CN104640351A - Method for manufacturing high-insulation-resistance and high-frequency circuit board - Google Patents
Method for manufacturing high-insulation-resistance and high-frequency circuit board Download PDFInfo
- Publication number
- CN104640351A CN104640351A CN201310548296.6A CN201310548296A CN104640351A CN 104640351 A CN104640351 A CN 104640351A CN 201310548296 A CN201310548296 A CN 201310548296A CN 104640351 A CN104640351 A CN 104640351A
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- Prior art keywords
- frequency
- circuit board
- plate
- frequency circuit
- resistance value
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a high-insulation-resistance and high-frequency circuit board. The method comprises a first step of manufacturing engineering and light painting materials, a second step of cutting and drilling, a third step of manufacturing a surface pattern, a fourth step of electroplating and etching, a fifth step of cleaning the surface of a substrate, and a sixth step of forming. By adopting the method for manufacturing a high-insulation-resistance and high-frequency circuit board provided by the invention, a high-insulation-resistance and high-frequency circuit board with high precision can be manufactured, the product quality and working efficiency are effectively improved, and a high-insulation-resistance and high-frequency circuit board manufactured by the method has stable and reliable performance.
Description
Technical field
The present invention relates to a kind of manufacture method of high insulating resistance value high-frequency circuit board.
Background technology
Along with electronic product is to the future development of miniaturization, digitlization, lightening, high frequency, high reliability, high-frequency ultrathin circuit board is except having the excellent high-fire resistance of common high-frequency circuit board, high-cooling property, excellent dimensional stability, have more high frequency, lightening, insulating medium layer has good intensity, pliability and resistance to high puncture voltage.But the dielectric constant of domestic manufacturer's production is at present in the high frequency Teflon material copper-clad plate of 3.0-3.5, production routinely, manufacture method and technique, very easily the insulating resistance value of circuit for generating plate reduces, and does not reach the demand of high-frequency microwave product.
Summary of the invention
The invention provides a kind of manufacture method of high insulating resistance value high-frequency circuit board, it is high that it not only makes precision, effectively improves product quality and operating efficiency, and the stable performance of obtained high insulating resistance value high-frequency circuit board.
Present invention employs following technical scheme: a kind of manufacture method of high insulating resistance value high-frequency circuit board, it comprises the following steps: step one: carry out engineering, light paints data make: first adopt and carry out graphic designs to template, then the figure designed is carried out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked, finally again with the egative film checked for female parent carries out diazo sheet copy, and the diazo sheet copied to be checked; Step 2: the making of sawing sheet, boring: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size; Then according to thickness of slab, high-frequency copper-clad plate is carried out wrapper sheet and form compoboard, get pin hole in the minor face position of compoboard; The compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, again the burr on compoboard surface and batch cutting edge of a knife or a sword are processed after boring, finally check; Step 3: the making of surfacial pattern: first polish-brush process is carried out to the surface of high-frequency copper-clad plate, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and high-frequency copper-clad plate are carried out figure contraposition, exposure; Finally adopt the sodium carbonate liquor of 0.9-1.0% to develop to the plate after exposure, the high-frequency copper-clad plate after development is overhauled; Step 4: to plating, etching making: pre-electroplating treatment is carried out on the high frequency plate surface completed by Graphic transitions, then to patterned surface carry out successively electro-coppering thicken process and gold-plated; Again by the high frequency plate surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the high frequency plate after etching, repaiies plate; Step 5: the cleaning of substrate surface is made: by the high frequency plate DI water soaking 8-12 hour checked, then with Ultrasonic Cleaning process 20-40 minute; With 150 DEG C of baking sheet 120-240 minute after cleaning, drying; Step 6: shaping making: first adopt the shape fabricating of numerical control mill software to high frequency plate to programme, and simulation test is carried out to the profile path after programming, simulate errorless rear employing CNC milling machine and carry out shaping making; Shaping complete after use cleaning machine carry out cleaning, dry, check, obtain the high-frequency circuit board of high insulating resistance value.
Resolution is adopted to be that the high precision laser drawing mechanism of 20240dpi makes black egative film in described step one; Use 200 times of magnifying glasses to check egative film, use 3KW exposure machine copy diazo sheet; Boring in described step 2 is 2-4 borings, the pin hole aperture got out in the minor face position of high-frequency copper-clad plate is 3.2mm, numerical control drilling machine adopts the drill of 45 degree, the drilling hole amount of drill is less than 500 holes, and boring uses the surface spikes of sand paper to high frequency plate of more than 2000 orders afterwards, batch cutting edge of a knife or a sword processes; Adopt 800 object running roller scrubbers to carry out polish-brush process to the surface of high frequency plate in described step 3, use 5KW exposure machine to carry out graph exposure; First acid deoiling is carried out, alligatoring after two-stage washing headed by the process of the pre-electroplating treatment in described step 4, then through two-stage washing, last pickling; Adopt DI water soaking after 8-12 hour to substrate surface cleaning in described step 5, then with Ultrasonic Cleaning process 20-40 minute, finally use 150 DEG C of baking sheet 120-240 minute; In described step 6 during shaping making, CNC milling cutter adopts two blade milling cutters at 110 degree of angles.
The present invention has following beneficial effect: the present invention adopts the highest drilling hole amount of drill to control below 500 holes in manufacturing process, effectively can solve the generation of the coarse and aperture displacement problem of aperture burr, hole wall like this, improve and make precision, and the stable performance of circuit board.
Embodiment
The present invention is a kind of manufacture method of high insulating resistance value high-frequency circuit board, it comprises the following steps: step one: carry out engineering, light paints data make: first adopt and carry out graphic designs to template, then will design figure and carry out project file process according to processing parameter, then according to working condition, layout carried out to the file handled well, adopt resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Use 200 times of magnifying glasses to check egative film to the egative film of completing again, finally carry out diazo sheet copy with the egative film checked for female parent uses 3KW exposure machine to copy diazo sheet again, and the diazo sheet copied is checked.Step 2: the making of sawing sheet, boring: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size; Then according to thickness, high-frequency copper-clad plate is carried out wrapper sheet and form compoboard, get pin hole in the minor face position of compoboard, pin hole aperture is 3.2mm; The compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, numerical control drilling machine adopts the drill of 45 degree, the drilling hole amount of drill is less than 500 holes, then digital control hole drilling is carried out, the sand paper re-using more than 2000 orders after boring processes compoboard surface spikes, batch cutting edge of a knife or a sword, finally checks.Step 3: the making of surfacial pattern: first adopt 800 object running roller scrubbers to carry out polish-brush process to the surface of compoboard, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and compoboard carried out figure contraposition, use 5KW exposure machine to carry out graph exposure exposure; Finally adopt the sodium carbonate liquor of 0.9-1.0% to develop to the compoboard after exposure, the compoboard after development is overhauled.Step 4: the making to plating, etching: pre-electroplating treatment is carried out on the high frequency plate surface completed by Graphic transitions, first carries out acid deoiling headed by the process of pre-electroplating treatment, alligatoring after two-stage washing, then through two-stage washing, last pickling; Again to patterned surface carry out successively electro-coppering thicken process and gold-plated; Again by the high frequency plate surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the high frequency plate after etching, repaiies plate; Step 5: shaping making: first adopt the shape fabricating of numerical control mill software to high frequency plate to programme, and simulation test is carried out to the profile path after programming, simulating errorless rear employing CNC milling machine and carry out shaping making, when carrying out shaping making, adopting two blade milling cutters at 110 degree of angles to carry out; Shaping complete after use cleaning machine carry out cleaning, dry, check, obtain high insulating resistance value high-frequency circuit board.
Claims (7)
1. a manufacture method for high insulating resistance value high-frequency circuit board, is characterized in that comprising the following steps:
Step one: carry out engineering, light paints data make: first adopt and graphic designs is carried out to template, then will design figure and carry out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked, finally again with the egative film checked for female parent carries out diazo sheet copy, and the diazo sheet copied to be checked;
Step 2: the making of sawing sheet, boring: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size; Then according to thickness of slab, high-frequency copper-clad plate is carried out wrapper sheet and form compoboard, get pin hole in the minor face position of compoboard; The compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, again the burr on compoboard surface and batch cutting edge of a knife or a sword are processed after boring, finally check;
Step 3: the making of surfacial pattern: first polish-brush process is carried out to the surface of high-frequency copper-clad plate, then wet film printing is carried out to its surface, baking; By location hole, diazo sheet and high-frequency copper-clad plate are carried out figure contraposition, exposure; Finally adopt the sodium carbonate liquor of 0.9-1.0% to develop to the plate after exposure, the high-frequency copper-clad plate after development is overhauled;
Step 4: to plating, etching making: pre-electroplating treatment is carried out on the high frequency plate surface completed by Graphic transitions, then to patterned surface carry out successively electro-coppering thicken process and gold-plated; Again by the high frequency plate surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the high frequency plate after etching, repaiies plate;
Step 5: the cleaning of substrate surface is made: by the high frequency plate DI water soaking 8-12 hour checked, then with Ultrasonic Cleaning process 20-40 minute; With 150 DEG C of baking sheet 120-240 minute after cleaning, drying;
Step 6: shaping making: first adopt the shape fabricating of numerical control mill software to high frequency plate to programme, and simulation test is carried out to the profile path after programming, simulate errorless rear employing CNC milling machine and carry out shaping making; Shaping complete after use cleaning machine carry out cleaning, dry, check, obtain the high-frequency circuit board of high insulating resistance value.
2. the manufacture method of high insulating resistance value high-frequency circuit board according to claim 1, is characterized in that adopting in described step one resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film; Use 200 times of magnifying glasses to check egative film, use 3KW exposure machine copy diazo sheet.
3. the manufacture method of high insulating resistance value high-frequency circuit board according to claim 1, it is characterized in that the boring in described step 2 is 2-4 borings, the pin hole aperture got out in the minor face position of high-frequency copper-clad plate is 3.2mm, numerical control drilling machine adopts the drill of 45 degree, the drilling hole amount of drill is less than 500 holes, uses the sand paper of more than 2000 orders that high frequency plate surface spikes, hole are criticized to cutting edge of a knife or a sword and processed after boring.
4. the manufacture method of high insulating resistance value high-frequency circuit board according to claim 1, is characterized in that adopting 800 object running roller scrubbers to carry out polish-brush process to the surface of high frequency plate in described step 3; 5KW exposure machine is used to carry out graph exposure.
5. the manufacture method of high insulating resistance value high-frequency circuit board according to claim 1, first carries out acid deoiling headed by the process that it is characterized in that the pre-electroplating treatment in described step 4, alligatoring after two-stage washing, then through two-stage washing, last pickling.
6. the manufacture method of high insulating resistance value high-frequency circuit board according to claim 1, it is characterized in that adopting DI water soaking after 8-12 hour to substrate surface cleaning in described step 5, again with Ultrasonic Cleaning process 20-40 minute, finally use 150 DEG C of baking sheet 120-240 minute.
7. the manufacture method of high insulating resistance value high-frequency circuit board according to claim 1, when it is characterized in that shaping making in described step 6, CNC milling cutter adopts two blade milling cutters at 110 degree of angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548296.6A CN104640351A (en) | 2013-11-06 | 2013-11-06 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548296.6A CN104640351A (en) | 2013-11-06 | 2013-11-06 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN104640351A true CN104640351A (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310548296.6A Pending CN104640351A (en) | 2013-11-06 | 2013-11-06 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
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| CN (1) | CN104640351A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0051174A2 (en) * | 1980-11-04 | 1982-05-12 | Siemens Aktiengesellschaft | Electrode for a plasma etchings plant |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN102159031A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Method for making super-long microwave high-frequency circuit board |
| CN102281716A (en) * | 2011-05-31 | 2011-12-14 | 蔡新民 | Manufacturing method for high frequency super-thick circuit board |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
-
2013
- 2013-11-06 CN CN201310548296.6A patent/CN104640351A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0051174A2 (en) * | 1980-11-04 | 1982-05-12 | Siemens Aktiengesellschaft | Electrode for a plasma etchings plant |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN102159031A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Method for making super-long microwave high-frequency circuit board |
| CN102281716A (en) * | 2011-05-31 | 2011-12-14 | 蔡新民 | Manufacturing method for high frequency super-thick circuit board |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
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Application publication date: 20150520 |
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