KR20130022911A - Printed circuit board and manufacturing method for printed circuit board - Google Patents

Abstract

PURPOSE: A printed circuit board and a method for manufacturing the same are provided to protect an insulating layer and a plating layer in a dummy region. CONSTITUTION: A base substrate(111) includes a circuit region(112) for an inner circuit layer(142) and a dummy region(113,114). An edge coating(150) surrounds the edge of the dummy region and protects an insulating layer and a plating layer(130) in a dummy region. The inner circuit layer includes a circuit pattern(141) and a via(140) for connecting an outer circuit.

Description

Printed circuit board and printed circuit board manufacturing method {PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD}

The present invention relates to a printed circuit board and a method of manufacturing a printed circuit board.

As electronic products are becoming smaller, printed circuit boards included in electronic products are also becoming smaller and thinner.

The printed circuit board is largely divided into a circuit formation region and a dummy region. The circuit forming area of the printed circuit board is formed according to a specific purpose such as power and signal transmission in order to perform a function of an electronic product. Various quality control is performed in the circuit formation area of such a printed circuit board. However, in the case of a dummy area including an edge of the printed circuit board, quality control is not performed differently from the circuit formation area. In addition, quality control is not performed in the dummy area of the printed circuit board, and damage occurs in the process of forming the circuit. In particular, during the development etching and strip (DES) process, all regions where no resist is formed are etched, and the insulating layer of the edge portion of the dummy region is exposed. The exposed edges are physically damaged by aligners, stoppers, etc. in the conveyor. In addition, the exposed insulating layer of the edge portion is damaged by chemical treatment in several steps and becomes unstable. The exposed insulating layer, which is turned into an unstable state, causes impurities in the subsequent process.

That is, impurities are generated at damaged edge portions of the printed circuit board, causing contamination of a clean room in which the process is performed. In addition, impurities generated at damaged edge portions of the printed circuit board may move to the circuit formation region, causing product defects such as interlayer short circuits, interlayer short circuits due to Cu Nodule, and protrusion. Korean Patent Laid-Open No. 10-2004-0092428 discloses a method of removing the edge region of a substrate with a laser beam.

One aspect of the present invention provides a method for manufacturing a printed circuit board and a printed circuit board to protect the insulating layer and the plating layer of the dummy region from various chemical treatments for performing a process by performing an edge coating on the dummy region of the printed circuit board. will be.

Another aspect of the present invention is to provide a printed circuit board and a method of manufacturing a printed circuit board to perform the edge coating on the dummy region of the printed circuit board to prevent the generation of impurities by the plating layer of the dummy region.

Another aspect of the present invention is to provide a printed circuit board and a method of manufacturing a printed circuit board to improve the reliability of the product by performing the edge coating on the dummy region of the printed circuit board to prevent the generation of impurities by the plating layer of the dummy region. .

According to an aspect of the present invention, there is provided a printed circuit board including a base substrate, an edge coating surrounding an edge of a dummy region of the base substrate, and an inner circuit layer formed on the circuit forming region of the base substrate.

The edge coating may be formed of a polymeric resin.

The edge coating may be epoxy based.

The edge coating can be formed by wet deposition.

According to another aspect of the invention, providing a base substrate, forming an inner layer via hole in the base substrate, performing a plating on the base substrate and the inner layer via hole, after applying a plating resist to the base substrate in the circuit formation region Performing exposure, performing edge coating surrounding the edge of the base substrate, developing and etching the circuit formation region on the edge coded base substrate to form an inner circuit layer and a dry film Provided is a method of manufacturing a printed circuit board comprising the step of removing.

In the step of performing the edge coating, the edge coating may be formed of a polymer resin.

In the step of performing the edge coating, the edge coating may be formed of an epoxy-based resin.

In the step of performing the edge coating, the edge coating may be performed by wet deposition.

In the step of performing the edge coating, the edge coating may be formed in the dummy region of the base substrate.

After forming the inner circuit layer, laminating an insulating layer on the inner circuit layer of the base substrate, forming an outer layer via hole penetrating the insulating layer, plating the insulating layer and the outer layer via hole to form a plating layer. The method may further include forming an outer circuit layer by patterning the plating layer.

After forming the via hole, the method may further include performing a desmear.

When performing desmear, the edge coating formed on the dummy region of the base substrate may be removed.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the printed circuit board and the method of manufacturing the printed circuit board of the present invention, it is possible to protect the insulating layer and the plating layer of the dummy region from various chemical treatments for performing the process by performing edge coating on the dummy region of the printed circuit board.

According to the printed circuit board and the method of manufacturing the printed circuit board of the present invention, it is possible to reduce impurities generated in the dummy area according to the protection of the plating layer of the dummy area of the printed circuit board.

According to the printed circuit board and the method of manufacturing the printed circuit board of the present invention, it is possible to improve the reliability of the product by reducing impurities generated in the dummy region of the printed circuit board.

According to the printed circuit board and the method of manufacturing the printed circuit board of the present invention, it is easy to implement the microcircuit by reducing the impurities in the clean room due to the reduction of impurities generated in the dummy region of the printed circuit board.

1 is an exemplary view showing a printed circuit board according to an embodiment of the present invention.
2 to 5 are exemplary views briefly showing a method of manufacturing a printed circuit board according to an embodiment of the present invention in the order of process.
6 is a perspective view showing a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to the prior art.
7 is a perspective view illustrating a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to an exemplary embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In this specification, the terms first, second, etc. are used to distinguish one element from another, and the element is not limited by the terms.

Hereinafter, a printed circuit board and a method of manufacturing the printed circuit board according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Printed circuit board

1 is an exemplary view showing a printed circuit board according to an embodiment of the present invention.

The printed circuit board according to the exemplary embodiment of the present invention may include a base substrate 111, an edge coating 150, and an inner circuit layer 142.

The base substrate 111 may be, for example, a copper clad laminate (CCL). Here, the copper foil laminate is a thin plate coated with a thin copper coating on an insulating layer, which is generally an original plate on which a printed circuit board is drawn. There are various kinds of copper foil laminated plates, such as glass / epoxy copper laminated sheets, heat-resistant resin copper laminated sheets, paper / phenol copper laminated sheets, high frequency copper laminated sheets, flexible copper laminated sheets (polyimide film), and composite copper laminated sheets depending on the use.

The base substrate 111 may be divided into a circuit formation region 112 in which the inner circuit layer 142 is formed and dummy regions 113 and 114 in which the inner circuit layer 142 is not formed. As such, the edge coating 150 may be formed in the dummy regions 113 and 114 where the inner circuit layer 131 is not formed.

The edge coating 150 is formed to enclose an edge included in the dummy regions 113 and 114 of the base substrate 111. The edge coating 150 surrounds the edges of the dummy regions 113 and 114 to protect the insulating layer and the plating layer 130 of the dummy regions 113 and 114. The edge coating 150 may be formed of a polymer resin such as epoxy resin.

The inner circuit layer 142 may be formed by developing and etching the circuit formation region 112 of the base substrate 111. The inner circuit layer 142 may include a via 140, a circuit pattern 141, and the like for electrical connection with an outer layer circuit.

Printed circuit board manufacturing method

2 to 5 are exemplary views briefly showing a method of manufacturing a printed circuit board according to an embodiment of the present invention in the order of process.

Referring to FIG. 2, a base substrate 111 on which via holes are formed is provided. The base substrate 111 may be formed in a form in which the metal layers 110 are stacked on both surfaces of the core layer 100. The core layer 100 may be an insulating layer, and the metal layer 110 may be copper. That is, the base substrate 111 may be, for example, a copper clad laminate (CCL). Here, the copper foil laminate is a thin plate, in which a thin copper sheet is coated on an insulating layer, in which a printed circuit board is generally manufactured. There are various kinds of copper foil laminated plates, such as glass / epoxy copper laminated sheets, heat-resistant resin copper laminated sheets, paper / phenol copper laminated sheets, high frequency copper laminated sheets, flexible copper laminated sheets (polyimide film), and composite copper laminated sheets depending on the use.

The via hole 120 is processed in the base substrate 111. The via hole 120 may be formed through drilling or laser processing. After the via hole 120 is formed in the base substrate 111, the insulating layer inside the base substrate 111 melts due to heat generated during the formation of the via hole 120 to remove smear generated on the inner wall of the via hole 120. The desmear process may be further performed.

Referring to FIG. 3, the plating layer 130 is formed on the base substrate 111 on which the via holes 120 are formed. Here, the plating layer 130 may be formed on the upper side of the base substrate 111 and the inner wall of the via hole 120 by performing electroless copper plating and electrolytic copper plating. When the plating layer 130 is formed, electroless copper plating is first performed. Electroless copper plating is to form a conductive film necessary for electrolytic copper plating, and is to perform a thin electroless copper plating by pretreatment prior to electrolytic copper plating. After electroless copper plating is performed, electrolytic copper plating is performed. In FIG. 2, one plating layer 130 is shown without distinguishing between the film formed by electroless copper plating and the film formed by electrolytic copper plating. Thereafter, the via 140 may be formed by filling the via hole 120 with a paste to protect the plating layer 130 formed on the inner wall of the via hole 120. Although the paste generally uses an insulating ink material, a conductive paste may also be used depending on the purpose of the printed circuit board. The conductive paste may be obtained by mixing a metal such as Cu, Ag, Au, Sn, Pb as a main component alone or in an alloy form with an organic adhesive.

Referring to FIG. 4, a plating resist for forming a circuit is applied to the base substrate 111. The plating resist 160 may be applied to the circuit formation region on the base substrate 111. The plating resist 160 may be, for example, a dry film or a liquid photo resist (LPR). After the plating resist 160 is applied to the circuit formation region, an exposure process is performed. In the exposure step, the plating resist 160 is irradiated with ultraviolet rays to cure the plating resist 160 to have a predetermined pattern.

After coating and exposing the plating resist 160 as described above, edge coating is performed. The edge coating 150 may be formed in the dummy region except for the circuit forming region of the base substrate 111. That is, the edge coating 150 may be formed to surround the edge where the circuit is not formed in the base substrate 111. The edge coating 150 may be deposited on the edge portion corresponding to the pile of the base substrate 111 by the spray method or the wet deposition method. The coating liquid used for forming the edge coating 150 may be a polymer resin. For example, the coating solution may be an epoxy resin. Edge coating 150 may be formed by wet deposition. For example, the edge coating 150 may be formed by spray-etching the etchant to the dummy region where the edge coating 150 of the base substrate 111 is to be formed. In addition, the edge coating 150 may be formed by impregnating the dummy region in which the edge coating 150 of the base substrate 111 is to be formed into the etching solution. The method of forming the edge coating 150 on the base substrate 111 is not limited thereto, and may be easily changed by those skilled in the art.

Referring to FIG. 5, a circuit pattern is formed on the base substrate 111. The plating resist 160 applied to the base substrate 111 is developed. Thus, the hardened part of the base substrate 111 can be removed using a developing solution by the developing process. That is, the plating resist 160 of the portion corresponding to the circuit pattern remains. Thereafter, etching is performed using a portion of the plating resist 160 which is not removed from the base substrate 111. Here, the edge coating 150 is formed on the dummy portion of the base substrate 111 when etching is performed to prevent the dummy region from being etched. Thus, unnecessary etching of the dummy region is prevented, and generation of impurities generated by etching of the dummy region is prevented.

As such, after the etching of the base substrate 111, the remaining plating resist 160 is peeled off to form a predetermined circuit pattern. The predetermined circuit pattern formed here may be an inner circuit pattern.

Although not shown in the drawing, after forming the inner layer circuit on the base substrate 111, an outer layer circuit may be formed on the inner layer circuit. The outer layer circuit includes the steps of stacking an insulating layer on the inner layer circuit, forming an outer layer via hole connected to the inner layer circuit or connected to the inner layer circuit, performing a desmear after forming the via hole, and plating the insulating layer and the outer layer via hole. Forming a plating layer by performing it may be formed through the step of performing a patterning (patterning) on the plating layer.

Here, when the desmearing is performed after the via hole is formed, the edge coating of the inner layer circuit may also be removed.

The method of performing each step of forming the outer layer circuit is well known and the drawings and detailed description thereof will be omitted.

6 is a perspective view showing a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to the prior art.

Referring to FIG. 6, it can be seen that the dummy region 130 of the printed circuit board is damaged after the conventional inner layer circuit is formed. As the plating layer 130 of the dummy region is damaged as described above, impurities are generated in the plating layer 130. Impurities generated in the plating layer 130 are then transferred to the circuit pattern region of the inner layer circuit to lower the reliability of the product.

7 is a perspective view illustrating a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to an exemplary embodiment of the present invention.

Referring to FIG. 7, it can be seen that the plating layer 130 of the dummy region where the edge coating is formed is protected and not damaged according to the present embodiment. As such, since the plating layer 130 in the dummy region of the printed circuit board is protected, impurities may be prevented from occurring.

According to an embodiment of the present invention, edge coating may be performed on the dummy region of the printed circuit board to protect the insulating layer and the plating layer of the dummy region from various chemical treatments for performing the process. As described above, by protecting the insulating layer and the plating layer of the dummy region of the printed circuit board, impurities generated in the dummy region can be reduced. Therefore, it is possible to improve the reliability of the printed circuit board by reducing the generation of impurities.

Although the present invention has been described in detail by way of examples, it is intended to describe the present invention in detail, and the method of manufacturing the printed circuit board and the printed circuit board according to the present invention is not limited thereto, and the general knowledge in the art. Those skilled in the art will appreciate that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention as set forth in the claims below.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: core layer 110: metal layer
111: base substrate 112: circuit formation region
113 114: dummy area 120: via hole
130: plating layer 140: via
141: circuit pattern 150: edge coating
160: plating resist

Claims (12)

A base substrate;
An edge coating surrounding an edge of the dummy region of the base substrate;
An inner circuit layer formed on the circuit formation region of the base substrate;
And a printed circuit board.
The method according to claim 1,
The edge coating is a printed circuit board, characterized in that formed of a polymer resin.
The method according to claim 1,
The edge coating is,
Printed circuit board, characterized in that the edge coating is formed of an epoxy-based.
The method according to claim 1,
The edge coating is a printed circuit board, characterized in that formed by wet deposition (wet deposition) method.
Providing a base substrate;
Forming inner layer via holes in the base substrate;
Plating the base substrate and the inner layer via hole;
Applying a plating resist to the base substrate to a circuit formation region and then performing exposure;
Performing an edge coating surrounding an edge of the base substrate;
Developing and etching a circuit formation region on the edge-coded base substrate to form an inner circuit layer; And
Method of manufacturing a printed circuit board comprising the step of removing the dry film.
The method of claim 5,
In the step of performing the edge coating,
The edge coating is a method of manufacturing a printed circuit board, characterized in that formed of a polymer resin.
The method of claim 5,
In the step of performing the edge coating,
The edge coating is a method of manufacturing a printed circuit board, characterized in that formed of an epoxy resin.
The method of claim 5,
In the step of performing the edge coating,
The edge coating is a method of manufacturing a printed circuit board, characterized in that performed by wet deposition (wet deposition) method.
The method of claim 5,
In the step of performing the edge coating,
The edge coating is a manufacturing method of a printed circuit board, characterized in that formed in the dummy region of the base substrate.
The method of claim 5,
After forming the inner circuit layer,
Stacking an insulating layer on the inner circuit layer of the base substrate;
Forming an outer layer via hole penetrating the insulating layer;
Forming a plating layer by plating the insulating layer and the outer layer via hole;
Patterning the plating layer to form an outer circuit layer;
Method of manufacturing a printed circuit board further comprising.
The method of claim 10,
After forming the via hole,
The method of manufacturing a printed circuit board further comprising the step of performing a desmear.
The method according to claim 11,
When performing the desmear, the manufacturing method of the printed circuit board, characterized in that the edge coating formed on the dummy region of the base substrate is removed.

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