CN103874333A - Manufacturing method of teflon high-frequency circuit board - Google Patents
Manufacturing method of teflon high-frequency circuit board Download PDFInfo
- Publication number
- CN103874333A CN103874333A CN201410114343.0A CN201410114343A CN103874333A CN 103874333 A CN103874333 A CN 103874333A CN 201410114343 A CN201410114343 A CN 201410114343A CN 103874333 A CN103874333 A CN 103874333A
- Authority
- CN
- China
- Prior art keywords
- copper
- wiring board
- circuit
- board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a manufacturing method of a teflon high-frequency circuit board. The method is characterized in that because traditional adhesive removing processes are replaced by the plasma cleaning process after the drilling process, the defects that holes are not provided with copper and the circuit board is disconnected can be effectively overcome, and the product yield is improved; because a double-edge milling cutter routing board is adopted in the forming process, quality defects like excessive flashes and burrs are effectively avoided, the number of milling cutters in use is reduced, and production cost is reduced; meanwhile, because phenolic resin cushion boards are arranged on the upper face of the circuit board and the lower face of the circuit board respectively in the drilling and routing processes, quality problems like board bending are reduced.
Description
[technical field]
The present invention relates to wiring board and make field, particularly relate to a kind of manufacture method of Teflon high-frequency circuit board.
[background technology]
At present, except in adhesive process, can use the harmful liquid such as organic solvent, volatility liquid medicine at the heavy copper cash of traditional wiring board, the glass fibre of copper-clad plate material is stung to erosion property stronger, be prone to resin cavity in hole, after heavy copper, occur Kong Wutong, will cause the quality defects such as wiring board open circuit; Be glass fiber net because Teflon plate construction is similar in addition, in moulding gong plate technique, disconnect as adopted plain cutter gong plate glass can be pulled out and being difficult for milling, cause occurring a large amount of quality defects such as cutting edges of a knife or a sword, burr of criticizing.
[summary of the invention]
The present invention seeks to have overcome the deficiencies in the prior art, the manufacture method of the Teflon high-frequency circuit board that a kind of production method is simple, conforming product rate is high is provided.
The present invention is achieved by the following technical solutions:
A manufacture method for Teflon high-frequency circuit board, its feature comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making instruction;
(3) plasma cleaning: impurity or greasy dirt on PCB surface and the hole inwall of the plasma removal step (2) producing with the high frequency voltage within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole;
(6) positive dry film develops: in the copper-clad plate obtaining after step (5) is processed, paste blue layer dry film, then paste exposure in the circuit board with the positive film, after exposure, on the positive film, the part of colourless printing opacity is unnecessary copper sheet, the part that black is in the light is circuit, through developing apparatus, the dry film on circuit is removed, after developing, exposed copper sheet is out desired circuit, and what under blue dry film, cover is copper unnecessary on wiring board;
(7) graphic plating: with electro-plating method thickening copper layer, then plate the protective layer of tin as this circuit on the exposed copper face of wiring board after completing steps (6);
(8) move back film: the blue dry film of step (6) is all returned, exposed unnecessary copper;
(9) alkali etching: step (8) wiring board after treatment is put into alkali etching liquid medicine, and the circuit copper layer that etching off is unnecessary, exposes circuit pack;
(10) move back tin: the tin plating through step (7) on circuit is all returned, obtained the line pattern being shaped;
(11) figure inspection: adopt scanner to open short circuit phenomenon inspection to circuit;
(12) anti-welding: the uniform welding resistance ink of local silk-screen one deck that does not need in the circuit board soldering of electronic components;
(13) wiring board divides plate: cut apart the connection between each production board in large plate with miniature carving cutter;
(14) moulding gong plate: adopt Double-edged milling cutter to go out finished product profile by customer requirement gong;
(15) subsequent handling: electric property and outward appearance that the described production board of detecting step (12) is each layer, on the solder side of described production board, plate under one deck normal temperature stable, can prevent copper surface oxidisation and not affect the organic film of welding function, finally production board is packed to shipment.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: in described step (14), wiring board upper and lower surface is all lined with phenolic resins backing plate.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: in described step (14), milling cutter is the right-spiral Double-edged milling cutter that hard metal material is made.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: the step of described plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air in discharge vacuum chamber is to 0.1-0.2torr;
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: the gas of described cleaning use is oxygen, hydrogen, argon gas or nitrogen.
Compared with prior art, the present invention has the following advantages:
1, the present invention adopts plasma cleaning to replace tradition except adhesive process, and except compared with adhesive process, plasma cleaning has the advantage of the following aspects with the heavy copper cash of tradition:
A. after plasma cleaning, wiring board plate face is very dry, and drying processing can be sent to next procedure again.
B. plasma cleaning technique not with an organic solvent, the harmful liquid such as volatility liquid medicine, after cleaning, can not produce noxious pollutant yet, belong to environmentally friendly green cleaning method.
C. the plasma that adopts the high-frequency discharge within the scope of radio wave to produce cleans, its directivity is not strong, can go deep into the fine eyelet of wiring board and the inside of depression and complete cleaning task, not be subject to the impact of cleaned material shape, can be better to those difficult cleaning performances that clean position.
D. the vacuum degree that plasma cleaning need to be controlled is 0.15-0.25torr, and this vacuum degree is easy to realize in plant produced.Equipment cost is not high, and cleaning process does not need to use expensive organic solvent or other liquid medicine yet, therefore plasma cleaning operating cost is far below traditional adhesive process that removes.
E. due to plasma cleaning do not need to cleaning fluid transport, store, the treatment measures such as discharge, so production site easily keeps hygienically clean.
F. plasma cleaning is under vacuum condition, PCB surface to be cleaned, and can not contact any organic solvent or liquid medicine, can effectively avoid the generation of the defect such as Kong Wutong, wiring board open circuit, improving product acceptance rate, thereby the company of saving production cost.
2, in moulding gong plate technique of the present invention, adopt hard metal Double-edged milling cutter, can effectively avoid the quality defects such as batch cutting edge of a knife or a sword, burr, and reduce the usage quantity of milling cutter, save production cost, in boring and gong plate operation, be all lined with phenolic resins backing plate at the upper and lower surface of wiring board simultaneously, can reduce the quality problem such as plate bending.
[brief description of the drawings]
Fig. 1 is process chart of the present invention;
Fig. 2 is positive process chart of the present invention;
Fig. 3 is plasma cleaning flow chart of the present invention.
[embodiment]
Below in conjunction with accompanying drawing, the invention will be further described:
A manufacture method for Teflon high-frequency circuit board, comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making instruction, as the edges of boards tooling hole of wiring board, tooling hole, insert hole etc.;
(3) plasma cleaning: impurity or greasy dirt etc. on PCB surface and the hole inwall of the plasma removal step (2) producing by the high-frequency discharge within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole, reaches customer requirement;
(6) positive dry film develops: blue layer dry film is sticked in the copper-clad plate obtaining after step (5) is processed, expose by positive film aligning, after dry film develops, exposed copper sheet is out desired circuit, and what under blue dry film, cover is copper unnecessary on wiring board;
(7) graphic plating: with electro-plating method thickening copper layer, then plate the protective layer of tin as this circuit on the exposed copper face of wiring board after completing steps (6);
(8) move back film: the blue dry film in step (7) is all returned, exposed unnecessary copper;
(9) move back tin: the tin that step (7) is plated is all returned;
(10) alkali etching: wiring board step (8) Suo Shu is put into alkali etching liquid medicine, and the circuit copper layer that etching off is unnecessary, exposes circuit pack, obtains the line pattern that is shaped;
(11) figure inspection: adopt scanner to circuit open short circuit phenomenon inspection, in industry, claim " AOI ";
(12) anti-welding: not need in the circuit board the uniform welding resistance ink of local silk-screen one deck of soldering of electronic components, mainly in the time of client's welding component, play and prevent that scolding tin from connecting the effect of short circuit, obtains production board;
(13) wiring board divides plate: cut apart the connection between each production board in large plate with V-CUT cutter (miniature carving cutter);
(14) moulding gong plate: adopt hard metal Double-edged milling cutter to go out finished product profile by customer requirement gong, to reduce the peripheral batch cutting edge of a knife or a sword of finished product;
(15) open-short circuit: the electric property that the described production board of detecting step (14) is each layer;
(16) finished product inspection: be mainly function and the outward appearance that checks production board;
(17) there is organizational security weldering film: stabilization energy prevents copper surface oxidisation and do not affect the organic film of welding function, title " OSP in industry under solder side plating one deck normal temperature of production board;
(18) finished product packing: by the qualified production board packaging shipment of inspection eventually.
Described positive blade technolgy concrete steps as shown in Figure 2, first paste in the circuit board blue layer dry film, then paste exposure in the circuit board with the positive film, after exposure, on the positive film, the part of colourless printing opacity is unnecessary copper sheet, the part that black is in the light is circuit, through developing apparatus, the dry film on circuit is removed, after developing, exposed copper sheet is out desired circuit, and what under blue dry film, cover is copper unnecessary on wiring board; Then on the exposed copper face of wiring board, thicken copper layer with electro-plating method through graphic plating operation; plate again the protective layer of tin as this circuit; return the dry film on unnecessary copper sheet through the film section of moving back of etching machine again; through alkali etching liquid medicine section, unnecessary copper sheet is etched away, then make circuit through moving back tin, oven dry etc.
In described step (14), milling cutter is the right-spiral Double-edged milling cutter that hard metal material is made.Be glass fiber net because Teflon plate construction is similar, glass can be pulled out and be difficult for milling and disconnect when regular knife milling plate, right-spiral catling can avoid this problem to occur, in described step (14), wiring board upper and lower surface is all lined with phenolic resins backing plate.Teflon plate is clipped in the middle, be equivalent to increase the hardness of sheet material, can avoid milling plate time, Teflon sheet deformation, affects the quality defects such as size, when milling plate, adjust again each milling board parameter, reduce such as reducing lower cutter speed, increase rotating speed, reduction gait of march etc. the appearance of criticizing cutting edge of a knife or a sword burr.
The step of described step (3) plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air of discharging in vacuum chamber is pressure unit to 0.1-0.2torr(torr, and Chinese is translated into holder, and 1 holder is decided to be 1/760 times of normal atmospheric pressure);
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr, according to the difference of cleaning material, can select respectively the gases such as oxygen, hydrogen, argon gas or nitrogen;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
Claims (5)
1. a manufacture method for Teflon high-frequency circuit board, its feature comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making instruction;
(3) plasma cleaning: impurity or greasy dirt on PCB surface and the hole inwall of the plasma removal step (2) producing with the high frequency voltage within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole;
(6) positive dry film develops: in the copper-clad plate obtaining after step (5) is processed, paste blue layer dry film, then paste exposure in the circuit board with the positive film, after exposure, on the positive film, the part of colourless printing opacity is unnecessary copper sheet, the part that black is in the light is circuit, through developing apparatus, the dry film on circuit is removed, after developing, exposed copper sheet is out desired circuit, and what under blue dry film, cover is copper unnecessary on wiring board;
(7) graphic plating: with electro-plating method thickening copper layer, then plate the protective layer of tin as this circuit on the exposed copper face of wiring board after completing steps (6);
(8) move back film: the blue dry film of step (6) is all returned, exposed unnecessary copper;
(9) alkali etching: step (8) wiring board after treatment is put into alkali etching liquid medicine, and the circuit copper layer that etching off is unnecessary, exposes circuit pack;
(10) move back tin: the tin plating through step (7) on circuit is all returned, obtained the line pattern being shaped;
(11) figure inspection: adopt scanner to open short circuit phenomenon inspection to circuit;
(12) anti-welding: the uniform welding resistance ink of local silk-screen one deck that does not need in the circuit board soldering of electronic components;
(13) wiring board divides plate: cut apart the connection between each production board in large plate with miniature carving cutter;
(14) moulding gong plate: adopt Double-edged milling cutter to go out finished product profile by customer requirement gong;
(15) subsequent handling: electric property and outward appearance that the described production board of detecting step (12) is each layer, on the solder side of described production board, plate under one deck normal temperature stable, can prevent copper surface oxidisation and not affect the organic film of welding function, finally production board is packed to shipment.
2. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: in described step (14), wiring board upper and lower surface is all lined with phenolic resins backing plate.
3. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: in described step (14), milling cutter is the right-spiral Double-edged milling cutter that hard metal material is made.
4. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: the step of described plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air in discharge vacuum chamber is to 0.1-0.2torr;
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
5. the manufacture method of Teflon high-frequency circuit board according to claim 4, is characterized in that: the gas of described cleaning use is oxygen, hydrogen, argon gas or nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114343.0A CN103874333A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114343.0A CN103874333A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103874333A true CN103874333A (en) | 2014-06-18 |
Family
ID=50912348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410114343.0A Pending CN103874333A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103874333A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883823A (en) * | 2015-05-22 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | Processing method of alkaline etching collapser |
| CN105722326A (en) * | 2016-03-25 | 2016-06-29 | 东莞美维电路有限公司 | PCB resin plugging technology |
| CN107172817A (en) * | 2017-06-21 | 2017-09-15 | 东莞联桥电子有限公司 | A kind of Teflon pcb board processing technology |
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108766865A (en) * | 2018-05-21 | 2018-11-06 | 北京铂阳顶荣光伏科技有限公司 | A kind of preparation method of flexible solar battery foreboard |
| CN110167276A (en) * | 2019-05-31 | 2019-08-23 | 孙来庆 | A kind of production method of same layer mandarin duck copper circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1394711A (en) * | 2001-07-10 | 2003-02-05 | 武汉市印制电路公司 | Special-purpose milling cutter for printing circuit board |
| CN201142786Y (en) * | 2008-01-08 | 2008-10-29 | 恩达电路(深圳)有限公司 | Manufacturing system for high-frequency metal base printed board |
| CN201324865Y (en) * | 2008-12-22 | 2009-10-14 | 中山市东泓硬质合金刀具有限公司 | Double-edged milling cutter |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN103648236A (en) * | 2013-12-31 | 2014-03-19 | 深圳市深联电路有限公司 | Method for improving PCB (Printed Circuit Board) metal binding local windowing |
-
2014
- 2014-03-25 CN CN201410114343.0A patent/CN103874333A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1394711A (en) * | 2001-07-10 | 2003-02-05 | 武汉市印制电路公司 | Special-purpose milling cutter for printing circuit board |
| CN201142786Y (en) * | 2008-01-08 | 2008-10-29 | 恩达电路(深圳)有限公司 | Manufacturing system for high-frequency metal base printed board |
| CN201324865Y (en) * | 2008-12-22 | 2009-10-14 | 中山市东泓硬质合金刀具有限公司 | Double-edged milling cutter |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN103648236A (en) * | 2013-12-31 | 2014-03-19 | 深圳市深联电路有限公司 | Method for improving PCB (Printed Circuit Board) metal binding local windowing |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883823A (en) * | 2015-05-22 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | Processing method of alkaline etching collapser |
| CN105722326A (en) * | 2016-03-25 | 2016-06-29 | 东莞美维电路有限公司 | PCB resin plugging technology |
| CN105722326B (en) * | 2016-03-25 | 2018-11-13 | 东莞美维电路有限公司 | PCB filling holes with resin techniques |
| CN107172817A (en) * | 2017-06-21 | 2017-09-15 | 东莞联桥电子有限公司 | A kind of Teflon pcb board processing technology |
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108323011B (en) * | 2018-01-25 | 2020-04-14 | 深圳崇达多层线路板有限公司 | Manufacturing method of multilayer teflon circuit board |
| CN108766865A (en) * | 2018-05-21 | 2018-11-06 | 北京铂阳顶荣光伏科技有限公司 | A kind of preparation method of flexible solar battery foreboard |
| CN110167276A (en) * | 2019-05-31 | 2019-08-23 | 孙来庆 | A kind of production method of same layer mandarin duck copper circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103874333A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN103874334A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN101902883A (en) | Method for manufacturing microwave high-frequency ceramic circuit board | |
| CN102159029B (en) | Method for making high-frequency aluminium-based circuit board | |
| CN108811334B (en) | Processing method of graphical blind slot at bottom of printed circuit board | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| CN110519944A (en) | Complex copper thick substrate production method | |
| CN101808464A (en) | Method for manufacturing ultra-long microwave high-frequency circuit board | |
| CN102143656B (en) | Manufacturing method of circuit board made of high-dielectric composite material | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN103874339A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN108200734B (en) | method for producing positive concave etching printed circuit board | |
| CN103874331A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN108112175B (en) | A kind of production method of ladder groove bottom graphical PCB | |
| CN103596369A (en) | Method for manufacturing rigid-flexible board with blind groove | |
| CN108124384A (en) | Small size wiring board method for processing forming without interior positioning | |
| CN103687309A (en) | Production process for high-frequency circuit board | |
| CN106455345A (en) | Method of machining burr-free hole of PCB copper-based core board | |
| CN108617109A (en) | A kind of High Efficiency PC B copper cores component brown jig and preparation method thereof | |
| CN108617093A (en) | A method of improving PTFE wiring board slot burrs | |
| CN103974548A (en) | Method for manufacturing mask plate | |
| CN111479397A (en) | Circuit manufacturing method | |
| CN106341947A (en) | Circuit board manufacturing method | |
| CN103874332A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN102281716A (en) | Manufacturing method for high frequency super-thick circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140618 |