CN102300418A - Embedded component type PCB manufacturing method - Google Patents
Embedded component type PCB manufacturing method Download PDFInfo
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- CN102300418A CN102300418A CN2011102333439A CN201110233343A CN102300418A CN 102300418 A CN102300418 A CN 102300418A CN 2011102333439 A CN2011102333439 A CN 2011102333439A CN 201110233343 A CN201110233343 A CN 201110233343A CN 102300418 A CN102300418 A CN 102300418A
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- type pcb
- lamina rara
- rara externa
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Abstract
The invention provides an embedded component type PCB manufacturing method. The method comprises the following steps: step1, providing an outer laminate, a component and an inner core plate, wherein the outer laminate comprises a first outer laminate and a second outer laminate; step 2, sticking and installing the component on a surface of the first outer laminate; step 3, printing a solder mask on the first outer laminate surface which is equipped with the component; step 4, drilling a aperture which corresponds with the component on the inner core plate, performing contraposition to the aperture and the component of the inner core plate and sticking and installing on the first outer laminate; step 5, sticking and installing the second outer laminate on the inner core plate, performing pressing plate and fusion so as to obtain the embedded component type PCB. In the manufacturing method of the invention, the component (resistor/capacitance) is built in the PCB so that a surface wiring space can be substantially saved. The resistance can reach more than 10K ohm and the capacitance can reach an UF grade. Compared to the prior art, a whole thickness of the embedded component type PCB made by the method of the invention can be substantially reduced, wherein the component is arranged on the PCB surface.
Description
Technical field
The present invention relates to the manufacture method of a kind of PCB, relate in particular to a kind of manufacture method that embeds component type PCB.
Background technology
For embedded resistance following several manufacture method is arranged roughly in the industry at present:
1, at the special resistance material of internal layer pressing, because of be subjected to material to limit its resistance/capacitance values very little, the resistance maximum can only reach hundreds of ohm, simultaneously the material cost height.
2, by embedding element (mode by the MILL groove is processed) after the pcb board internal layer is emptied again, this processes is more loaded down with trivial details.
Therefore, be necessary the manufacture method of existing embedding component type PCB is improved, to overcome the above-mentioned problem that exists.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method that embeds component type PCB, technology is simple and easy to implement, and the cost of material is low.
For achieving the above object, the invention provides a kind of manufacture method that embeds component type PCB, comprise the steps:
Step 1, provide lamina rara externa, element and core material, lamina rara externa to include first lamina rara externa and second lamina rara externa;
Step 2, with component mounter on the first lamina rara externa surface;
Step 3, be pasted with first lamina rara externa surface seal solder mask of element;
Step 5, relative first lamina rara externa of second lamina rara externa is mounted on the core material, pressing plate merges, and makes to embed component type PCB.
Also comprise step 6, this embedding component type PCB is carried out skin processing.
Described element is resistance or electric capacity.
Described core material is pure glue, several superimposed prepregs or pure glue and several superimposed prepregs, the height of the height counter element of described core material.
During with the element contraposition, the pure glue of first contraposition, contraposition prepreg again.
The quantity of described hole portion and the quantity and the profile setting of interior shape counter element.
Described solder mask thickness is 5-10 μ m.
Beneficial effect of the present invention: the manufacture method of embedding component type PCB of the present invention, element (resistance) is built in the wiring board (PCB), saved its surperficial wiring space greatly, its resistance value can reach more than 10K ohm, and electric capacity can reach the UF level; And the prepared embedding component type of the present invention PCB is reduced greatly in the product integral thickness of prior art at the board surface sticked element of circuit (resistance).
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effect apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 is the manufacture method flow chart that the present invention embeds component type PCB;
Fig. 2 forms schematic diagram for the manufacturing process structure of the embedding component type PCB of manufacture method of the present invention;
The structural representation of the embedding component type PCB that Fig. 3 makes for the present invention.
Embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
As shown in Figure 1, the manufacture method flow chart of embedding component type PCB of the present invention, shown in Fig. 2-3, it comprises the steps:
Step 1, provide lamina rara externa, element 40 and core material 30; Wherein lamina rara externa includes first lamina rara externa 10 and second lamina rara externa 20, and element 40 is the element of resistance, electric capacity or other types, and its quantity can be one or more.The height of the height counter element 40 of described core material 30.Core material 30 is pure glue, several superimposed prepregs or pure glue and several superimposed prepregs, described pure glue thickness is selected according to element heights, the quantity of described prepreg is selected according to element heights, promptly select the prepreg of right quantity to carry out superimposed according to the height of element 40, make the height of superimposed prepreg and element 40 highly quite or slightly high, as shown in Figure 2, highly adopt three prepregs to be built up the core material 30 of counter element 40 height according to element 40.When core material 30 is pure glue and several superimposed prepregs, with element 40 contrapositions, the pure glue of first contraposition, contraposition prepreg again.
Step 2, element 40 is mounted on first lamina rara externa, 10 surfaces.
Step 3, being pasted with the first lamina rara externa 10 surface seal solder masks of element 40, to increase the adhesion of pressing plate; Solder mask is located at first lamina rara externa 10 and is pasted with on this surface of element 40, and its thickness is 5-10 μ m.
Step 5, second lamina rara externa, 20 relative first lamina rara externas 10 are mounted on the core material 30, pressing plate merges, and makes to embed component type PCB.Wherein make core material 30 gummosis, merge, fit more with the lamina rara externa 10,20 of its upper and lower sides by pressing plate.
Also comprise step 6, this embedding component type PCB is carried out skin processing, described outer processing is processed according to conventional methods, includes: machine drilling, PTH, plating, image transfer, etching, welding resistance, surface treatment.
The embedding component type PCB of the embodiment that the inventive method makes, as shown in Figure 3, it comprises core material 30, is located at first lamina rara externa 10 and second lamina rara externa 20 of core material 30 both sides and be embedded element 40 in core material 30 respectively, be located at the hole portion 31 of counter element 40 on this core material 30, element 40 is embedded in the hole portion 31.The prepared embedding component type of manufacture method of the present invention PCB is different from prior art and with including components therein wherein, has saved surperficial wiring space greatly, and reduces greatly on the product integral thickness in existing PCB at element pasted on surface; The embedding component type PCB that makes, resistance value can reach more than 10K ohm, and electric capacity can reach the UF level.
In sum, the manufacture method of embedding component type PCB of the present invention is built in element (resistance) in the wiring board (PCB), has saved its surperficial wiring space greatly, and its resistance value can reach more than 10K ohm, and electric capacity can reach the UF level; And the prepared embedding component type of the present invention PCB is reduced greatly in the product integral thickness of prior art at the board surface sticked element of circuit (resistance).
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of claim of the present invention.
Claims (7)
1. a manufacture method that embeds component type PCB is characterized in that, comprises the steps:
Step 1, provide lamina rara externa, element and core material, lamina rara externa to include first lamina rara externa and second lamina rara externa;
Step 2, with component mounter on the first lamina rara externa surface;
Step 3, be pasted with first lamina rara externa surface seal solder mask of element;
Step 4, on core material, get out the hole portion of counter element, the hole portion and the element of core material carried out contraposition, mount on first lamina rara externa, thereby element is embedded in the core material;
Step 5, relative first lamina rara externa of second lamina rara externa is mounted on the core material, pressing plate merges, and makes to embed component type PCB.
2. the manufacture method of embedding component type PCB as claimed in claim 1 is characterized in that, also comprises step 6, this embedding component type PCB is carried out skin processing.
3. the manufacture method of embedding component type PCB as claimed in claim 1 is characterized in that, described element is resistance or electric capacity.
4. the manufacture method of embedding component type PCB as claimed in claim 1 is characterized in that, described core material is pure glue, several superimposed prepregs or pure glue and several superimposed prepregs, the height of the height counter element of described core material.
5. the manufacture method of embedding component type PCB as claimed in claim 4 is characterized in that, during with the element contraposition, and the pure glue of first contraposition, contraposition prepreg again.
6. the manufacture method of embedding component type PCB as claimed in claim 1 is characterized in that, the quantity of described hole portion and the quantity and the profile setting of interior shape counter element.
7. the manufacture method of embedding component type PCB as claimed in claim 1 is characterized in that, described solder mask thickness is 5-10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102333439A CN102300418A (en) | 2011-08-12 | 2011-08-12 | Embedded component type PCB manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102333439A CN102300418A (en) | 2011-08-12 | 2011-08-12 | Embedded component type PCB manufacturing method |
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| Publication Number | Publication Date |
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| CN102300418A true CN102300418A (en) | 2011-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102333439A Pending CN102300418A (en) | 2011-08-12 | 2011-08-12 | Embedded component type PCB manufacturing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295478A (en) * | 2012-02-29 | 2013-09-11 | 株式会社东芝 | Video display device and illuminating device |
| CN105163522A (en) * | 2015-07-09 | 2015-12-16 | 高德（无锡）电子有限公司 | Dielectric layer stitching production technology utilizing different materials between soft boards of combined soft and hard boards |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222820A (en) * | 2007-11-21 | 2008-07-16 | 健鼎（无锡）电子有限公司 | Production method for circuit board directly embedded in passive component |
| CN101686603A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | Manufacturing technology of blind hole plate embedding electronic devices |
| CN201928521U (en) * | 2010-08-24 | 2011-08-10 | 张�林 | Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires |
-
2011
- 2011-08-12 CN CN2011102333439A patent/CN102300418A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222820A (en) * | 2007-11-21 | 2008-07-16 | 健鼎（无锡）电子有限公司 | Production method for circuit board directly embedded in passive component |
| CN101686603A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | Manufacturing technology of blind hole plate embedding electronic devices |
| CN201928521U (en) * | 2010-08-24 | 2011-08-10 | 张�林 | Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295478A (en) * | 2012-02-29 | 2013-09-11 | 株式会社东芝 | Video display device and illuminating device |
| CN105163522A (en) * | 2015-07-09 | 2015-12-16 | 高德（无锡）电子有限公司 | Dielectric layer stitching production technology utilizing different materials between soft boards of combined soft and hard boards |
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Application publication date: 20111228 |