CN102159031B - Method for making super-long microwave high-frequency circuit board - Google Patents
Method for making super-long microwave high-frequency circuit board Download PDFInfo
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- CN102159031B CN102159031B CN 201110066610 CN201110066610A CN102159031B CN 102159031 B CN102159031 B CN 102159031B CN 201110066610 CN201110066610 CN 201110066610 CN 201110066610 A CN201110066610 A CN 201110066610A CN 102159031 B CN102159031 B CN 102159031B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000005553 drilling Methods 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 12
- 238000003801 milling Methods 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 12
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 11
- 238000013461 design Methods 0.000 claims description 9
- 238000003618 dip coating Methods 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 244000137852 Petrea volubilis Species 0.000 claims description 3
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 238000004088 simulation Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 230000008719 thickening Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008774 maternal effect Effects 0.000 description 1
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Abstract
The invention discloses a method for making a super-long microwave high-frequency circuit board. The method comprises the following steps of: 1, making engineering and photo-plotting data; 2, cutting and drilling holes; 3, making surface patterns; 4, electroplating and etching; 5, carrying out welding preventing and surface weldable processing; and 6, molding. The products with high accuracy can be made by using the method, the product quality and the work efficiency are effectively improved, and the performance of the made high-frequency circuit board is stable.
Description
Technical field
The present invention relates to a kind of manufacture method of ultra-long microwave high-frequency circuit board.
Background technology
Along with the direction of electronic product to miniaturization, digitlization, high frequencyization, high reliabilityization develops; High frequency metal base circuit board is except having the good high-fire resistance of common metal base circuit board, high-cooling property, excellent size stability; Have more high frequencyization, insulating medium layer has good intensity, pliability and anti-high puncture voltage.
Summary of the invention
The invention provides a kind of manufacture method of ultra-long microwave high-frequency circuit board, it not only makes the precision height, has effectively improved product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
The present invention has adopted following technical scheme: a kind of manufacture method of ultra-long microwave high-frequency circuit board; It may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs; To design figure then and carry out the project file processing according to processing parameter; According to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the copper-clad plate of needed 1.8 meters high frequency overlength with electronic plate shearing machine; Carry out wrapper sheet according to thickness of slab then and form compoboard, wrap the back and get pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, bored Kong Houzai the burr and batch cutting edge of a knife or a sword on surface are handled, check at last; Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Through location hole diazo sheet and 1 compoboard are carried out figure contraposition, exposure; Adopt the sodium carbonate liquor of 0.9-1.1% that the compoboard after making public is developed at last, and overhaul; Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is accomplished, again patterned surface is carried out the electro-coppering thickening successively and handle and zinc-plated anti-etching processing; Plate surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; To check the anti-etching tin layer stripping on the good compoboard surfacial pattern at last; Step 5: anti-welding and surperficial solderability is handled: slight polish-brush is carried out on the compoboard surface handle, the compoboard behind the polish-brush is placed in the plasma machine directly carries out the anti-solder ink printing after the processing then, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition according to location hole and figure, then that contraposition is good combination board to explosure adopts the sodium carbonate liquor of 1.0-1.2% that the compoboard after making public is developed, and overhauls; Carry out cured behind the high temperature with carrying out anti-welding plate, carry out dip-coating oxygen-proof film after the pre-electroplating treatment then, accomplish also inspection dip-coating effect of after washing oven dry; Step 6: moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding then and make; Use jetting machine to clean, dry, check after moulding is accomplished, obtain 1.8 meters ultra-long microwave high-frequency circuit board at last.
Adopting resolution in the said step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, uses 100 times of magnifying glasses that egative film is checked, uses the 3KW exposure machine to copy diazo sheet; During boring in the said step 2 six mutual borings; Get out the pin hole that the aperture is 3.2mm in the minor face position of compoboard; Numerical control drilling machine adopts the brill cutter of 110 degree; The drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword on ultra-long microwave high-frequency circuit board surface are handled; Adopting 500 purpose running roller polish-brush machines to carry out polish-brush in the said step 3 handles; Use the 5KW exposure machine to carry out graph exposure; Carry out acid deoiling headed by the process of the pre-electroplating treatment in the said step 4 earlier, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; Adopting 800 purpose running roller polish-brush machines that slight polish-brush is carried out on the compoboard surface in the said step 5 handles; Adopt the 7KW exposure machine that anti-welding figure is made public; The CNC milling cutter of CNC milling machine is two blade milling cutters in the said step 6, adopts six mutual electric router modes to carry out when moulding is milled in numerical control.
The present invention has following beneficial effect: the present invention not only can produce the high product of precision, has effectively improved product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
Description of drawings
Fig. 1 is a process chart of the present invention
Embodiment
In Fig. 1; A kind of manufacture method of ultra-long microwave high-frequency circuit board; It may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs; To design figure then and carry out the project file processing according to processing parameter; According to working condition the file of handling well being carried out layout, adopts resolution then is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Re-use 100 times of magnifying glasses the egative film of completing is checked, last serves as that the maternal 3KW of use exposure machine carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked.Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the copper-clad plate of needed 1.8 meters high frequency overlength with electronic plate shearing machine; Carry out wrapper sheet according to thickness of slab then and form compoboard, wrap the back and adopt six mutual borings in the minor face position of compoboard, the aperture of getting is the pin hole of 3.2mm; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top; Carry out digital control hole drilling then; Numerical control drilling machine adopts the brill cutter of 110 degree; The drilling hole amount that bores cutter is less than 800 holes, has bored use behind the hole the above sand paper of 2000 orders to the surperficial burr of compoboard, criticize cutting edge of a knife or a sword and handle, check at last.Step 3: the making of surfacial pattern: at first handle, then the wet film printing is carried out on its surface, baking to adopting 500 purpose running roller polish-brush machines that polish-brush is carried out on the surface of compoboard; Through location hole diazo sheet and 1 compoboard are carried out the figure contraposition, use the 5KW exposure machine to carry out graph exposure; Adopt the sodium carbonate liquor of 0.9-1.1% that the compoboard after making public is developed at last, and overhaul.Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is accomplished, carries out acid deoiling earlier headed by the process of pre-electroplating treatment, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; Again patterned surface being carried out the electro-coppering thickening successively handles and zinc-plated anti-etching processing; Plate surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; To check the anti-etching tin layer stripping on the good compoboard surfacial pattern at last.Step 5: anti-welding and surperficial solderability is handled: adopt 800 purpose running roller polish-brush machines that slight polish-brush is carried out on the compoboard surface and handle; Then the compoboard behind the polish-brush is placed in the plasma machine and directly carries out the anti-solder ink printing after the processing, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition based on locating hole and figure, adopt the 7KW exposure machine combination board to explosure that contraposition is good then, adopt the sodium carbonate liquor of 1.0-1.2% that the compoboard after making public is developed, and overhaul; Carry out cured behind the high temperature with carrying out anti-welding plate, carry out dip-coating oxygen-proof film after the pre-electroplating treatment then, accomplish also inspection dip-coating effect of after washing oven dry.Step 6: moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed; And to the programming after the profile path carry out simulation test; The CNC milling cutter that adopts CNC milling machine to carry out moulding making CNC milling machine then is two blade milling cutters, adopts six mutual electric router modes to carry out when moulding is milled in numerical control; Use jetting machine to clean, dry, check after moulding is accomplished, obtain 1.8 meters ultra-long microwave high-frequency circuit board at last.
Claims (6)
1. the manufacture method of a ultra-long microwave high-frequency circuit board, it may further comprise the steps:
Step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs; To design figure then and carry out the project file processing according to processing parameter; According to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked;
Step 2: the making of opening material, boring: at first leave by singly requirement size of flow process and produce the copper-clad plate of needed 1.8 meters high frequency overlength with electronic plate shearing machine; Carry out wrapper sheet according to thickness of slab then and form compoboard, wrap the back and get pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, bored Kong Houzai the burr and batch cutting edge of a knife or a sword on surface are handled, check at last;
Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Through location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopt the sodium carbonate liquor of 0.9-1.1% that the compoboard after making public is developed at last, and overhaul;
Step 4: to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface that figure transfer is accomplished, carries out acid deoiling earlier headed by the process of pre-electroplating treatment, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; Again patterned surface being carried out the electro-coppering thickening successively handles and zinc-plated anti-etching processing; Plate surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; To check the anti-etching tin layer stripping on the good compoboard surfacial pattern at last;
Step 5: anti-welding and surperficial solderability is handled: slight polish-brush is carried out on the compoboard surface handle, then the compoboard behind the polish-brush is placed in the plasma machine and directly carries out the anti-solder ink printing after the processing, be put into the low temperature baking oven after being completed for printing and toast; Carry out contraposition based on locating hole and figure, then that contraposition is good combination board to explosure adopts the sodium carbonate liquor of 1.0-1.2% that the compoboard after making public is developed, and overhauls; Carry out cured behind the high temperature with carrying out anti-welding plate; Carry out pre-electroplating treatment then, carry out acid deoiling earlier headed by the process of pre-electroplating treatment, through two-stage washing back alligatoring; Again through the two-stage washing; Last pickling, dip-coating oxygen-proof film after the pre-electroplating treatment is accomplished after washing oven dry and inspection dip-coating effect;
Step 6: moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding then and make; Use jetting machine to clean, dry, check after moulding is accomplished, obtain 1.8 meters ultra-long microwave high-frequency circuit board at last.
2. the manufacture method of ultra-long microwave high-frequency circuit board according to claim 1; It is characterized in that in the said step 1 adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 3KW exposure machine copy diazo sheet.
3. the manufacture method of ultra-long microwave high-frequency circuit board according to claim 1; When it is characterized in that holing in the said step 2 six mutual borings; Get out the pin hole that the aperture is 3.2mm in the minor face position of compoboard; Numerical control drilling machine adopts the brill cutter of 110 degree, and the drilling hole amount that bores cutter is less than 800 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword on ultra-long microwave high-frequency circuit board surface are handled.
4. the manufacture method of ultra-long microwave high-frequency circuit board according to claim 1 is characterized in that adopting in the said step 3 500 purpose running roller polish-brush machines to carry out polish-brush and handles; Use the 5KW exposure machine to carry out graph exposure.
5. the manufacture method of ultra-long microwave high-frequency circuit board according to claim 1 is characterized in that adopting in the said step 5 800 purpose running roller polish-brush machines that slight polish-brush is carried out on the compoboard surface and handles; Adopt the 7KW exposure machine that anti-welding figure is made public.
6. the manufacture method of ultra-long microwave high-frequency circuit board according to claim 1 is characterized in that the CNC milling cutter of CNC milling machine in the said step 6 is two blade milling cutters, adopts six mutual electric router modes to carry out when moulding is milled in numerical control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110066610 CN102159031B (en) | 2011-03-16 | 2011-03-16 | Method for making super-long microwave high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110066610 CN102159031B (en) | 2011-03-16 | 2011-03-16 | Method for making super-long microwave high-frequency circuit board |
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| CN102159031A CN102159031A (en) | 2011-08-17 |
| CN102159031B true CN102159031B (en) | 2012-12-05 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711379A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency microwave super-long circuit soft board |
| CN104640351A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
| CN104333980B (en) * | 2014-12-02 | 2019-01-22 | 深圳市博敏电子有限公司 | A kind of overlength wiring board graph transfer method |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
| CN113207227A (en) * | 2021-03-29 | 2021-08-03 | 北京无线电测量研究所 | Microwave substrate manufacturing method |
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|---|---|---|---|---|
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN101902883A (en) * | 2010-07-16 | 2010-12-01 | 施吉连 | Method for manufacturing microwave high-frequency ceramic circuit board |
-
2011
- 2011-03-16 CN CN 201110066610 patent/CN102159031B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN101902883A (en) * | 2010-07-16 | 2010-12-01 | 施吉连 | Method for manufacturing microwave high-frequency ceramic circuit board |
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Application publication date: 20110817 Assignee: TAIZHOU JINDING ELECTRONIC CO., LTD. Assignor: Cai Xinmin Contract record no.: 2013320000370 Denomination of invention: Method for manufacturing ultra-long microwave high-frequency circuit board Granted publication date: 20121205 License type: Exclusive License Record date: 20130425 |
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Effective date of registration: 20160704 Address after: 225327 chemical industry zone, Yongan Town, high port area, Taizhou, Jiangsu Patentee after: TAIZHOU JINDING ELECTRONIC CO., LTD. Address before: 225327 No. 9, planning road, Gao Yong pharmaceutical chemical industrial park, Yongan Town, high port area, Jiangsu, Taizhou Patentee before: Cai Xinmin |