CN103997856A - Method for manufacturing high-resistance-value carbon film circuit board - Google Patents
Method for manufacturing high-resistance-value carbon film circuit board Download PDFInfo
- Publication number
- CN103997856A CN103997856A CN201410224555.4A CN201410224555A CN103997856A CN 103997856 A CN103997856 A CN 103997856A CN 201410224555 A CN201410224555 A CN 201410224555A CN 103997856 A CN103997856 A CN 103997856A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- carbon film
- carried out
- carry out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a high-resistance-value carbon film circuit board. The method includes the first step of preparing project and light painting data, the second step of carrying out cutting and drilling, the third step of making surface patterns, the fourth step of carrying out electroplating and etching, the fifth step of a solder mask high-resistance-value carbon film, and the sixth step of forming the high-resistance-value carbon film circuit board. The method for manufacturing the high-resistance-value carbon film circuit board is high in manufacturing accuracy, product quality and working efficiency are effectively improved, and the obtained high-resistance-value carbon film circuit board is stable in performance.
Description
Technical field
The present invention relates to a kind of manufacture method of high resistance carbon film wiring board.
Background technology
Along with the future development of electronic product to miniaturization, digitlization, lightening, high frequency, high reliability, the carbon film wiring board of high resistance is except having high-fire resistance that ordinary circuit board is good, high-cooling property, excellent dimensional stability, have more high frequency, lightening, insulating medium layer has good intensity, pliability and resistance to high puncture voltage.
Summary of the invention
The invention provides a kind of manufacture method of high resistance carbon film wiring board, it is high that it not only makes precision, effectively improved product quality and operating efficiency, and the stable performance of the carbon film circuit board of the high resistance making.
The present invention has adopted following technical scheme: a kind of manufacture method of high resistance carbon film wiring board, it comprises the following steps: step 1: carry out engineering, light is painted data make: first adopt template is carried out to graphic designs, then will design figure and carry out project file processing according to processing parameter, then according to working condition, the file of handling well is carried out layout, makes black egative film, the egative film that light is painted rinses, development, photographic fixing, cleaning, air-dry; The egative film of completing is checked, the egative film that checks of finally take again carries out diazo sheet copy as female parent, and the diazo sheet copying is checked again; Step 2: the making of sawing sheet, boring: first output and produce needed copper-clad plate by flow process list requirement size with electric plate shearer; Then according to thickness of slab, copper-clad plate is carried out to wrapper sheet and form compoboard, in the minor face position of compoboard, get pin hole; The compoboard of accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, after boring, again the burr on compoboard surface and batch cutting edge of a knife or a sword are processed, finally check; Step 3: the making of surfacial pattern: first polish-brush processing is carried out in the surface of copper-clad plate, then wet film printing is carried out in its surface, baking; By location hole, diazo sheet and copper-clad plate are carried out to figure contraposition, exposure; Finally adopting volume ratio is that 0.9-1.2% the sodium carbonate liquor plate after to exposure develops, and the copper-clad plate after developing is overhauled; Step 4: to electroplating, etched making: pre-electroplating treatment is carried out on the copper-clad plate surface that figure has been shifted, headed by the process of pre-electroplating treatment, first carry out acid deoiling, alligatoring after two-stage washing, again through two-stage washing, last pickling, then patterned surface is carried out to electro-coppering thickening processing and gold-plated successively; Then to the anti-plate wet film stripping of copper-clad plate surface, and according to the figure designing, by unwanted partially-etched removal in surfacial pattern, finally the copper-clad plate after etching is checked, repaiies plate; Step 5: anti-welding, high resistance carbon film is made: silk-screen welding resistance green oil, baking sheet after the copper-clad plate having checked is cleaned, then by location hole, diazo sheet and copper-clad plate are carried out to figure contraposition, exposure; Finally adopting volume ratio is that 0.9-1.2% the sodium carbonate liquor plate after to exposure develops, overhauls; By the plate the having overhauled carbon oil of biting, be then cured processing; Step 6: moulding is made: first adopt numerical control mill software to programme to the shape fabricating of copper-clad plate, and simulation test is carried out in the profile path after programming, simulate errorless rear employing CNC milling machine and carry out moulding making; After moulding completes, use cleaning machine cleans, dries, checks, obtains the carbon film wiring board of high resistance.
In described step 1, adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet; Boring in described step 2 is 2-4 borings, the pin hole aperture getting out in the minor face position of copper-clad plate is 3.2mm, numerical control drilling machine adopts the brill cutter of 45 degree, the drilling hole amount that bores cutter is less than 3000 holes, uses sand paper more than 2000 orders that copper-clad plate surface burr, hole are criticized cutting edge of a knife or a sword and processed after boring; In described step 3, adopt 800 object running roller scrubbers to carry out polish-brush processing to the surface of copper-clad plate; Use 5KW exposure machine to carry out line pattern exposure; In described step 5, adopt 1200 object running roller scrubbers to carry out polish-brush processing to the surface of copper-clad plate; Use 8KW exposure machine to carry out welding resistance graph exposure; The printing of high resistance carbon film adopts 100T net to carry out being completed for printing for twice, and curing processing procedure is that compoboard is placed on to baking sheet 40-60 minute at 150 ℃; When in described step 6, moulding is made, CNC milling cutter adopts two blade milling cutters at 110 degree angles.
The present invention has following beneficial effect: the present invention adopts the highest drilling hole amount that bores cutter to be controlled at below 3000 holes in manufacturing process, can effectively solve like this aperture burr, hole wall is coarse and the generation of aperture displacement problem, improve and make precision, and the stable performance of circuit board.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Embodiment
As shown in Figure 1, the present invention is a kind of manufacture method of high resistance carbon film wiring board, it comprises the following steps: step 1: carry out engineering, light is painted data make: first adopt template is carried out to graphic designs, then will design figure and carry out project file processing according to processing parameter, then according to working condition, the file of handling well is carried out layout, makes black egative film, the egative film that light is painted rinses, development, photographic fixing, cleaning, air-dry; The egative film of completing is checked, the egative film that checks of finally take again carries out diazo sheet copy as female parent, and the diazo sheet copying is checked again; In described step 1, adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.Step 2: the making of sawing sheet, boring: first output and produce needed copper-clad plate by flow process list requirement size with electric plate shearer; Then according to thickness of slab, copper-clad plate is carried out to wrapper sheet and form compoboard, in the minor face position of compoboard, get pin hole; The compoboard of accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, after boring, again the burr on compoboard surface and batch cutting edge of a knife or a sword are processed, finally check; Boring in described step 2 is 2-4 borings, the pin hole aperture getting out in the minor face position of copper-clad plate is 3.2mm, numerical control drilling machine adopts the brill cutter of 45 degree, the drilling hole amount that bores cutter is less than 3000 holes, uses sand paper more than 2000 orders that copper-clad plate surface burr, hole are criticized cutting edge of a knife or a sword and processed after boring.Step 3: the making of surfacial pattern: first polish-brush processing is carried out in the surface of copper-clad plate, then wet film printing is carried out in its surface, baking; By location hole, diazo sheet and copper-clad plate are carried out to figure contraposition, exposure; Finally adopting volume ratio is that 0.9-1.2% the sodium carbonate liquor plate after to exposure develops, and the copper-clad plate after developing is overhauled; In described step 3, adopt 800 object running roller scrubbers to carry out polish-brush processing to the surface of copper-clad plate; Use 5KW exposure machine to carry out line pattern exposure.Step 4: to electroplating, etched making: pre-electroplating treatment is carried out on the copper-clad plate surface that figure has been shifted, headed by the process of pre-electroplating treatment, first carry out acid deoiling, alligatoring after two-stage washing, again through two-stage washing, last pickling, then patterned surface is carried out to electro-coppering thickening processing and gold-plated successively; Then to the anti-plate wet film stripping of copper-clad plate surface, and according to the figure designing, by unwanted partially-etched removal in surfacial pattern, finally the copper-clad plate after etching is checked, repaiies plate.Step 5: anti-welding, high resistance carbon film is made: silk-screen welding resistance green oil, baking sheet after the copper-clad plate having checked is cleaned, then by location hole, diazo sheet and copper-clad plate are carried out to figure contraposition, exposure; Finally adopting volume ratio is that 0.9-1.2% the sodium carbonate liquor plate after to exposure develops, overhauls; By the plate the having overhauled carbon oil of biting, be then cured processing; In described step 5, adopt 1200 object running roller scrubbers to carry out polish-brush processing to the surface of copper-clad plate; Use 8KW exposure machine to carry out welding resistance graph exposure; The printing of high resistance carbon film adopts 100T net to carry out being completed for printing for twice, and curing processing procedure is that compoboard is placed on to baking sheet 40-60 minute at 150 ℃.Step 6: moulding is made: first adopt numerical control mill software to programme to the shape fabricating of copper-clad plate, and simulation test is carried out in the profile path after programming, simulate errorless rear employing CNC milling machine and carry out moulding making; After moulding completes, use cleaning machine cleans, dries, checks, obtains the carbon film wiring board of high resistance; When in described step 6, moulding is made, CNC milling cutter adopts two blade milling cutters at 110 degree angles.
Claims (6)
1. a manufacture method for high resistance carbon film wiring board, is characterized in that it comprises the following steps:
Step 1: carry out engineering, light is painted data make: first adopt template is carried out to graphic designs, then will design figure and carry out project file processing according to processing parameter, then according to working condition, the file of handling well is carried out layout, makes black egative film, the egative film that light is painted rinses, development, photographic fixing, cleaning, air-dry; The egative film of completing is checked, the egative film that checks of finally take again carries out diazo sheet copy as female parent, and the diazo sheet copying is checked again;
Step 2: the making of sawing sheet, boring: first output and produce needed copper-clad plate by flow process list requirement size with electric plate shearer; Then according to thickness of slab, copper-clad plate is carried out to wrapper sheet and form compoboard, in the minor face position of compoboard, get pin hole; The compoboard of accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, after boring, again the burr on compoboard surface and batch cutting edge of a knife or a sword are processed, finally check;
Step 3: the making of surfacial pattern: first polish-brush processing is carried out in the surface of copper-clad plate, then wet film printing is carried out in its surface, baking; By location hole, diazo sheet and copper-clad plate are carried out to figure contraposition, exposure; Finally adopting volume ratio is that 0.9-1.2% the sodium carbonate liquor plate after to exposure develops, and the copper-clad plate after developing is overhauled;
Step 4: to electroplating, etched making: pre-electroplating treatment is carried out on the copper-clad plate surface that figure has been shifted, headed by the process of pre-electroplating treatment, first carry out acid deoiling, alligatoring after two-stage washing, again through two-stage washing, last pickling, then patterned surface is carried out to electro-coppering thickening processing and gold-plated successively; Then to the anti-plate wet film stripping of copper-clad plate surface, and according to the figure designing, by unwanted partially-etched removal in surfacial pattern, finally the copper-clad plate after etching is checked, repaiies plate;
Step 5: anti-welding, high resistance carbon film is made: silk-screen welding resistance green oil, baking sheet after the copper-clad plate having checked is cleaned, then by location hole, diazo sheet and copper-clad plate are carried out to figure contraposition, exposure; Finally adopting volume ratio is that 0.9-1.2% the sodium carbonate liquor plate after to exposure develops, overhauls; By the plate the having overhauled carbon oil of biting, be then cured processing;
Step 6: moulding is made: first adopt numerical control mill software to programme to the shape fabricating of copper-clad plate, and simulation test is carried out in the profile path after programming, simulate errorless rear employing CNC milling machine and carry out moulding making; After moulding completes, use cleaning machine cleans, dries, checks, obtains the carbon film wiring board of high resistance.
2. the manufacture method of a kind of high resistance carbon film wiring board according to claim 1, it is characterized in that adopting in described step 1 resolution is that the high precision laser drawing mechanism of 20240dpi is made black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.
3. the manufacture method of a kind of high resistance carbon film wiring board according to claim 1, it is characterized in that the boring in described step 2 is 2-4 borings, the pin hole aperture getting out in the minor face position of copper-clad plate is 3.2mm, numerical control drilling machine adopts the brill cutter of 45 degree, the drilling hole amount that bores cutter is less than 3000 holes, uses sand paper more than 2000 orders that copper-clad plate surface burr, hole are criticized cutting edge of a knife or a sword and processed after boring.
4. the manufacture method of a kind of high resistance carbon film wiring board according to claim 1, is characterized in that adopting 800 object running roller scrubbers to carry out polish-brush processing to the surface of copper-clad plate in described step 3; Use 5KW exposure machine to carry out line pattern exposure.
5. the manufacture method of a kind of high resistance carbon film wiring board according to claim 1, is characterized in that adopting 1200 object running roller scrubbers to carry out polish-brush processing to the surface of copper-clad plate in described step 5; Use 8KW exposure machine to carry out welding resistance graph exposure; The printing of high resistance carbon film adopts 100T net to carry out being completed for printing for twice, and curing processing procedure is that compoboard is placed on to baking sheet 40-60 minute at 150 ℃.
6. the manufacture method of a kind of high resistance carbon film wiring board according to claim 1, while it is characterized in that in described step 6, moulding is made, CNC milling cutter adopts two blade milling cutters at 110 degree angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410224555.4A CN103997856A (en) | 2014-05-26 | 2014-05-26 | Method for manufacturing high-resistance-value carbon film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410224555.4A CN103997856A (en) | 2014-05-26 | 2014-05-26 | Method for manufacturing high-resistance-value carbon film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103997856A true CN103997856A (en) | 2014-08-20 |
Family
ID=51311821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410224555.4A Pending CN103997856A (en) | 2014-05-26 | 2014-05-26 | Method for manufacturing high-resistance-value carbon film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103997856A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540329A (en) * | 2014-12-23 | 2015-04-22 | 福州瑞华印制线路板有限公司 | Method for printing carbon film plate carbon key |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN109275264A (en) * | 2018-09-18 | 2019-01-25 | 镇江华印电路板有限公司 | A kind of preparation process of film key carbon film printed circuit board |
| CN110677985A (en) * | 2019-10-25 | 2020-01-10 | 杭州友成电子有限公司 | Carbon film printed board high-conductivity paste resistance value regulation and control method |
| CN112218438A (en) * | 2020-10-26 | 2021-01-12 | 广东合通建业科技股份有限公司 | Method for manufacturing low-resistance carbon oil plate |
-
2014
- 2014-05-26 CN CN201410224555.4A patent/CN103997856A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540329A (en) * | 2014-12-23 | 2015-04-22 | 福州瑞华印制线路板有限公司 | Method for printing carbon film plate carbon key |
| CN104540329B (en) * | 2014-12-23 | 2017-05-17 | 福州瑞华印制线路板有限公司 | Method for printing carbon film plate carbon key |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN104619122B (en) * | 2015-01-05 | 2018-08-17 | 惠州市星之光科技有限公司 | A kind of production method of printed circuit board |
| CN109275264A (en) * | 2018-09-18 | 2019-01-25 | 镇江华印电路板有限公司 | A kind of preparation process of film key carbon film printed circuit board |
| CN110677985A (en) * | 2019-10-25 | 2020-01-10 | 杭州友成电子有限公司 | Carbon film printed board high-conductivity paste resistance value regulation and control method |
| CN112218438A (en) * | 2020-10-26 | 2021-01-12 | 广东合通建业科技股份有限公司 | Method for manufacturing low-resistance carbon oil plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102159029B (en) | Method for making high-frequency aluminium-based circuit board | |
| CN102143656B (en) | Manufacturing method of circuit board made of high-dielectric composite material | |
| CN102137551B (en) | Production method of high-frequency four-layer circuit board | |
| CN102638940A (en) | Preparation method of polytetrafluoroethylene high-frequency circuit board | |
| CN103997856A (en) | Method for manufacturing high-resistance-value carbon film circuit board | |
| CN102638937A (en) | Preparation method of copper-base printed wiring board | |
| CN101902883A (en) | Method for manufacturing microwave high-frequency ceramic circuit board | |
| CN101784162A (en) | Manufacturing method for microwave high frequency metal base circuit board | |
| CN101808464A (en) | Method for manufacturing ultra-long microwave high-frequency circuit board | |
| CN102905471A (en) | Method for manufacturing polytetrafluoroethylene high-frequency circuit board | |
| CN104159404A (en) | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) | |
| CN106455345A (en) | Method of machining burr-free hole of PCB copper-based core board | |
| CN102917546A (en) | Method for manufacturing polytetrafluoroethylene high-frequency circuit board | |
| CN102159031B (en) | Method for making super-long microwave high-frequency circuit board | |
| CN102281716A (en) | Manufacturing method for high frequency super-thick circuit board | |
| CN104582293A (en) | Manufacturing method of ceramic-based circuit board | |
| CN104640378A (en) | Manufacturing method for improving holing yield of high-frequency circuit board | |
| CN102638938A (en) | Manufacturing method of high-intermodulation and high-frequency circuit board | |
| CN102159030A (en) | Making method of high-frequency ultrathin circuit board | |
| CN112654160A (en) | PCB processing technology | |
| CN105163503A (en) | Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing | |
| CN103874333A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN102917544A (en) | Manufacturing method of high-frequency three-layer circuit board with impermeable slot | |
| CN103874331A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN102917545A (en) | Method for manufacturing high-frequency silver immersion circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140820 |