CN102917540A - Selective hole copper removing method for printed circuit board - Google Patents
Selective hole copper removing method for printed circuit board Download PDFInfo
- Publication number
- CN102917540A CN102917540A CN2012103961266A CN201210396126A CN102917540A CN 102917540 A CN102917540 A CN 102917540A CN 2012103961266 A CN2012103961266 A CN 2012103961266A CN 201210396126 A CN201210396126 A CN 201210396126A CN 102917540 A CN102917540 A CN 102917540A
- Authority
- CN
- China
- Prior art keywords
- hole
- wiring board
- printed wiring
- copper
- dry film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a selective hole copper removing method for a printed circuit board. The selective hole copper removing method comprises a mechanical drilling step, to be specific, removing protective layers and/or weldable layers on hole copper surfaces of problem holes through mechanical drilling, and removing partial hole copper on the hole copper surfaces of the problem holes with partial hole copper left; a film bonding step, to be specific, bonding a dry film on the surface of a printed circuit board; a problem hole exposing step, to be specific, tearing off a PET (Polyethylene Glycol Terephthalate) protection film on the surface of the dry film, piercing the dry films at two ends on corresponding positions of the problem holes so as to expose the problem holes, wherein the problem holes are nonmetalized holes plated with the hole copper; an acid etching step, to be specific, completely removing the left partial hole copper of the problem holes through acid etching; a water washing and drying step, to be specific, carrying out water washing on a printed circuit board, and drying after water washing so as to remove chemical liquid left after the acid etching step; and a dry film removing step, to be specific, removing the dry film on the surface of the printed circuit board.
Description
Technical field
The present invention relates to printed wiring board and make the field, more particularly, the present invention relates to a kind of printed wiring board selectivity hole copper removal method.
Background technology
Plated-through hole (Plated Through Hole, PTH) and non-metallic hole (No Plated Through Hole, NPTH) are two large common types of printed wiring board through hole, possess simultaneously plated-through hole and non-metallic hole in most of printed wiring board.
But, when making printed wiring board, owing to the reasons such as error of project data or technological operation, in the manufacturing process of printed wiring board, the situation that indivedual non-metallic holes mistake plates hole copper can appear.And, for carrying out follow-up surface-treated printed wiring board, can cover other protective layers and/or layer again but miss the copper surface, hole of plating.
In the prior art, in order to remove the hole copper in problems hole, can pass through the mechanical hole reaming method, but protective layer and/or the layer on hole copper and its top layer are once removed; But, for this method, only getting out the hole more bigger than original aperture at place, problem hole, guarantee is thoroughly removed the copper layer of hole wall; That is to say that the method can increase the aperture in non-metallic hole, affects aperture precision, and even can therefore cause scrapping of printed wiring board.
Therefore, hope can provide a kind of and can overcome the existing machinery expanding method and cause the aperture to increase not enough and method that realize removing the hole copper on the mistake of the non-metallic hole of printed wiring board.
Summary of the invention
Technical problem to be solved by this invention is for there being defects in the prior art, provides a kind of and can overcome that the existing machinery expanding method causes the deficiency that the aperture increases and the method that realizes removing the employing chemical method selective removal hole copper of the hole copper on the mistake of the non-metallic hole of printed wiring board.
According to the present invention, a kind of printed wiring board selectivity hole copper removal method is provided, it comprises: step of membrane sticking is used at printed wiring board surface label dry film; Problem hole exposing step is used for throwing off polyester (Polyester, the PET) diaphragm on dry film surface, and discloses out the dry film at the two ends of corresponding position, problem hole, thus the problem of exposure hole, and wherein said problem hole is the NPTH hole that is coated with hole copper; The acid etching step is used for removing the residual part hole copper in problem hole fully by acid etching; Washing and drying steps are used for printed wiring board is carried out washing, and carry out drying after washings, thereby remove the residual liquid medicine of acid etching step; Dry film is removed step, is used for the dry film on printed wiring board surface is taken off.
Preferably; described printed wiring board selectivity hole copper removal method also comprises: the machine drilling step of carrying out before step of membrane sticking; but be used for removing protective layer and/or the layer that covers copper surface, hole, problem hole by machine drilling; and remove the part hole copper on copper surface, hole, problem hole, and residual fraction hole copper.
Preferably, but the protective layer on copper surface, hole, problem hole and/or layer comprise slicker solder layer, tin layer, nickel dam, gold layer, nickel-gold layer, NiPdAu layer, silver layer, have organizational security to weld rete.
Preferably; in the machine drilling step; set drilling program for the problem hole; and with pin printed wiring board is located; adopt the brill cutter to be holed in the problem hole; between the design aperture, non-metallic hole in the effective aperture in the bore diameter of wherein said brill cutter problem hole before surface treatment and problem hole, but guarantee thus protective layer and/or the layer on copper surface, hole, problem hole are removed fully.
Preferably, in type printed wiring board, in step of membrane sticking, adopt and cut film vacuum film pressing method subsides dry film; For the printed wiring board of moulding not, in step of membrane sticking, adopt note film vacuum film pressing method to paste dry film; Keep away the printed wiring board that copper is processed for plate face edge, in step of membrane sticking, at the edges of boards subsides protective tapes of printed wiring board, and dry film is removed step and removed first protective tapes before the protection dry film with the printed wiring board surface is taken off.
Preferably, the protective tapes of employing is the adhesive tape of anti-the plating.
Preferably, the acid etching step is at DES(Develop-Etch-Strip, development-etching-stripping) the etching section of production line carries out.
Preferably, in washing and drying steps, carry out drying up and drying to carry out drying.
Preferably, described washing, the processing that dries up, dries are positioned on the same horizontal line.
By printed wiring board selectivity according to the present invention hole copper removal method; can remove the hole copper in non-metallic hole fully; and overcome the deficiency that aperture that the existing machinery expanding method causes increases; guaranteed that non-metallic hole precision is unaffected, effectively protected the plate face figure of printed wiring board.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the according to the preferred embodiment of the invention flow chart of printed wiring board selectivity hole copper removal method.
Need to prove that accompanying drawing is used for explanation the present invention, and unrestricted the present invention.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
Fig. 1 schematically shows the according to the preferred embodiment of the invention flow chart of printed wiring board selectivity hole copper removal method.
Specifically, as shown in Figure 1, copper removal method in printed wiring board selectivity hole comprises according to the preferred embodiment of the invention:
Machine drilling step S1: but remove protective layer and/or the layer that covers copper surface, hole, problem hole by machine drilling, and remove the part hole copper on copper surface, hole, problem hole, and residual fraction hole copper; Specifically, remove a small amount of hole copper on copper surface, hole, problem hole, and residual most of hole copper.
Wherein, " problem hole " refers to the non-metallic hole that is coated with hole copper.And wherein, but the protective layer on the copper of hole or layer comprise slicker solder layer, tin layer, nickel dam, gold layer, nickel-gold layer, NiPdAu layer, silver layer, organizational security weldering film (OSP, Organic Solderability Preservatives) layer etc. are arranged.
Specifically, for example, can set drilling program for the problem hole, and with pin printed wiring board be located; Adopt the brill cutter of suitable diameter to be holed in the problem hole; Between the design aperture, non-metallic hole in the effective aperture in the bore diameter of described brill cutter problem hole before surface treatment and problem hole, but and can guarantee the protective layer on copper surface, hole and/or layer are removed.
Step of membrane sticking S2: at printed wiring board surface label dry film, so that other hole copper and surfacial patterns except the problem hole of baffle face, and preferably, paste protective tapes and protect edges of boards.
Specifically, for example, in type printed wiring board, can adopt and cut film vacuum film pressing technique subsides dry film; For the printed wiring board of the large plate face of moulding not, adopt note film vacuum film pressing technique to paste dry film.Preferably, keep away the printed wiring board that copper is processed for plate face edge, need to paste protective tapes at the edges of boards of printed wiring board to protect, further preferably, the protective tapes of employing is the adhesive tape of anti-plating the (PVC).
Problem hole exposing step S3: throw off the PET diaphragm on dry film surface, and adopt the drill bit of suitable diameter to disclose out the dry film at the two ends of corresponding position, problem hole, thus the problem of exposure hole.
Acid etching step S4: the residual part hole copper of removing the problem hole by acid etching fully.
Specifically because two ends, problem hole are without dry film protection, so can so that the residual part hole etched liquid medicine of copper remove fully.For example, this step can be carried out in the etching section of DES production line.
More particularly, if residual part hole copper is not removed in an etching fully, then can increase the etching number of times until the residual part hole copper in problem hole is completely removed.
Washing and drying steps S5: printed wiring board is carried out washing (for example high-pressure washing), and after washing, carry out drying, for example carry out drying up and drying, thereby remove the residual liquid medicine of acid etching step S4.
Specifically, for the situation of carrying out the 4th step S4 at the development production line, the washing of development production line etching section is normally inadequate, and do not dry up, dry design, so to carry out further high-pressure washing and dry up, dry the printed wiring board of processing, residual with the liquid medicine that reaches after thorough removing etching section is processed.Preferably, described washing (for example high-pressure washing), the processing that dries up, dries can be on the same horizontal line.
Dry film is removed step S6: posting in the situation of protective tapes, throwing off the protective tapes that is attached to edges of boards, and taking off at the protection dry film that for example takes off on the film line the printed wiring board surface.
Thus, in printed wiring board selectivity hole copper removal method according to the preferred embodiment of the invention, can remove hole copper on the mistake of non-metallic hole by above step, and avoid affecting the precision in non-metallic hole.Figure 1 shows that the according to the preferred embodiment of the invention implementation step example of printed wiring board selectivity hole copper removal method.For the situation of not carrying out the surface-treated printed wiring board, it is the situation that non-metallic hole surface only has copper, but the method can be skipped the step that protective layer or/or layer are removed in machine drilling, and directly the hole copper on the chemical etching removal mistake is carried out in the protection of employing subsides dry film; Perhaps make the machine drilling step only be used for removing part hole copper, thereby can reduce hole, the chemical etching problem hole copper time.
By printed wiring board selectivity hole copper removal method according to the preferred embodiment of the invention; can remove the hole copper in non-metallic hole fully; and overcome the deficiency that aperture that the existing machinery expanding method causes increases; guaranteed that non-metallic hole precision is unaffected, effectively protected the plate face figure of printed wiring board.
Be understandable that although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (9)
1. printed wiring board selectivity hole copper removal method is characterized in that comprising:
Step of membrane sticking is used at printed wiring board surface label dry film;
Problem hole exposing step is used for throwing off polyester (Polyester, the PET) diaphragm on dry film surface, and discloses out the dry film at the two ends of corresponding position, problem hole, thus the problem of exposure hole, and wherein said problem hole is the non-metallic hole that is coated with hole copper;
The acid etching step is used for removing the residual part hole copper in problem hole fully by acid etching;
Washing and drying steps are used for printed wiring board is carried out washing, and carry out drying after washings, thereby remove the residual liquid medicine of acid etching step;
Dry film is removed step, is used for the dry film on printed wiring board surface is taken off.
2. printed wiring board selectivity according to claim 1 hole copper removal method; characterized by further comprising: the machine drilling step of before step of membrane sticking, carrying out; but be used for removing protective layer and/or the layer that covers copper surface, hole, problem hole by machine drilling; and remove the part hole copper on copper surface, hole, problem hole, and residual fraction hole copper.
3. printed wiring board selectivity according to claim 2 hole copper removal method; it is characterized in that, but the protective layer on copper surface, hole, problem hole and/or layer comprise slicker solder layer, tin layer, nickel dam, gold layer, nickel-gold layer, NiPdAu layer, silver layer, organizational security weldering rete are arranged.
4. printed wiring board selectivity according to claim 2 hole copper removal method; it is characterized in that; in the machine drilling step; set drilling program for the problem hole; and with pin printed wiring board is located; adopt the brill cutter to be holed in the problem hole, between the design aperture, non-metallic hole in the effective aperture in the bore diameter of wherein said brill cutter problem hole before surface treatment and problem hole, but guarantee thus the protective layer on copper surface, hole, problem hole and/or layer are removed.
5. according to claim 1 to one of 4 described printed wiring board selectivity hole copper removal methods, it is characterized in that, in type printed wiring board, in step of membrane sticking, adopt and cut film vacuum film pressing method and paste dry film; For the printed wiring board of moulding not, in step of membrane sticking, adopt note film vacuum film pressing method to paste dry film; Keep away the printed wiring board that copper is processed for plate face edge, in step of membrane sticking, at the edges of boards subsides protective tapes of printed wiring board, and dry film is removed step and removed first protective tapes before the protection dry film with the printed wiring board surface is taken off.
6. according to claim 1 to one of 4 described printed wiring board selectivity hole copper removal methods, it is characterized in that the protective tapes of employing is the adhesive tape of anti-the plating.
7. according to claim 1 to one of 4 described printed wiring board selectivity hole copper removal methods, it is characterized in that the acid etching step is carried out in the etching section of DES production line.
8. according to claim 1 to one of 4 described printed wiring board selectivity hole copper removal methods, it is characterized in that, in washing and drying steps, carry out drying up and drying to carry out drying.
9. printed wiring board selectivity according to claim 8 hole copper removal method is characterized in that described washing, the processing that dries up, dries are positioned on the same horizontal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210396126.6A CN102917540B (en) | 2012-10-17 | 2012-10-17 | Printed wiring board selectivity hole copper minimizing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210396126.6A CN102917540B (en) | 2012-10-17 | 2012-10-17 | Printed wiring board selectivity hole copper minimizing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102917540A true CN102917540A (en) | 2013-02-06 |
| CN102917540B CN102917540B (en) | 2015-10-07 |
Family
ID=47615709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210396126.6A Active CN102917540B (en) | 2012-10-17 | 2012-10-17 | Printed wiring board selectivity hole copper minimizing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102917540B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640380A (en) * | 2013-11-13 | 2015-05-20 | 北大方正集团有限公司 | Non-plating through hole with hole ring making method and printed circuit board manufacturing method |
| CN105228349A (en) * | 2015-08-27 | 2016-01-06 | 深圳崇达多层线路板有限公司 | A kind of method improved without gold on copper hole |
| CN106358385A (en) * | 2016-08-31 | 2017-01-25 | 开平依利安达电子第三有限公司 | Printed circuit board processing method adopting etching process for forming backdrilled holes |
| CN109618500A (en) * | 2018-12-27 | 2019-04-12 | 广州兴森快捷电路科技有限公司 | Reparation detection method for semiconductor test board |
| CN111970848A (en) * | 2020-08-31 | 2020-11-20 | 全成信电子（深圳）股份有限公司 | Method for rapidly processing copper stained in hole of PCB |
| CN112672525A (en) * | 2020-11-12 | 2021-04-16 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533887A (en) * | 2009-04-13 | 2009-09-16 | 瀚宇博德科技（江阴）有限公司 | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
-
2012
- 2012-10-17 CN CN201210396126.6A patent/CN102917540B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533887A (en) * | 2009-04-13 | 2009-09-16 | 瀚宇博德科技（江阴）有限公司 | Method for manufacturing thermoelectric cell of bottom board of printed circuit board and structure thereof |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640380A (en) * | 2013-11-13 | 2015-05-20 | 北大方正集团有限公司 | Non-plating through hole with hole ring making method and printed circuit board manufacturing method |
| CN104640380B (en) * | 2013-11-13 | 2018-07-24 | 北大方正集团有限公司 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
| CN105228349A (en) * | 2015-08-27 | 2016-01-06 | 深圳崇达多层线路板有限公司 | A kind of method improved without gold on copper hole |
| CN105228349B (en) * | 2015-08-27 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A method of improve without golden on copper hole |
| CN106358385A (en) * | 2016-08-31 | 2017-01-25 | 开平依利安达电子第三有限公司 | Printed circuit board processing method adopting etching process for forming backdrilled holes |
| CN109618500A (en) * | 2018-12-27 | 2019-04-12 | 广州兴森快捷电路科技有限公司 | Reparation detection method for semiconductor test board |
| CN111970848A (en) * | 2020-08-31 | 2020-11-20 | 全成信电子（深圳）股份有限公司 | Method for rapidly processing copper stained in hole of PCB |
| CN111970848B (en) * | 2020-08-31 | 2024-04-09 | 深圳全成信电子有限公司 | Method for rapidly treating copper sticking in PCB hole |
| CN112672525A (en) * | 2020-11-12 | 2021-04-16 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN112672525B (en) * | 2020-11-12 | 2022-05-17 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102917540B (en) | 2015-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102917540A (en) | Selective hole copper removing method for printed circuit board | |
| CN104918421B (en) | A kind of production method of PCB golden fingers | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| KR101814113B1 (en) | Method for manufacturing of printed circuit board | |
| CN103249264B (en) | A kind of manufacturing method of multi-layer circuit board of built-in golden finger | |
| CN106231816A (en) | A kind of manufacture method of golden fingerboard without lead wire | |
| CN109348650A (en) | A kind of method of optical module plate etched plate lead | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN112654178B (en) | Process method of embedded pad type rigid-flex printed circuit board | |
| CN103379749B (en) | Multilayer circuit board and preparation method thereof | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN108934128A (en) | Prevent the method, printed wiring board and computer installation of anti-solder ink plug-hole | |
| CN107347229A (en) | The process of wiring board selective resin consent | |
| CN108650800A (en) | A kind of PCB production procedures reducing dry film holes | |
| CN105228357B (en) | A kind of preparation method of ladder wiring board | |
| KR20130022911A (en) | Printed circuit board and manufacturing method for printed circuit board | |
| CN109362179A (en) | A kind of novel die method | |
| CN105208777A (en) | Manufacturing method for circuit board with metallization back drilled hole | |
| CN111194141B (en) | Circuit board and manufacturing method thereof | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB | |
| CN213522561U (en) | Circuit board | |
| CN105722338A (en) | Method for preparing circuit board | |
| CN211019442U (en) | Soft-hard combined circuit board cover opening structure | |
| CN209299584U (en) | A kind of solderability pcb board | |
| CN103298263A (en) | Printed circuit board and processing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |