CN102281726A - Multilayer circuit board method with high density interconnection and high reliability combination - Google Patents
Multilayer circuit board method with high density interconnection and high reliability combination Download PDFInfo
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- CN102281726A CN102281726A CN201110199869XA CN201110199869A CN102281726A CN 102281726 A CN102281726 A CN 102281726A CN 201110199869X A CN201110199869X A CN 201110199869XA CN 201110199869 A CN201110199869 A CN 201110199869A CN 102281726 A CN102281726 A CN 102281726A
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a multilayer circuit board method with high density interconnection and high reliability combination. The method comprises the following steps of: rough shape cutting, sticking of dry film, transferring of inner layer patterns, etching of patterns, removing of a dry film, inspecting of patterns, brownification, stitching of a laminate, stitching, boring and burying, copper deposition, electrifying of the board, sticking of the dry film, transferring of patterns, electroplating of patterns, etching of patterns, brownification, stitching of laminated, stitching, copper deposition, electrifying of the board, sticking of the dry film, transferring of patterns, electroplating of patterns, etching of patterns, inspecting of patterns and molding. The invention aims to provide a multilayer circuit board method, after the cold and heat impulsion and the hot-oil high reliability testing, the resistance change rate is small, and the failure of the circuit board product is not easy to occur.
Description
[technical field]
The present invention relates to the multilayer circuit board method that a kind of high density interconnect combines with high reliability.
[background technology]
Economic development along with society, product of the same race can be sold to all parts of the world, because the environment of various places, weather etc. are different, the available circuit panel products has not adapted to influences such as environment, weather, after test of available circuit panel products thermal shock and the deep fat test, the resistance change rate of circuit board is very big, various faults appear in circuit board product easily, therefore, the high reliability test has been the difficult problem in the circuit board product industry, after high-end product (high density interconnect) adds strict reliability testing, fail a difficult point breaking through especially in the industry always.
[summary of the invention]
The present invention has overcome the deficiency of above-mentioned technology, provides a kind of resistance change rate through circuit board after thermal shock and the test of deep fat high reliability very little, the multilayer circuit board method that circuit board product is not easy to break down.
For achieving the above object, the present invention has adopted following technical proposal:
The multilayer circuit board method that a kind of high density interconnect combines with high reliability comprises the steps:
Step 1: open material, leave the circuit board plate face that satisfies the size that adheres to specification;
Step 2: paste dry film, dry film on each laminating of internal layer;
Step 3: the internal layer figure transfer, utilize film exposure technique, with the figure transfer of internal layer to the plate face;
Step 4: the figure etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching liquid medicine.
Step 5: move back dry film, the dry film that sticks is all returned, copper face and circuit are exposed;
Step 6: the figure inspection, open the poor short circuit phenomenon with what scanner was checked out circuit;
Step 7: brown, copper face of each layer of alligatoring internal layer and line face, good binding between layer and the layer when making operation pressing thereafter;
Step 8: the pressing lamination, each layer of internal layer all stacked, skin wouldn't be made; Pressing: each is laminated together with internal layer, and skin wouldn't be made;
Step 9: bore buried via hole, on a plurality of internal layers, get out buried via hole;
Step 10: heavy copper burying copper on the inner hole deposition, all is communicated with each internal layer;
Step 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 12: paste dry film, the whole face of skin is sticked dry film;
Step 13: figure transfer, the technology of utilizing film exposure with the figure transfer of internal layer to the plate face;
Step 14: graphic plating, electroplate the circuit of each internal layer;
Step 15: the figure etching, the circuit etching of each internal layer is come out;
Step 10 six: brown, copper face of each layer of alligatoring internal layer and line face, good binding between layer and the layer when making operation pressing thereafter;
Step 10 seven: the pressing lamination all stacks inside and outside layer;
Step 10 eight: pressing all forces together inside and outside layer;
Step 10 nine: the drilling blind hole through hole, run through outer field blind hole with radium-shine making, make the through hole that runs through inside and outside layer with machine drilling;
Step 2 ten: heavy copper, copper on blind hole, logical inner hole deposition all is communicated with inside and outside layer.
Step 2 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 2 12: paste dry film, the whole face of skin is sticked dry film;
Step 2 13: figure transfer, the technology of utilizing film exposure with outer field figure transfer to the plate face;
Step 2 14: graphic plating, copper is thick and figure copper is thick in thickening blind hole, the through hole;
Step 2 15: the figure etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching liquid medicine;
Step 2 16: figure inspection: open the poor short circuit phenomenon with what scanner was checked out circuit;
Step 2 17: moulding, gong go out the finished product profile.
Also will carry out green oil and character silk printing step between figure inspection and forming step, green oil is meant at silk-screen one deck on the plate face and plays the liquid of insulation; Character silk printing is meant the literal of discerning when silk-screen goes out to be convenient to play element on the plate face.
Also carry out the electrical measurement step after the character silk printing step, electrical measurement is meant carries out open-short circuit.Also carry out surface treatment step after the electrical measurement step, surface treatment is meant on the circuit board face and plates oxidation-resistant film.
Also carry out the finished product inspection step after surface treatment step, finished product inspection is function and an outward appearance of checking product.
After the finished product inspection step, also carry out packaging step: with the circuit board packing of passed examination.
With the radium-shine aperture of running through outer blind hole of making is 0.1mm, makes with machine drilling that to run through inside and outside layer through-hole aperture be 0.3mm.
The invention has the beneficial effects as follows: 1, the circuit board that processes through this method, doing the CAF test, its condition is: 85 ℃, 85%RH DC100V 1000h, insulation resistance can guarantee more than 500M Ω.2, the circuit board that processes through this method in the condition of finishing is:
Thermal shock test after the 1000cycle, resistance change rate can be controlled in 10%.3, the circuit board that processes through this method, finishing condition:
After the deep fat test of 1000cycle, resistance change rate can be controlled in 10%.
[description of drawings]
Fig. 1 is a flow chart of the present invention.
[embodiment]
The multilayer circuit board method that a kind of high density interconnect combines with high reliability comprises the steps:
Step 1: open material, leave the circuit board plate face that satisfies the size that adheres to specification;
Step 2: paste dry film, dry film on each laminating of internal layer;
Step 3: the internal layer figure transfer, utilize film exposure technique, with the figure transfer of internal layer to the plate face;
Step 4: the figure etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching liquid medicine.
Step 5: move back dry film, the dry film that sticks is all returned, copper face and circuit are exposed;
Step 6: the figure inspection, open the poor short circuit phenomenon with what scanner was checked out circuit;
Step 7: brown, copper face of each layer of alligatoring internal layer and line face, good binding between layer and the layer when making operation pressing thereafter;
Step 8: the pressing lamination, each layer of internal layer all stacked, skin wouldn't be made; Pressing: each is laminated together with internal layer, and skin wouldn't be made;
Step 9: bore buried via hole, on a plurality of internal layers, get out buried via hole;
Step 10: heavy copper burying copper on the inner hole deposition, all is communicated with each internal layer;
Step 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 12: paste dry film, the whole face of skin is sticked dry film;
Step 13: figure transfer, the technology of utilizing film exposure with the figure transfer of internal layer to the plate face;
Step 14: graphic plating, electroplate the circuit of each internal layer;
Step 15: the figure etching, the circuit etching of each internal layer is come out;
Step 10 six: brown, copper face of each layer of alligatoring internal layer and line face, good binding between layer and the layer when making operation pressing thereafter;
Step 10 seven: the pressing lamination all stacks inside and outside layer;
Step 10 eight: pressing all forces together inside and outside layer;
Step 10 nine: the drilling blind hole through hole, run through outer field blind hole with radium-shine making, make the through hole that runs through inside and outside layer with machine drilling;
Step 2 ten: heavy copper, copper on blind hole, logical inner hole deposition all is communicated with inside and outside layer.
Step 2 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 2 12: paste dry film, the whole face of skin is sticked dry film;
Step 2 13: figure transfer, the technology of utilizing film exposure with outer field figure transfer to the plate face;
Step 2 14: graphic plating, copper is thick and figure copper is thick in thickening blind hole, the through hole;
Step 2 15: the figure etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching liquid medicine;
Step 2 16: figure inspection: open the poor short circuit phenomenon with what scanner was checked out circuit.
Step 2 17: moulding, gong go out the finished product profile.
Also will carry out green oil and character silk printing step between figure inspection and forming step, green oil is meant at silk-screen one deck on the plate face and plays the liquid of insulation; Character silk printing is meant the literal of discerning when silk-screen goes out to be convenient to play element on the plate face.
Also carry out the electrical measurement step after the character silk printing step, electrical measurement is meant carries out open-short circuit.
Also carry out surface treatment step after the electrical measurement step, surface treatment is meant on the circuit board face and plates oxidation-resistant film.
Also carry out the finished product inspection step after surface treatment step, finished product inspection is function and an outward appearance of checking product.
After the finished product inspection step, also carry out packaging step: with the circuit board packing of passed examination.
With the radium-shine aperture of running through outer blind hole of making is 0.1mm, makes with machine drilling that to run through inside and outside layer through-hole aperture be 0.3mm.
Claims (7)
1. the multilayer circuit board method that high density interconnect combines with high reliability is characterized in that comprising the steps:
Step 1: open material, leave the circuit board plate face that satisfies the size that adheres to specification;
Step 2: paste dry film, dry film on each laminating of internal layer;
Step 3: the internal layer figure transfer, utilize film exposure technique, with the figure transfer of internal layer to the plate face;
Step 4: the figure etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching liquid medicine;
Step 5: move back dry film, the dry film that sticks is all returned, copper face and circuit are exposed;
Step 6: the figure inspection, open the poor short circuit phenomenon with what scanner was checked out circuit;
Step 7: brown, copper face of each layer of alligatoring internal layer and line face, good binding between layer and the layer when making operation pressing thereafter;
Step 8: the pressing lamination, each layer of internal layer all stacked, skin wouldn't be made; Pressing: each is laminated together with internal layer, and skin wouldn't be made;
Step 9: bore buried via hole, on a plurality of internal layers, get out buried via hole;
Step 10: heavy copper burying copper on the inner hole deposition, all is communicated with each internal layer;
Step 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 12: paste dry film, the whole face of skin is sticked dry film;
Step 13: figure transfer, the technology of utilizing film exposure with the figure transfer of internal layer to the plate face;
Step 14: graphic plating, electroplate the circuit of each internal layer;
Step 15: the figure etching, the circuit etching of each internal layer is come out;
Step 10 six: brown, copper face of each layer of alligatoring internal layer and line face, good binding between layer and the layer when making operation pressing thereafter;
Step 10 seven: the pressing lamination all stacks inside and outside layer;
Step 10 eight: pressing all forces together inside and outside layer;
Step 10 nine: the drilling blind hole through hole, run through outer field blind hole with radium-shine making, make the through hole that runs through inside and outside layer with machine drilling;
Step 2 ten: heavy copper, copper on blind hole, logical inner hole deposition all is communicated with inside and outside layer.
Step 2 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 2 12: paste dry film, the whole face of skin is sticked dry film;
Step 2 13: figure transfer, the technology of utilizing film exposure with outer field figure transfer to the plate face;
Step 2 14: graphic plating, copper is thick and figure copper is thick in thickening blind hole, the through hole;
Step 2 15: the figure etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching liquid medicine;
Step 2 16: figure inspection: open the poor short circuit phenomenon with what scanner was checked out circuit;
Step 2 17: moulding, gong go out the finished product profile.
2. the multilayer circuit board method that a kind of high density interconnect according to claim 1 combines with high reliability, it is characterized in that also will carrying out green oil and character silk printing step between figure inspection and forming step, green oil is meant at silk-screen one deck on the plate face and plays the liquid of insulation; Character silk printing is meant the literal of discerning when silk-screen goes out to be convenient to play element on the plate face.
3. the multilayer circuit board method that a kind of high density interconnect according to claim 2 combines with high reliability is characterized in that, also carries out the electrical measurement step after the character silk printing step, and electrical measurement is meant carries out open-short circuit.
4. the multilayer circuit board method that a kind of high density interconnect according to claim 3 combines with high reliability is characterized in that, also carries out surface treatment step after the electrical measurement step, and surface treatment is meant on the circuit board face and plates oxidation-resistant film.
5. the multilayer circuit board method that a kind of high density interconnect according to claim 4 combines with high reliability is characterized in that, also carries out the finished product inspection step after surface treatment step, and finished product inspection is function and an outward appearance of checking product.
6. the multilayer circuit board method that a kind of high density interconnect according to claim 5 combines with high reliability is characterized in that, also carries out packaging step after the finished product inspection step: with the circuit board packing of passed examination.
7. the multilayer circuit board method that a kind of high density interconnect according to claim 1 combines with high reliability is characterized in that, is 0.1mm with the radium-shine aperture of running through outer blind hole of making, and makes with machine drilling that to run through inside and outside layer through-hole aperture be 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201110199869 CN102281726B (en) | 2011-07-16 | 2011-07-16 | Multilayer circuit board method with high density interconnection and high reliability combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110199869 CN102281726B (en) | 2011-07-16 | 2011-07-16 | Multilayer circuit board method with high density interconnection and high reliability combination |
Publications (2)
| Publication Number | Publication Date |
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| CN102281726A true CN102281726A (en) | 2011-12-14 |
| CN102281726B CN102281726B (en) | 2013-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110199869 Expired - Fee Related CN102281726B (en) | 2011-07-16 | 2011-07-16 | Multilayer circuit board method with high density interconnection and high reliability combination |
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| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN102781170A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Method for preparing mirror-surface aluminum substrate |
| CN103889170A (en) * | 2014-02-28 | 2014-06-25 | 双鸿电子(惠州)有限公司 | Method for manufacturing multilayer vehicle-mounted flexible printed board |
| CN104202930A (en) * | 2014-09-17 | 2014-12-10 | 四川海英电子科技有限公司 | High-density multilayer circuit board production method |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN104427762A (en) * | 2013-09-02 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Buried resistance printed board and manufacturing method thereof |
| CN104602444A (en) * | 2015-01-29 | 2015-05-06 | 高德(苏州)电子有限公司 | Automotive multilayer-structured circuit board and production method thereof |
| CN104080278B (en) * | 2014-06-24 | 2017-06-06 | 柏承科技(昆山)股份有限公司 | The production technology of wiring board conductive polymer fenestra technique and its collocation graphic plating |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN109511214A (en) * | 2018-09-20 | 2019-03-22 | 通元科技(惠州)有限公司 | A kind of LED circuit board and preparation method thereof of black FR4 substrate |
| CN109769340A (en) * | 2019-01-22 | 2019-05-17 | 博罗县亿阳电子有限公司 | A kind of preparation process of multi-lager semiconductor printed wiring board |
| CN110167287A (en) * | 2019-04-29 | 2019-08-23 | 恩达电路(深圳)有限公司 | The production method of new energy OBC blind hole plate |
| CN111479391A (en) * | 2020-04-16 | 2020-07-31 | 广东通元精密电路有限公司 | HDI board manufacturing method for any-order interconnection and HDI board |
| CN112566389A (en) * | 2020-11-10 | 2021-03-26 | 深圳市昶东鑫线路板有限公司 | Multilayer circuit board manufacturing method with high aspect ratio blind hole and multilayer circuit board |
| CN112601371A (en) * | 2020-12-22 | 2021-04-02 | 江西志博信科技股份有限公司 | HDI manufacturing process |
| CN112689405A (en) * | 2020-12-21 | 2021-04-20 | 江西遂川光速电子有限公司 | Production process of HDI circuit board |
| CN112739022A (en) * | 2020-12-22 | 2021-04-30 | 江西志博信科技股份有限公司 | Process for applying printed circuit board by HDI technology |
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| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
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| CN1842253A (en) * | 2005-03-28 | 2006-10-04 | 邓柏生 | Production technique for surface mounting multi-layer resistive plate |
| CN101686603A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | Manufacturing technology of blind hole plate embedding electronic devices |
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| CN102523704B (en) * | 2011-12-15 | 2014-02-19 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN102781170A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Method for preparing mirror-surface aluminum substrate |
| CN104427762B (en) * | 2013-09-02 | 2017-12-15 | 深圳崇达多层线路板有限公司 | Bury resistance printed board and preparation method thereof |
| CN104427762A (en) * | 2013-09-02 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Buried resistance printed board and manufacturing method thereof |
| CN103889170A (en) * | 2014-02-28 | 2014-06-25 | 双鸿电子(惠州)有限公司 | Method for manufacturing multilayer vehicle-mounted flexible printed board |
| CN103889170B (en) * | 2014-02-28 | 2017-03-15 | 双鸿电子(惠州)有限公司 | A kind of preparation method of the vehicle-mounted flexible printed board of multilayer |
| CN104080278B (en) * | 2014-06-24 | 2017-06-06 | 柏承科技(昆山)股份有限公司 | The production technology of wiring board conductive polymer fenestra technique and its collocation graphic plating |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN104202930B (en) * | 2014-09-17 | 2017-06-23 | 四川海英电子科技有限公司 | The production method of high-density multi-layer circuit board |
| CN104202930A (en) * | 2014-09-17 | 2014-12-10 | 四川海英电子科技有限公司 | High-density multilayer circuit board production method |
| CN104602444A (en) * | 2015-01-29 | 2015-05-06 | 高德(苏州)电子有限公司 | Automotive multilayer-structured circuit board and production method thereof |
| CN109511214A (en) * | 2018-09-20 | 2019-03-22 | 通元科技(惠州)有限公司 | A kind of LED circuit board and preparation method thereof of black FR4 substrate |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN109769340A (en) * | 2019-01-22 | 2019-05-17 | 博罗县亿阳电子有限公司 | A kind of preparation process of multi-lager semiconductor printed wiring board |
| CN110167287A (en) * | 2019-04-29 | 2019-08-23 | 恩达电路(深圳)有限公司 | The production method of new energy OBC blind hole plate |
| CN111479391A (en) * | 2020-04-16 | 2020-07-31 | 广东通元精密电路有限公司 | HDI board manufacturing method for any-order interconnection and HDI board |
| CN112566389A (en) * | 2020-11-10 | 2021-03-26 | 深圳市昶东鑫线路板有限公司 | Multilayer circuit board manufacturing method with high aspect ratio blind hole and multilayer circuit board |
| CN112689405A (en) * | 2020-12-21 | 2021-04-20 | 江西遂川光速电子有限公司 | Production process of HDI circuit board |
| CN112601371A (en) * | 2020-12-22 | 2021-04-02 | 江西志博信科技股份有限公司 | HDI manufacturing process |
| CN112739022A (en) * | 2020-12-22 | 2021-04-30 | 江西志博信科技股份有限公司 | Process for applying printed circuit board by HDI technology |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
| CN115666010B (en) * | 2022-11-21 | 2023-03-21 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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