CN102281716A

CN102281716A - Manufacturing method for high frequency super-thick circuit board

Info

Publication number: CN102281716A
Application number: CN2011101431260A
Authority: CN
Inventors: 蔡新民
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-05-31
Filing date: 2011-05-31
Publication date: 2011-12-14

Abstract

The present invention discloses a manufacturing method for a high frequency super-thick circuit board, comprising: making engineering and light printing data; board cutting and boring; making a surface pattern; electroplating and etching; and moulding. According to the manufacturing method, not only products with high precision are manufactured, effectively improving the product quality and the working efficiency; but also the manufactured high frequency circuit board has stable performance and effectively avoids the phenomenon of edge burr of the circuit board.

Description

The manufacture method of the super thick circuit board of a kind of high frequency

Technical field

The present invention relates to the manufacture method of the super thick circuit board of a kind of high frequency.

Background technology

Along with the direction of electronic product to miniaturization, digitlization, high frequencyization, high reliabilityization develops, high frequency metal base circuit board is except having the good high-fire resistance of common metal base circuit board, high-cooling property, excellent size stability, have more high frequencyization, insulating medium layer has good intensity, pliability and anti-high puncture voltage.

Summary of the invention

The invention provides the manufacture method of the super thick circuit board of a kind of high frequency, it not only makes the precision height, has effectively improved product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.

The present invention has adopted following technical scheme: the manufacture method of the super thick circuit board of a kind of high frequency, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, to design figure then and carry out the project file processing according to processing parameter, according to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the super thick copper-clad plate of needed 5.0mm high frequency with electronic plate shearing machine; After holding plate successfully, earlier plate gravity pressure with 0.2kg/cm2 under 180 ℃ of conditions was dried by the fire 2-4 hour, carry out wrapper sheet according to thickness of slab then and form compoboard, wrap the back and get pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, bored Kong Houzai the burr and batch cutting edge of a knife or a sword on surface are handled, check at last; Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopt the sodium carbonate liquor of 0.9-1.0% that the compoboard after exposing is developed at last, and overhaul; Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is finished, again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Plate surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; Step 5: moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding then and make; Use jetting machine to clean, dry, check after moulding is finished, obtain the super thick circuit board of the thick high frequency of 5.0mm at last.

Adopting resolution in the described step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, uses 100 times of magnifying glasses that egative film is checked, uses the 3KW exposure machine to copy diazo sheet; During boring in the described step 2 monolithic boring, get out the pin hole that the aperture is 3.5mm in the minor face position of compoboard, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword of the super thick circuit board surface of high frequency are handled; Adopting 800 purpose running roller polish-brush machines to carry out polish-brush in the described step 3 handles; Use the 5KW exposure machine to carry out graph exposure; Carry out acid deoiling headed by the process of the pre-electroplating treatment in the described step 4 earlier, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; The gold-plated ammoniacal liquor immersion treatment that retreats the preceding 1-3% of use of film; The CNC milling cutter of CNC milling machine is that drift angle is the milling cutter of 110 degree in the described step 5.

The present invention has following beneficial effect: the present invention not only can produce the high product of precision, has effectively improved product quality and operating efficiency, and the stable performance of the high-frequency circuit board that the makes generation that simultaneously can effectively solve the board edge burr phenomena.

Description of drawings

Fig. 1 is a process chart of the present invention

Embodiment

In Fig. 1, the manufacture method of the super thick circuit board of a kind of high frequency, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, to design figure then and carry out the project file processing according to processing parameter, according to working condition the file of handling well being carried out layout, adopts resolution then is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Re-use 100 times of magnifying glasses the egative film of completing is checked, last serves as that the maternal 3KW of use exposure machine carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked.Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the super thick copper-clad plate of needed 5.0mm high frequency with electronic plate shearing machine; After holding plate successfully, earlier plate gravity pressure with 0.2kg/cm2 under 180 ℃ of conditions was dried by the fire 2-4 hour, carry out wrapper sheet according to thickness of slab then and form compoboard, get pin-and-hole in the minor face position of compoboard after wrapping and directly be the pin hole of 3.5mm; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carry out digital control hole drilling then, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 800 holes, use the above sand paper of 2000 orders again the burr and batch cutting edge of a knife or a sword of the super thick circuit board surface of high frequency to be handled after having bored the hole, check at last.Step 3: the making of surfacial pattern: at first adopt 800 purpose running roller polish-brush machines that polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out the figure contraposition, use the 5KW exposure machine to carry out graph exposure; Adopt the sodium carbonate liquor of 0.9-1.0% that the compoboard after exposing is developed at last, and overhaul.Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is finished, again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Carry out acid deoiling headed by the process of pre-electroplating treatment earlier, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; The gold-plated ammoniacal liquor immersion treatment that retreats the preceding 1-3% of use of film; Plate surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then.Step 5: moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and to the programming after the profile path carry out simulation test, adopt CNC milling machine to carry out moulding then and make, the CNC milling cutter of CNC milling machine is that drift angle is the milling cutter of 110 degree; Use jetting machine to clean, dry, check after moulding is finished, obtain the super thick circuit board of the thick high frequency of 5.0mm at last.

Claims

1. the manufacture method of the super thick circuit board of high frequency, it may further comprise the steps:

Step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, to design figure then and carry out the project file processing according to processing parameter, according to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked;

Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the super thick copper-clad plate of needed 5.0mm high frequency with electronic plate shearing machine; After holding plate successfully, earlier plate gravity pressure with 0.2kg/cm2 under 180 ℃ of conditions was dried by the fire 2-4 hour, carry out wrapper sheet according to thickness of slab then and form compoboard, wrap the back and get pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, bored Kong Houzai the burr and batch cutting edge of a knife or a sword on surface are handled, check at last;

Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopt the sodium carbonate liquor of 0.9-1.0% that the compoboard after exposing is developed at last, and overhaul;

Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is finished, again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Plate surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then;

Step 5: moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding then and make; Use jetting machine to clean, dry, check after moulding is finished, obtain the super thick circuit board of the thick high frequency of 5.0mm at last.

2. the manufacture method of the super thick circuit board of a kind of high frequency according to claim 1, it is characterized in that in the described step 1 adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, use 100 times of magnifying glasses that egative film is checked, use 3KW exposure machine copy diazo sheet.

3. the manufacture method of ultra-long microwave high-frequency circuit board according to claim 1, when it is characterized in that the boring in the described step 2 monolithic boring, get out the pin hole that the aperture is 3.5mm in the minor face position of compoboard, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword of the super thick circuit board surface of high frequency are handled.

4. the manufacture method of the super thick circuit board of a kind of high frequency according to claim 1 is characterized in that adopting in the described step 3 800 purpose running roller polish-brush machines to carry out polish-brush and handles; Use the 5KW exposure machine to carry out graph exposure.

5. the manufacture method of the super thick circuit board of a kind of high frequency according to claim 1 is characterized in that carrying out acid deoiling earlier headed by the process of the pre-electroplating treatment in the described step 4, through two-stage washing back alligatoring, and again through the two-stage washing, last pickling; The gold-plated ammoniacal liquor immersion treatment that retreats the preceding 1-3% of use of film.

6. the manufacture method of the super thick circuit board of a kind of high frequency according to claim 1, the CNC milling cutter that it is characterized in that CNC milling machine in the described step 5 are that drift angle is the milling cutter of 110 degree.