CN102905471A - Method for manufacturing polytetrafluoroethylene high-frequency circuit board - Google Patents
Method for manufacturing polytetrafluoroethylene high-frequency circuit board Download PDFInfo
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- CN102905471A CN102905471A CN2012104002632A CN201210400263A CN102905471A CN 102905471 A CN102905471 A CN 102905471A CN 2012104002632 A CN2012104002632 A CN 2012104002632A CN 201210400263 A CN201210400263 A CN 201210400263A CN 102905471 A CN102905471 A CN 102905471A
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Abstract
The invention discloses a method for manufacturing a polytetrafluoroethylene high-frequency circuit board. The method comprises the following steps of: (1) manufacturing engineering and light painting information; (2) cutting, drilling and carrying out hole metallization; (3) manufacturing surface patterns; (4) electroplating and etching; (5) carrying out surface weldability treatment; and (6) molding. The method for manufacturing the polytetrafluoroethylene high-frequency circuit board, disclosed by the invention, has the advantages that the manufacturing accuracy is high, the product quality and the work efficiency are effectively increased, and the manufactured high-frequency circuit board has stable performance.
Description
Technical field
The present invention relates to a kind of manufacture method of polytetrafluoroethylene HF link plate.
Background technology
Along with the future development of electronic product to high frequency, high reliability, 3G, 4G communication with high-frequency circuit board except having the good high-fire resistance of ordinary circuit board, high-cooling property, excellent dimensional stability, have more high frequency, insulating medium layer has good intensity, pliability and anti-high puncture voltage; Because the 4G communication base station is unconventional overlength wiring board with antenna circuit board mostly, along with the upgrading raising of mechanics of communication, more existing overlength wiring boards begin to have the requirement of plated-through hole at present.Because overlength wiring board long (mostly being more than 1 meter), this has brought difficulty for the producer that does not have corresponding hole equipment.If carry out twice PTH and twice thickening copper facing, can make the end copper thickness of high frequency plate become inhomogeneous, thereby bring difficulty for follow-up circuit etching, and so that the performance inconsistency of HF link panel products increase, when serious even can't use.
Summary of the invention
The invention provides a kind of manufacture method of polytetrafluoroethylene HF link plate, it is high that it not only makes precision, Effective Raise product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
The present invention has adopted following technical scheme: a kind of manufacture method of polytetrafluoroethylene HF link plate, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, the figure that designs is carried out project file according to processing parameter to be processed, then according to working condition the file of handling well is carried out layout, makes the black egative film, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked, copy as female parent carries out diazo sheet take the egative film that checks again at last, and the diazo sheet that copies is checked, splices; Step 2: the making of opening material, boring, hole metallization: at first leave by singly requirement size of flow process with electric plate shearer and produce needed polytetrafluoroethylene high-frequency copper-clad plate, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got with dowel driving machine in minor face position at compoboard, the compoboard of accomplishing fluently pin hole is fixed on the CNC milling machine work top, then carry out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, and checked; After checking that good compoboard carries out the hole processing, divide two sections to carry out PTH through inserting frame behind the deburring nog plate, then the plate behind the PTH is carried out nog plate and process, then carry out a copper facing, carry out cleaning, drying, inspection after plating is good, produce resist ink at compoboard after the wet film printing; Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and process, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopting at last volume ratio is that 0.9-1.1% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Step 4: plating, etched making: figure is shifted the compoboard surface of finishing carry out pre-electroplating treatment, again patterned surface is carried out the electro-coppering thickening successively and process and zinc-plated anti-etching processing; Compoboard surface resist ink stripping after will processing again, then the figure of foundation design checks, repaiies plate to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern; Then with the anti-etching tin layer stripping on the compoboard surfacial pattern of passed examination; Step 5: surperficial solderability is processed: carry out the dip-coating oxygen-proof film after the compoboard process oil removing after line pattern is completed, washing, microetch, the washing and process, then oven dry checks; Step 6: moulding is made: at first adopt numerical control mill software that the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding and make; The use jetting machine cleaned, dries, checks circuit board after moulding was finished, and obtained polytetrafluoroethylene HF link plate.
Adopting resolution in the described step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet; When holing in the described step 2, getting out the pin hole aperture in the minor face position of compoboard is that then 3.2mm adopts the boring of two blade milling cutters with CNC milling machine, the drilling hole amount of milling cutter is less than 500 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword on the compoboard surface after holing are processed; Divide first two sections to carry out PTH plate during hole metallization, after then plate being processed with 320 order nylon bruss nog plates again clamping plate once thicken copper facing; Adopting 500 purpose running roller scrubbers that polish-brush is carried out on the surface of compoboard in the described step 3 processes; Use the 5KW exposure machine to carry out graph exposure; Carry out first acid deoiling headed by the process of the pre-electroplating treatment in the described step 4, through alligatoring after the two-stage washing, again through the two-stage washing, last pickling; The CNC milling cutter that CNC milling machine adopts in the described step 6 is two blade milling cutters.
The present invention has following beneficial effect: the product that the present invention produces not only precision is high, Effective Raise product quality and operating efficiency, and the stable performance of the high-frequency circuit board that makes.
Description of drawings
Fig. 1 is process chart of the present invention.
Embodiment
In Fig. 1, the present invention is a kind of manufacture method of polytetrafluoroethylene HF link plate, it may further comprise the steps: step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, the figure that designs is carried out project file according to processing parameter to be processed, then according to working condition the file of handling well being carried out layout, adopts resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that uses 100 times of magnifying glasses that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked, copy as the maternal 5KW of use exposure machine carries out diazo sheet take the egative film that checks again at last, and the diazo sheet that copies is checked, splices; Step 2: open material, boring, the making of hole metallization: at first leave by singly requirement size of flow process with electric plate shearer and produce needed polytetrafluoroethylene high-frequency copper-clad plate, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got with dowel driving machine in minor face position at compoboard, nail aperture, hole is 3.2mm, the compoboard of accomplishing fluently pin hole is fixed on the CNC milling machine work top, then adopt two blade milling cutters to carry out digital control hole drilling, the drilling hole amount of milling cutter is less than 500 holes, bored the sand paper that re-uses more than 2000 orders behind the hole burr and batch cutting edge of a knife or a sword on compoboard surface have been processed, and checked; To check that good compoboard carries out dividing two sections to carry out PTH through inserting frame behind the deburring nog plate after the hole processes, then the plate behind the PTH is carried out carrying out a copper facing after nog plate processes with 320 order nylon brusses, carry out cleaning, drying, inspection after the plating well; Step 3: the making of surfacial pattern: at first adopt 500 purpose running roller scrubbers that polish-brush is carried out on the surface of compoboard and process, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out the figure contraposition, use the 5KW exposure machine to carry out graph exposure; Adopting at last volume ratio is that 0.9-1.1% the sodium carbonate liquor compoboard after to exposure develops, and overhauls; Step 4: plating, etched making: figure is shifted the compoboard surface of finishing carry out pre-electroplating treatment, carry out first acid deoiling headed by the process of pre-electroplating treatment, through alligatoring after the two-stage washing, again through the two-stage washing, last pickling is carried out successively the electro-coppering thickening to patterned surface again and is processed and zinc-plated anti-etching processing; Compoboard surface resist ink stripping after will processing again, then the figure of foundation design checks, repaiies plate to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern; Then with the anti-etching tin layer stripping on the compoboard surfacial pattern of passed examination; Step 5: surperficial solderability is processed: carry out the dip-coating oxygen-proof film after the compoboard process oil removing after line pattern is completed, washing, microetch, the washing and process, then oven dry checks; Step 6: moulding is made: at first adopt numerical control mill software that the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding and make, the CNC milling cutter that CNC milling machine adopts is two blade milling cutters; The use jetting machine cleaned, dries, checks circuit board after moulding was finished, and obtained polytetrafluoroethylene HF link plate.
Claims (6)
1. the manufacture method of a polytetrafluoroethylene HF link plate is characterized in that it may further comprise the steps:
Step 1: carry out engineering, light is painted data make: at first template is carried out graphic designs, the figure that designs is carried out project file according to processing parameter to be processed, then according to working condition the file of handling well is carried out layout, makes the black egative film, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked, copy as female parent carries out diazo sheet take the egative film that checks again at last, and the diazo sheet that copies is checked, splices;
Step 2: the making of opening material, boring, hole metallization: at first leave by singly requirement size of flow process with electric plate shearer and produce needed polytetrafluoroethylene high-frequency copper-clad plate, then carry out wrapper sheet according to thickness of slab and form compoboard, pin hole is got with dowel driving machine in minor face position at compoboard, the compoboard of accomplishing fluently pin hole is fixed on the CNC milling machine work top, then carry out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, and checked; After checking that good compoboard carries out the hole processing, divide two sections to carry out PTH through inserting frame behind the deburring nog plate, then the plate nog plate behind the PTH is processed, then carry out a copper facing, carry out cleaning, drying, inspection after the plating well;
Step 3: the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and process, then the wet film printing is carried out on its surface, baking; By location hole diazo sheet and compoboard are carried out figure contraposition, exposure; Adopting at last volume ratio is that 0.9-1.1% the sodium carbonate liquor compoboard after to exposure develops, and overhauls;
Step 4: plating, etched making: figure is shifted the compoboard surface of finishing carry out pre-electroplating treatment, again patterned surface is carried out the electro-coppering thickening successively and process and zinc-plated anti-etching processing; Compoboard surface resist ink stripping after will processing again, then the figure of foundation design checks, repaiies plate to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern; Then with the anti-etching tin layer stripping on the compoboard surfacial pattern of passed examination;
Step 5: surperficial solderability is processed: carry out the dip-coating oxygen-proof film after the compoboard process oil removing after line pattern is completed, washing, microetch, the washing and process, then oven dry checks;
Step 6: moulding is made: at first adopt numerical control mill software that the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, adopt CNC milling machine to carry out moulding and make; The use jetting machine cleaned, dries, checks circuit board after moulding was finished, and obtained polytetrafluoroethylene HF link plate.
2. the manufacture method of a kind of polytetrafluoroethylene HF link plate according to claim 1, it is characterized in that adopting in the described step 1 resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 100 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet.
3. the manufacture method of a kind of polytetrafluoroethylene HF link plate according to claim 1, when it is characterized in that holing in the described step 2, getting out the pin hole aperture in the minor face position of compoboard is that then 3.2mm adopts the boring of two blade milling cutters with CNC milling machine, the drilling hole amount of milling cutter is less than 500 holes, uses the above sand paper of 2000 orders that burr, batch cutting edge of a knife or a sword on the compoboard surface after holing are processed; Divide first two sections to carry out PTH plate during hole metallization, after then plate being processed with 320 order nylon bruss nog plates again clamping plate once thicken copper facing.
4. the manufacture method of a kind of polytetrafluoroethylene HF link plate according to claim 1 is characterized in that adopting in the described step 3 500 purpose running roller scrubbers that polish-brush is carried out on the surface of compoboard and processes; Use the 5KW exposure machine to carry out graph exposure.
5. the manufacture method of a kind of polytetrafluoroethylene HF link plate according to claim 1 is characterized in that carrying out first acid deoiling headed by the process of the pre-electroplating treatment in the described step 4, through alligatoring after the two-stage washing, and again through the two-stage washing, last pickling.
6. the manufacture method of a kind of polytetrafluoroethylene HF link plate according to claim 1 is characterized in that the CNC milling cutter that CNC milling machine adopts in the described step 6 is two blade milling cutters.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104002632A CN102905471A (en) | 2012-10-21 | 2012-10-21 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
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| CN2012104002632A CN102905471A (en) | 2012-10-21 | 2012-10-21 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917053A (en) * | 2014-04-22 | 2014-07-09 | 上海尚容电子科技有限公司 | Application of nickel as alkaline etching resistant layer materials |
| CN106102330A (en) * | 2016-06-23 | 2016-11-09 | 江西景旺精密电路有限公司 | A kind of manufacture method of pcb board fine-line |
| CN106851994A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of preparation method of high heat-conducting ceramic printed circuit board |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
| CN108112195A (en) * | 2018-01-23 | 2018-06-01 | 江西景旺精密电路有限公司 | A kind of manufacturing method of multi-layer circuit board |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
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| CN101677066A (en) * | 2008-09-19 | 2010-03-24 | 钰桥半导体股份有限公司 | Build-up circuit board manufacturing method |
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
| CN102638937A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of copper-base printed wiring board |
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| CN101677066A (en) * | 2008-09-19 | 2010-03-24 | 钰桥半导体股份有限公司 | Build-up circuit board manufacturing method |
| CN102143656A (en) * | 2011-03-16 | 2011-08-03 | 蔡新民 | Manufacturing method of circuit board made of high-dielectric composite material |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917053A (en) * | 2014-04-22 | 2014-07-09 | 上海尚容电子科技有限公司 | Application of nickel as alkaline etching resistant layer materials |
| CN106102330A (en) * | 2016-06-23 | 2016-11-09 | 江西景旺精密电路有限公司 | A kind of manufacture method of pcb board fine-line |
| CN106851994A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of preparation method of high heat-conducting ceramic printed circuit board |
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
| CN107817774B (en) * | 2017-11-21 | 2019-12-17 | 吉安市满坤科技有限公司 | intelligent manufacturing process of printed circuit board |
| CN108112195A (en) * | 2018-01-23 | 2018-06-01 | 江西景旺精密电路有限公司 | A kind of manufacturing method of multi-layer circuit board |
| CN108112195B (en) * | 2018-01-23 | 2020-07-17 | 江西景旺精密电路有限公司 | Method for manufacturing multilayer circuit board |
| CN110418502A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of preparation method of polytetrafluoroethylhigh-frequency high-frequency circuit board |
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Application publication date: 20130130 |