compoboard, hot setting adopts four sections roasting modes to carry out, and then carries out dip-coating oxidation-resistant film after the anti-oxidant pre-treatment, finishes the after washing oven dry and checks; Step 6: moulding is made: at first adopt numerical control mill software that the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding and make, the CNC milling cutter that CNC milling machine adopts is two blade milling cutters; The use jetting machine cleaned, dries, checks circuit board after moulding was finished, and obtained the polytetrafluoroethylene high-frequency circuit board.
Claims (7)
1. the manufacture method of a polytetrafluoroethylene high-frequency circuit board is characterized in that it may further comprise the steps:
Step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, the figure that designs is carried out project file according to processing parameter to be processed, then according to working condition the file of handling well is carried out layout, makes the black egative film, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked, copy as female parent carries out diazo sheet take the egative film that checks again at last, and the diazo sheet that copies is checked;
Step 2: the making of opening material, boring, hole metallization: at first leave by singly requirement size of flow process with electric plate shearer and produce needed Copper Clad Laminates Based On Polytetrafluoroethylene, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got with dowel driving machine in minor face position at compoboard, the compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, then carry out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, and checked; After checking that good compoboard carries out the hole processing, carry out PTH through inserting frame behind the deburring nog plate, then carry out a copper facing, carry out cleaning, drying, inspection after plating is good;
Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and process, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopting at last volume ratio is that 0.9-1.2% the sodium carbonate liquor compoboard after to exposure develops, and overhauls;
Step 4: plating, etched making: figure is shifted the compoboard surface of finishing carry out pre-electroplating treatment, again patterned surface is carried out the electro-coppering thickening successively and process and zinc-plated anti-etching processing; The resist ink stripping on the compoboard surface after will processing again, then the figure of foundation design checks, repaiies plate to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern; To check at last the anti-etching tin layer stripping on the good compoboard surfacial pattern;
Step 5: anti-welding and surperficial solderability is processed: will overhaul good compoboard through acid deoiling, two-stage washing, microetch, two-stage washing, and directly carry out the anti-solder ink printing after then processing with pickling machine, and be put into the low temperature baking oven after being completed for printing to toast; Carry out contraposition according to location hole and figure, the combination board to explosure that contraposition is good then, adopting volume ratio is that 1.0-1.2% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Carry out hot setting and process carrying out anti-welding compoboard, then carry out dip-coating oxidation-resistant film after the anti-oxidant pre-treatment, finish the after washing oven dry and check;
Step 6: moulding is made: at first adopt numerical control mill software that the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding and make; The use jetting machine cleaned, dries, checks circuit board after moulding was finished, and obtained the polytetrafluoroethylene high-frequency circuit board.
2. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1, it is characterized in that adopting in the described step 1 resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet.
3. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1, when it is characterized in that holing in the described step 2, getting out the pin hole aperture in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword on the compoboard surface after holing are processed.
4. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that adopting in the described step 3 500 purpose running roller scrubbers that polish-brush is carried out on the surface of compoboard and processes; Use the 5KW exposure machine to carry out graph exposure.
5. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that carrying out first acid deoiling headed by the process of the pre-electroplating treatment in the described step 4, through microetch after the two-stage washing, and again through the two-stage washing, last pickling.
6. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that adopting acid deoiling, washing, microetch, washing in the described step 5, and with pickling machine the welding resistance pre-treatment is carried out on the compoboard surface; Adopt the 7KW exposure machine that anti-welding figure is exposed; The hot setting of anti-postwelding adopts four sections roasting modes to carry out.
7. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that the CNC milling cutter that CNC milling machine adopts in the described step 6 is two blade milling cutters.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104002670A CN102917546A (en) | 2012-10-21 | 2012-10-21 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104002670A CN102917546A (en) | 2012-10-21 | 2012-10-21 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716985A (en) * | 2013-12-31 | 2014-04-09 | 张伯平 | Glass-based circuit board and manufacturing method thereof |
| CN103874332A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| WO2015006907A1 (en) * | 2013-07-15 | 2015-01-22 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency pcb |
| CN109195334A (en) * | 2018-10-16 | 2019-01-11 | 江苏迪飞达电子有限公司 | A kind of 5G communication manufacture craft of high frequency plate |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
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| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
| CN102638937A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of copper-base printed wiring board |
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- 2012-10-21 CN CN2012104002670A patent/CN102917546A/en active Pending
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| CN101677066A (en) * | 2008-09-19 | 2010-03-24 | 钰桥半导体股份有限公司 | Build-up circuit board manufacturing method |
| CN102137551A (en) * | 2011-03-16 | 2011-07-27 | 蔡新民 | Production method of high-frequency four-layer circuit board |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2015006907A1 (en) * | 2013-07-15 | 2015-01-22 | 深圳崇达多层线路板有限公司 | Resistance welding pretreatment process and preparation process of high-frequency pcb |
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| CN104737629B (en) * | 2013-07-15 | 2017-12-01 | 深圳崇达多层线路板有限公司 | Frequency PCB welding resistance pre-treating technology and its preparation technology |
| CN103716985A (en) * | 2013-12-31 | 2014-04-09 | 张伯平 | Glass-based circuit board and manufacturing method thereof |
| CN103716985B (en) * | 2013-12-31 | 2017-01-04 | 邢台市海纳电子科技有限责任公司 | A kind of glass base circuit board and manufacture method thereof |
| CN103874332A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| CN109195334A (en) * | 2018-10-16 | 2019-01-11 | 江苏迪飞达电子有限公司 | A kind of 5G communication manufacture craft of high frequency plate |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
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Application publication date: 20130206 |