CN102917554B - Manufacturing method of multilayer double-copper conductor plate - Google Patents
Manufacturing method of multilayer double-copper conductor plate Download PDFInfo
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- CN102917554B CN102917554B CN201210396166.0A CN201210396166A CN102917554B CN 102917554 B CN102917554 B CN 102917554B CN 201210396166 A CN201210396166 A CN 201210396166A CN 102917554 B CN102917554 B CN 102917554B
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Abstract
The invention discloses a manufacturing method of a multilayer double-copper conductor plate. The manufacturing method comprises the steps of: providing engineering data, cutting according to the engineering data and manufacturing an inner layer graph of a core plate; browning the inner layer graph and copper plates, taking two layers of copper plates as a surface layer and carrying out assembling and positioning on the copper plates for primary pressing according to preset stacking; carrying out positioning hole drilling, milling, edge polishing and correction hole drilling on the core plate and obtaining surface graph pre-increase data through the correction hole drilling process, wherein expanding/shrinking data are expanding/shrinking data of the laminated inner layer graph and are used as pre-expanding values of the engineering data of the surface layer graph and other inner layer graphs except the outer layer; manufacturing the surface graph of the core plate by using a chemical etching method; carrying out joint filling and abrading on the surface layer graph of the core plate by using layer insulation resin; carrying out secondary pressing on the core plate as well as an inner layer single sheet, a semi-cured sheet, an outer layer cover plate and/or a cover foil to obtain a semi-finished product; and carrying out subsequent hole drilling, outer layer graph manufacturing, surface processing and molding milling on the semi-finished product, wherein expanding/shrinking data of the outer layer graph are obtained through the correction hole drilling process.
Description
Technical field
The present invention relates to printed circuit board and manufacture field, more particularly, the present invention relates to a kind of two copper core method for producing multi-layer board.
Background technology
The feature such as metallic plate possesses heat conduction, thermal diffusivity is good, thermal expansivity is little, dimensional stability is high and shielding is good.When current densities is higher, have double sided SMT (surface mounting technology) require or through-hole mounting element more, and manufacturing and designing heat radiation or the higher printed board of dimensional stability requirements and some other particular electrical subsystem, preferably can adopt the metal-cored multi-layer sheet of high heat-conducting type, the centre embedding multilayer printed board by the good metallic plate of thermal conductivity realizes.Metal core layer is then typically designed to the bus plane of printed board or electric stratum.Preparing metal-cored multi-layer sheet conventional method is the figure first being obtained metal core layer by the method for boring milling, again by metal core layer and internal layer monolithic, prepreg, outer cladding plate or cover paper tinsel and carry out one step press, then carry out the follow-up conventional manufacturing process such as outer graphics making, welding resistance character, surface treatment and finished product milling, thus obtain metal-cored multilayer printed board.Core metal sheet number of plies amount can be individual layer or multilayer (being no less than 2 layers).
Common metal plate material has copper, aluminium, iron, steel, cover copper indium watt etc., wherein, copper coin and modern printed board large-scale production equipment compatibility better, so copper coin is the preferred material of metal-cored multiple sliding cover.
Double-deck copper coin is also a typical metal-cored Multilayer Structure as metal-cored multi-layer sheet, and for two copper core multi-layer sheet, the making thinking of prior art is also one step press method.
But, adopt the way of one step press to make the printed board of double-deck copper core, because the thermal expansion coefficient difference of copper coin sandwich layer and other layer of base material is larger, grope if do not have more materials to carry out harmomegathus, vertical contraposition existing problems.In addition, due to the usual >150 μm of copper coin core layer thickness, more conventional internal layer Copper Foil is thick, during pressing, the more molten resin of prepreg can flow to the void region (being generally disk hole) of copper coin, cause copper coin void region packless, and the prepreg local starved of this areas adjacent, cause lamination cavity problem.
Summary of the invention
Technical problem to be solved by this invention is for there is above-mentioned defect in prior art, provides a kind of two copper core method for producing multi-layer boards that effectively can solve vertical alignment issues and lamination cavity problem.
According to the present invention, provide a kind of two copper core method for producing multi-layer board, it comprises: first step, for providing project data, project data comprises sawing sheet data, graph data, borehole data and other auxiliary material frock data, and press project data sawing sheet, then make the figure of central layer internal layer monolithic; Second step, for brown inner figure and copper coin, and with two-layer copper coin for top layer, carries out dress plate by presetting folded structure and locates one step press, thus obtaining multi-layer coreboard; Third step, for carrying out brill location hole, milling, edging, brill correction hole to central layer, obtain top layer figure to rise in advance data by boring correction hole program, described harmomegathus data are inner figure harmomegathus data after lamination, and using described harmomegathus data as top layer figure and top layer outside the value that rises in advance of other inner figure project data; 4th step, makes central layer top layer figure for adopting method for chemially etching.5th step, for adopting interlaminar insulating resin by the figure joint filling of central layer top layer and polishing; 6th step, for by central layer and other supporting internal layer monolithic, prepreg, outer cladding plate and/or cover paper tinsel and carry out second pressing, obtains semi-finished product.7th step, for carrying out follow-up boring, outer graphics making, surface treatment, shaping milling to semi-finished product; Wherein, outer graphics harmomegathus data are obtained by the correction hole program of third step, and with described harmomegathus data creating outer graphics.
Preferably, in a first step, by performing chemical pre-treatment, press mold, UV exposure, development, etching successively, stripping makes central layer inner figure.
Preferably, in the second step, the thickness of every layer of copper coin is 150-400 μm.
Preferably, in the 4th step, adopt the etching of acidic copper chloride system solution to make figure, and adopt dry film to protect.
Preferably, in the 4th step, adopt the etching of ammonia copper system solution to make figure, and adopt slicker solder to protect or tin protection separately.
Preferably, in the 5th step, carry out 1 ~ 5 resin joint filling, until interlaminar insulating resin flushes with copper face or substantially flush, carry out after each joint filling vacuumizing and toast making toasting and innerly then grind smooth without cavity afterwards, and carry out rear baking and make hardening of resin.
Preferably, in the 5th step, interlaminar insulating resin used is thermmohardening type Layer increasing method interlaminar insulating resin.
According in of the present invention pair of copper core method for producing multi-layer board, by carrying out one step press using copper coin as central layer top layer, and make top layer and other inner figure by the data that rise in advance obtaining secondary graphic making by correction hole program, the vertical alignment issues of copper coin sandwich layer and other each layer pattern can be solved; And, insulating resin joint filling process is carried out to central layer top layer and can avoid lamination cavity problem.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its adjoint advantage and feature, wherein:
Fig. 1 schematically shows the flow chart of the two copper core method for producing multi-layer boards according to the embodiment of the present invention.
It should be noted that, accompanying drawing is for illustration of the present invention, and unrestricted the present invention.
Embodiment
In order to make content of the present invention clearly with understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
In two copper core method for producing multi-layer boards of the embodiment of the present invention, can first by two-layer copper coin (thickness of every layer of copper coin is such as 150-400 μm) with inner figure single press, formed multi-layer coreboard.Wherein, by boring the harmomegathus value of the secondary graphic making that correction hole obtains on multi-layer coreboard top layer.Then central layer top layer figure is made by this harmomegathus value, and other layer of inner figure beyond central layer, central layer top layer figure adopts method for chemially etching to make.Then adopt the top layer (i.e. copper coin sandwich layer) of insulating resin to multi-layer coreboard to carry out joint filling process, and carry out routine and polish.By the multi-layer coreboard of the joint filling process of acquisition and other supporting internal layer monolithic, prepreg, outer cladding plate or cover paper tinsel and preset folded structure by printed board and carry out pressing, the flow process after pressing routinely method for producing multi-layer board is carried out.
Fig. 1 schematically shows the flow chart of according to an embodiment of the invention pair of copper core method for producing multi-layer board.
As shown in Figure 1, two according to the preferred embodiment of the invention copper core method for producing multi-layer board comprises:
First step S1: project data is provided, project data comprises sawing sheet data, graph data, borehole data and other auxiliary material frock data; Such as, by CAM(computer AidedManufacturing, computer-aided manufacture) provide sawing sheet data, graph data, borehole data.By project data sawing sheet, then such as toast the moisture of removing base material, stablize its size, and make central layer inner figure.
Wherein, preferably, such as, by performing chemical pre-treatment, press mold, UV(ultraviolet successively) operation such as exposure, development, etching, stripping makes and obtains central layer inner figure.
Second step S2: brown inner figure and copper coin, to increase its surface roughness, and with two-layer copper coin for top layer, carries out dress plate by presetting folded structure and locates one step press, thus obtaining multi-layer coreboard.
Preferably, the thickness of every layer of copper coin is such as 150-400 μm.The monolithic number of plies of the present invention to multi-layer coreboard internal layer does not limit.
Localization method can be rivet location, four groove location, Mass method location, hot melt location.Standard-sized plank preferably can adopt four groove location, rivet location or both combinations, and brown process, first at perforating press pre-subpunch four slotted eye, is then carried out in four groove location.The plank of off-standard size preferably adopts rivet localization method.Wherein, Mass method location, without the need to rushing location hole, is applicable to the situation only having a monolithic (1 ~ 2 layer pattern) in multiple-plate default folded structure between double-deck copper coin sandwich layer.
Third step S3: brill location hole, milling, edging, brill correction hole are carried out to central layer, and obtain top layer figure to rise in advance data by boring correction hole program.Here, the corresponding different correction hole program of the making sheet die size that do not coexist, bores correction hole by this program, by X ray (X-ray) measurement update hole site to adjust, and the final harmomegathus value obtaining acceptable error scope.These harmomegathus data are inner figure harmomegathus data after lamination, and using described harmomegathus data as top layer figure and top layer outside the value that rises in advance of other inner figure project data.
4th step S4: adopt method for chemially etching to make central layer top layer figure.Such as, method for chemially etching comprises the etching of employing acidic copper chloride system solution, and ammonia copper system solution also can be adopted to etch.
Preferably, adopting dry film to protect when adopting the etching of acidic copper chloride system solution to make figure, adopting slicker solder to protect or tin protection separately when adopting the etching of ammonia copper system solution to make figure, making lateral erosion can control less thus.
5th step S5: adopt interlaminar insulating resin by the figure joint filling of central layer top layer and polish.
Preferably carry out 1 ~ 5 resin joint filling, until interlaminar insulating resin flushes with copper face or substantially flush; Carry out after each joint filling vacuumizing and toast making toasting and innerly ground smooth after filling and leading up without cavity afterwards, and carry out rear baking and make hardening of resin.
Adopt the method for interlaminar insulating resin joint filling that prepreg can be avoided to occur that the problem in cavity appears in interlayer cavity problem and disk hole filler deficiency at copper core disk hole near zone because gummosis is excessive.
Preferably, interlaminar insulating resin used is thermmohardening type Layer increasing method interlaminar insulating resin.
6th step S6: by central layer and other supporting internal layer monolithic, prepreg, outer cladding plate and/or cover paper tinsel and carry out second pressing, obtains semi-finished product.
7th step S7: semi-finished product are carried out to the flow processs such as follow-up conventional boring, outer graphics making, surface treatment, shaping milling.Wherein, outer graphics harmomegathus data are obtained by correction hole program, and with this harmomegathus data creating outer graphics.
According in two copper core method for producing multi-layer boards of the embodiment of the present invention, by carrying out one step press using copper coin as central layer top layer, and make top layer and other inner figure by the data that rise in advance obtaining secondary graphic making by correction hole program, the vertical alignment issues of copper coin sandwich layer and other each layer pattern can be solved; And, insulating resin joint filling process is carried out to central layer top layer and can avoid lamination cavity problem.
Be understandable that, although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. a two copper core method for producing multi-layer board, is characterized in that comprising:
First step, for providing project data, project data comprises sawing sheet data, graph data, borehole data and other auxiliary material frock data, and presses project data sawing sheet, then makes central layer inner figure;
Second step, for brown inner figure and copper coin, and with two-layer copper coin for top layer, carries out dress plate by presetting folded structure and locates one step press, thus obtaining multi-layer coreboard;
Third step, for carrying out brill location hole, milling, edging, brill correction hole to central layer, obtain top layer figure to rise in advance data by boring correction hole program, the figure data that rise in advance in described top layer are inner figure harmomegathus data after lamination, and to rise in advance in advance the rise data of data as other inner figure project data outside top layer using described top layer figure;
4th step, makes central layer top layer figure for adopting method for chemially etching;
5th step, for adopting interlaminar insulating resin by the figure joint filling of central layer top layer and polishing;
6th step, for by central layer and other supporting internal layer monolithic, prepreg, outer cladding plate and/or cover paper tinsel and carry out second pressing, obtains semi-finished product;
7th step, for carrying out follow-up boring, outer graphics making, surface treatment, shaping milling to semi-finished product; Wherein, outer graphics harmomegathus data are obtained by correction hole program, and with described outer graphics harmomegathus data creating outer graphics.
2. according to claim 1 pair of copper core method for producing multi-layer board, is characterized in that, in a first step, by performing chemical pre-treatment, press mold, UV exposure, development, etching successively, stripping makes central layer inner figure.
3. according to claim 1 pair of copper core method for producing multi-layer board, is characterized in that, in the second step, the thickness of every layer of copper coin is 150-400 μm.
4. according to claim 1 pair of copper core method for producing multi-layer board, is characterized in that, in the 4th step, adopts the etching of acidic copper chloride system solution to make figure, and adopts dry film to protect.
5. according to claim 1 pair of copper core method for producing multi-layer board, is characterized in that, in the 4th step, adopts the etching of ammonia copper system solution to make figure, and adopts slicker solder to protect or tin protection separately.
6. according to claim 1 pair of copper core method for producing multi-layer board, it is characterized in that, in the 5th step, carry out 1 ~ 5 resin joint filling, until interlaminar insulating resin flushes with copper face, carry out after each joint filling vacuumizing and toast making toasting and innerly then grind smooth without cavity afterwards, and carry out rear baking and make it sclerosis.
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Cited By (1)
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|---|---|---|---|---|
| TWI578872B (en) * | 2015-07-22 | 2017-04-11 | 乾坤科技股份有限公司 | Multi-layer wire structure of pcb, magnetic element and manufacturing method thereof |
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| CN103237423A (en) * | 2013-04-28 | 2013-08-07 | 无锡江南计算技术研究所 | Indium tile copper interlayer graph making method for multilayer printed board |
| WO2014188830A1 (en) | 2013-05-22 | 2014-11-27 | 株式会社村田製作所 | Fibrillated liquid-crystal polymer powder, method for manufacturing fibrillated liquid-crystal polymer powder, paste, resin multilayered substrate, and method for manufacturing resin multilayered substrate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1274256A (en) * | 1999-05-18 | 2000-11-22 | 三星电机株式会社 | Printed circuit board and its mfg. method |
| CN1842253A (en) * | 2005-03-28 | 2006-10-04 | 邓柏生 | Production technique for surface mounting multi-layer resistive plate |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005027223A1 (en) * | 2003-09-09 | 2005-03-24 | Sanyo Electric Co., Ltd | Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same |
-
2012
- 2012-10-17 CN CN201210396166.0A patent/CN102917554B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1274256A (en) * | 1999-05-18 | 2000-11-22 | 三星电机株式会社 | Printed circuit board and its mfg. method |
| CN1842253A (en) * | 2005-03-28 | 2006-10-04 | 邓柏生 | Production technique for surface mounting multi-layer resistive plate |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI578872B (en) * | 2015-07-22 | 2017-04-11 | 乾坤科技股份有限公司 | Multi-layer wire structure of pcb, magnetic element and manufacturing method thereof |
| US10068693B2 (en) | 2015-07-22 | 2018-09-04 | Cyntec Co., Ltd. | Multi-layer wiring structure, magnetic element and manufacturing method thereof |
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