CN101686603A - Manufacturing technology of blind hole plate embedding electronic devices - Google Patents
Manufacturing technology of blind hole plate embedding electronic devices Download PDFInfo
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- CN101686603A CN101686603A CN200810200251A CN200810200251A CN101686603A CN 101686603 A CN101686603 A CN 101686603A CN 200810200251 A CN200810200251 A CN 200810200251A CN 200810200251 A CN200810200251 A CN 200810200251A CN 101686603 A CN101686603 A CN 101686603A
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- blind hole
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- glued membrane
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Abstract
The invention discloses a manufacturing technology of a blind hole plate embedding electronic devices, relating to the process field of printed circuit boards. The technology comprises the following steps: inlayer etching, inlayer punching, inlayer brown oxidizing, lower coating sticking, electronic device embedding, upper coating sticking, type setting, stitching, X-RAY punching, blind hole powerdrilling, through-hole power drilling, chemical copper depositing, once copper plating, outer layer patterning, detecting, solder resisting, electroless metal plating, appearance, final inspecting, packaging and shipping. A depth tester is adopted to test and control blind hole depth of printed circuit boards. By adopting the technology, the embedding electronic device in which the inlayer of theblind hole plate embedding electronic devices is embedded has favorable breakover and does not affect the basic function of the electronic devices.
Description
Technical field
The present invention relates to the printed circuit board (PCB) manufacture field, particularly manufacturing technology of blind hole plate embedding electronic devices.
Background technology
Existing manufacturing technology of blind hole plate embedding electronic devices is, adopts the method for rubberizing film to make to imbed electronic devices and components to be fixed on stably in the core material, and power auger blind hole after the pressing, key are control blind hole depth 0.2 ± 0.05mm.Now in the manufacture craft flow process of blind hole plate embedding electronic devices, the general laser drill that adopts drills through blind hole, but in the aperture is Φ 0.5-0.7mm, degree of depth 0.15-0.25mm, and need pierce in this series products of internal layer chip (embedding electronic devices) 0.05-0.15mm, laser drill can't satisfy the aperture and pierce the requirement of the thickness of internal layer chip.
In addition, because the machined surface of laser is comparatively narrow and small, therefore also comparatively narrow by the formed groove of laser, and when carrying out the consent step, to make printing ink can't insert fully in the groove and form emptying aperture, and then influence the electrical performance and the reliability of overall wire line structure.Moreover, though can reaching the aperture of printed circuit board, laser drill makes, but because laser energy and parameter control are difficult for, and cause producing carbonization phenomenon easily near the hole wall that is drilled with, this kind phenomenon will cause the problem on plated-through-hole (PTH) processing procedure of printed circuit board.Also have laser drill difficult especially greater than the boring of 10 μ m, and can not pierce the inner layer metal chip copper thickness; In addition, laser drill cost height, therefore comprehensive above-mentioned shortcoming is necessary to design a kind of new manufacturing technology of blind hole plate embedding electronic devices.
Summary of the invention
Technical problem to be solved by this invention is that the electronic device conducting that provides a kind of internal layer to imbed is good, and does not influence the manufacturing technology of blind hole plate embedding electronic devices of the electronic device basic function of imbedding.
Technical problem to be solved by this invention can be achieved through the following technical solutions:
A kind of manufacturing technology of blind hole plate embedding electronic devices may further comprise the steps: internal layer etching → internal layer punching → internal layer brown → subsides are glued membrane → embedding electronic devices (comprise buried resistor and bury the internal layer chip) → stick glued membrane → composing → pressing → X-RAY punching → power auger blind hole → power auger through hole → electroless copper plating → one time electro-coppering → outer graphics → detection → welding resistance → chemical gold → profile → end inspection → packing → shipment down.
The internal layer etching promptly exposes on ultraviolet exposure machine by photosensitive resist dry film and figure egative film, again with unexposed dry film dissolving video picture.Copper layer under the dry film protection dry film of remaining exposed portion is removed the copper reaction of exposing out after the video picture in etching solution, and the dry film after the exposure of decorporating again stays the copper layer pattern that needs.
The internal layer punching is by stamping machine, goes out the position, hole that needs, and is used to place the electronic device that will imbed.
The internal layer brown forms the brown protective layer of one deck on the copper surface, plays the effect that protection internal layer copper is not oxidized and improve the adhesion between internal layer and the insulating barrier.Internal layer etching, internal layer punching, internal layer brown all belong to prior art, therefore do not do detailed description.
Paste down that glued membrane is to press by hot pressing is billowing, this glued membrane is affixed on the one side of brown metacoxal plate, be convenient to electronic device (comprising resistance and internal layer chip) and place, and guarantee can not come off; Described glued membrane is pure glued membrane, thickness 11 μ m-13 μ m.
Embedding electronic devices, the position, hole that electronic device (comprise buried resistor and bury internal layer chip) is gone out when putting into the internal layer punching.Require smooth, do not have to leak put, pollution-free.
Stick glued membrane, stick glued membrane, electronic device (comprise buried resistor and bury the internal layer chip) clamping in the glued membrane up and down, is not come off by the billowing upper surface of base plate that places electronic device (comprise buried resistor and bury the internal layer chip) that is pressed in of hot pressing.Described glued membrane is pure glued membrane, thickness 11 μ m-13 μ m.
Composing → pressing → X-RAY punching promptly stacks Copper Foil, bonding sheet (prepreg), core material, pressing steel plate location by designing requirement.Composing → pressing → X-RAY punching belongs to existing technology, does not therefore do detailed description.
The power auger blind hole, the good drilling parameter of input calculated in advance in the control system of numerical control drilling machine.Begin a test drilling 1-5 hole then, whether meet the requirements with depth tester test blind hole depth, as undesirable, then the drilling parameter of setting is debugged according to test result, carry out test drilling again,, formally bore up to meeting the requirements, per 1000 holes are tested once, and more bit change is also wanted test and debugging once at every turn.Described test comprises and utilizes the depth tester MTD.
At last, power auger blind hole → power auger through hole → electroless copper plating → one time electro-coppering → outer graphics → detection → welding resistance → chemical gold → profile → end inspection → packing → shipment, it is close that this flow process and common PCB make flow process.No special feature.
Adopt manufacture method described in the invention to produce in batches.Adopt depth tester test blind hole depth in the sampling Detection; Whether the conduction of the electronic devices and components that test blind hole and internal layer were imbedded after the test outer graphics formed is good, and the electronic devices and components that table of discovery surface layer and internal layer are imbedded have good conducting and do not influence the basic function of electronic devices and components.
Description of drawings
Describe the present invention in detail below in conjunction with the drawings and specific embodiments.
Fig. 1 is for using process flow diagram of the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the present invention.
Referring to Fig. 1; the first step; carry out the internal layer etching; expose on ultraviolet exposure machine by photosensitive resist dry film and figure egative film; with sodium carbonate liquor unexposed dry film is dissolved video picture again; copper layer under the dry film protection dry film of remaining exposed portion is removed the copper reaction of exposing out after the video picture in etching solution, promptly is called etching.Decorporate again dry film after the exposure stays the copper layer pattern that needs.This is identical with common PCB circuit manufacture method.
Second step, carry out the internal layer punching, be by stamping machine, with the mould that designs and produces in advance, go out the position, hole that needs, be used to place the inner electron device.This is the specific process that this product adopts.
The 3rd step, carry out the internal layer brown, be to form the brown protective layer of one deck on the copper surface by chemical method, play the effect that protection internal layer copper is not oxidized and improve the adhesion between internal layer and the insulating barrier.This step is often used in common PCB circuit is made.
In the 4th step, paste glued membrane down: employed glued membrane is the pure glued membrane of a kind of special use, presses by hot pressing is billowing, and described glued membrane is affixed on the one side of brown metacoxal plate, is convenient to electronic device (comprising resistance and internal layer chip) and places, and guarantee can not come off; Described glued membrane is pure glued membrane, thickness 11 μ m-13 μ m, the about 12 μ m of preferred thickness.
The 5th step, embedding electronic devices: the position, hole that electronic device (comprise buried resistor and bury internal layer chip) is gone out when putting into the internal layer punching.Require smooth, do not have to leak put, pollution-free.
In the 6th step, stick glued membrane: stick glued membrane by the billowing upper surface of base plate that places electronic device (comprise buried resistor and bury the internal layer chip) that is pressed in of hot pressing, electronic device (comprise buried resistor and bury the internal layer chip) clamping in the glued membrane up and down, is not come off.Described glued membrane is pure glued membrane, thickness 11 μ m-13 μ m, the about 12 μ m of preferred thickness.
The 7th step, composing → pressing → X-RAY punching: identical with common multi-layer sheet manufacture method, promptly Copper Foil, bonding sheet (prepreg), core material, pressing steel plate location are stacked by designing requirement.Composing → pressing → X-RAY punching belongs to existing technology, does not therefore do detailed description.
In the 8th step, power auger blind hole, power auger blind hole are used seldom in the PCB industry, and blind hole adopts laser drill mostly, because of this product requirement hole diameter Φ 0.5-0.7mm, particularly Φ 0.6mm, the degree of depth 0.2 ± 0.05mm; And need pierce internal layer 0.1 ± 0.05mm, laser drill can't satisfy the aperture and pierce the requirement of chip.So the power auger blind hole is the specific process for the substrate employing of this specific (special) requirements, the control blind hole depth also is the special control method that adopts for the specific (special) requirements of these specialities.
Concrete way is: import the good drilling parameter of calculated in advance earlier on request in the control system of numerical control drilling machine.Begin a test drilling 1-5 hole then, whether meet the requirements with depth tester test blind hole depth, as undesirable, then the drilling parameter of setting is debugged according to test result, carry out test drilling again,, formally bore up to meeting the requirements, per 1000 holes are tested once, and more bit change is also wanted test and debugging once at every turn.
Because the manufacture method of power auger blind hole adopts depth tester test control PCB blind hole depth also to belong to the inventor and adopts first in PCB industry usefulness hardly.It is reported that the industry does not also adopt the method.
Depth tester mainly is the tester that is used in mechanical processing industry test hole milling (hole) degree of depth, by the bottom of the most advanced and sophisticated contact hole of testing needle (hole), watches depth data to show and reaches test purpose.
The 9th step, power auger through hole → electroless copper plating → one time electro-coppering → outer graphics → detections → welding resistance → chemical gold → profile → end inspection → packing → shipment, this flow process is close with common PCB making flow process.No special feature.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (7)
1, a kind of manufacturing technology of blind hole plate embedding electronic devices, it is characterized in that, may further comprise the steps: internal layer etching → internal layer punching → internal layer brown → subsides are glued membrane → embedding electronic devices → stick glued membrane → composing → pressing → X-RAY punching → power auger blind hole → power auger through hole → electroless copper plating → one time electro-coppering → outer graphics → detection → welding resistance → chemical gold → profile → end inspection → packing → shipment down.
2, a kind of manufacturing technology of blind hole plate embedding electronic devices according to claim 1; it is characterized in that; described internal layer etching; for on ultraviolet exposure machine, exposing by photosensitive resist dry film and figure egative film; with unexposed dry film dissolving video picture, the copper layer under the dry film protection dry film of remaining exposed portion is removed the copper reaction of exposing out after the video picture in etching solution again; decorporate again dry film after the exposure stays the copper layer pattern that needs.
3, a kind of manufacturing technology of blind hole plate embedding electronic devices according to claim 1 is characterized in that, described internal layer punching is by stamping machine, goes out the position, hole that needs, and is used to place the electronic device that will imbed.
4, a kind of manufacturing technology of blind hole plate embedding electronic devices according to claim 1 is characterized in that, glued membrane is to press by hot pressing is billowing under the described subsides, and this glued membrane is affixed on the one side of brown metacoxal plate, is convenient to electronic device and places, and guarantee can not come off; Described glued membrane is pure glued membrane, thickness 11 μ m-13 μ m.
5, a kind of manufacturing technology of blind hole plate embedding electronic devices according to claim 1 is characterized in that, described embedding electronic devices, the position of going out when electronic device is put into the internal layer punching, hole, require smooth, do not have to leak put, pollution-free.
6, a kind of manufacturing technology of blind hole plate embedding electronic devices according to claim 1, it is characterized in that, the described glued membrane that sticks, be pressed in the upper surface of base plate that places electronic device and stick glued membrane by hot pressing is billowing, electronic device is being clamped in the glued membrane up and down, do not come off, described glued membrane is pure glued membrane, thickness 11 μ m-13 μ m.
7, a kind of manufacturing technology of blind hole plate embedding electronic devices according to claim 1, it is characterized in that, described power auger blind hole, the good drilling parameter of input calculated in advance in the control system of numerical control drilling machine, begin a test drilling 1-5 hole then, whether meet the requirements with depth tester test blind hole depth, as undesirable, then the drilling parameter of setting is debugged according to test result, carry out test drilling again,, formally bore up to meeting the requirements, per 1000 holes are tested once, and more bit change is also wanted test and debugging once at every turn; Described test comprises and utilizes the depth tester MTD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810200251A CN101686603A (en) | 2008-09-23 | 2008-09-23 | Manufacturing technology of blind hole plate embedding electronic devices |
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| CN200810200251A CN101686603A (en) | 2008-09-23 | 2008-09-23 | Manufacturing technology of blind hole plate embedding electronic devices |
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| CN101686603A true CN101686603A (en) | 2010-03-31 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN102300418A (en) * | 2011-08-12 | 2011-12-28 | 东莞康源电子有限公司 | Embedded component type PCB manufacturing method |
| CN102348337A (en) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | Method for producing circuit board containing stepped blind hole |
| CN102427671A (en) * | 2011-11-10 | 2012-04-25 | 东莞生益电子有限公司 | Local thick copper plating process of dense hole |
| CN102869191A (en) * | 2011-07-04 | 2013-01-09 | 上海贺鸿电子有限公司 | Manufacturing method of printed circuit board |
| CN105704930A (en) * | 2016-04-05 | 2016-06-22 | 苏州市惠利源科技有限公司 | Manufacturing method of buried resistance plate |
| CN108430165A (en) * | 2018-02-08 | 2018-08-21 | 广州兴森快捷电路科技有限公司 | Pcb board etches detection method |
| WO2022222411A1 (en) * | 2021-04-22 | 2022-10-27 | 广东工业大学 | Pcb short-wavelength pulse laser drilling method and related apparatus |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
-
2008
- 2008-09-23 CN CN200810200251A patent/CN101686603A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| CN102348337A (en) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | Method for producing circuit board containing stepped blind hole |
| CN102869191A (en) * | 2011-07-04 | 2013-01-09 | 上海贺鸿电子有限公司 | Manufacturing method of printed circuit board |
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN102300418A (en) * | 2011-08-12 | 2011-12-28 | 东莞康源电子有限公司 | Embedded component type PCB manufacturing method |
| CN102427671B (en) * | 2011-11-10 | 2013-10-16 | 东莞生益电子有限公司 | Local thick copper plating process of dense hole |
| CN102427671A (en) * | 2011-11-10 | 2012-04-25 | 东莞生益电子有限公司 | Local thick copper plating process of dense hole |
| CN105704930A (en) * | 2016-04-05 | 2016-06-22 | 苏州市惠利源科技有限公司 | Manufacturing method of buried resistance plate |
| CN105704930B (en) * | 2016-04-05 | 2019-01-25 | 苏州市惠利源科技有限公司 | The manufacturing method of buried resistance board |
| CN108430165A (en) * | 2018-02-08 | 2018-08-21 | 广州兴森快捷电路科技有限公司 | Pcb board etches detection method |
| CN108430165B (en) * | 2018-02-08 | 2019-12-20 | 广州兴森快捷电路科技有限公司 | PCB etching detection method |
| WO2022222411A1 (en) * | 2021-04-22 | 2022-10-27 | 广东工业大学 | Pcb short-wavelength pulse laser drilling method and related apparatus |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
| CN115666010B (en) * | 2022-11-21 | 2023-03-21 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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Open date: 20100331 |