KR101067134B1 - A carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same - Google Patents

Abstract

The present invention relates to a carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same, (A) forming a protruding member on the outside of the plate to prepare a carrier, (B) metal layers on both sides of the first insulating layer Preparing the formed copper-clad laminate and processing the groove, (C) inserting the protruding member into the groove to bond the copper-clad laminate to the carrier, patterning the exposed metal layer to form a first circuit layer, and forming a build-up layer And (D) separating the carrier and removing the exposed metal layer, and maintaining the size of the printed circuit board by using the protruding member and the groove, and reusing the carrier. Provided are a manufacturing carrier and a method of manufacturing a printed circuit board using the same.

Carrier, Protrusion, Substrate Size, Step Surface

Description

A carrier for manufacturing a printed circuit board and a method for manufacturing a printed circuit board using the same {A CARRIER FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD USING THE SAME}

The present invention relates to a carrier for manufacturing a printed circuit board and a method of manufacturing a printed circuit board using the same.

In general, a printed circuit board is formed of copper foil on one or both sides of a board made of various thermosetting synthetic resins to arrange and fix integrated circuits (ICs) or electronic components on the board, and to implement electrical wiring therebetween and then coated with an insulator. .

In recent years, due to the development of the electronic industry, the demand for high functionalization and light weight reduction of electronic components is rapidly increasing. Accordingly, printed circuit boards on which such electronic components are mounted also require high density wiring and thinning.

In particular, in order to cope with thinning of printed circuit boards, a coreless substrate that can reduce the overall thickness and shorten the signal processing time by removing the core substrate has been attracting attention. However, since the coreless key board does not use a core board, a carrier member capable of performing a support function during the manufacturing process is required.

1 to 5 illustrate a method of manufacturing a printed circuit board using a carrier according to the prior art. Hereinafter, the manufacturing method will be described with reference to FIGS. 1 to 5.

First, the carrier 10 is prepared as shown in FIG. Specifically, the adhesive layer 12, the first metal layer 13, and the second metal layer 14 are sequentially formed on both surfaces of the copper foil laminated plate 11 (CCL) having copper foil layers formed on both surfaces of the insulating layer. At this time, both ends of the adhesive layer 12 are adhered to the copper-clad laminate 11 and the second metal layer 14 by applying heating and pressurization with a high temperature / high pressure press. On the other hand, the first metal layer 13 is in contact with the second metal layer 14 but is not bonded.

Next, as shown in FIG. 2, the buildup layer 15 is formed on both sides of the carrier 10, and the third metal layer 16 is formed on the outermost insulating layer. The buildup layer 15 is generally performed by a known method, and vias connecting the respective buildup circuit layers may be additionally formed. In addition, the third metal layer 16 is formed to prevent warpage of the build-up layer 15.

Next, as shown in FIG. 3, the buildup layer 15 is separated from the carrier 10. At this time, both ends of the adhesive layer 12 bonded to the copper-clad laminate 11 and the second metal layer 14 are removed through a router process to separate the build-up layer 15 from the carrier 10. Since the first metal layer 13 serves as a release layer and is not bonded to the second metal layer 14, when the adhesive layer 12 is removed, the first metal layer 13 is easily separated from the second metal layer 14.

Next, as shown in FIG. 4, the second metal layer 14 and the third metal layer 16 formed on the buildup layer 15 are removed by etching.

Next, as shown in FIG. 5, the open part 17 which exposes the pad part 19 of the outermost circuit layer of the buildup layer 15 is processed to the outermost insulating layer of the buildup layer 15, and solder ball (18) is formed.

However, in the case of a conventional printed circuit board using a carrier, since both ends of the printed circuit board are cut by the router process, there is a problem that the size of the printed circuit board is reduced.

In addition, since the carrier 10 is also cut during the router process, the carrier 10 may not be reused, thereby causing a large process cost and process time.

The present invention was created to solve the problems of the prior art as described above, and an object of the present invention is to provide a carrier for manufacturing a printed circuit board in which the size of the printed circuit board is maintained and a method of manufacturing a printed circuit board using the same.

Another object of the present invention is to provide a carrier for manufacturing a printed circuit board, and a method of manufacturing a printed circuit board using the same, in which a process cost and processing time are reduced by reusing a carrier.

Carrier according to a preferred embodiment of the present invention, characterized in that it comprises a flat plate and a protruding member protruding in the thickness direction of the flat plate, the outer side of the flat plate.

Here, the outer surface of the plate is characterized in that it is formed stepped.

In addition, the protruding member is characterized in that the cylindrical shape.

In addition, the exposed surface of the plate is characterized in that the release treatment.

In addition, the plate is characterized in that consisting of a metal, a polymer material, or an inorganic material.

In addition, the protruding member is formed on a second stepped surface located higher than the first stepped surface of the stepped surface.

In a method of manufacturing a printed circuit board using a carrier according to a preferred embodiment of the present invention, (A) forming a protruding member protruding in the thickness direction of the flat plate on the outside of the flat plate, (B) the first Preparing a copper clad laminate by forming metal layers on both sides of the insulating layer, and processing grooves corresponding to the protruding members in the copper clad laminate, (C) inserting the protrusion members of the carrier into the grooves of the copper laminate. Bonding the copper clad laminate to the carrier, patterning a first metal layer exposed to the outside of the metal layer to form a first circuit layer, and forming a buildup layer on the copper clad laminate, and (D) separating the carrier And removing the second metal layer exposed to the outside of the metal layer.

At this time, the protruding member is characterized in that the cylindrical shape.

Further, in the step (A), characterized in that the outer surface of the plate is formed stepped.

The protruding member may be formed on a second stepped surface positioned higher than a first stepped surface among the stepped surfaces formed on the flat plate.

In addition, the size of the protruding member and the groove is characterized in that the same.

In addition, the groove is characterized in that formed in the dummy region of the copper-clad laminate.

In addition, the length of the protruding member is characterized in that the shorter than the thickness of the copper-clad laminate.

In addition, it characterized in that the release treatment on the exposed surface of the plate.

In addition, the step (D), (D1) separating the carrier, (D2) removing the second metal layer exposed to the outside of the metal layer by etching, and (D3) the first insulating layer and the And processing an open portion exposing the pad portion of the first circuit layer and the outermost layer circuit layer of the build-up layer to the outermost insulating layer of the build-up layer.

In addition, the plate is characterized in that consisting of a metal, a polymer material, or an inorganic material.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may appropriately define the concept of a term in order to best describe its invention The present invention should be construed in accordance with the spirit and scope of the present invention.

According to the present invention, since the printed circuit board is coupled to the carrier by using the protruding member and the groove, the separation of the printed circuit board and the carrier is easy and does not go through a routing process, and thus the size of the printed circuit board is maintained. have.

In addition, according to the present invention, since the carrier is not damaged even when the printed circuit board and the carrier are separated, the carrier can be reused, thereby reducing the process cost and the process time.

In addition, according to the present invention, there is an advantage in that the carrier and the printed circuit board can be easily separated by giving a step to the flat plate of the carrier or performing a release process.

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

For printed circuit board manufacturing carrier

6 is a cross-sectional view of a carrier 100 for manufacturing a printed circuit board according to an exemplary embodiment of the present invention. Hereinafter, the carrier 100 for manufacturing a printed circuit board according to the present embodiment will be described with reference to the embodiment.

As shown in FIG. 6, the carrier 100 for manufacturing a printed circuit board according to the present embodiment is provided with a protruding member 102 protruding outward from an outer side of the flat plate 101.

The flat plate 101 is a part corresponding to the body of the carrier 100 for manufacturing a printed circuit board, and performs a supporting function in the manufacturing process of the printed circuit board 200.

Here, the flat plate 101 may be manufactured by an injection molding method of a metal or a heat resistant polymer or an inorganic material, and may include, for example, stainless steel or an organic resin material. In particular, when made of stainless steel, there is an advantage that the separation from the printed circuit board 200 is easy.

On the other hand, the flat plate 101 is preferably formed with a stepped outer surface, and is composed of a first stepped surface 103a positioned low and a second stepped surface 103b positioned high. This stepped shape, when manufacturing the printed circuit board 200 by stacking the build-up layer on the carrier 100, to form a space between the outermost layer of the printed circuit board 200 and the outer plate 101, Separation of the printed circuit board 200 and the flat plate 101 can be easily performed. Meanwhile, a stepped shape may be formed on both the upper and lower outer surfaces of the flat plate 101, or may be formed only on one surface thereof.

In addition, by releasing the exposed surface of the flat plate 101, separation of the printed circuit board 200 and the flat plate 101 can be easily performed. The release treatment may be a film type release material that is generally used. The release material of the film type may preferably be a release material made of an epoxy-based release material or a fluorine resin, wherein the surface treatment may be Si coating or plasma treatment and the surface of the flat plate 101 may be hydrophilic. It is preferable to carry out the surface treatment in such a way. For example, the release treatment may be a polyethylene terephthalate plastic sheet coated with a Si-based release agent.

The protruding member 102 is a member for fixing the printed circuit board 200 to the flat plate 101 during the manufacturing process of the printed circuit board 200, and is formed outside the flat plate 101.

Here, the protruding member 102 may be formed separately from the flat plate 101, or may be formed together with the flat plate 101 in a single injection molding method. In addition, the protruding member 102 may be formed of a polygonal pillar, but it is preferable that the protrusion member 102 is formed in a cylindrical shape for convenience of manufacturing. On the other hand, it is preferable that the protruding member 102 is formed on the second stepped surface 103b of the stepped surface of the flat plate 101 in connection with the separation of the printed circuit board 200.

Manufacturing method of printed circuit board

7 to 14 are views for explaining a method of manufacturing a printed circuit board 200 using a carrier according to an embodiment of the present invention. Hereinafter, a manufacturing method of a printed circuit board 200 using a carrier according to a preferred embodiment of the present invention will be described with reference to FIGS. 7 to 14.

In the present exemplary embodiment, the manufacturing of the printed circuit boards on both surfaces of the carrier 100 will be described. However, the present invention is not limited thereto, and the printed circuit board may be manufactured only on one surface of the carrier 100.

First, as shown in FIG. 7, the carrier 100 is prepared.

In this case, the carrier 100 may be manufactured by forming the protruding member 102 on the flat plate 101. Here, the flat plate 101 is preferably made of the same size or slightly larger than the printed circuit board 200, and may form the outer surface of the flat plate 101 stepped to facilitate the separation of the carrier 200 afterwards. have.

In addition, when the protruding member 102 is formed on the first stepped surface 103a of the stepped surface of the flat plate 101, the protruding member 102 may be an obstacle when the carrier 100 is separated. It is preferable that it is formed in the 2nd step surface 103b. On the other hand, the length of the protruding member 102 is preferably shorter than the thickness of the copper-clad laminate 107 described below.

Next, as shown in FIG. 8, the copper clad laminate 104 having the metal layer 106 formed on both surfaces of the first insulating layer 105 is prepared, and the protruding member 102 of the carrier 100 is provided on the copper foil laminated plate 104. The groove 108 corresponding to) is machined.

In this case, the groove 108 is formed in the dummy region 113 of the printed circuit board 200, and thus, the groove 108 is not related to the circuit operation of the printed circuit board 200. In addition, the size of the groove 108 is preferably the same as or slightly larger than the size of the protruding member 102, for example, can be processed using a laser. In addition, the cross-sectional shape of the groove 108 may be circular, but is not limited thereto, and may be any shape that can support the protrusion member 102 by being inserted therein.

Meanwhile, the copper clad laminate 104 may serve to support the build-up layer 109 described below together with the carrier 100. In addition, the first insulating layer 105 later becomes the outermost layer of the printed circuit board 200, and may be formed of a solder resist.

Next, as shown in FIG. 9, the copper-clad laminate 104 is bonded to the carrier 100.

At this time, the protruding member 102 of the carrier 100 is inserted into the groove 108 of the copper-clad laminate plate 104, one surface of the copper-clad laminate 104 is in contact with the second step surface 103b of the flat plate 101. Can be. At this time, since the length of the protruding member 102 is shorter than the thickness of the copper clad laminate 104, the protruding member 102 may not be exposed onto the copper clad laminate 104. In addition, because the protruding member 102 is inserted into the groove 108, the carrier 100 and the copper clad laminate 104 are coupled, so that the process may be performed at room temperature.

Next, as shown in FIG. 10, the exposed first metal layer 106a of the metal layer 106 of the copper clad laminate 104 is patterned to form the first circuit layer 107.

At this time, it is possible to form the first circuit layer 107 using a generally known etching method, for example, to form an etching resist on the first metal layer 106a on which the first circuit layer 107 is to be formed. After the etching liquid is applied to the first metal layer 106a, the etching resist may be removed to form the first circuit layer 107.

Next, as shown in FIG. 11, the buildup layer 109 is formed on the copper clad laminated board 104 in which the 1st circuit layer 107 was formed.

In this case, although the build-up layer 109 is illustrated as two layers in FIG. 11, it is possible to form a single layer or a multilayer as an example. In addition, the buildup layer 109 may include a buildup insulating layer and a buildup circuit layer, and may be electrically connected between the buildup circuit layer or between the buildup circuit layer and the first circuit layer 107 through vias. On the other hand, the build-up insulating layer of the outermost layer of the build-up layer 109 may be composed of a solder resist layer, in this case, the solder resist layer serves to protect the build-up circuit layer of the outermost layer of the build-up layer 109 To perform.

Next, as shown in FIG. 12, the carrier 100 is separated from the copper-clad laminate 104 and the buildup layer 109.

In this case, when the flat plate 101 of the carrier 100 is formed stepped, a member having, for example, '└' and '┘' shapes can be easily separated from the stepped surface. In addition, the carrier 100 may be easily separated even when the release surface of the flat plate 101 is released.

Next, as shown in FIG. 13, the exposed second metal layer 106b of the copper clad laminate 107 is removed.

In this case, although all of the second metal layer 106b is removed in FIG. 13, only a part of the second metal layer 106b is removed to be used as a circuit layer, and a separate solder resist layer for protecting the circuit layer is formed. It is also possible. Meanwhile, the second metal layer 106b may be removed through, for example, an etching process.

Next, as shown in FIG. 14, an open part for exposing the pad part 112 to the first insulating layer 105 of the build-up insulating layer and the copper-clad laminate 107 of the outermost layer of the build-up layer 109 ( 110 to process the solder ball 111.

In this case, the open part 110 may be formed by, for example, a laser method, a drill drill method, or the like, and forms a solder ball 111 for connecting to an external device (not shown) through the open part 110. Here, the pad 112 of the printed circuit board 200 and an external device (not shown) are electrically connected through the solder ball 111.

By such a manufacturing process, the printed circuit board 200 using the carrier according to the preferred embodiment shown in FIG. 14 is manufactured.

Although the present invention has been described in detail through specific embodiments, it is for explaining the present invention in detail, and a carrier for manufacturing a printed circuit board according to the present invention and a method for manufacturing a printed circuit board using the same are not limited thereto. It will be apparent that modifications and improvements are possible by those skilled in the art within the technical idea.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

1 to 5 are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to the prior art.

6 is a perspective view of a carrier for manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

7 to 14 are views for explaining a method of manufacturing a printed circuit board using the carrier shown in FIG.

<Description of the symbols for the main parts of the drawings>

100: carrier 101: flat plate

102: protrusion member 103a: first step surface

103b: second step surface 104: copper clad laminate

105: first insulating layer 106: metal layer

106a: first metal layer 106b: second metal layer

107: first circuit layer 108: groove

109: build-up layer 110: open section

111: solder ball 112: pad portion

113: dummy area

Claims (16)

reputation; And Is formed on the outside of the flat plate, protruding member protruding in the thickness direction of the flat plate Includes, the outer surface of the plate is a carrier for manufacturing a printed circuit board, characterized in that formed stepped. delete The method according to claim 1, The protruding member is a carrier for manufacturing a printed circuit board, characterized in that the cylindrical shape. The method according to claim 1, Carrier for manufacturing a printed circuit board, characterized in that the exposed surface of the plate has been released. The method according to claim 1, The flat plate is a carrier for manufacturing a printed circuit board, characterized in that composed of a metal, a polymer material, or an inorganic material. The method according to claim 1, The protruding member is a carrier for manufacturing a printed circuit board, characterized in that formed on the second step surface located higher than the first step surface of the stepped surface. delete delete delete delete delete delete delete delete delete delete

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