CN103068167A - Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad - Google Patents
Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad Download PDFInfo
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- CN103068167A CN103068167A CN2012105580150A CN201210558015A CN103068167A CN 103068167 A CN103068167 A CN 103068167A CN 2012105580150 A CN2012105580150 A CN 2012105580150A CN 201210558015 A CN201210558015 A CN 201210558015A CN 103068167 A CN103068167 A CN 103068167A
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Abstract
The invention discloses a method for resolving a copper sheet delaminating problem in drilling a metal substrate thick copper plate independent pad. The method for resolving the copper sheet delaminating problem in drilling the metal substrate thick copper plate independent pad comprises the following steps: firstly, presetting the etching compensation value of a thick copper plate independent pad; then, conducting no copper treatment on the positions, needing to be drilled, of the independent pad when a circuit film is designed; in the no copper treatment in film design, the size difference between each of the positions, needing to be drilled, of the independent pad and the bore diameter of each drilled bore is enabled to be between -2mil and +2mil after the circuit pattern transference is conducted according to the process capacity; finally, the drilling process can be produced in bulk directly. After being drilled, the independent pad is good in drilling position quality and free from burrs and copper sheet delaminations. The method for resolving the copper sheet delaminating problem in drilling the metal substrate thick copper plate independent pad not only reduces production cost, but also improves production efficiency and quality. Meanwhile, the drilling process capacity, on the metal substrate thick copper plate, of enterprises is improved, so that stable quality is provided to the metal substrate thick copper plate.
Description
Technical field
The present invention relates to Metal Substrate boring, printed wiring board manufacture technology field, relate in particular to a kind of method that the thick copper coin independence of Metal Substrate PAD boring copper sheet warps that solves.
Background technology
High speed development along with the microelectronics integrated technology, electronic product is more and more higher to the power requirement of components and parts, the quantity of the components and parts that carry on the metal substrate is more and more, cause the operational environment of device to change to the high temperature direction, for life-span and the reliability that guarantees components and parts, must timely the heat dissipation that produces be gone out, so the demand of the thick copper coin of Metal Substrate is constantly soaring, the thick continuous increase of the copper of Metal Substrate power panel.
Thick copper coin, refer to internal layer or outer finish copper thick 〉=wiring board of 2OZ, the thick copper coin of Metal Substrate in order to bearing great current, reduce thermal strain and heat radiation, multiplex in communication apparatus, space flight and aviation, automobile, the network energy, flat surface transformer and power module etc.Along with the chip technology integrated level is more and more higher, the electric current that the circuit of metal-based copper-clad plate need to carry is increasing.How making the thick copper coin of qualified Metal Substrate becomes and captures a difficult problem, and wherein independent PAD boring copper sheet warps and also perplexing the industry producer always.
The thick copper coin of Metal Substrate usually adopts one to bore or bore drilling parameters and brill from two and chew the boring copper sheet that quality sets about solving independent PAD and warp, have following shortcoming: 1. one bore: figure transfer water horizontal line easily causes in the hole coarse later, the quality problem such as Kong Da, one bores the thick copper coin of Metal Substrate easily causes the copper face burr, causes line pattern to shift easy ill-exposed the appearance and scraps; 2. two bore the drilling parameter improvement: by reducing the production of lamination number, high to the backing plate density requirements, production efficiency is low, and circuit surface easily causes the boring burr quality problem that punching weighs wounded to occur.3. the quality of holing: adopt the thick copper coin special jewel of special-purpose metal base to chew production, but production cost is high, is unsuitable for producing in batches.
In view of this, prior art haves much room for improvement and improves.
Summary of the invention
In view of the deficiencies in the prior art, the object of the invention is to provide a kind of method that the thick copper coin independence of Metal Substrate PAD boring copper sheet warps that solves.Be intended to solve the various drawbacks of the thick copper coin drill mode of Metal Substrate in the prior art.
Technical scheme of the present invention is as follows:
A kind ofly solve the method that the thick copper coin independence of Metal Substrate PAD boring copper sheet warps, wherein, said method comprising the steps of:
S1, preset the etching offset of thick copper coin independence PAD;
The position of when S2, the designed lines film need of independent PAD being holed is done without copper according to its corresponding etching offset and is processed, and wherein, the size that the circuit film need be emptied equals boring aperture and removes first the etching offset;
S3, design the amended circuit film, the line road figure of going forward side by side shifts, and the big or small gap of the position of the need of independent PAD boring and boring aperture is between ± 2mil after the etching, and the Circular Aperture of namely emptying follows the boring aperture size in ± 2mil;
S4, carry out that welding resistance is processed, after character processes, use the direct polylith lamination of Metal Substrate drill bit to hole.
The method that the thick copper coin independence of described solution Metal Substrate PAD boring copper sheet warps, wherein, comprise without the copper processing among the described step S2: the place that will hole etches away.
The method that the thick copper coin independence of described solution Metal Substrate PAD boring copper sheet warps, wherein, the etching offset of independent PAD comprises among the described step S1:
4OZ independence PAD compensates 0.15mm.
Beneficial effect:
The method that the application's the thick copper coin independence of solution Metal Substrate PAD boring copper sheet warps, independent PAD bore position quality is good after the boring, warps without burr and copper sheet; The method has not only reduced production cost but also improved production efficiency and quality problem, simultaneously, has improved the boring process capability of the thick copper coin of company's Metal Substrate, for the thick copper coin of Metal Substrate provides stable quality.
Description of drawings
Fig. 1 is the flow chart of the method that warps of the thick copper coin independence of solution Metal Substrate of the present invention PAD boring copper sheet.
Embodiment
The invention provides a kind of method that the thick copper coin independence of Metal Substrate PAD boring copper sheet warps that solves, clearer, clear and definite for making purpose of the present invention, technical scheme and effect, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
See also Fig. 1, the flow chart of the method that it warps for the thick copper coin independence of solution Metal Substrate of the present invention PAD boring copper sheet.As shown in the figure, the method that warps of the thick copper coin independence of described solution Metal Substrate PAD boring copper sheet may further comprise the steps:
S1, preset the etching offset of thick copper coin independence PAD;
The position of when S2, the designed lines film need of independent PAD being holed is done without copper according to its corresponding etching offset and is processed, and wherein, the size that the circuit film need be emptied equals boring aperture and removes first the etching offset;
S3, design the amended circuit film, the line road figure of going forward side by side shifts, and the big or small gap of the position of the need of independent PAD boring and boring aperture is between ± 2mil after the etching, and the Circular Aperture of namely emptying follows the boring aperture size in ± 2mil;
S4, carry out that welding resistance is processed, after character processes, use the direct polylith lamination of Metal Substrate drill bit to hole.
The below specifically describes for above-mentioned steps respectively:
Described step S1 is the etching offset that presets thick copper coin independence PAD.Wherein, the etching offset obtains by lot of experiments, creation data.It can set up corresponding database, for example: 4OZ independence PAD entire compensation 0.15mm.
The position of when described step S2 is the designed lines film need of independent PAD being holed is done without copper according to its corresponding etching offset and is processed, and wherein, the size that the circuit film need be emptied equals boring aperture and removes first the etching offset.Wherein, the described processing without copper also claims to empty processing, and namely the place of boring etches away.
Described step S3 designs the amended circuit film, and the line road figure of going forward side by side shifts, and the big or small gap of the position of the need of independent PAD boring and boring aperture is between ± 2mil after the etching, and the Circular Aperture of namely emptying follows the boring aperture size in ± 2mil.The independent PAD that tradition two is bored plate looks like solid copper, and independent PAD bore position is annulus (without copper) after the thick copper coin etching of this patent Metal Substrate.
Described step S4 uses the direct polylith lamination of common metal base drill bit to hole for after carrying out welding resistance processing, character processing.This step is same as the prior art, just seldom does here and gives unnecessary details.Independent PAD bore position quality is good after its boring, warps without burr and copper sheet.
The method that the thick copper coin independence of solution Metal Substrate of the present invention PAD boring copper sheet warps, compare with the pattern that the boring copper sheet that solved independent PAD warps in the past:
1. avoided shifting the quality problem such as ill-exposed because a brill causes the hole to reach greatly figure;
2. but the polylith lamination is produced, and production efficiency is high, can not cause the quality problem of circuit surface burr;
3. need not to adopt special jewel to chew production, use common metal base boring batch production to get final product, Decrease production cost, simple to operation.
In sum, the method that the thick copper coin independence of solution Metal Substrate of the present invention PAD boring copper sheet warps, wherein, described method comprises: at first, preset the etching offset of thick copper coin independence PAD; Then, the position of the need boring of independent PAD done without copper during the designed lines film and process; Film design without copper according to process capability accomplish line pattern shift after the position of need boring of independent PAD than boring aperture between ± the 2mil; At last, drilling operating is directly produced in batches and is got final product.Independent PAD bore position quality is good after the boring, warps without burr and copper sheet; The method has not only reduced production cost but also improved production efficiency and quality problem, simultaneously, has improved the boring process capability of the thick copper coin of company's Metal Substrate, for the thick copper coin of Metal Substrate provides stable quality.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, for those of ordinary skills, can be improved according to the above description or conversion that all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (3)
1. one kind solves the method that the thick copper coin independence of Metal Substrate PAD boring copper sheet warps, and it is characterized in that, said method comprising the steps of:
S1, preset the etching offset of thick copper coin independence PAD;
The position of when S2, the designed lines film need of independent PAD being holed is done without copper according to its corresponding etching offset and is processed, and wherein, the size that the circuit film need be emptied equals boring aperture and removes first the etching offset;
S3, design the amended circuit film, the line road figure of going forward side by side shifts, and the big or small gap of the position of the need of independent PAD boring and boring aperture is between ± 2mil after the etching, and the Circular Aperture of namely emptying follows the boring aperture size in ± 2mil;
S4, carry out that welding resistance is processed, after character processes, use the direct polylith lamination of Metal Substrate drill bit to hole.
2. the method that warps of the thick copper coin independence of solution Metal Substrate according to claim 1 PAD boring copper sheet is characterized in that, processes without copper among the described step S2 to comprise: the place that will hole etches away.
3. the method that warps of the thick copper coin independence of solution Metal Substrate according to claim 1 PAD boring copper sheet is characterized in that the etching offset of independent PAD comprises among the described step S1:
4OZ independence PAD compensates 0.15mm.
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| CN201210558015.0A CN103068167B (en) | 2012-12-20 | 2012-12-20 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
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| CN201210558015.0A CN103068167B (en) | 2012-12-20 | 2012-12-20 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889157A (en) * | 2014-02-13 | 2014-06-25 | 九江华祥科技股份有限公司 | Method for making thick copper printed circuit board |
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN104582276A (en) * | 2013-10-18 | 2015-04-29 | 北大方正集团有限公司 | Method for manufacturing printed circuit board (PCB) |
| CN106735387A (en) * | 2016-12-27 | 2017-05-31 | 广东生益科技股份有限公司 | Multiple-plate boring method |
| CN108012421A (en) * | 2017-11-09 | 2018-05-08 | 建业科技电子（惠州）有限公司 | Control separate wells aperture and independent lines thickness production method |
| CN109788650A (en) * | 2019-02-01 | 2019-05-21 | 奥士康精密电路（惠州）有限公司 | A kind of ameliorative way of super thick copper sheet PTH plug-in unit hole bur |
| CN110167289A (en) * | 2019-06-26 | 2019-08-23 | 广州弘高科技股份有限公司 | A kind of production method of multilayer circuit board |
| CN111050480A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Drilling method for preventing half-hole copper sheet from rolling up |
| CN111148354A (en) * | 2019-12-30 | 2020-05-12 | 惠州市永隆电路有限公司 | Batch cutting processing method for metallized semi-hole PCB |
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| CN101998768A (en) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | Novel manufacturing method for back drilling of PCB (Printed Circuit Board) |
| CN102427671A (en) * | 2011-11-10 | 2012-04-25 | 东莞生益电子有限公司 | Local thick copper plating process of dense hole |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
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| CN101998768A (en) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | Novel manufacturing method for back drilling of PCB (Printed Circuit Board) |
| CN102427671A (en) * | 2011-11-10 | 2012-04-25 | 东莞生益电子有限公司 | Local thick copper plating process of dense hole |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582276A (en) * | 2013-10-18 | 2015-04-29 | 北大方正集团有限公司 | Method for manufacturing printed circuit board (PCB) |
| CN104582276B (en) * | 2013-10-18 | 2017-08-29 | 北大方正集团有限公司 | A kind of processing method of printing board PCB |
| CN103889157A (en) * | 2014-02-13 | 2014-06-25 | 九江华祥科技股份有限公司 | Method for making thick copper printed circuit board |
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN106735387A (en) * | 2016-12-27 | 2017-05-31 | 广东生益科技股份有限公司 | Multiple-plate boring method |
| CN108012421A (en) * | 2017-11-09 | 2018-05-08 | 建业科技电子（惠州）有限公司 | Control separate wells aperture and independent lines thickness production method |
| WO2019090859A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Manufacturing method for controlling independent pore size and independent wire thickness |
| CN109788650A (en) * | 2019-02-01 | 2019-05-21 | 奥士康精密电路（惠州）有限公司 | A kind of ameliorative way of super thick copper sheet PTH plug-in unit hole bur |
| CN110167289A (en) * | 2019-06-26 | 2019-08-23 | 广州弘高科技股份有限公司 | A kind of production method of multilayer circuit board |
| CN110167289B (en) * | 2019-06-26 | 2020-08-07 | 广州弘高科技股份有限公司 | Method for manufacturing multilayer circuit board |
| CN111050480A (en) * | 2019-12-30 | 2020-04-21 | 惠州市永隆电路有限公司 | Drilling method for preventing half-hole copper sheet from rolling up |
| CN111148354A (en) * | 2019-12-30 | 2020-05-12 | 惠州市永隆电路有限公司 | Batch cutting processing method for metallized semi-hole PCB |
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| CN103068167B (en) | 2015-07-22 |
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