CN110167287A - The production method of new energy OBC blind hole plate - Google Patents
The production method of new energy OBC blind hole plate Download PDFInfo
- Publication number
- CN110167287A CN110167287A CN201910352787.0A CN201910352787A CN110167287A CN 110167287 A CN110167287 A CN 110167287A CN 201910352787 A CN201910352787 A CN 201910352787A CN 110167287 A CN110167287 A CN 110167287A
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- plate
- copper
- client
- hole
- daughter board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of production method of new energy OBC blind hole plate, the first daughter board and the second daughter board including two multilayers, the first daughter board and the second daughter board press the motherboard for connecting into multilayer by PP prepreg.The present invention is pressed using two daughter boards, does not need drilling blind hole, after two 4 each holes drilled through of straton plate, is pressed into 8 layers of blind hole plate；Solve blind hole plating permeability problems using daughter board, daughter board presses the electroplates in hole, saves process and cost.
Description
Technical field
The present invention relates to circuit board production techniques field, in particular to a kind of production method of new energy OBC blind hole plate.
Background technique
Previous ordinary circuit board production technology can not be applicable in the highly difficult technical requirements of new energy OBC blind hole plate；New energy OBC
Blind hole plate belongs to automobile mounted battery charger class, and major function is the power grid electricity for drawing high pressure for high voltage traction battery
Pressure (AC) is converted to charging voltage (DC), the conversion and control applied to cell electric and pluggable hybrid electric vehicle electric energy flow
System.Therefore product must adapt to reliability under long term time high and low temperature shock environment；Material is high voltage withstanding, process reliability；Mesh
The hierarchy of skill of preceding home made O BC project PCB production is also in relatively low level, high-end OBC project pcb board or a piece of
Blank, need selection, material production, processing technology technical bottleneck on break through.Traditional board production technology, Yi Jicai
Material matching, is unable to control the reliability of such template requirement.
Summary of the invention
The present invention provides a kind of production methods of new energy OBC blind hole plate, to solve at least one above-mentioned technical problem.
To solve the above problems, providing a kind of production side of new energy OBC blind hole plate as one aspect of the present invention
Method, the first daughter board and the second daughter board including two multilayers, the first daughter board and the second daughter board pass through the pressing connection of PP prepreg
At the motherboard of multilayer；First daughter board and the second daughter board are made by following manner, comprising the following steps:
Sawing sheet: setting the size of working plate according to equipment process capability, availability ratio of the armor plate, is then split into plate accordingly
Size；
DVCP1: thickening the copper on surface, reaches the requirement of client, to ensure the requirement on electric performance of terminal client；
The imaging of internal layer light: according to the data of client, figure is transferred on working plate from egative film；
Acid etching 1: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed is complete
It stings erosion and comes out in portion；
Internal layer brownification 1: using chemical mode, and coarse surface increases the binding force between material；
Pressing: using corresponding pressing plate formula, different routes is laminated together by vacuum hotpressing machine；
Buried blind via drilling: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize upper and lower level
The electric performance conducting of copper；
Baking sheet: toasting plate using vertical type oven, guarantees product stability；
Positive de-smear: the foreign matters such as the glue residue in hole are chemically removed；
Buried blind via sinks copper: being exactly to plate one layer of thin copper in the hole of drilling, realizes the upper and lower level electric performance conducting of plate；
Electric plating of whole board: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure terminal client
Requirement on electric performance；
DVCP2: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure the electricity of terminal client
Performance requirement；
Filling holes with resin: potting resin material is utilized, the hole for having plated copper is clogged, the reliability of product is increased；
Negative film dry film: according to the data of client, figure is transferred to working plate up from egative film, quality main points: line width/away from
It must be qualified；
Acid etching: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed is complete
Corrode out in portion；
Brownification: using chemical mode, and coarse surface increases the binding force between material.
The present invention is pressed using two daughter boards, does not need drilling blind hole, after two 4 each holes drilled through of straton plate, be pressed into 8 layers it is blind
Orifice plate；Solve blind hole plating permeability problems using daughter board, daughter board presses the electroplates in hole, saves process and cost.
Detailed description of the invention
Fig. 1 schematically shows the structural schematic diagram of the blind hole plate in the present invention；
Fig. 2 schematically shows L1-L4 the first daughter board flow charts；
Fig. 3 schematically shows L5-L8 the second daughter board flow chart；
Fig. 4 schematically shows L1-L8 motherboard flow charts.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
The present invention uses new production technology, can control PCB reliability, meets under the long-term varying environment of client using steady
It is fixed reliably to require.
The present invention connects into 8 layers of motherboard structure by two 4 straton plates, by the pressing of PP prepreg, its advantage is that: it uses
The pressing of two daughter boards, does not need drilling blind hole, after two 4 each holes drilled through of straton plate, is pressed into 8 layers of blind hole plate；It is solved using daughter board
Permeability problems are electroplated in blind hole, and daughter board presses the electroplates in hole, save process and cost.
Concrete technology flow process is as follows:
One, the first daughter board of L1-L4 process description:
1, sawing sheet: the size of working plate is set according to equipment process capability, availability ratio of the armor plate, plate is then split into phase
The size answered.
2, DVCP: thickening the copper on surface, reaches the requirement of client, to ensure the requirement on electric performance of terminal client.
3, internal layer light is imaged: according to the data of client, figure being transferred on working plate from egative film.
4, acid etching 1: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed
It all stings erosion to come out, which wants priority control, and line width/line-spacing must control in acceptability limit；Remove the layer of upper and lower level
Between deviation to control within 25um.
5, internal layer detects: using automatically scanning detecting instrument, the quality after checking circuit etching.
6, internal layer brownification 1: using chemical mode, and coarse surface increases the binding force between material.
7, it presses: using corresponding pressing plate formula, different routes is laminated together by vacuum hotpressing machine, quality
Main points: plate thickness and tolerance will be qualified, and thermal shock and Reflow Soldering are without layering/bubble problem.
8, frame is milled: by equipment by work edges of boards gummosis region mill off.
9, buried blind via drills: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize up and down
The electric performance conducting of layer copper, in the process, the quality that drills wants strict control.Roughness does not allow excessive in hole, is not allow for hair
The problems such as thorn, burr, substrate damage/deformation.
10, examination board 1: quality artificial or using automatic detection instrument detection hole.
11, baking sheet: toasting plate using vertical type oven, guarantees product stability.
12, the foreign matters such as the glue residue in hole positive de-smear: are chemically removed.
13, the heavy copper of buried blind via: it is exactly to plate one layer of thin copper in the hole of drilling, realizes the upper and lower level electric performance conducting of plate.
14, electric plating of whole board: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure terminal visitor
The requirement on electric performance at family.
15, DVCP2: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure terminal client
Requirement on electric performance.
16, filling holes with resin: potting resin material is utilized, the hole for having plated copper is clogged, the reliability of product is increased.
17, resin nog plate: utilizing mechanical equipment, the remaining resin of plate face of polishing.
18, examination board 2: whether manual inspection surface resin polishes completely.
19, negative film dry film: according to the data of client, figure is transferred to working plate up from egative film, quality main points: line
Wide/away from necessary qualified.
20, acid etching: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed
All corrode out, which wants priority control, and line width/line-spacing must control in acceptability limit.
21, internal layer detection 1: automatically scanning detecting instrument is used, the quality after checking circuit etching.
22, erosion inspection: quality artificial and using automatically scanning detecting instrument, after checking circuit etching.
23, brownification: using chemical mode, and coarse surface increases the binding force between material.
Two, the second daughter board of L5-L8 process description:
1, sawing sheet: the size of working plate is set according to equipment process capability, availability ratio of the armor plate, plate is then split into phase
The size answered.
2, DVCP: thickening the copper on surface, reaches the requirement of client, to ensure the requirement on electric performance of terminal client.
3, internal layer light is imaged: according to the data of client, figure being transferred on working plate from egative film.
4, acid etching 1: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed
It all stings erosion to come out, which wants priority control, and line width/line-spacing must control in acceptability limit；Remove the layer of upper and lower level
Between deviation to control within 25um.
5, internal layer detects: using automatically scanning detecting instrument, the quality after checking circuit etching.
6, internal layer brownification 1: using chemical mode, and coarse surface increases the binding force between material.
7, it presses: using corresponding pressing plate formula, different routes is laminated together by vacuum hotpressing machine, quality
Main points: plate thickness and tolerance will be qualified, and thermal shock and Reflow Soldering are without layering/bubble problem.
8, frame is milled: by equipment by work edges of boards gummosis region mill off.
9, buried blind via drills: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize up and down
The electric performance conducting of layer copper, in the process, the quality that drills wants strict control.Roughness does not allow excessive in hole, is not allow for hair
The problems such as thorn, burr, substrate damage/deformation.
10, examination board 1: quality artificial or using automatic detection instrument detection hole.
11, baking sheet: toasting plate using vertical type oven, guarantees product stability.
12, the foreign matters such as the glue residue in hole positive de-smear: are chemically removed.
13, the heavy copper of buried blind via: it is exactly to plate one layer of thin copper in the hole of drilling, realizes the upper and lower level electric performance conducting of plate.
14, electric plating of whole board: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure terminal visitor
The requirement on electric performance at family.
15, DVCP2: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure terminal client
Requirement on electric performance.
16, filling holes with resin: potting resin material is utilized, the hole for having plated copper is clogged, the reliability of product is increased.
17, resin nog plate: utilizing mechanical equipment, the remaining resin of plate face of polishing.
18, examination board 2: whether manual inspection surface resin polishes completely.
19, negative film dry film: according to the data of client, figure is transferred to working plate up from egative film, quality main points: line
Wide/away from necessary qualified.
20, acid etching: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed
All corrode out, which wants priority control, and line width/line-spacing must control in acceptability limit.
21, internal layer detection 1: automatically scanning detecting instrument is used, the quality after checking circuit etching.
22, erosion inspection: quality artificial and using automatically scanning detecting instrument, after checking circuit etching.
23, brownification: using chemical mode, and coarse surface increases the binding force between material.
Three, L1-L8 motherboard process description
1, sawing sheet: the size of working plate is set according to equipment process capability, availability ratio of the armor plate, plate is then split into phase
The size answered.
2, it presses: using corresponding pressing plate formula, different routes is laminated together by vacuum hotpressing machine, quality
Main points: plate thickness and tolerance will be qualified, and thermal shock and Reflow Soldering are without layering/bubble problem.
3, frame is milled: by equipment by work edges of boards gummosis region mill off.
4, it removes glue: removing in hole and the remaining glue mark of plate face.
5, drill: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize upper and lower level copper
Electric performance conducting, in the process, the quality that drills wants strict control.Roughness does not allow excessive in hole, is not allow for burr, drapes over one's shoulders
The problems such as cutting edge of a knife or a sword, substrate damage/deformation.
6, examination board 1: quality artificial or using automatic detection instrument detection hole.
7, baking sheet 1: toasting plate using vertical type oven, guarantees product stability.
8, the foreign matters such as the glue residue in hole positive de-smear: are chemically removed.
9, heavy copper: it is exactly to plate one layer of thin copper in the hole of drilling, realizes the upper and lower level electric performance conducting of plate.
10, electric plating of whole board: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure terminal visitor
The requirement on electric performance at family.
11, pattern transfer: according to the data of client, figure is transferred to working plate up from egative film, quality main points: line
Wide/away from necessary qualified.
12, figure electrolytic copper tin: only in hole or the line conductor plated with copper that retains is needed, realize that the upper and lower level of plate is electrical
It can conducting；Tin plating protection is not snapped eating away when etching.
13, etch: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed is whole
Corrosion comes out, which wants priority control, and line width/line-spacing must control in acceptability limit.
14, outer layer detects: using automatically scanning detecting instrument, the quality after checking circuit etching.
15, low-resistance is tested: being utilized automatic low-resistance test equipment, is prevented in detection hole, retain the product of Kong Wutong, guarantee to arrive
The reliability of the product of client.
16, erosion inspection: quality artificial and using automatically scanning detecting instrument, after checking circuit etching.
17, green oil: according to the requirement of client, the ink of one layer of insulation is printed in circuit plate face, but wants plug-in unit and patch
Pad all expose.
18, full gaging hole copper: using hole copper detecting instrument, and full gaging hole copper guarantees product reliability.
19, it forms: effective cellular manufacture being come out using numerical control gong machine or CNC.Quality main points: outer dimension has to comply with
It is required that.
20, board-washing is formed: level cleaning line, the foreign matters such as plate face residual dust after cleaning molding.
21, it tests: open-short circuit is carried out to working plate, if discovery has out short circuit, processing need to be scrapped.
22, Hi-pot test: utilizing special Hi-pot test frame, according to the test condition of client, potential high pressure is bad
Screen is elected.
23, baking sheet: toasting plate using vertical type oven, guarantees product stability.
24, it is surface-treated: being surface-treated according to the requirement of client, such as: chemical silvering, chemical gilding, organic guarantor weld film
Etc. techniques, the process quality main points: the thickness of surface treatment has to comply with customer requirement, while to have good welding performance.
25, final inspection: checking product according to IPC standard or Customer Standard, and qualified plate can be packed.
26, it packs: being packed according to the manner of packing of customer requirement, generally there is thermoplastic packaging and two kinds of In Aluminium Foil Packing.
Present invention is characterized in that
(1) product ion migration and capacitor corrosion；
Using there is a filler, the high TG epoxide resin material of the S1170G of resistance to CAF and Halogen, TG value reaches 180 DEG C, resistance to
Temperature and resistance to Ion transfer performance are good；It when finished product assembles, is tested by aging etc., the object for generating corrosion to capacitor will not be discharged
Matter increases the long time stability of product.
(2) leak electricity short-circuit under product high power load；
It is designed using copper thickness, copper thickness reaches 105um or more, and load capacity is big at high power.Internal layer uses blind hole+tree
Rouge jack designs, product will by 288 DEG C * 10S 6 times heat resistance test, no layering, hallrcuts, air bubble problem.Route is adopted
It is etched method with vacuum etch method, the flash for reducing copper face solves leak electricity short-circuit.
(3) reliability under the long-term high and low temperature shock environment of product；
The especially material of resistance to CAF is selected, program is pressed using independent proprietary material, material meets 180 DEG C of * in solidification temperature
60min or more；After machining, baking process is designed, reduces material internal stress；The design of via hole copper thickness is electroplated in 30um, with true
Protect reliability under product conduction property and long-term high and low temperature shock environment.
(4) material is high voltage withstanding, process reliability；
Thin core plate is made of 2 prepreg pressings, and proof voltage ability reaches 5000VDC or more；All filled medias
Interlayer design is designed using 3 or more prepregs, increases route side filling capacity and processing stability.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (1)
1. a kind of production method of new energy OBC blind hole plate, which is characterized in that first daughter board and including two multilayers
Two daughter boards, the first daughter board and the second daughter board connect into the motherboard of multilayer by the pressing of PP prepreg；
First daughter board and the second daughter board are made by following manner, comprising the following steps:
Sawing sheet: setting the size of working plate according to equipment process capability, availability ratio of the armor plate, and plate is then split into corresponding ruler
It is very little；
DVCP1: thickening the copper on surface, reaches the requirement of client, to ensure the requirement on electric performance of terminal client；
The imaging of internal layer light: according to the data of client, figure is transferred on working plate from egative film；
Acid etching 1: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client needs all is stung
Erosion comes out；
Internal layer brownification 1: using chemical mode, and coarse surface increases the binding force between material；
Pressing: using corresponding pressing plate formula, different routes is laminated together by vacuum hotpressing machine；
Buried blind via drilling: the purpose of process is that through-hole is drilled out in plate face, rear process can electroless copper, realize upper and lower level copper
Electric performance conducting；
Baking sheet: toasting plate using vertical type oven, guarantees product stability；
Positive de-smear: the foreign matters such as the glue residue in hole are chemically removed；
Buried blind via sinks copper: being exactly to plate one layer of thin copper in the hole of drilling, realizes the upper and lower level electric performance conducting of plate；
Electric plating of whole board: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure the electrical property of terminal client
It can require；
DVCP2: the copper of copper and surface in device to hole is thickeied, and the requirement of client is reached, to ensure the electrical property of terminal client
It is required that；
Filling holes with resin: potting resin material is utilized, the hole for having plated copper is clogged, the reliability of product is increased；
Negative film dry film: according to the data of client, figure is transferred to working plate up from egative film, quality main points: line width/away from necessary
It is qualified；
Acid etching: using acid corrosion liquid medicine (sodium hypochlorite, hydrochloric acid, additive), the figure that client is needed is all rotten
Erosion comes out；
Brownification: using chemical mode, and coarse surface increases the binding force between material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910352787.0A CN110167287A (en) | 2019-04-29 | 2019-04-29 | The production method of new energy OBC blind hole plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910352787.0A CN110167287A (en) | 2019-04-29 | 2019-04-29 | The production method of new energy OBC blind hole plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110167287A true CN110167287A (en) | 2019-08-23 |
Family
ID=67633007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910352787.0A Pending CN110167287A (en) | 2019-04-29 | 2019-04-29 | The production method of new energy OBC blind hole plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN110167287A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194617A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | PCB negative film production process |
| CN113645774A (en) * | 2021-07-30 | 2021-11-12 | 高德（无锡）电子有限公司 | Method for improving warping of high-density interconnected circuit board |
| WO2023087495A1 (en) * | 2021-11-19 | 2023-05-25 | 深南电路股份有限公司 | Circuit board preparation method and circuit board |
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| US3606677A (en) * | 1967-12-26 | 1971-09-21 | Rca Corp | Multilayer circuit board techniques |
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN103140059A (en) * | 2011-11-24 | 2013-06-05 | 深南电路有限公司 | Method for machining multi-layer circuit board with blind hole |
| CN107809855A (en) * | 2017-10-18 | 2018-03-16 | 通元科技(惠州)有限公司 | The preparation method of one species support plate |
| JP2018152510A (en) * | 2017-03-14 | 2018-09-27 | イビデン株式会社 | Printed Wiring Board |
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2019
- 2019-04-29 CN CN201910352787.0A patent/CN110167287A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3606677A (en) * | 1967-12-26 | 1971-09-21 | Rca Corp | Multilayer circuit board techniques |
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN103140059A (en) * | 2011-11-24 | 2013-06-05 | 深南电路有限公司 | Method for machining multi-layer circuit board with blind hole |
| JP2018152510A (en) * | 2017-03-14 | 2018-09-27 | イビデン株式会社 | Printed Wiring Board |
| CN107809855A (en) * | 2017-10-18 | 2018-03-16 | 通元科技(惠州)有限公司 | The preparation method of one species support plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194617A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | PCB negative film production process |
| CN113645774A (en) * | 2021-07-30 | 2021-11-12 | 高德（无锡）电子有限公司 | Method for improving warping of high-density interconnected circuit board |
| WO2023087495A1 (en) * | 2021-11-19 | 2023-05-25 | 深南电路股份有限公司 | Circuit board preparation method and circuit board |
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Application publication date: 20190823 |
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