CN102523703A - Manufacturing method of back drill holes on PCB (Printed Circuit Board) - Google Patents
Manufacturing method of back drill holes on PCB (Printed Circuit Board) Download PDFInfo
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- CN102523703A CN102523703A CN201210004258XA CN201210004258A CN102523703A CN 102523703 A CN102523703 A CN 102523703A CN 201210004258X A CN201210004258X A CN 201210004258XA CN 201210004258 A CN201210004258 A CN 201210004258A CN 102523703 A CN102523703 A CN 102523703A
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Abstract
The invention discloses a manufacturing method of back drill holes on a PCB (Printed Circuit Board). The manufacturing method comprises the following steps of: in a manufacturing process of the PCB, dividing all layers of the PCB into layers for forming a metalized hole layer and layers for forming a non-metalized hole layer according to layered distribution of metalized holes and non-metalized holes of the back drill holes on the PCB to be manufactured; respectively manufacturing and processing all the layers forming the metalized hole layer and all the layers forming the non-metalized hole layer to form a metalized hole layer with the metalized holes and a non-metalized layer with the non-metalized holes; and laminating the metalized hole layer with the metalized holes and the non-metalized layer with the non-metalized holes through a prepreg with low fluidity to form the PCB with the back drill holes. Therefore, according to the manufacturing method disclosed by the invention, useless hole copper can be completely eliminated, so that the back drill holes without useless hole copper residual can be manufactured on the PCB, and the signal transmission integrity of the PCB is ensured so as to adapt to development requirements of electronic products.
Description
Technical field
The invention belongs to pcb board and make the field, more particularly, the present invention relates to the manufacture method in back drill hole on a kind of pcb board.
Background technology
Along with constantly speeding of electronic product transmission rate, electronic product obviously increases the requirement of the integrality (being called for short SI) of pcb board signal transmission.And the back drill hole is a key factor in the pcb board design, and the back drill hole is played and is electrically connected, the effect of immobilising device.
In the manufacturing process of pcb board (being printed circuit board), the useless hole copper in the plated-through-hole (being the PTH hole) (being called for short Stub) is inoperative to the signal transmission, so, need the useless hole copper in the plated-through-hole be got rid of, to guarantee the integrality of pcb board signal transmission.
As shown in Figure 1; After 02 removal of the useless hole copper in the plated-through-hole on the pcb board 01; Form corresponding non-metallic hole (being the NP hole) 03, rest parts is plated-through hole 04, and above-mentioned non-metallic hole 03 has just constituted the back drill hole with plated-through hole 04; Wherein, the residual useless hole copper 05 between the 03 distance signal layer 06 of non-metallic hole is residual Stub; The effect length of residual useless hole copper 05 is to the integrality of pcb board signal transmission; The length that is residual useless hole copper 05 is long more; The loss of signal is just big more, and excellent back drilling method need reduce the length of residual useless hole copper 05 as far as possible, and is final goal to eliminate residual useless hole copper fully.
At present, in order to remove useless hole copper 02, the PCB industry generally adopts numerically controlled drill that pcb board is carried out mechanical back drill processing; As shown in Figure 2; Existing numerically controlled drill generally comprises operating system 07, Z axle servo system 08 and the measuring unit 09 of mutual electric connection, bores to chew 010 and be installed on the rig and with operating system 07 and be electrically connected, and measuring unit 09 is electrically connected with pcb board 011; Cover plate 012 is placed on the pcb board 011; Operating system 07 control is bored and is chewed 010 and move down, and chews 010 when contacting with cover plate 012 when brill, bores and chews 07, the closed-loop path of pcb board 011 and measuring unit 09 formation; And put with this and to begin to calculate down drilling depth; Chew 010 during when measuring unit 09 detects to bore, to give Z axle servo system 08 with signal feedback, and correspondingly accomplish boring pcb board 011 with the activation signal on pcb board 011 surface;
Like this; Existing numerically controlled drill is convenient for its power auger blind hole function (being Blind hole function); The back drill degree of depth is detected in closed-loop path through brill chews 07, pcb board 011 and measuring unit 09 form, is zero point with the plate face, pierces the needed back drill degree of depth downwards.
Since receive its control back drill degree of depth ability of numerically controlled drill up till now restriction, receive the inhomogeneity influence that influences and receive the used substrate thickness fluctuation of pcb board tolerance of pcb board lamination thickness of dielectric layers; So residual useless hole copper 05 length that this mechanical back drill processing technology is produced is generally long;
Simultaneously; Be easy to generate copper wire at the interface between non-metallic hole 03 in Fig. 1 and the residual useless hole copper 05; The easy consent plug-hole of above-mentioned copper wire, and the aperture of back drill is more little, and the phenomenon of consent plug-hole will be serious more; So just, the quality of pcb board and the integrality of electronic product signal transmission can be had influence on, thereby customer requirement can not be finely satisfied.
Summary of the invention
Technical problem to be solved by this invention provides the manufacture method in back drill hole on a kind of pcb board; This manufacture method can be eliminated residual useless hole copper fully; Thereby on pcb board, produce the back drill hole that does not have residual useless hole copper; Guaranteed the integrality of pcb board signal transmission, to adapt to the growth requirement of electronic product.
In order to solve the problems of the technologies described above, the technical scheme that the present invention adopts is following:
The manufacture method in back drill hole on a kind of pcb board is characterized in that: may further comprise the steps successively:
(1) treating that according to its plated-through hole of back drill hole and non-metallic hole the level on the manufacturing PCB plate distributes, each layer that constitutes pcb board is being divided into each layer of formation plated-through hole layer and each layer of the non-metallic hole of formation layer;
(2) each layer that constitutes the plated-through hole layer carried out internal layer figure transfer, pressing successively, form the plated-through hole layer thereby make; Then, in the position of treating on the manufacturing PCB plate, machine drilling on the relevant position of plated-through hole layer, and to this hole copper, plating forms plated-through hole thereby on the plated-through hole layer, make according to plated-through hole; Then, hole, the power auger first pipe position on the plated-through hole layer; Skin to the plated-through hole layer carries out figure transfer etching, brown oxidation processes again;
(3) each layer that constitutes non-metallic hole layer carried out internal layer figure transfer, pressing successively, form non-metallic hole layer thereby make; Then, according to non-metallic hole in the position of treating on the manufacturing PCB plate, the non-metallic hole of power auger on the relevant position of non-metallic hole layer; Then, hole, the power auger second pipe position on the layer of non-metallic hole, the position in hole, the above-mentioned second pipe position is corresponding with the position in hole, the first pipe position; Skin to non-metallic hole layer carries out figure transfer etching, brown oxidation processes again;
(4) according to non-metallic hole, the position of hole on the layer of non-metallic hole, the second pipe position, on the relevant position of low fluidity prepreg, carry out laser and window, form through hole and hole, the 3rd pipe position thereby on low fluidity prepreg, make;
(5) manage the contraposition that a hole, position and second a pipe hole are managed in hole, position, the 3rd through first; To have plated-through hole the plated-through hole layer, have the low fluidity prepreg of through hole and have the non-metallic layer stack and the pressing successively in non-metallic hole; Like this; Above-mentioned plated-through hole layer just closes through low fluidity prepreg and non-metallic hole lamination and constitutes pcb board, and above-mentioned plated-through hole, through hole and non-metallic hole just constitute the back drill hole on the pcb board;
(6) pcb board that has the back drill hole is carried out subsequent treatment: other through hole of power auger, change that copper, dry film are covered the back drill hole, electroplated, move back film, outer graphics transfer, sensitization coating, surface treatment, processing and forming.
The diameter in said non-metallic hole is greater than the diameter of plated-through hole.
The diameter of through hole is greater than the diameter in non-metallic hole on the said low fluidity prepreg, and after the plated-through hole layer closed through low fluidity prepreg and non-metallic hole lamination, the diameter of through hole was identical with the diameter in non-metallic hole on the low fluidity prepreg.
The present invention's beneficial effect against existing technologies is:
Compare with the mechanical back drill technology of existing numerically controlled drill; This manufacture method need not to adopt mechanical back drill technology just can on pcb board, form the back drill hole; Promptly in the manufacturing process of pcb board; Treating that according to its plated-through hole of back drill hole and non-metallic hole the level on the manufacturing PCB plate distributes; Each layer that constitutes pcb board is divided into each layer that constitutes the plated-through hole layer and each layer that constitutes non-metallic hole layer; Respectively each layer that constitutes the plated-through hole layer and each layer that constitutes non-metallic hole layer are carried out fabrication and processing again, thereby form plated-through hole layer that has plated-through hole and the non-metallic layer that has non-metallic hole, the non-metallic lamination that will have the plated-through hole layer of plated-through hole through low fluidity prepreg again and have a non-metallic hole closes and constitutes the pcb board that has the back drill hole; Like this, this manufacture method just adopts compression method to form the back drill hole in the manufacturing process of pcb board, thereby has changed the traditional fabrication method in back drill hole on the pcb board; Overcome the difficult problem of the residual useless hole copper that the mechanical back drill technology of traditional employing produced fully; Therefore, this manufacture method can be eliminated residual useless hole copper fully, thereby on pcb board, produces the back drill hole that does not have residual useless hole copper; Guaranteed the integrality of pcb board signal transmission, to adapt to the growth requirement of electronic product.
Simultaneously, this manufacture method can treat that the place level on the manufacturing PCB plate clearly defines, and processes respectively plated-through hole and non-metallic hole to the plated-through hole and the non-metallic hole in back drill hole; So this manufacture method is the degree of depth of keyhole accurately, thereby the machining accuracy of this manufacture method is high; Thereby eliminate the back drill hole bur fully; Form good pass, and this manufacture method does not receive the back drill limited aperture; Eliminate the numerically controlled drill machinery back drill aperture (problem of drilling cuttings plug-hole consent during like bore diameter≤0.25mm) fully; Also reduce the design of back drill aperture and pitch-row line, helped high-density wiring, thereby adapted to the compact demand for development of electronic product.
In addition, this manufacture method can also promote the jigsaw utilance, for PCB producer, can save Material Cost in a large number and detect cost.
Description of drawings
Fig. 1 is the sketch map of back drill hole traditional manufacturing technique on the pcb board;
Fig. 2 is the sketch map of the existing numerically controlled drill control back drill degree of depth;
The sketch map that Fig. 3 is the preferred embodiment of the present invention before plated-through hole layer and non-metallic lamination close;
The sketch map that Fig. 4 is the preferred embodiment of the present invention after plated-through hole layer and non-metallic lamination close;
Fig. 5 is the sketch map of the preferred embodiment of the present invention after pcb board carries out subsequent treatment.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done further explanation.
Like Fig. 3, Fig. 4 and shown in Figure 5, the pcb board in this preferred embodiment is ten laminates, and the manufacture method in back drill hole can be made with reference to this preferred embodiment on the pcb board of other number of plies.
(1) treating that according to its plated-through hole of back drill hole and non-metallic hole the level on the manufacturing PCB plate distributes, and is divided into each layer L1, L2, L3, L4, L5, L6, L7, L8, L9, the L10 that constitute pcb board each layer L7, L8, L9, the L10 of the non-metallic hole of each layer L1, L2, L3, L4, L5, L6 and the formation layer that constitutes the plated-through hole layer;
(2) each layer L1, L2, L3, L4, L5, the L6 that constitutes the plated-through hole layer carried out internal layer figure transfer, pressing successively, form plated-through hole layer L1-L6 thereby make, as shown in Figure 3; Then, in the position of treating on the manufacturing PCB plate, machine drilling on the relevant position of plated-through hole layer L1-L6, and to this hole copper, plating forms plated-through hole H1 thereby on plated-through hole layer L1-L6, make according to plated-through hole; Then, the power auger first pipe position hole A1 on plated-through hole layer L1-L6; Outer L1, L6 to plated-through hole layer L1-L6 carries out figure transfer etching, brown oxidation processes again;
(3) each layer L7, L8, L9, the L10 that constitutes non-metallic hole layer carried out internal layer figure transfer, pressing successively, form non-metallic hole layer L7-L10 thereby make; Then; According to non-metallic hole in the position of treating on the manufacturing PCB plate; The non-metallic hole H2 of power auger on the relevant position of non-metallic hole layer L7-L10; Wherein, the brill of non-metallic hole H2 is chewed with respect to the brill of plated-through hole H1 and is chewed monolateral increasing 2mil～4mil, and the diameter of promptly non-metallic hole H2 is greater than the diameter of plated-through hole H1; Then, the power auger second pipe position hole A2 on non-metallic hole layer L7-L10, the position of the above-mentioned second pipe position hole A2 is corresponding with the position of the first pipe position hole A1; Outer L7, L10 to non-metallic hole layer L7-L10 carries out figure transfer etching, brown oxidation processes again;
(4) according to non-metallic hole H2, the position of hole A2 on non-metallic hole layer L7-L10, the second pipe position; On the relevant position of low fluidity prepreg B, carry out laser and window, form through hole H3 and the 3rd pipe position hole A3 thereby on low fluidity prepreg, make; The size of through hole H3 is with respect to the 10mil～50mil that contracts in non-metallic hole H2 big or small monolateral, and promptly low fluidity prepreg B goes up the diameter of the diameter of through hole H3 greater than non-metallic hole H2;
(5) manage the contraposition that position hole A1, the 3rd manages a position hole A3 and second a pipe hole A2 through first; To have the plated-through hole layer L1-L6 of plated-through hole H1, the non-metallic layer L7-L10 that has the low fluidity prepreg B of through hole H3 and have a non-metallic hole H2 superposes and pressing successively; Like this; As shown in Figure 4; Above-mentioned plated-through hole layer L1-L6 just constitutes pcb board through low fluidity prepreg B and the layer L7-L10 pressing of non-metallic hole, and above-mentioned plated-through hole H1, through hole H3 and non-metallic hole H2 just constitute the back drill hole on the pcb board; Plated-through hole layer L1-L6 is through after hanging down fluidity prepreg B and the layer L7-L10 pressing of non-metallic hole, and the diameter that low fluidity prepreg B goes up through hole H3 is identical with the diameter of non-metallic hole H2;
(6) as shown in Figure 5, the pcb board that has the back drill hole is carried out subsequent treatment: other through hole of power auger H4, change that copper, dry film are covered the back drill hole, electroplated, move back film, outer graphics transfers, sensitization coating, surface treatment, processing and forming (with the removal of the part beyond the dotted line among Fig. 4 and other forming processes).
The above is merely preferred embodiment of the present invention, is not to be used for limiting practical range of the present invention; Be all various equivalents of being done according to claim scope of the present invention, be claim scope of the present invention and cover.
Claims (3)
1. the manufacture method in back drill hole on the pcb board is characterized in that: may further comprise the steps successively:
(1) treating that according to its plated-through hole of back drill hole and non-metallic hole the level on the manufacturing PCB plate distributes, each layer that constitutes pcb board is being divided into each layer of formation plated-through hole layer and each layer of the non-metallic hole of formation layer;
(2) each layer that constitutes the plated-through hole layer carried out internal layer figure transfer, pressing successively, form the plated-through hole layer thereby make; Then, in the position of treating on the manufacturing PCB plate, machine drilling on the relevant position of plated-through hole layer, and to this hole copper, plating forms plated-through hole thereby on the plated-through hole layer, make according to plated-through hole; Then, hole, the power auger first pipe position on the plated-through hole layer; Skin to the plated-through hole layer carries out figure transfer etching, brown oxidation processes again;
(3) each layer that constitutes non-metallic hole layer carried out internal layer figure transfer, pressing successively, form non-metallic hole layer thereby make; Then, according to non-metallic hole in the position of treating on the manufacturing PCB plate, the non-metallic hole of power auger on the relevant position of non-metallic hole layer; Then, hole, the power auger second pipe position on the layer of non-metallic hole, the position in hole, the above-mentioned second pipe position is corresponding with the position in hole, the first pipe position; Skin to non-metallic hole layer carries out figure transfer etching, brown oxidation processes again;
(4) according to non-metallic hole, the position of hole on the layer of non-metallic hole, the second pipe position, on the relevant position of low fluidity prepreg, carry out laser and window, form through hole and hole, the 3rd pipe position thereby on low fluidity prepreg, make;
(5) manage the contraposition that a hole, position and second a pipe hole are managed in hole, position, the 3rd through first; To have plated-through hole the plated-through hole layer, have the low fluidity prepreg of through hole and have the non-metallic layer stack and the pressing successively in non-metallic hole; Above-mentioned plated-through hole layer just closes through low fluidity prepreg and non-metallic hole lamination and constitutes pcb board, and above-mentioned plated-through hole, through hole and non-metallic hole just constitute the back drill hole on the pcb board;
(6) pcb board that has the back drill hole is carried out subsequent treatment: other through hole of power auger, change that copper, dry film are covered the back drill hole, electroplated, move back film, outer graphics transfer, sensitization coating, surface treatment, processing and forming.
2. the manufacture method in back drill hole on the pcb board according to claim 1, it is characterized in that: the diameter in said non-metallic hole is greater than the diameter of plated-through hole.
3. the manufacture method in back drill hole on the pcb board according to claim 1; It is characterized in that: the diameter of through hole is greater than the diameter in non-metallic hole on the said low fluidity prepreg; After the plated-through hole layer closed through low fluidity prepreg and non-metallic hole lamination, the diameter of through hole was identical with the diameter in non-metallic hole on the low fluidity prepreg.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210004258XA CN102523703A (en) | 2012-01-06 | 2012-01-06 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
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| CN201210004258XA CN102523703A (en) | 2012-01-06 | 2012-01-06 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
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| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
| CN103068167A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
| CN104284528A (en) * | 2013-07-02 | 2015-01-14 | 深南电路有限公司 | Machining method of printed circuit board back drill |
| CN104354189A (en) * | 2014-08-21 | 2015-02-18 | 深圳市大族激光科技股份有限公司 | Method for improving accuracy of back drilling holes of PCB |
| CN104354189B (en) * | 2014-08-21 | 2016-11-30 | 大族激光科技产业集团股份有限公司 | A kind of method improving pcb board back of the body borehole accuracy |
| CN109327968A (en) * | 2018-11-28 | 2019-02-12 | 郑州云海信息技术有限公司 | A kind of processing method improving intensive heat release hole region subdivision |
| CN109862720A (en) * | 2019-04-02 | 2019-06-07 | 东莞职业技术学院 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
| CN109874229A (en) * | 2017-12-04 | 2019-06-11 | 北大方正集团有限公司 | The manufacturing method and pcb board of pcb board stepped hole |
| CN110087395A (en) * | 2019-04-30 | 2019-08-02 | 东莞联桥电子有限公司 | A kind of manufacture craft of circuit board |
| CN111970836A (en) * | 2020-09-25 | 2020-11-20 | 景旺电子科技(龙川)有限公司 | 5G communication PCB back drilling manufacturing method and system |
| CN113964613A (en) * | 2021-12-16 | 2022-01-21 | 苏州浪潮智能科技有限公司 | Method, device and equipment for reducing stub of high-speed connector and readable medium |
| CN114980575A (en) * | 2022-05-26 | 2022-08-30 | 珠海杰赛科技有限公司 | Processing method of half-side metalized half-side non-metalized blind groove and printed circuit board |
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| CN102917540B (en) * | 2012-10-17 | 2015-10-07 | 无锡江南计算技术研究所 | Printed wiring board selectivity hole copper minimizing technology |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
| CN103068167A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
| CN103068167B (en) * | 2012-12-20 | 2015-07-22 | 景旺电子科技(龙川)有限公司 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
| CN104284528A (en) * | 2013-07-02 | 2015-01-14 | 深南电路有限公司 | Machining method of printed circuit board back drill |
| CN104284528B (en) * | 2013-07-02 | 2017-06-09 | 深南电路有限公司 | The processing method of printed circuit board (PCB) back drill |
| CN104354189A (en) * | 2014-08-21 | 2015-02-18 | 深圳市大族激光科技股份有限公司 | Method for improving accuracy of back drilling holes of PCB |
| CN104354189B (en) * | 2014-08-21 | 2016-11-30 | 大族激光科技产业集团股份有限公司 | A kind of method improving pcb board back of the body borehole accuracy |
| CN109874229A (en) * | 2017-12-04 | 2019-06-11 | 北大方正集团有限公司 | The manufacturing method and pcb board of pcb board stepped hole |
| CN109874229B (en) * | 2017-12-04 | 2021-04-09 | 北大方正集团有限公司 | Manufacturing method of PCB stepped hole and PCB |
| CN109327968A (en) * | 2018-11-28 | 2019-02-12 | 郑州云海信息技术有限公司 | A kind of processing method improving intensive heat release hole region subdivision |
| CN109327968B (en) * | 2018-11-28 | 2021-07-23 | 郑州云海信息技术有限公司 | Processing method for improving layering of dense heat dissipation hole region |
| CN109862720A (en) * | 2019-04-02 | 2019-06-07 | 东莞职业技术学院 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
| CN110087395A (en) * | 2019-04-30 | 2019-08-02 | 东莞联桥电子有限公司 | A kind of manufacture craft of circuit board |
| CN111970836A (en) * | 2020-09-25 | 2020-11-20 | 景旺电子科技(龙川)有限公司 | 5G communication PCB back drilling manufacturing method and system |
| CN113964613A (en) * | 2021-12-16 | 2022-01-21 | 苏州浪潮智能科技有限公司 | Method, device and equipment for reducing stub of high-speed connector and readable medium |
| CN114980575A (en) * | 2022-05-26 | 2022-08-30 | 珠海杰赛科技有限公司 | Processing method of half-side metalized half-side non-metalized blind groove and printed circuit board |
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Application publication date: 20120627 |