CN102638940A - Preparation method of polytetrafluoroethylene high-frequency circuit board - Google Patents
Preparation method of polytetrafluoroethylene high-frequency circuit board Download PDFInfo
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- CN102638940A CN102638940A CN2012101153132A CN201210115313A CN102638940A CN 102638940 A CN102638940 A CN 102638940A CN 2012101153132 A CN2012101153132 A CN 2012101153132A CN 201210115313 A CN201210115313 A CN 201210115313A CN 102638940 A CN102638940 A CN 102638940A
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Abstract
The invention discloses a preparation method for enhancing the hole-forming yield of a polytetrafluoroethylene high-frequency plate, which comprises the following steps: 1. preparing engineering and light printing information; 2. opening the material, drilling a hole, and metallizing the hole; 3. making a surface pattern; 4. electroplating, and etching; 5. carrying out solder masking and surface weldability treatment; and 6. forming. The invention can be used for preparing a polytetrafluoroethylene circuit board product with a high hole-forming yield and a high-precision circuit, and can effectively enhance the product quality and work efficiency; and the prepared the polytetrafluoroethylene high-frequency circuit board has stable properties.
Description
Technical field
The present invention relates to a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board.
Background technology
Along with the direction of electronic product to miniaturization, digitlization, high frequencyization, high reliabilityization develops, the application of high-frequency circuit board more and more widely.And polytetrafluoroethylene class high frequency plate is because the particularity of sheet material, causes its difficulty very when hole metallization is produced, and traditional handicraft produces that to be prone to take place the PTH number of times of doing over again too much, causes copper thickness ununiformity, etching difficulty, product to be difficult to debug even cause and scrap.
Summary of the invention
The invention provides a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board; The product that this method is made not only precision is high; And the disposable yield of holeization reached 99.9%, effectively improved product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
The present invention has adopted following technical scheme: a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board; It may further comprise the steps: step 1; Carry out engineering, light is painted data make: at first template is carried out graphic designs; The figure that designs is carried out project file according to processing parameter handle, according to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2; Open the making of material, boring, hole metallization: at first with electronic plate shearing machine on request size leave and produce needed polytetrafluoroethylene copper-clad plate, carry out wrapper sheet according to thickness of slab then and form compoboard, get pin hole in the minor face position of compoboard with dowel driving machine; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top; Carry out digital control hole drilling then, bored Kong Houzai the burr and the burr on compoboard surface are handled, and checked; With high frequency plate adjustment agent the hole wall of the compoboard checked is soaked a period of time, carry out the hole pre-treatment then, carry out PTH, carry out a copper facing then, carry out cleaning, drying, inspection after the plating well through inserting frame behind the deburring nog plate; Step 3, the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Through location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Compoboard after adopting 0.9-1.1% sodium carbonate liquor to exposure at last develops, and overhauls; Step 4, plating, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is accomplished, again patterned surface is carried out the electro-coppering thickening successively and handle and zinc-plated anti-etching processing; Compoboard surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; To check the anti-etching tin layer stripping on the good compoboard surfacial pattern at last; Step 5, anti-welding and surperficial solderability is handled: slight polish-brush is carried out on the compoboard surface handle, the compoboard behind the polish-brush is placed in the plasma machine directly carries out the anti-solder ink printing after the processing then, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then that contraposition is good combination board to explosure, the sodium carbonate liquor of employing 1.0-1.2% develops to the compoboard after making public, and overhauls; Carry out hot setting and handle carrying out anti-welding compoboard, spray tin after spraying the tin pre-treatment then, accomplish also inspection of after washing oven dry; Step 6, moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the external form path after the programming, adopt CNC milling machine to carry out moulding and make; Use jetting machine that circuit board is cleaned, dries, checks after moulding is accomplished, obtain the polytetrafluoroethylene high-frequency circuit board of high hole yield.
Adopting resolution in the said step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet; When holing in the said step 2; Compoboard thickness is between 2-4PNL; Getting out the pin hole aperture in the minor face position of compoboard is 3.2mm; Numerical control drilling machine adopts the brill cutter of 110 degree, and the drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, the burr on the compoboard surface after holing are handled; Soaked 30-40 minute with the hole wall of high frequency plate adjustment agent compoboard; In the said step 3 500 purpose running roller polish-brush machines are carried out adopting when polish-brush is handled in the surface of compoboard; Use the 5KW exposure machine to carry out graph exposure; Carry out acid deoiling headed by the process of the pre-electroplating treatment in the said step 4 earlier, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; In the said step 5 800 purpose running roller polish-brush machines are carried out adopting when slight polish-brush is handled in the compoboard surface; Adopt the 7KW exposure machine combination board to explosure good to contraposition; The hot setting of anti-postwelding adopts the segmentation baking method to carry out; The CNC milling cutter that CNC milling machine adopts in the said step 6 is two blade milling cutters.
The present invention has following beneficial effect: the present invention not only can produce the product of high hole yield and high accuracy circuit, has effectively improved product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
Description of drawings
Fig. 1 is a process chart of the present invention.
Embodiment
In Fig. 1; The present invention is a kind of manufacture method of polytetrafluoroethylene high-frequency circuit board; It may further comprise the steps: step 1; Carry out engineering, light is painted data make: at first template is carried out graphic designs; The figure that designs is carried out project file according to processing parameter handle, according to working condition the file of handling well being carried out layout, adopts resolution then is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Re-use 100 times of magnifying glasses the egative film of completing is checked, last serves as that the maternal 5KW of use exposure machine carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2, the making of opening material, boring, hole metallization: at first with electronic plate shearing machine on request size leave and produce needed polytetrafluoroethylene copper-clad plate, carry out wrapper sheet according to thickness of slab then and form compoboard; Pin hole is got with dowel driving machine in minor face position at compoboard, and the compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then; During boring; Compoboard thickness is between 2-4PNL, and getting out the pin hole aperture in the minor face position of compoboard is 3.2mm, and numerical control drilling machine adopts the brill cutter of 110 degree; The drilling hole amount that bores cutter is less than 800 holes; Burr, the burr on the compoboard surface after using the above sand paper of 2000 orders to boring are handled, and bored Kong Houzai the burr and the burr on compoboard surface are handled, and checked; Soaked 30-40 minute with the hole wall of high frequency plate adjustment agent, carry out the hole pre-treatment then, carry out PTH, carry out a copper facing then, carry out cleaning, drying, inspection after the plating well through inserting frame behind the deburring nog plate to the compoboard checked; Step 3, the making of surfacial pattern: at first adopt 500 purpose running roller polish-brush machines that polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Through location hole diazo sheet and compoboard are carried out the figure contraposition, use the 5KW exposure machine to carry out graph exposure; Compoboard after adopting 0.9-1.1% sodium carbonate liquor to exposure at last develops, and overhauls; Step 4; Plating, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is accomplished; Carry out acid deoiling headed by the process of pre-electroplating treatment earlier, through two-stage washing back alligatoring, again through the two-stage washing; Last pickling is carried out the electro-coppering thickening successively to patterned surface again and is handled and zinc-plated anti-etching processing; Compoboard surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; To check the anti-etching tin layer stripping on the good compoboard surfacial pattern at last; Step 5; Anti-welding and surperficial solderability is handled: adopt 800 purpose running roller polish-brush machines that slight polish-brush is carried out on the compoboard surface and handle; Then the compoboard behind the polish-brush is placed in the plasma machine and directly carries out the anti-solder ink printing after the processing, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, adopt the 7KW exposure machine combination board to explosure that contraposition is good then, the sodium carbonate liquor of employing 1.0-1.2% develops to the compoboard after making public, and overhauls; Carry out hot setting and handle carrying out anti-welding compoboard, hot setting adopts the segmentation baking method to carry out, and sprays tin after spraying the tin pre-treatment then, accomplishes also inspection of after washing oven dry; Step 6, moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the external form path after the programming, adopt CNC milling machine to carry out moulding and make, the CNC milling cutter that CNC milling machine adopts is two blade milling cutters; Use jetting machine that circuit board is cleaned, dries, checks after moulding is accomplished, obtain the polytetrafluoroethylene high-frequency circuit board of high hole yield.
Claims (7)
1. the manufacture method of a polytetrafluoroethylene high-frequency circuit board is characterized in that it may further comprise the steps:
Step 1; Carry out engineering, light is painted data make: at first template is carried out graphic designs; The figure that designs is carried out project file according to processing parameter to be handled; According to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked;
Step 2; Open the making of material, boring, hole metallization: at first with electronic plate shearing machine on request size leave and produce needed polytetrafluoroethylene copper-clad plate, carry out wrapper sheet according to thickness of slab then and form compoboard, get pin hole in the minor face position of compoboard with dowel driving machine; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top; Carry out digital control hole drilling then, bored Kong Houzai the burr and the burr on compoboard surface are handled, and checked; With high frequency plate adjustment agent the hole wall of the compoboard checked is soaked a period of time, carry out the hole pre-treatment then, carry out PTH, carry out a copper facing then, carry out cleaning, drying, inspection after the plating well through inserting frame behind the deburring nog plate;
Step 3, the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Through location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Compoboard after adopting 0.9-1.1% sodium carbonate liquor to exposure at last develops, and overhauls;
Step 4, plating, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is accomplished, again patterned surface is carried out the electro-coppering thickening successively and handle and zinc-plated anti-etching processing; Compoboard surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; To check the anti-etching tin layer stripping on the good compoboard surfacial pattern at last;
Step 5, anti-welding and surperficial solderability is handled: slight polish-brush is carried out on the compoboard surface handle, the compoboard behind the polish-brush is placed in the plasma machine directly carries out the anti-solder ink printing after the processing then, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then that contraposition is good combination board to explosure, the sodium carbonate liquor of employing 1.0-1.2% develops to the compoboard after making public, and overhauls; Carry out hot setting and handle carrying out anti-welding compoboard, spray tin after spraying the tin pre-treatment then, accomplish also inspection of after washing oven dry;
Step 6, moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the external form path after the programming, adopt CNC milling machine to carry out moulding and make; Use jetting machine that circuit board is cleaned, dries, checks after moulding is accomplished, obtain the polytetrafluoroethylene high-frequency circuit board of high hole yield.
2. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1, it is characterized in that in the said step 1 adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet.
3. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1; When it is characterized in that holing in the said step 2; Compoboard thickness is between 2-4PNL, and getting out the pin hole aperture in the minor face position of compoboard is 3.2mm, and numerical control drilling machine adopts the brill cutter of 110 degree; The drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, the burr on the compoboard surface after holing are handled; Soaked 30-40 minute with the hole wall of high frequency plate adjustment agent compoboard.
4. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that in the said step 3 500 purpose running roller polish-brush machines being carried out adopting when polish-brush is handled in the surface of compoboard; Use the 5KW exposure machine to carry out graph exposure.
5. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that carrying out acid deoiling earlier headed by the process of the pre-electroplating treatment in the said step 4, through two-stage washing back alligatoring, and again through the two-stage washing, last pickling.
6. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that in the said step 5 800 purpose running roller polish-brush machines being carried out adopting when slight polish-brush is handled in the compoboard surface; Adopt the 7KW exposure machine combination board to explosure good to contraposition; The hot setting of anti-postwelding adopts the segmentation baking method to carry out.
7. the manufacture method of a kind of polytetrafluoroethylene high-frequency circuit board according to claim 1 is characterized in that the CNC milling cutter that CNC milling machine adopts in the said step 6 is two blade milling cutters.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101153132A CN102638940A (en) | 2012-04-19 | 2012-04-19 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101153132A CN102638940A (en) | 2012-04-19 | 2012-04-19 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN102905471A (en) * | 2012-10-21 | 2013-01-30 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN102917545A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing high-frequency silver immersion circuit board |
| CN102917546A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN103025086A (en) * | 2012-12-28 | 2013-04-03 | 广州杰赛科技股份有限公司 | PCB (printed circuit board) plasma treatment method |
| CN103687309A (en) * | 2012-09-24 | 2014-03-26 | 广东兴达鸿业电子有限公司 | Production process for high-frequency circuit board |
| CN103945648A (en) * | 2013-11-06 | 2014-07-23 | 广东兴达鸿业电子有限公司 | Production technology for high-frequency circuit board |
| CN103987196A (en) * | 2014-05-26 | 2014-08-13 | 蔡新民 | Method for manufacturing wet film circuit board free of roast |
| CN104640378A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Manufacturing method for improving holing yield of high-frequency circuit board |
| CN104640353A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing ceramic-based printed circuit board |
| CN104640351A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
| CN104640352A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing circuit board with high-density and high-definition characters |
| CN109195334A (en) * | 2018-10-16 | 2019-01-11 | 江苏迪飞达电子有限公司 | A kind of 5G communication manufacture craft of high frequency plate |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
| CN110754141A (en) * | 2017-05-30 | 2020-02-04 | 阿莫绿色技术有限公司 | Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by the same |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
Citations (1)
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| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
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2012
- 2012-04-19 CN CN2012101153132A patent/CN102638940A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821551B (en) * | 2012-08-28 | 2015-06-03 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN103687309A (en) * | 2012-09-24 | 2014-03-26 | 广东兴达鸿业电子有限公司 | Production process for high-frequency circuit board |
| CN103687309B (en) * | 2012-09-24 | 2016-12-21 | 广东兴达鸿业电子有限公司 | A kind of production technology of high-frequency circuit board |
| CN102905471A (en) * | 2012-10-21 | 2013-01-30 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN102917545A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing high-frequency silver immersion circuit board |
| CN102917546A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN103025086A (en) * | 2012-12-28 | 2013-04-03 | 广州杰赛科技股份有限公司 | PCB (printed circuit board) plasma treatment method |
| CN104640378A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Manufacturing method for improving holing yield of high-frequency circuit board |
| CN104640353A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing ceramic-based printed circuit board |
| CN104640351A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
| CN104640352A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing circuit board with high-density and high-definition characters |
| CN103945648A (en) * | 2013-11-06 | 2014-07-23 | 广东兴达鸿业电子有限公司 | Production technology for high-frequency circuit board |
| CN103945648B (en) * | 2013-11-06 | 2017-01-04 | 广东兴达鸿业电子有限公司 | A kind of high-frequency circuit board production technology |
| CN103987196A (en) * | 2014-05-26 | 2014-08-13 | 蔡新民 | Method for manufacturing wet film circuit board free of roast |
| CN110754141A (en) * | 2017-05-30 | 2020-02-04 | 阿莫绿色技术有限公司 | Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by the same |
| CN109195334A (en) * | 2018-10-16 | 2019-01-11 | 江苏迪飞达电子有限公司 | A kind of 5G communication manufacture craft of high frequency plate |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
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Application publication date: 20120815 Assignee: TAIZHOU JINDING ELECTRONIC CO., LTD. Assignor: Cai Xinmin Contract record no.: 2013320000370 Denomination of invention: Method for manufacturing polytetrafluoroethylene high-frequency circuit board License type: Exclusive License Record date: 20130425 |
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