CN105376961A - HASL surface treatment PCB manufacturing method - Google Patents
HASL surface treatment PCB manufacturing method Download PDFInfo
- Publication number
- CN105376961A CN105376961A CN201510743009.6A CN201510743009A CN105376961A CN 105376961 A CN105376961 A CN 105376961A CN 201510743009 A CN201510743009 A CN 201510743009A CN 105376961 A CN105376961 A CN 105376961A
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- China
- Prior art keywords
- copper
- independent
- pcb
- ring
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the PCB (Printed Circuit Board) production technical field, and concretely discloses an HASL surface treatment PCB manufacturing method. In manufacturing an internal layer plate, independent copper rings are manufactured on the outer periphery of an independent hole site, and in successive processes, an independent plated-through hole is manufactured at a position corresponding to the independent hole site, thereby substantially improving the binding force between the porous copper of the independent plated-through hole and a base material, and avoiding stripping between the porous copper of the independent plated-through hole and the base material in an HASL surface treatment process. Proper ring widths are correspondingly set according to the thickness of the independent copper rings, thereby minimizing the area of the independent copper rings, meanwhile guaranteeing that the binding force between the porous copper and the base material is large enough to avoid stripping therebetween, and thereby reducing independent copper ring influence to internal layer line design. The copper on plate edge sides is removed before HASL surface treatment, thereby accelerating heat radiation and reducing delamination. The HASL surface treatment process is provided with a high temperature plate baking step, thereby reducing steam left in the plate, and further decreasing delamination.
Description
Technical field
The present invention relates to board production technical field, particularly relate to a kind of manufacture method of spraying the PCB of tin surfaces process.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, and also known as printed substrate, being important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Along with the diversified development of electronic product, the design of PCB also tends to variation.The production procedure of PCB is as follows: sawing sheet → internal layer circuit → pressing → boring → heavy copper → electric plating of whole board → outer-layer circuit → solder mask → surface treatment → gong profile → electrical testing → inspection at end.Wherein, surface-treated kind comprise heavy nickel gold, heavy silver, heavy tin, electronickelling gold, without/have plumbous spray tin, anti-oxidant and light copper etc.The flow process of existing spray tin surfaces process is: the pre-treatment → rumble scaling powder → spray tin → spray tin reprocessing of spray tin.Because existing production method does not do any special process to production plate before the process of spray tin surfaces, be easy to cause producing plate and occur that the hole copper in plate bursting or plated-through hole is separated with base material, especially produce in plate and there is aperture when being greater than the independent metal hole of 3.0mm, more easily occur the problem that plate bursting or hole copper and base material are peeled off.
Summary of the invention
The present invention is directed in the production of existing spray tin surfaces process PCB, easily occurring when spraying tin surfaces process the problem that plate bursting or hole copper and base material are peeled off, providing a kind of and reducing the manufacture method that the PCB of the spray tin surfaces process of problem is peeled off in plate bursting or hole copper and base material.
For achieving the above object, the present invention by the following technical solutions.
Spray a manufacture method of the PCB of tin surfaces process, comprise the following steps:
S1 inner plating: make internal layer circuit by negative film technique on central layer, form inner plating, the region for making independent metal hole on described inner plating is called separate wells position; Described internal layer circuit comprises independent copper ring, and described independent copper ring is positioned at the periphery of separate wells position.
Preferably, the aperture >=3.0mm in described independent metal hole.
Preferably, the copper of described independent copper ring is thick when being 4OZ, the ring width >=0.35mm of independent copper ring; The copper of described independent copper ring is thick when being 3OZ, the ring width >=0.3mm of independent copper ring; The copper of described independent copper ring is thick when being 2OZ, the ring width >=0.25mm of independent copper ring; The copper of described independent copper ring is thick when being HOZ or 1OZ, the ring width >=0.18mm of independent copper ring; Or during the thick < 4OZ of the copper of described independent copper ring, the ring width of independent copper ring is 0.3mm.
S2 multilayer circuit board: according to prior art, is integrated inner plating and outer copper foil pressing by prepreg, forms multi-layer sheet; Multi-layer sheet makes through boring, heavy copper, electric plating of whole board, positive blade technolgy making outer-layer circuit and solder mask successively, forms multilayer circuit board.
S3 surface treatment: the process of spray tin surfaces is carried out to multilayer circuit board.
Preferably, before the process of spray tin surfaces is carried out to multilayer circuit board, first the copper of the edges of boards side of multilayer circuit board is removed.
Preferred, the edges of boards going 1mm on multilayer circuit board wide with gong cutter gong, thus the copper of the edges of boards side of removing multilayer circuit board.Preferably, the process of described spray tin surfaces comprises the pre-treatment of spray tin, high temperature baking sheet, rumble scaling powder, spray tin and spray tin post-processing step successively, and the baking sheet temperature in described high temperature baking sheet step is 155 DEG C, and the baking sheet time is 60min.
Operation after S4: according to prior art, gong profile operation, electrical testing operation and end are carried out successively to multilayer circuit board and examine operation, obtained PCB finished product.
Compared with prior art, the invention has the beneficial effects as follows: the present invention is by when making inner plating, independent copper ring is made in the periphery of separate wells position, rear operation is when making independent metal hole with relevant position, separate wells position, the hole copper in independent metal hole and the adhesion of base material can be significantly improved, thus prevent from spraying the problem that the hole copper that occurs independent metal hole in tin surfaces processing procedure and base material peel off.According to thickness (i.e. the thickness of the internal layer layers of copper) ring width that relative set is suitable of independent copper ring, ensure while making the area of independent copper ring little as far as possible that the adhesion of hole copper and base material is enough large to avoid the problem occurring that hole copper and base material are peeled off, thus the impact that independent copper ring designs internal layer circuit can be reduced.Before carrying out spray tin surfaces process, the copper of edges of boards side is removed, can accelerate to spray distributing of heat in the process of tin surfaces process, reduce plate bursting problem and occur.Spray tin surfaces processing procedure increases high temperature baking sheet step, can reduce steam residual in plate further, thus reduce plate bursting problem further.
Accompanying drawing explanation
Fig. 1 is the generalized section of one of them independent metal hole and near zone on multilayer circuit board in embodiment.
Embodiment
In order to understand technology contents of the present invention more fully, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment
The present embodiment provides a kind of manufacture method of spraying the PCB of tin surfaces process.Concrete steps are as follows:
(1) inner plating
According to prior art, central layer is obtained to base material sawing sheet, then on central layer, make internal layer circuit by negative film technique, form inner plating.Region for making independent metal hole on inner plating is called separate wells position.The internal layer circuit that inner plating makes comprises independent copper ring and circuit-line, and described independent copper ring is positioned at the periphery of separate wells position.Described independent metal hole refers in particular to the independent metal hole of aperture >=3.0mm.
For different inner platings, the relation between the ring width of independent copper ring and the copper of independent copper ring thick (thickness of the internal layer layers of copper on inner plating) is as follows: the copper of independent copper ring is thick when being 4OZ, the ring width >=0.35mm of independent copper ring; During the thick < 4OZ of the copper of independent copper ring, the ring width of independent copper ring is 0.3mm.
When the area that the periphery of separate wells position can be used for making independent copper ring is less, the ring width of independent copper ring can be reduced, but the minimum requirement of the ring width of independent copper ring is as follows: the copper of independent copper ring is thick when being 3OZ, the ring width >=0.3mm of independent copper ring; The copper of independent copper ring is thick when being 2OZ, the ring width >=0.25mm of independent copper ring; The copper of independent copper ring is thick when being HOZ or 1OZ, the ring width >=0.18mm of independent copper ring.
(2) multilayer circuit board
According to prior art, by prepreg, inner plating and outer copper foil pressing are integrated, form multi-layer sheet.Then multi-layer sheet makes through boring, heavy copper, electric plating of whole board, positive blade technolgy making outer-layer circuit and solder mask successively, forms multilayer circuit board.On multilayer circuit board after positive processes, as shown in Figure 1, in figure, 1 is independent copper ring to the cross-section structure of an independent metal hole and near zone, and 2 is the hole copper in independent metal hole, and 3 is independent metal hole.
(3) gong edges of boards
First the part copper of the edges of boards side of multilayer circuit board is removed, namely with the edges of boards that gong cutter gong goes 1mm on multilayer circuit board wide, thus the copper of the edges of boards side of removing multilayer circuit board.
(4) surface treatment
Carry out the process of spray tin surfaces to multilayer circuit board, the step of spray tin surfaces process is as follows: the pre-treatment → high temperature baking sheet → rumble scaling powder → spray tin → spray tin reprocessing of spray tin.Wherein, the baking sheet temperature in high temperature baking sheet step is 155 DEG C, and the baking sheet time is 60min; And spray tin pre-treatment step, rumble scaling powder step, spray tin step and spray tin post-processing step all consistent with the corresponding steps in existing spray tin surfaces treatment technology.
(5) operation afterwards
According to prior art, gong profile operation, electrical testing operation and end are carried out successively to multilayer circuit board and examine operation, obtained PCB finished product.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (10)
1. spray a manufacture method of the PCB of tin surfaces process, it is characterized in that, comprise the following steps:
S1 inner plating: make internal layer circuit by negative film technique on central layer, form inner plating, the region for making independent metal hole on described inner plating is called separate wells position; Described internal layer circuit comprises independent copper ring, and described independent copper ring is positioned at the periphery of separate wells position;
S2 multilayer circuit board: according to prior art, is integrated inner plating and outer copper foil pressing by prepreg, forms multi-layer sheet; Multi-layer sheet makes through boring, heavy copper, electric plating of whole board, positive blade technolgy making outer-layer circuit and solder mask successively, forms multilayer circuit board;
S3 surface treatment: the process of spray tin surfaces is carried out to multilayer circuit board;
Operation after S4: according to prior art, gong profile operation, electrical testing operation and end are carried out successively to multilayer circuit board and examine operation, obtained PCB finished product.
2. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 1, is characterized in that, in step S3, before carrying out the process of spray tin surfaces to multilayer circuit board, first removed by the copper of the edges of boards side of multilayer circuit board.
3. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 2, is characterized in that, in step S3, and the edges of boards going 1mm on multilayer circuit board wide with gong cutter gong, thus the copper of the edges of boards side of removing multilayer circuit board.
4. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 2, it is characterized in that, in step S3, the process of described spray tin surfaces comprises the pre-treatment of spray tin, high temperature baking sheet, rumble scaling powder, spray tin and spray tin post-processing step successively, baking sheet temperature in described high temperature baking sheet step is 155 DEG C, and the baking sheet time is 60min.
5. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 1, is characterized in that, in step S1, and the aperture >=3.0mm in described independent metal hole.
6. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 5, is characterized in that, the copper of described independent copper ring is thick when being 4OZ, the ring width >=0.35mm of independent copper ring.
7. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 5, is characterized in that, the copper of described independent copper ring is thick when being 3OZ, the ring width >=0.3mm of independent copper ring.
8. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 5, is characterized in that, the copper of described independent copper ring is thick when being 2OZ, the ring width >=0.25mm of independent copper ring.
9. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 5, is characterized in that, the copper of described independent copper ring is thick when being HOZ or 1OZ, the ring width >=0.18mm of independent copper ring.
10. a kind of manufacture method of spraying the PCB of tin surfaces process according to claim 5, is characterized in that, during the thick < 4OZ of the copper of described independent copper ring, the ring width of independent copper ring is 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510743009.6A CN105376961A (en) | 2015-11-03 | 2015-11-03 | HASL surface treatment PCB manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510743009.6A CN105376961A (en) | 2015-11-03 | 2015-11-03 | HASL surface treatment PCB manufacturing method |
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| Publication Number | Publication Date |
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| CN105376961A true CN105376961A (en) | 2016-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510743009.6A Pending CN105376961A (en) | 2015-11-03 | 2015-11-03 | HASL surface treatment PCB manufacturing method |
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| CN (1) | CN105376961A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107058930A (en) * | 2017-05-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of thick pcb board and its spray tin method |
| CN112153820A (en) * | 2020-10-28 | 2020-12-29 | 奥士康科技股份有限公司 | Method for improving thick copper plate tin spraying and plate explosion |
| CN114340188A (en) * | 2021-12-30 | 2022-04-12 | 清远市富盈电子有限公司 | Production method for improving blistering layering of copper layer of PTH slot of lead-free tin-sprayed plate |
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| US20020170947A1 (en) * | 2001-04-27 | 2002-11-21 | Minoru Igarashi | Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument |
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN103096643A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured |
| CN103442530A (en) * | 2013-09-18 | 2013-12-11 | 胜华电子（惠阳）有限公司 | Manufacturing method for PCB unilateral annular ring |
| CN104470203A (en) * | 2013-09-25 | 2015-03-25 | 深南电路有限公司 | HDI circuit board and interlayer interconnection structure and machining method thereof |
| CN104883810A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Manufacture method for PCB having dense heat dissipation holes |
-
2015
- 2015-11-03 CN CN201510743009.6A patent/CN105376961A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020170947A1 (en) * | 2001-04-27 | 2002-11-21 | Minoru Igarashi | Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument |
| CN103096643A (en) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | Method for detecting back drill holes of printed circuit board (PCB) and PCB being manufactured |
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN103442530A (en) * | 2013-09-18 | 2013-12-11 | 胜华电子（惠阳）有限公司 | Manufacturing method for PCB unilateral annular ring |
| CN104470203A (en) * | 2013-09-25 | 2015-03-25 | 深南电路有限公司 | HDI circuit board and interlayer interconnection structure and machining method thereof |
| CN104883810A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Manufacture method for PCB having dense heat dissipation holes |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107058930A (en) * | 2017-05-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of thick pcb board and its spray tin method |
| CN107058930B (en) * | 2017-05-15 | 2019-06-11 | 深圳市景旺电子股份有限公司 | It is a kind of thickness pcb board and its spray tin method |
| CN112153820A (en) * | 2020-10-28 | 2020-12-29 | 奥士康科技股份有限公司 | Method for improving thick copper plate tin spraying and plate explosion |
| CN114340188A (en) * | 2021-12-30 | 2022-04-12 | 清远市富盈电子有限公司 | Production method for improving blistering layering of copper layer of PTH slot of lead-free tin-sprayed plate |
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Application publication date: 20160302 |
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