KR101896555B1 - Printed circuit board and manufacturing method for printed circuit board - Google Patents

Abstract

The present invention relates to a printed circuit board and a method of manufacturing a printed circuit board. According to an embodiment of the present invention, there is provided a method of manufacturing a printed circuit board including a base substrate, an edge coating surrounding the edge of the dummy region of the base substrate, A circuit board is provided.

Description

Technical Field [0001] The present invention relates to a printed circuit board (PCB)

The present invention relates to a printed circuit board and a method of manufacturing a printed circuit board.

As electronic products become smaller and smaller, printed circuit boards included in electronic products are becoming smaller and thinner.

The printed circuit board is largely divided into a circuit forming area and a dummy area. The circuit formation area of the printed circuit board is formed according to a specific purpose such as power and signal transmission to perform the function of the electronic product. Such a circuit forming area of a printed circuit board is subjected to various quality control. However, in the case of a dummy region including an edge of a printed circuit board, quality control is not performed unlike the circuit forming region. Further, in the case of the dummy area of the printed circuit board, quality control is not performed, and damage occurs in the process for forming a circuit. Particularly, in a DES (Development Etching and Strip) process, all the regions where no resist is formed are etched, and in particular, the insulating layers at the edge portions of the dummy regions are exposed. Such exposed edges are physically damaged by the aligner, the stopper, and the like in the conveyor. In addition, the exposed insulating layer of the edge portion is damaged by the chemical treatment in the various stages of processing and is transformed into an unstable state. The exposed insulating layer, which has changed to an unstable state, causes impurities while performing the subsequent process.

That is, impurities are generated at the damaged edge portion of the printed circuit board to cause contamination of the clean room where the process is performed. In addition, impurities generated in the damaged edge portion of the printed circuit board migrate to the circuit formation region, causing short circuit between layers, interlayer shorting by Cu nodule, and defective products such as protrusion. Korean Patent Laid-Open No. 10-2004-0092428 discloses a method of removing an edge region of a substrate with a laser beam.

One aspect of the present invention provides a printed circuit board and a printed circuit board manufacturing method for protecting an insulating layer and a plating layer of a dummy area from various chemical treatments for performing a process by performing edge coating on a dummy area of a printed circuit board will be.

Another aspect of the present invention is to provide a printed circuit board and a method of manufacturing a printed circuit board that perform edge coating on a dummy area of a printed circuit board to prevent generation of impurities by the plating layer in the dummy area.

Another aspect of the present invention is to provide a printed circuit board and a method of manufacturing a printed circuit board that improve the reliability of a product by preventing the occurrence of impurities by the plating layer in the dummy area by performing edge coating on the dummy area of the printed circuit board .

According to an aspect of the present invention, there is provided a printed circuit board comprising a base substrate, an edge coating surrounding the edge of the dummy region of the base substrate, and an inner layer circuit layer formed in the circuit formation region of the base substrate.

The edge coating may be formed of a polymer resin.

The edge coating may be epoxy based.

The edge coating may be formed by wet deposition.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: providing a base substrate; forming an inner layer via hole in the base substrate; performing plating on the base substrate and inner layer via holes; Performing an exposure, performing an edge coating around an edge of the base substrate, developing and etching the circuit-formed areas on the edge-coded base substrate to form an inner layer circuit layer, The method comprising the steps of:

In performing the edge coating, the edge coating may be formed of a polymeric resin.

In performing the edge coating, the edge coating may be formed of an epoxy-based resin.

In performing the edge coating, the edge coating may be performed by a wet deposition method.

In performing the edge coating, the edge coating may be formed in the dummy region of the base substrate.

A step of forming an outer layer via hole penetrating the insulating layer, a step of forming a plating layer by performing plating on the insulating layer and the outer layer via hole, after the step of forming the inner layer circuit layer, , And patterning the plating layer to form an outer layer circuit layer.

After the step of forming the via hole, performing the desmear.

In performing the desmear, the edge coating formed on the dummy area of the base substrate can be removed.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the printed circuit board and the printed circuit board manufacturing method of the present invention, edge coating is performed on the dummy area of the printed circuit board to protect the insulating layer and the plating layer of the dummy area from various chemical treatments for performing the process.

According to the printed circuit board and the method for manufacturing a printed circuit board of the present invention, impurities generated in the dummy area can be reduced by protecting the plating layer in the dummy area of the printed circuit board.

INDUSTRIAL APPLICABILITY According to the printed circuit board and the method for manufacturing a printed circuit board of the present invention, the reliability of a product can be improved by reducing impurities generated in a dummy area of a printed circuit board.

According to the printed circuit board and the method for manufacturing a printed circuit board of the present invention, impurities in the clean room are reduced due to the reduction of impurities generated in the dummy area of the printed circuit board, thereby facilitating the implementation of the fine circuit.

1 is an exemplary view illustrating a printed circuit board according to an embodiment of the present invention.
FIGS. 2 to 5 are schematic views illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention in a simplified sequence.
6 is a perspective view showing a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to the prior art.
7 is a perspective view showing a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In this specification, the terms first, second, etc. are used to distinguish one element from another, and the element is not limited by the terms.

Hereinafter, a printed circuit board and a method of manufacturing a printed circuit board according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Printed circuit board

1 is an exemplary view illustrating a printed circuit board according to an embodiment of the present invention.

A printed circuit board according to an embodiment of the present invention may include a base substrate 111, an edge coating 150 and an inner layer circuit layer 142.

The base substrate 111 may be, for example, a copper clad laminate (CCL). Here, a copper-clad laminate is a thin laminated board in which a printed circuit board is generally formed, and a thin copper-clad laminated insulating layer. There are various types of copper-clad laminates, such as glass / epoxy copper-clad laminates, heat-resisting resin copper-clad laminates, paper / phenol copper-clad laminates, high frequency copper-clad laminates, flexible copper-clad laminates (polyimide films) and composite copper-clad laminates.

The base substrate 111 can be divided into a circuit forming region 112 in which the inner layer circuit layer 142 is formed and dummy regions 113 and 114 in which the inner layer circuit layer 142 is not formed. Thus, the edge coating 150 can be formed in the dummy regions 113 and 114 where the inner-layer circuit layer 131 is not formed.

The edge coating 150 is formed to surround an edge included in the dummy areas 113 and 114 of the base substrate 111. [ The edge coating 150 surrounds the edges of the dummy regions 113 and 114 and protects the insulating layer and the plating layer 130 of the dummy regions 113 and 114. The edge coating 150 may be formed of a polymer resin such as an epoxy-based resin.

The inner layer circuit layer 142 may be formed by performing development and etching on the circuit formation region 112 of the base substrate 111. The inner layer circuit layer 142 may include a via 140, a circuit pattern 141, and the like for electrical connection with the outer layer circuit.

Printed circuit board manufacturing method

FIGS. 2 to 5 are schematic views illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention in a simplified sequence.

Referring to FIG. 2, a base substrate 111 on which a via hole is formed is provided. Here, the base substrate 111 may be formed by stacking the metal layers 110 on both sides of the core layer 100. Here, the core layer 100 may be an insulating layer and the metal layer 110 may be copper. That is, the base substrate 111 may be, for example, a copper clad laminate (CCL). Here, a copper clad laminate is generally a thin plate laminated with a thin copper foil on an insulating layer, which is an original plate on which a printed circuit board is manufactured. There are various types of copper-clad laminates, including glass / epoxy copper-clad laminates, heat-resisting resin copper-clad laminates, paper / phenol copper-clad laminates, high-frequency copper clad laminates, flexible copper clad laminates (polyimide films) and composite copper clad laminates.

A via hole 120 is formed in the base substrate 111. [ The via hole 120 may be formed through drilling or laser processing. The insulating layer inside the base substrate 111 is melted due to the heat generated when the via hole 120 is formed after the base substrate 111 is formed and the smear generated on the inner wall of the via hole 120 is removed A desmear process can be further performed.

Referring to FIG. 3, a plating layer 130 is formed on a base substrate 111 on which a via hole 120 is formed. Here, the plating layer 130 may be formed on the base substrate 111 and the inner wall of the via hole 120 by performing electroless copper plating and electrolytic copper plating. When the plating layer 130 is formed, electroless copper plating is performed first. Electroless Dissolving Gold is used to form a conductive film necessary for electrolytic copper plating. It is to perform electroless copper plating thinly by pretreatment prior to electrolytic copper plating. After performing electroless copper plating, electroplating is performed. In FIG. 2, one plating layer 130 is shown without separating a film formed by electroless copper plating and a film formed by electrolytic copper plating. The via hole 120 may be filled with paste to form the via 140 to protect the plating layer 130 formed on the inner wall of the via hole 120. The paste is generally made of an insulating ink material, but a conductive paste may also be used depending on the purpose of use of the printed circuit board. The conductive paste may be a mixture of metal such as Cu, Ag, Au, Sn, Pb or the like as a main component alone or in combination with an organic adhesive in an alloy form.

Referring to FIG. 4, a plating resist for forming a circuit is applied to the base substrate 111. The plating resist 160 may be applied to the circuit formation region in the base substrate 111. [ Here, the plating resist 160 may be, for example, a dry film or a liquid photo resist (LPR). After the plating resist 160 is applied to the circuit formation region, an exposure process is performed. In the exposure step, ultraviolet rays are applied to the plating resist 160 to harden the plating resist 160 so as to have a predetermined pattern.

After the plating resist 160 is applied and exposed in this way, edge coating is performed. The edge coating 150 may be formed in the dummy region except for the circuit forming region of the base substrate 111. [ That is, the edge coating 150 may be formed to surround an edge where no circuit is formed in the base substrate 111. The edge coating 150 may be deposited on the edge portion corresponding to the pile of the base substrate 111 by a spray method or a wet deposition method. Here, the coating liquid used for forming the edge coating 150 may be a polymer resin. For example, an epoxy-based resin may be used as the coating liquid. The edge coating 150 may be formed by a wet deposition method. For example, the edge coating 150 may be formed by spraying an etchant on the dummy area where the edge coating 150 of the base substrate 111 is to be formed. In addition, the edge coating 150 may be formed by impregnating the etchant into the dummy area where the edge coating 150 of the base substrate 111 is to be formed. The method of forming the edge coating 150 on the base substrate 111 is not limited thereto and can be easily changed by those skilled in the art.

Referring to FIG. 5, a circuit pattern is formed on the base substrate 111. The plating resist 160 applied to the base substrate 111 is developed. In this way, the cured portion of the base substrate 111 can be removed using a developing solution by the developing process. That is, the portion of the plating resist 160 corresponding to the circuit pattern remains. Thereafter, etching is performed using a portion of the plating resist 160 not removed from the base substrate 111. Here, an edge coating 150 is formed on the dummy portion of the base substrate 111 when performing the etching, thereby preventing the dummy region from being etched. Thus, unnecessary etching of the dummy region is prevented, and generation of impurities caused by etching of the dummy region is prevented.

After the base substrate 111 is etched in this manner, a predetermined circuit pattern can be formed by removing the remaining plating resist 160. The predetermined circuit pattern formed here may be an inner layer circuit pattern.

Although not shown in the drawings, an inner layer circuit may be formed on the base substrate 111, and then an outer layer circuit may be formed on the inner layer circuit. The outer layer circuit includes a step of laminating an insulating layer on the inner layer circuit, a step of passing through the insulating layer, forming an outer layer via hole connected to the inner layer circuit, a step of performing a desmear after the via hole is formed, To form a plating layer, and performing patterning on the plating layer.

Here, when performing the desmear after forming the via hole, the edge coating of the inner layer circuit can be removed as well.

The steps of forming the outer layer circuits are known matters, and the drawings and detailed description will be omitted.

6 is a perspective view showing a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to the prior art.

Referring to FIG. 6, it can be seen that the dummy area 130 of the printed circuit board is damaged after the formation of the conventional inner-layer circuit. As the plating layer 130 in the dummy area is damaged, impurities are generated in the plating layer 130. The impurities generated in the plating layer 130 are then transferred to the circuit pattern region of the inner layer circuit to lower the reliability of the product.

7 is a perspective view showing a cross section of a dummy region of a printed circuit board after forming an inner layer circuit according to an embodiment of the present invention.

Referring to FIG. 7, it can be seen that the plating layer 130 of the dummy region where the edge coating is formed is protected and not damaged according to this embodiment. As described above, the plating layer 130 in the dummy area of the printed circuit board is protected, thereby preventing the generation of impurities.

According to an embodiment of the present invention, edge coating is performed on the dummy area of the printed circuit board to protect the insulating layer and the plating layer of the dummy area from various chemical treatments for performing the process. Thus, by protecting the insulating layer and the plating layer in the dummy region of the printed circuit board, impurities generated in the dummy region can be reduced. Therefore, the reliability of the printed circuit board can be improved by reducing the generation of impurities.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: core layer 110: metal layer
111: base substrate 112: circuit forming region
113 114: dummy area 120: via hole
130: Plated layer 140: Via
141: circuit pattern 150: edge coating
160: Plating resist

Claims (12)

A base substrate;
An inner layer circuit layer formed in a circuit formation region of the base substrate;
A plating layer surrounding the dummy region on the upper and lower surfaces of the base substrate and the side surface of the base substrate; And
And a resin layer formed on an outer surface of the plating layer so as to surround a dummy region on the upper and lower surfaces of the base substrate and a side surface of the base substrate,
A dummy region on the upper and lower surfaces of the base substrate is connected to a side surface of the base substrate,
The plating layer may include a top or bottom plating layer formed on a dummy region of the upper or lower surface of the base substrate and a side plating layer formed on a side surface of the base substrate,
Wherein the side plating layer is connected to the upper and lower plating layers,
Wherein the resin layer comprises a top or bottom resin layer formed on an outer surface of the top or bottom plating layer and a side resin layer formed on an outer surface of the side plating layer,
And the side resin layer is connected to the upper and lower resin layers.
The method according to claim 1,
Wherein the resin layer is formed of a polymer resin.
The method according to claim 1,
Wherein the resin layer is formed of an epoxy-based resin.
The method according to claim 1,
Wherein the resin layer is formed by a wet deposition method.
Providing a base substrate;
Forming a plating layer surrounding the upper and lower surfaces of the base substrate and the entire side surface;
Applying a resist on the plating layer located in a circuit formation region of the base substrate and then performing exposure;
Forming a resin layer on an outer surface of the plating layer so as to surround a dummy region on the upper and lower surfaces of the base substrate and a side surface of the base substrate;
Developing the resist to remove a portion of the resist;
Performing etching on the plating layer located in the circuit formation region to form an inner layer circuit layer; And
And removing the resist,
A dummy region on the upper and lower surfaces of the base substrate is connected to a side surface of the base substrate,
In the step of forming the inner-layer circuit layer,
Wherein the resin layer protects the plating layer formed on the dummy area on the upper and lower surfaces of the base substrate and the side surface of the base substrate from etching,
The plating layer may include a top or bottom plating layer formed on a dummy region of the upper or lower surface of the base substrate and a side plating layer formed on a side surface of the base substrate,
Wherein the side plating layer is connected to the upper and lower plating layers,
Wherein the resin layer comprises a top or bottom resin layer formed on an outer surface of the top or bottom plating layer and a side resin layer formed on an outer surface of the side plating layer,
And the side resin layer is connected to the upper and lower resin layers.
The method of claim 5,
In the step of forming the resin layer,
Wherein the resin layer is formed of a polymer resin.
The method of claim 5,
In the step of forming the resin layer,
Wherein the resin layer is formed of an epoxy-based resin.
The method of claim 5,
In the step of forming the resin layer,
Wherein the resin layer is formed by a wet deposition method.
The method of claim 5,
After providing the base substrate,
Further comprising forming an inner layer via hole in the base substrate,
Wherein the plating layer is formed on the inner wall of the inner layer via hole in the step of forming the plating layer.
The method of claim 5,
After the step of removing the resist,
Stacking an insulating layer on the inner layer circuit layer of the base substrate;
Forming an outer layer via hole penetrating the insulating layer; And
And forming an outer layer circuit layer on the insulating layer and the outer layer via hole.
The method of claim 10,
After the step of forming the outer layer via hole,
Further comprising the step of performing a desmear of the printed circuit board.
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