CN104640380A - Non-plating through hole with hole ring making method and printed circuit board manufacturing method - Google Patents
Non-plating through hole with hole ring making method and printed circuit board manufacturing method Download PDFInfo
- Publication number
- CN104640380A CN104640380A CN201310571588.1A CN201310571588A CN104640380A CN 104640380 A CN104640380 A CN 104640380A CN 201310571588 A CN201310571588 A CN 201310571588A CN 104640380 A CN104640380 A CN 104640380A
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- China
- Prior art keywords
- hole
- orifice ring
- printed circuit
- heavy copper
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of manufacturing of printed circuit boards and relates to a method for making a non-plating through hole with a hole ring and a printed circuit board manufacturing method. The method for making the non-plating through hole with the hole ring includes: firstly, drilling to make through holes in laminated printed circuit boards; secondly, carrying out electroplating to copperize faces of the laminated printed circuit boards and interiors of the through holes; thirdly, performing pattern transferring again to make patterns on the faces of the laminated printed circuit boards, and windowing the hole with the hole ring; finally, etching the patterns and the windowed hole to form the non-plating through hole. When the non-plating through hole with the hole ring is made, a secondary drilling procedure is omitted, so that a whole process is optimized; in addition, due to avoidance of the secondary drilling procedure, the problems of flashing and hole ring damages resulted from the secondary drilling procedure are thoroughly solved.
Description
Technical field
The invention belongs to printed circuit board (PCB) (PCB) manufacturing technology field, be specifically related to a kind of non-heavy copper hole with orifice ring and print circuit plates making method.
Background technology
In printed circuit board (PCB) (PCB) manufacture field, along with the raising of properties of product, the non-heavy copper hole Non Plating Through Hole of NPTH(from without orifice ring) printed wiring board develops the printed circuit board of the NPTH including orifice ring.And for the manufacture craft in non-heavy copper hole of band orifice ring, in whole printed circuit board industry, the general two driller's skills that adopt make at present, and its production procedure is as follows:
Pressing---boring (first time boring)---plating---Graphic transitions---etching (acidity)---boring (second time boring)---AOI(optical check).
In above flow process, the effect of each operation is as follows:
(1) hole (for the first time): be mainly and make other through holes.
(2) electroplate: copper-plated process in printed circuit board plate face and hole.
(3) Graphic transitions: graphic making process.
(4) etch: go out figure (comprising the circular pad PAD of this technique) at printed circuit board facet etch.
(5) hole (second time boring): hole in the PAD of etched figure, thus form NPTH hole.
Effect schematic diagram after each flow process completes is as shown in Fig. 1 (a) to Fig. 1 (e).The NPTH hole manufacture craft of this kind of band orifice ring needs after the etching boring again (often say two bore flow processs) to complete, and this manufacture craft has following shortcoming when second time boring:
(1) when second time is holed after the etching, there is the line pattern after etching in printed board face, easily to the scratch of figure circuit during second time drilling operation, causes open circuit;
(2) easily burr is produced, and difficult;
(3) when second time boring makes, the condition such as material restriction, as materials such as RO4350B, easily occurs that orifice ring is damaged;
Along with the develop rapidly of electron trade, the NPTH hole technique adopting two driller's skills to make band orifice ring can not meet the requirement of electron trade development, a kind of new technique must be had to make up the deficiency of the manufacture craft aspect of boring with two, the burr that the NPTH hole optimized its Making programme and solve band orifice ring produces when two drill and do and orifice ring damaging problem.
Summary of the invention
For the defect existed in prior art, technical problem to be solved by this invention is to provide a kind of non-heavy copper hole and print circuit plates making method of effective band orifice ring.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
The manufacture method in the non-heavy copper hole with orifice ring, comprises the following steps:
(1) hole: the printed circuit board after pressing makes through hole;
(2) electroplate: to copper facing in the plate face of the printed circuit board after described pressing and described through hole hole;
(3) Graphic transitions: figure is produced in the printed circuit board plate face after described pressing, and windowed in the hole of band orifice ring;
(4) etch: described figure is etched, and the hole of windowing is etched, form non-heavy copper hole.
The manufacture method in the non-heavy copper hole of band orifice ring as above, etching described in step (4) adopts acid etching flow process.Described acid etching flow process comprises the following steps: 1. Graphic transitions; 2. develop; 3. etch; 4. striping.
The manufacture method in the non-heavy copper hole of band orifice ring as above, the method for windowing described in step (3) is: the non-heavy copper borehole jack copper mode of band orifice ring is boring aperture-X.Described X according to borehole accuracy, Graphic transitions exposure bench aligning accuracy, electroplate copper thickness, etching factor below and determine.
The manufacture method in the non-heavy copper hole of band orifice ring as above, wherein, after the etching, also comprises the step adopting optical inspection to check described non-heavy copper hole.
A manufacture method for printed circuit board (PCB), described printed circuit board (PCB) comprises the non-heavy copper hole of band orifice ring, and the non-heavy copper hole of described band orifice ring is obtained by said method.
The method of the invention, when making the non-heavy copper hole of band orifice ring, decreasing a drilling program, thus optimizing whole Making programme.And, due to without two bore flow processs, so because of two driller's skills generations burr and non-heavy copper hole damaging problem obtain thorough improvement.
Accompanying drawing explanation
Fig. 1 is two driller's process flow effect schematic diagrames in prior art, wherein Fig. 1 (a) is the effect schematic diagram after pressing, Fig. 1 (b) is the effect schematic diagram after boring, Fig. 1 (c) is the effect schematic diagram after plating, Fig. 1 (d) is the effect schematic diagram after etching, and Fig. 1 (e) is the effect schematic diagram after second time boring;
Fig. 2 is the NPTH hole manufacture method flow chart with orifice ring in embodiment;
Fig. 3 is the NPTH hole manufacture method flow process effect schematic diagram with orifice ring in embodiment, wherein Fig. 3 (a) is the effect schematic diagram after pressing, Fig. 3 (b) is the effect schematic diagram after boring, Fig. 3 (c) is the effect schematic diagram after plating, Fig. 3 (d) is the effect schematic diagram after Graphic transitions, and Fig. 3 (e) is the effect schematic diagram after etching.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
As shown in Figure 2, the NPTH hole manufacture method with orifice ring in present embodiment comprises the following steps:
(1) hole.
Printed circuit board after pressing makes through hole, as the PATENT left side via of Fig. 3 (a).Certainly, also can make the through hole except being with the non-heavy copper hole of orifice ring, as the right side through hole of Fig. 3 (b) simultaneously.The boring flow process being about to the NPTH hole of band orifice ring is dissolved in normal drill flow process, the boring flow process (two bore) that the NPTH hole optimizing existing band orifice ring makes.Circuit board effect after pressing is as shown in Fig. 3 (a), and the effect after boring as shown in Figure 3 (b).
(2) electroplate.
To copper facing in printed circuit board plate face and hole, comprise copper facing in the through hole to band orifice ring.Effect after plating as shown in Figure 3 (c).
(3) Graphic transitions.
Produce figure in printed circuit board plate face, except normal figure, also need to window to the hole of band orifice ring, the NPTH hole making data of windowing being about to band orifice ring adds in normal graphic documentation.Its method of windowing is as follows: the NPTH borehole jack copper of band orifice ring is designed to original aperture (the D)-X(mil that holes), mil is unit Mill.X according to borehole accuracy, Graphic transitions exposure bench aligning accuracy, electroplate copper thickness, etching factor etc. below.The effective ways obtaining X value are setting X is that different values is tested, and the effect after etching determines X value, to ensure to have etched rear NPTH hole without orifice ring because off normal causes the phenomenon of defect.Effect after Graphic transitions is as shown in Fig. 3 (d).
(4) etch.
Described figure being etched, except etching normal figure, also needing the hole to windowing to etch, form NPTH hole.Etching adopts acid etching flow process, is specially: development → etching → striping.Effect after etching is as shown in Fig. 3 (e).
(5) check.
After etching, adopt optical check (AOI) to check orifice ring, check whether its orifice ring has the orifice ring breakage because off normal causes.Optical check is the existing production procedure making pcb board, no longer launches explanation herein.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technology thereof, then the present invention is also intended to comprise these change and modification.
Claims (7)
1. the manufacture method in the non-heavy copper hole with orifice ring, comprises the following steps:
(1) hole: the printed circuit board after pressing makes through hole;
(2) electroplate: to copper facing in the plate face of the printed circuit board after described pressing and described through hole hole;
(3) Graphic transitions: figure is produced in the printed circuit board plate face after described pressing, and windowed in the hole of band orifice ring;
(4) etch: described figure is etched, and the hole of windowing is etched, form non-heavy copper hole.
2. the manufacture method in the non-heavy copper hole of band orifice ring as claimed in claim 1, is characterized in that: etching described in step (4) adopts acid etching flow process.
3. the manufacture method in the non-heavy copper hole of band orifice ring as claimed in claim 2, is characterized in that: described acid etching flow process comprises the following steps: 1. Graphic transitions; 2. develop; 3. etch; 4. striping.
4. the manufacture method in the non-heavy copper hole of band orifice ring as claimed in claim 1, is characterized in that: the method for windowing described in step (3) is: the non-heavy copper borehole jack copper mode of band orifice ring is boring aperture-X.
5. the manufacture method in the non-heavy copper hole of band orifice ring as claimed in claim 4, is characterized in that: described X according to borehole accuracy, Graphic transitions exposure bench aligning accuracy, electroplate copper thickness, etching factor below and determine.
6. the manufacture method in the non-heavy copper hole of the band orifice ring according to any one of claim 1 to 5, is characterized in that: after the etching, also comprises the step adopting optical inspection to check described non-heavy copper hole.
7. a manufacture method for printed circuit board (PCB), described printed circuit board (PCB) comprises the non-heavy copper hole of band orifice ring, and it is characterized in that, the non-heavy copper hole of described band orifice ring is obtained by the either method in the claims 1 ~ 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310571588.1A CN104640380B (en) | 2013-11-13 | 2013-11-13 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310571588.1A CN104640380B (en) | 2013-11-13 | 2013-11-13 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104640380A true CN104640380A (en) | 2015-05-20 |
| CN104640380B CN104640380B (en) | 2018-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310571588.1A Active CN104640380B (en) | 2013-11-13 | 2013-11-13 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106529106A (en) * | 2017-01-09 | 2017-03-22 | 郑州云海信息技术有限公司 | Hole building method and device as well as PCB |
| CN107949188A (en) * | 2017-11-16 | 2018-04-20 | 广东兴达鸿业电子有限公司 | Connect the circuit board processing method in hole with NPTH |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| CN115334756A (en) * | 2022-08-19 | 2022-11-11 | 东莞联桥电子有限公司 | Manufacturing process of ball grid array printed circuit board |
| CN116916563A (en) * | 2023-08-10 | 2023-10-20 | 清远市富盈电子有限公司 | Manufacturing method of PCB with PTH holes connected with NPTH holes, and PCB |
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| JPH0590758A (en) * | 1991-02-18 | 1993-04-09 | Dia Denshi Kk | Production of multilayered printed-board |
| US6495394B1 (en) * | 1999-02-16 | 2002-12-17 | Sumitomo Metal (Smi) Electronics Devices Inc. | Chip package and method for manufacturing the same |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
| CN203523145U (en) * | 2013-10-12 | 2014-04-02 | 北大方正集团有限公司 | Pcb |
-
2013
- 2013-11-13 CN CN201310571588.1A patent/CN104640380B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590758A (en) * | 1991-02-18 | 1993-04-09 | Dia Denshi Kk | Production of multilayered printed-board |
| US6495394B1 (en) * | 1999-02-16 | 2002-12-17 | Sumitomo Metal (Smi) Electronics Devices Inc. | Chip package and method for manufacturing the same |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
| CN203523145U (en) * | 2013-10-12 | 2014-04-02 | 北大方正集团有限公司 | Pcb |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106529106A (en) * | 2017-01-09 | 2017-03-22 | 郑州云海信息技术有限公司 | Hole building method and device as well as PCB |
| CN106529106B (en) * | 2017-01-09 | 2019-09-06 | 郑州云海信息技术有限公司 | One kind building hole method, apparatus and a kind of PCB |
| CN107949188A (en) * | 2017-11-16 | 2018-04-20 | 广东兴达鸿业电子有限公司 | Connect the circuit board processing method in hole with NPTH |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| CN115334756A (en) * | 2022-08-19 | 2022-11-11 | 东莞联桥电子有限公司 | Manufacturing process of ball grid array printed circuit board |
| CN116916563A (en) * | 2023-08-10 | 2023-10-20 | 清远市富盈电子有限公司 | Manufacturing method of PCB with PTH holes connected with NPTH holes, and PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104640380B (en) | 2018-07-24 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, fangzheng building, 298 Fu Cheng Road, Beijing, Haidian District Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220916 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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