CN101902883A - Method for manufacturing microwave high-frequency ceramic circuit board - Google Patents
Method for manufacturing microwave high-frequency ceramic circuit board Download PDFInfo
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- CN101902883A CN101902883A CN 201010229240 CN201010229240A CN101902883A CN 101902883 A CN101902883 A CN 101902883A CN 201010229240 CN201010229240 CN 201010229240 CN 201010229240 A CN201010229240 A CN 201010229240A CN 101902883 A CN101902883 A CN 101902883A
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Abstract
The invention discloses a method for manufacturing a microwave high-frequency ceramic circuit board. The method comprises the following steps of: 1, manufacturing a light painting template; 2, cutting, drilling and performing hole-forming; 3, manufacturing surface figures; 4, electroplating and etching; 5, preparing solder green oil; and 6, forming to obtain the microwave high-frequency ceramic circuit board. The method has the advantages of high manufacturing accuracy, stable performance of the produced microwave high-frequency ceramic circuit board and effective improvement on the product quality and the working efficiency.
Description
Technical field
The present invention relates to a kind of manufacture method of microwave high-frequency ceramic circuit board.
Background technology
Along with the direction of electronic product to miniaturization, high frequencyization, digitlization, high reliabilityization develops, microwave high-frequency ceramic circuit board expands, hangs down ease gas and obtained using widely in all kinds of communication products with its remarkable high-frequency low-consumption characteristic, the extremely low hot coefficient of dielectric constant, splendid electric and mechanical performance, low Z axle.The production method of microwave current high-frequency ceramic circuit board still follows the manufacture method and the technology of ordinary epoxy resin circuit board, but the characteristic of its incompatibility microwave high-frequency ceramic material, its aperture is prone to blast hole, quick-fried copper phenomenon, influences client product signal transmission performance.
Summary of the invention
The invention provides a kind of manufacture method of microwave high-frequency ceramic circuit board, it makes the precision height, the microwave high-frequency ceramic circuit board stable performance that makes, and effectively improved product quality and operating efficiency.
The present invention has adopted following technical scheme: a kind of manufacture method of microwave high-frequency ceramic circuit board, it may further comprise the steps: step 1, light is painted template construct: at first adopt CAD software that template is carried out graphic designs, processing and layout, make it satisfy the requirement of production and processing; Make the black egative film then, to egative film develop, photographic fixing, cleaning and air-dry, egative film is checked, be that female parent duplicates brown sheet at last with the egative film; Step 2, split the making of material, boring, holeization: at first adopt electronic plate shearing machine to leave required ceramic copper-clad plate by dimensional requirement, carry out wrapper sheet then, then ceramic copper-clad plate is fixed on the Digit Control Machine Tool bore path is programmed, choose the brill cutter, adopt numerical control drilling machine that ceramic copper-clad plate is carried out digital control hole drilling, at last the ceramic copper-clad plate that has bored the hole is carried out metalized; Step 3, making to surfacial pattern: at first pickling is carried out on the ceramic copper-clad plate surface, nog plate, to ceramic copper-clad plate printed on both sides wet film, the ceramic copper-clad plate to the good wet film of silk-screen toasts then then, and the plate face of brown sheet and ceramic copper-clad plate is carried out contraposition, graph exposure to the plate face, develop, at last surfacial pattern is checked, repair plate; Step 4, plating, etched making: at first figure is carried out pre-electroplating treatment, then patterned surface is carried out the electro-coppering thickening, then zinc-plated processing is carried out on the surface, anti-coatings is decorporated, carry out etching according to the figure that designs, at last the product after the etching is checked, repaiied plate; Step 5, the welding resistance green oil is made: at first ceramic copper-clad plate is carried out peracid treatment before the welding resistance, then the plate face is gently ground, then to ceramic copper-clad plate printed on both sides welding resistance green oil, ceramic copper-clad plate to the good green oil of silk-screen toasts, and exposure is developed, at last ceramic copper-clad plate surface welding resistance green oil is checked, repaiied plate; Step 6, moulding is made: at first adopt the profile of ceramic copper-clad plate is carried out the 3 D stereo programming, then the three dimensional design path after the programming is simulated, then adopt CNC milling machine that ceramic copper-clad plate is carried out forming processes, the ceramic copper-clad plate after the moulding is carried out numerical control V again cut; All after the moulding, adopt jetting machine to carry out cleaning surfaces, at last the microwave high-frequency ceramic circuit board behind the finished product is carried out performance checking and visual examination, after above step finishes, promptly can be made into microwave high-frequency ceramic circuit board ceramic wafer.Adopting resolution in the described step 1 is that the high-accuracy laser drawing mechanism of 10160dpi is made the black egative film, adopts 100 * microscope that its egative film is checked, is maternal with the egative film, adopts the 3KW exposure machine to duplicate brown sheet.Contain 1-2 sheet ceramic copper-clad plate in the described step 2 in the wrapper sheet, ceramic copper-clad plate is fixed on the Digit Control Machine Tool by the pin hole of the φ 3.2mm that the minor face position gets out, the cutter head angle of boring cutter is 120 °, and number arrange cutter according to cutter, the highest drilling hole amount that bores cutter is controlled at 1000 holes, adopts 2000 order sand paper that its surperficial burr, burr are handled to ceramic copper-clad plate after having bored the hole.Adopt two pairs 500 order roller brush Plate grinders to carry out nog plate in the described step 3, adopt sparerib shelf that the ceramic copper-clad plate of the good wet film of silk-screen is toasted, adopt the 5KW exposure machine to carry out graph exposure, adopt 1.0%NA the plate face
2CO
3Solution develop.Pre-electroplating treatment in the described step 4 comprises oil removing, city's washing, alligatoring, secondary washing and pickling.Light mill in the described step 5 adopts the two pairs 1000 soft brush plating gold surface of order gently to grind, and adopts sparerib shelf to toast to the ceramic copper-clad plate of the good green oil of silk-screen, and exposure adopts the 7KW exposure machine to carry out the welding resistance exposure, develops and adopts 1.0%NA
2CO
3Solution exposed plate is developed.CNC milling machine adopts two blade milling cutters in the described step 6, and numerical control V tapping is with ceramic special-purpose V cutting blade.
The present invention has following beneficial effect: the invention provides a kind of manufacture method of microwave high-frequency ceramic circuit board, it makes the precision height, the microwave high-frequency ceramic circuit board stable performance that makes, and effectively improved product quality and operating efficiency.The present invention adopts the cutter head angle in manufacturing process be 120 ° brill cutter, and be the brand-new cutter that bores, the highest drilling hole amount that bores cutter is controlled at 1000 holes, strict in addition control digital control hole drilling parameter, the generation that can effectively solve aperture blast hole, quick-fried copper and aperture displacement problem like this.The present invention adopts two blade milling cutters to carry out the generation that the numerical control electric router can effectively solve ceramic edge powdery phenomenon in manufacturing process, guarantees that its milling edge is smooth.The present invention adopts numerical control V to cut ceramic special-purpose V cutting blade in manufacturing process, can effectively solve ceramic substrate because of the hard V of material cuts the generation of frangible phenomenon, has improved the qualification rate of product greatly, simultaneously the effective serviceability of stable prod.
Embodiment
The present invention is a kind of manufacture method of microwave high-frequency ceramic circuit board, and it may further comprise the steps: step 1, and light is painted template construct: at first adopt CAD software that template is carried out graphic designs, processing and layout, make it satisfy the requirement of production and processing; Adopting resolution then is that the high-accuracy laser drawing mechanism of 10160dpi is made the black egative film, to egative film develop, photographic fixing, cleaning and air-dry, adopt 100 * microscope that its egative film is checked, be that the maternal 3KW of employing exposure machine duplicates brown sheet at last with the egative film; Step 2, split material, boring, the making of holeization: at first adopt electronic plate shearing machine to leave required ceramic copper-clad plate by dimensional requirement, carry out wrapper sheet then, contain 1-2 sheet ceramic copper-clad plate in the wrapper sheet, then ceramic copper-clad plate is fixed on the Digit Control Machine Tool bore path is programmed, ceramic copper-clad plate is fixed on the Digit Control Machine Tool by the pin hole of the φ 3.2mm that the minor face position gets out, choose the brill cutter, the cutter head angle of boring cutter is 120 °, and number arrange cutter according to cutter, the highest drilling hole amount that bores cutter is controlled at 1000 holes, adopt numerical control drilling machine that ceramic copper-clad plate is carried out digital control hole drilling, adopt 2000 order sand paper to its surperficial burr to ceramic copper-clad plate after having bored the hole, burr is handled, and at last the ceramic copper-clad plate that has bored the hole is carried out metalized; Step 3, making to surfacial pattern: at first pickling is carried out on the ceramic copper-clad plate surface, adopt two pairs 500 order roller brush Plate grinders to carry out nog plate, then to ceramic copper-clad plate printed on both sides wet film, adopt sparerib shelf that the ceramic copper-clad plate of the good wet film of silk-screen is toasted then, the plate face of brown sheet and ceramic copper-clad plate is carried out contraposition, adopt the 5KW exposure machine to carry out graph exposure, adopt 1.0%NA the plate face
2CO
3Solution develop, at last surfacial pattern is checked, repair plate; Step 4, plating, etched making: at first figure is carried out pre-electroplating treatment, pre-electroplating treatment comprises oil removing, city's washing, alligatoring, secondary washing and pickling, then patterned surface is carried out the electro-coppering thickening, then zinc-plated processing is carried out on the surface, anti-coatings is decorporated, carry out etching according to the figure that designs, at last the product after the etching is checked, repaiied plate; Step 5, the welding resistance green oil is made: at first ceramic copper-clad plate is carried out peracid treatment before the welding resistance, adopt the two pairs 1000 soft brush plating gold surface of order gently to grind to the plate face then, then to ceramic copper-clad plate printed on both sides welding resistance green oil, ceramic copper-clad plate to the good green oil of silk-screen adopts sparerib shelf to toast, and adopts the 7KW exposure machine to carry out the welding resistance exposure, adopts 1.0%NA
2CO
3Solution exposed plate is developed, at last ceramic copper-clad plate surface welding resistance green oil is checked, repair plate; Step 6, moulding is made: at first adopt the profile of ceramic copper-clad plate is carried out the 3 D stereo programming, then the three dimensional design path after the programming is simulated, then adopt CNC milling machine that ceramic copper-clad plate is carried out forming processes, CNC milling machine adopts two blade milling cutters, ceramic copper-clad plate after the moulding is carried out numerical control V again cut, numerical control V tapping is with ceramic special-purpose V cutting blade; All after the moulding, adopt jetting machine to carry out cleaning surfaces, at last the microwave high-frequency ceramic circuit board behind the finished product is carried out performance checking and visual examination, after above step finishes, promptly can be made into microwave high-frequency ceramic circuit board ceramic wafer.
Claims (7)
1. the manufacture method of a microwave high-frequency ceramic circuit board, it may further comprise the steps:
Step 1, light is painted template construct: at first adopt CAD software that template is carried out graphic designs, processing and layout, make it satisfy the requirement of production and processing; Make the black egative film then, to egative film develop, photographic fixing, cleaning and air-dry, egative film is checked, be that female parent duplicates brown sheet at last with the egative film;
Step 2, split the making of material, boring, holeization: at first adopt electronic plate shearing machine to leave required ceramic copper-clad plate by dimensional requirement, carry out wrapper sheet then, then ceramic copper-clad plate is fixed on the Digit Control Machine Tool bore path is programmed, choose the brill cutter, adopt numerical control drilling machine that ceramic copper-clad plate is carried out digital control hole drilling, at last the ceramic copper-clad plate that has bored the hole is carried out metalized;
Step 3, making to surfacial pattern: at first pickling is carried out on the ceramic copper-clad plate surface, nog plate, to ceramic copper-clad plate printed on both sides wet film, the ceramic copper-clad plate to the good wet film of silk-screen toasts then then, and the plate face of brown sheet and ceramic copper-clad plate is carried out contraposition, graph exposure to the plate face, develop, at last surfacial pattern is checked, repair plate;
Step 4, plating, etched making: at first figure is carried out pre-electroplating treatment, then patterned surface is carried out the electro-coppering thickening, then zinc-plated processing is carried out on the surface, anti-coatings is decorporated, carry out etching according to the figure that designs, at last the product after the etching is checked, repaiied plate;
Step 5, the welding resistance green oil is made: at first ceramic copper-clad plate is carried out peracid treatment before the welding resistance, then the plate face is gently ground, then to ceramic copper-clad plate printed on both sides welding resistance green oil, ceramic copper-clad plate to the good green oil of silk-screen toasts, and exposure is developed, at last ceramic copper-clad plate surface welding resistance green oil is checked, repaiied plate;
Step 6, moulding is made: at first adopt the profile of ceramic copper-clad plate is carried out the 3 D stereo programming, then the three dimensional design path after the programming is simulated, then adopt CNC milling machine that ceramic copper-clad plate is carried out forming processes, the ceramic copper-clad plate after the moulding is carried out numerical control V again cut; All after the moulding, adopt jetting machine to carry out cleaning surfaces, at last the microwave high-frequency ceramic circuit board behind the finished product is carried out performance checking and visual examination, after above step finishes, promptly can be made into microwave high-frequency ceramic circuit board ceramic wafer.
2. the manufacture method of microwave high-frequency ceramic circuit board according to claim 1, it is characterized in that in the described step 1 adopting resolution is that the high-accuracy laser drawing mechanism of 10160dpi is made the black egative film, adopt 100 * microscope that its egative film is checked, with the egative film is maternal, adopts the 3KW exposure machine to duplicate brown sheet.
3. the manufacture method of microwave high-frequency ceramic circuit board according to claim 1, it is characterized in that containing in the wrapper sheet in the described step 2 1-2 sheet ceramic copper-clad plate, ceramic copper-clad plate is fixed on the Digit Control Machine Tool by the pin hole of the φ 3.2mm that the minor face position gets out, the cutter head angle of boring cutter is 120 °, and number arrange cutter according to cutter, the highest drilling hole amount that bores cutter is controlled at 1000 holes, adopts 2000 order sand paper that its surperficial burr, burr are handled to ceramic copper-clad plate after having bored the hole.
4. the manufacture method of microwave high-frequency ceramic circuit board according to claim 1, it is characterized in that adopting in the described step 3 two pairs 500 order roller brush Plate grinders to carry out nog plate, adopt sparerib shelf that the ceramic copper-clad plate of the good wet film of silk-screen is toasted, adopt the 5KW exposure machine to carry out graph exposure to the plate face, adopt 1.0%NA
2CO
3Solution develop.
5. the manufacture method of microwave high-frequency ceramic circuit board according to claim 1 is characterized in that the pre-electroplating treatment in the described step 4 comprises oil removing, city's washing, alligatoring, secondary washing and pickling.
6. the manufacture method of microwave high-frequency ceramic circuit board according to claim 1, it is characterized in that the light mill in the described step 5 adopts the two pairs 1000 soft brush plating gold surface of order gently to grind, ceramic copper-clad plate to the good green oil of silk-screen adopts sparerib shelf to toast, exposure adopts the 7KW exposure machine to carry out the welding resistance exposure, develops and adopts 1.0%NA
2CO
3Solution exposed plate is developed.
7. the manufacture method of microwave high-frequency ceramic circuit board according to claim 1 is characterized in that CNC milling machine adopts two blade milling cutters in the described step 6, and numerical control V tapping is with ceramic special-purpose V cutting blade.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010229240 CN101902883A (en) | 2010-07-16 | 2010-07-16 | Method for manufacturing microwave high-frequency ceramic circuit board |
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| CN 201010229240 CN101902883A (en) | 2010-07-16 | 2010-07-16 | Method for manufacturing microwave high-frequency ceramic circuit board |
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| CN101902883A true CN101902883A (en) | 2010-12-01 |
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| CN 201010229240 Pending CN101902883A (en) | 2010-07-16 | 2010-07-16 | Method for manufacturing microwave high-frequency ceramic circuit board |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102159027A (en) * | 2011-01-17 | 2011-08-17 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN102159030A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Making method of high-frequency ultrathin circuit board |
| CN102159029A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Method for making high-frequency aluminium-based circuit board |
| CN102159031A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Method for making super-long microwave high-frequency circuit board |
| CN102300405A (en) * | 2011-08-16 | 2011-12-28 | 深南电路有限公司 | Embedded-type circuit board and production method thereof |
| CN102421243A (en) * | 2011-08-06 | 2012-04-18 | 倪新军 | Microwave high-frequency circuit board |
| CN102711379A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency microwave super-long circuit soft board |
| CN102938978A (en) * | 2012-11-28 | 2013-02-20 | 成都航天通信设备有限责任公司 | Thick-ceramic-base printed circuit board processing method |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN103491710A (en) * | 2013-09-09 | 2014-01-01 | 莆田市龙腾电子科技有限公司 | Process for processing two-sided and multilayer circuit board |
| CN103533759A (en) * | 2013-10-21 | 2014-01-22 | 朱云霞 | Method for manufacturing high-frequency microwave super-long flexible printed circuit board |
| CN104219893A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT board line resistance welding process |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN104822229A (en) * | 2015-04-22 | 2015-08-05 | 上海凯思尔电子有限公司 | Operation process for fixing PCB with thumbtacks |
| CN106102330A (en) * | 2016-06-23 | 2016-11-09 | 江西景旺精密电路有限公司 | A kind of manufacture method of pcb board fine-line |
| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN109413858A (en) * | 2018-11-09 | 2019-03-01 | 博罗康佳精密科技有限公司 | A kind of preparation method of microwave ceramics substrate |
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| CN114423173A (en) * | 2021-12-13 | 2022-04-29 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001172035A (en) * | 1999-12-14 | 2001-06-26 | Asahi Glass Co Ltd | Method for perforating boardlike material made of ceramics |
| CN101699932A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing high thermal conductivity ceramic circuit board |
| CN101699935A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing locatable high heat conduction ceramic circuit board |
-
2010
- 2010-07-16 CN CN 201010229240 patent/CN101902883A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001172035A (en) * | 1999-12-14 | 2001-06-26 | Asahi Glass Co Ltd | Method for perforating boardlike material made of ceramics |
| CN101699932A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing high thermal conductivity ceramic circuit board |
| CN101699935A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing locatable high heat conduction ceramic circuit board |
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| CN102159027A (en) * | 2011-01-17 | 2011-08-17 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN102159027B (en) * | 2011-01-17 | 2012-08-08 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102159030A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Making method of high-frequency ultrathin circuit board |
| CN102159029A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Method for making high-frequency aluminium-based circuit board |
| CN102159031A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Method for making super-long microwave high-frequency circuit board |
| CN102159029B (en) * | 2011-03-16 | 2012-12-05 | 蔡新民 | Method for making high-frequency aluminium-based circuit board |
| CN102143656B (en) * | 2011-03-16 | 2012-12-05 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102159031B (en) * | 2011-03-16 | 2012-12-05 | 蔡新民 | Method for making super-long microwave high-frequency circuit board |
| CN102421243A (en) * | 2011-08-06 | 2012-04-18 | 倪新军 | Microwave high-frequency circuit board |
| CN102300405A (en) * | 2011-08-16 | 2011-12-28 | 深南电路有限公司 | Embedded-type circuit board and production method thereof |
| CN102300405B (en) * | 2011-08-16 | 2014-05-07 | 深南电路有限公司 | Embedded-type circuit board and production method thereof |
| CN102711379A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency microwave super-long circuit soft board |
| CN102938978A (en) * | 2012-11-28 | 2013-02-20 | 成都航天通信设备有限责任公司 | Thick-ceramic-base printed circuit board processing method |
| CN102938978B (en) * | 2012-11-28 | 2015-04-15 | 成都航天通信设备有限责任公司 | Thick-ceramic-base printed circuit board processing method |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN103354702B (en) * | 2013-07-26 | 2016-05-25 | 东莞生益电子有限公司 | The circuit board that microwave circuit board manufacturing method and the method make |
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| CN103491710B (en) * | 2013-09-09 | 2016-02-17 | 莆田市龙腾电子科技有限公司 | A kind of two-sided and multilayer line board machining process |
| CN103533759A (en) * | 2013-10-21 | 2014-01-22 | 朱云霞 | Method for manufacturing high-frequency microwave super-long flexible printed circuit board |
| CN104219893A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT board line resistance welding process |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN104619122B (en) * | 2015-01-05 | 2018-08-17 | 惠州市星之光科技有限公司 | A kind of production method of printed circuit board |
| CN104822229A (en) * | 2015-04-22 | 2015-08-05 | 上海凯思尔电子有限公司 | Operation process for fixing PCB with thumbtacks |
| CN106102330A (en) * | 2016-06-23 | 2016-11-09 | 江西景旺精密电路有限公司 | A kind of manufacture method of pcb board fine-line |
| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN106211631B (en) * | 2016-09-13 | 2018-10-12 | 电子科技大学 | A kind of production method of the enhanced printed circuit board inner figure of laminating surface binding force |
| CN109413858A (en) * | 2018-11-09 | 2019-03-01 | 博罗康佳精密科技有限公司 | A kind of preparation method of microwave ceramics substrate |
| CN113487004A (en) * | 2021-06-29 | 2021-10-08 | 河源市飞利华电子有限公司 | RFID electronic ceramic tag manufacturing process and RFID electronic ceramic tag |
| CN114423173A (en) * | 2021-12-13 | 2022-04-29 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
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