CN105636345A - Multilayer PCB core material expansion and shrinkage matching method - Google Patents
Multilayer PCB core material expansion and shrinkage matching method Download PDFInfo
- Publication number
- CN105636345A CN105636345A CN201610157263.2A CN201610157263A CN105636345A CN 105636345 A CN105636345 A CN 105636345A CN 201610157263 A CN201610157263 A CN 201610157263A CN 105636345 A CN105636345 A CN 105636345A
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- core material
- annulus
- matching process
- layer pcb
- pcb core
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
Abstract
The invention discloses a multilayer PCB core material expansion and shrinkage matching method. The method comprises the following steps of arranging a target at each corner of all core materials; stacking the core materials, then laminating the core materials, measuring the length and width of each core material through an X-ray drill target machine, and collecting length and width data of each core material; deducing a pre-expansion coefficient of each core material by utilizing the collected length and width data of each core material; and outputting the pre-expansion coefficient to an inner-layer exposure tool for manufacturing in a mass production board manufacturing process, and applying the pre-expansion coefficient to the inner-layer exposure tool for manufacturing. The method is simple, clear in operation and easy to master; and the size difference of finished products can be controlled to be within +/-4mil, the interlayer size range is controlled to be within 4mil, and the finished product rate is remarkably increased.
Description
Technical field
The present invention relates to pcb board technology manufacture field, the particularly matching process of multi-layer PCB core material harmomegathus.
Background technology
Pcb board, also known as printed circuit board (PCB), printed-wiring board (PWB), is called for short printed board, it is base material taking insulcrete, it is cut into certain size, at least with a conductive pattern on it, and be furnished with hole (such as unit piece bores, fastener hole, plated through-hole etc.), and realize being interconnected between electronic devices and components. It is adopt electronic printing art to make due to this kind of plate, therefore it is called as " printing " circuit card. This kind of circuit card needs through multiple operation sequence in process of production, wherein in order to ensure the quality of finished product, making processes is needed the harmomegathus being controlled core material by penalty coefficient, thus size match after making each layer central layer pressing, it is to increase product yield rate.
At present, by adopting the fixing unified penalty coefficient that rises in advance to carry out the harmomegathus of core material in pcb board industry, this method is feasible for the making of simple pcb board, but the development along with pcb board industry, from simple dual platen, four laminates develop into high multi-ply wood, the folded structure design of high multiple-plate core material is complicated various, if fruit still adopts the fixing unified penalty coefficient that rises in advance to carry out the harmomegathus of core material, due to core material One's name is legion, the thickness of uncontrollable all core materials is all consistent with copper rate residual between each layer, a little difference easily occurs, the fixing unified penalty coefficient that rises in advance is adopted easily to cause the difference of size between each level in this case, after each layer central layer pressing, size is not mated, final dimension difference can reach more than 15mil, thus cause bulk scrapping, especially the importing big layout made, this kind of situation is even more serious.
Summary of the invention
Technical problem to be solved by this invention is, overcome the above-mentioned defect that prior art exists, one is provided to be applied in before multi-ply wood pressing during internal layer graphic making, the calculating means of pre-expansion factor, complete to guarantee multi-ply wood pressing, the matching process of the multi-layer PCB core material harmomegathus of each level harmomegathus coupling.
The technical solution adopted for the present invention to solve the technical problems is, the matching process of multi-layer PCB core material harmomegathus, comprises the following steps:
(1) one group of mark target is all set at each corner place of all core materials;
(2) core material processed through step (1) is carried out folded structure, then part model (FA plate) headed by pressing, and bore, by X-ray, length and the width that each core material measured by target drone, by the length of each core material and wide data gathering; The each core material length collected and wide data are utilized to release the pre-expansion factor of each core material;
(3) the inner layer exposure instrument in volume production plate making processes of being exported to by the pre-expansion factor of each core material released by step (2) is made, and pre-expansion factor is applied to inner layer exposure instrument and makes.
Further, in described step (1), described mark target is concentric(al) circles mark target, the center of described concentric(al) circles mark target is provided with the center of circle, and the outside in the described center of circle is provided with a plurality of annulus, and described annulus amplifies from inside to outside successively, the ring width of annulus is identical, and the spacing between annulus with annulus is identical.
Further, the quantity of described annulus is 2.
Further, the diameter in the described center of circle is 20-60mil (preferred 40mil), and the ring width of described annulus is 10-14mil (preferred 12mil), and the spacing between annulus and annulus is 1-3mil (preferred 2mil).
Further, in described step (2), it is that MMX-888X-ray bores target drone that X-ray bores target drone, and it is �� 10um that X-ray bores the measuring accuracy of target drone.
Further, in described step (3), before inner layer exposure instrument makes, Quadratic Finite Element test monitoring is utilized to control the dimensional change of the instrument film.
Further, the measuring error that described Quadratic Finite Element is tested in 500mm range is �� 3um.
Compared with prior art, the present invention has following useful effect: method is simple, and operation is clear and definite, easily grasps, the reliability of final dimension can be ensured, harmomegathus coupling can effectively management and control, final dimension difference can control within �� 4mil, start with from actual harmomegathus result, ensure that the reliability providing coefficient, different media layer material can be got rid of, the impact of the different residual copper rate of central layer, the harmomegathus size of accurate each layer, ensure size match between multi-ply wood layer, between layer, size extreme difference controls within 4mil, have employed the thinking of layering compensation and greatly improve core material harmomegathus matching degree, yield rate significantly improves, the each core material length collected and wide data are utilized to release the pre-expansion factor of each core material.
Accompanying drawing explanation
Fig. 1 is the schema of the present invention for circuit card volume production;
Fig. 2 is the structural representation of one embodiment of the invention mark target.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment 1
The present embodiment comprises the following steps:
(1) one group of concentric(al) circles mark target is all set at each corner place of all core materials; The center of concentric(al) circles mark target is provided with the center of circle 1, and the outside in the center of circle 1 is provided with 2 annulus 2, and annulus 2 amplifies from inside to outside successively, and the ring width of annulus 2 is identical, and the spacing between annulus 2 with annulus 2 is identical; The diameter in the center of circle 1 is 40mil, and the ring width of annulus 2 is 12mil, and the spacing between annulus 2 and annulus 2 is 2mil;
(2) core material processed through step (1) being carried out folded structure, then pressing is FA plate, and bores, by MMX-888X-ray, length and the width that each core material measured by target drone, by the length of each core material and wide data gathering; The each core material length collected and wide data are utilized to release the pre-expansion factor of each core material; It is �� 10um that X-ray bores the measuring accuracy of target drone;
(3) the inner layer exposure instrument in volume production plate making processes of being exported to by the pre-expansion factor of each core material released by step (2) is made, and pre-expansion factor is applied to inner layer exposure instrument and makes; Before inner layer exposure instrument makes, Quadratic Finite Element test monitoring is utilized to control the dimensional change of the instrument film; The measuring error of Quadratic Finite Element test in 500mm range is �� 3um.
Coefficient reliability, final dimension difference is within �� 4mil, and between layer, size extreme difference is within 4mil, size match between multi-ply wood layer, and the yield rate of circuit card significantly improves.
Embodiment 2
The difference of the present embodiment and embodiment 1 is only, the diameter in the center of circle 1 is 50mil, and the ring width of annulus 2 is 13mil, and the spacing between annulus 2 and annulus 2 is 3mil; All the other are substantially the same manner as Example 1.
Coefficient reliability, final dimension difference is within �� 4mil, and between layer, size extreme difference is within 4mil, size match between multi-ply wood layer, and the yield rate of circuit card significantly improves.
Embodiment 3
The difference of the present embodiment and embodiment 1 is only, the diameter in the center of circle 1 is 30mil, and the ring width of annulus 2 is 11mil, and the spacing between annulus 2 and annulus 2 is 1mil; All the other are substantially the same manner as Example 1.
Coefficient reliability, final dimension difference is within �� 4mil, and between layer, size extreme difference is within 4mil, size match between multi-ply wood layer, and the yield rate of circuit card significantly improves.
Claims (8)
1. the matching process of multi-layer PCB core material harmomegathus, it is characterised in that, comprise the following steps:
(1) one group of mark target is all set at each corner place of all core materials;
(2) core material processed through step (1) is carried out folded structure, then part model headed by pressing, and bore, by X-ray, length and the width that each core material measured by target drone, by the length of each core material and wide data gathering; The each core material length collected and wide data are utilized to release the pre-expansion factor of each core material;
(3) the inner layer exposure instrument in volume production plate making processes of being exported to by the pre-expansion factor of each core material released by step (2) is made, and pre-expansion factor is applied to inner layer exposure instrument and makes.
2. the matching process of multi-layer PCB core material harmomegathus according to claim 1, it is characterized in that, in described step (1), described mark target is concentric(al) circles mark target, the center of described concentric(al) circles mark target is provided with the center of circle, and the outside in the described center of circle is provided with a plurality of annulus, and described annulus amplifies from inside to outside successively, the ring width of annulus is identical, and the spacing between annulus with annulus is identical.
3. the matching process of multi-layer PCB core material harmomegathus according to claim 2, it is characterised in that, the quantity of described annulus is 2.
4. the matching process of multi-layer PCB core material harmomegathus according to Claims 2 or 3, it is characterised in that, the diameter in the described center of circle is 20-60mil, and the ring width of described annulus is 10-14mil, and the spacing between annulus and annulus is 1-3mil.
5. the matching process of multi-layer PCB core material harmomegathus according to claim 4, it is characterised in that, the diameter in the described center of circle is 40mil, and the ring width of described annulus is 12mil, and the spacing between annulus and annulus is 2mil.
6. the matching process of multi-layer PCB core material harmomegathus according to claim 1, it is characterised in that, in described step (2), it is that MMX-888X-ray bores target drone that X-ray bores target drone, and it is �� 10um that X-ray bores the measuring accuracy of target drone.
7. the matching process of multi-layer PCB core material harmomegathus according to claim 1, it is characterised in that, in described step (3), before inner layer exposure instrument makes, utilize Quadratic Finite Element test monitoring to control the dimensional change of the instrument film.
8. the matching process of multi-layer PCB core material harmomegathus according to claim 7, it is characterised in that, the measuring error of described Quadratic Finite Element test in 500mm range is �� 3um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610157263.2A CN105636345A (en) | 2016-03-18 | 2016-03-18 | Multilayer PCB core material expansion and shrinkage matching method |
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| CN201610157263.2A CN105636345A (en) | 2016-03-18 | 2016-03-18 | Multilayer PCB core material expansion and shrinkage matching method |
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| CN201610157263.2A Pending CN105636345A (en) | 2016-03-18 | 2016-03-18 | Multilayer PCB core material expansion and shrinkage matching method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061106A (en) * | 2016-08-04 | 2016-10-26 | 高德（江苏）电子科技有限公司 | Method for monitoring expansion-contraction matching degree of different internal-layer core plates |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN107148170A (en) * | 2017-06-27 | 2017-09-08 | 奥士康精密电路（惠州）有限公司 | A kind of core material riveting bad method partially in reduction PCB multilayer board |
| CN107666768A (en) * | 2017-09-29 | 2018-02-06 | 奥士康科技股份有限公司 | Aligning degree monitoring method between PCB layer |
| CN108072343A (en) * | 2017-12-18 | 2018-05-25 | 广州兴森快捷电路科技有限公司 | The appraisal procedure of PCB new material harmomegathus penalty coefficients |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN113347779A (en) * | 2021-05-31 | 2021-09-03 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with vertical transmission structure and preparation method |
| CN113573477A (en) * | 2021-06-21 | 2021-10-29 | 广州添利电子科技有限公司 | PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipment |
| US11341628B2 (en) | 2019-12-20 | 2022-05-24 | Industrial Technology Research Institute | Method for compensating design image of workpiece and system for processing design image of workpiece |
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| CN101668389A (en) * | 2009-09-04 | 2010-03-10 | 东莞美维电路有限公司 | Method for making high alignment printed circuit board |
| CN102917554A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Manufacturing method of multilayer double-copper conductor plate |
| CN103747639A (en) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | Manufacturing method for high-rise board |
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Patent Citations (3)
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| CN101668389A (en) * | 2009-09-04 | 2010-03-10 | 东莞美维电路有限公司 | Method for making high alignment printed circuit board |
| CN102917554A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Manufacturing method of multilayer double-copper conductor plate |
| CN103747639A (en) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | Manufacturing method for high-rise board |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN106061106B (en) * | 2016-08-04 | 2018-10-12 | 高德（江苏）电子科技有限公司 | A method of each level core material harmomegathus matching degree of monitoring |
| CN106061106A (en) * | 2016-08-04 | 2016-10-26 | 高德（江苏）电子科技有限公司 | Method for monitoring expansion-contraction matching degree of different internal-layer core plates |
| CN107148170A (en) * | 2017-06-27 | 2017-09-08 | 奥士康精密电路（惠州）有限公司 | A kind of core material riveting bad method partially in reduction PCB multilayer board |
| CN107148170B (en) * | 2017-06-27 | 2019-05-24 | 奥士康精密电路（惠州）有限公司 | A kind of partially undesirable method of core material riveting in reduction PCB multilayer board |
| CN107666768A (en) * | 2017-09-29 | 2018-02-06 | 奥士康科技股份有限公司 | Aligning degree monitoring method between PCB layer |
| CN108072343A (en) * | 2017-12-18 | 2018-05-25 | 广州兴森快捷电路科技有限公司 | The appraisal procedure of PCB new material harmomegathus penalty coefficients |
| WO2019119770A1 (en) * | 2017-12-18 | 2019-06-27 | 广州兴森快捷电路科技有限公司 | Method for estimating expansion and contraction compensation coefficient of new pcb material |
| CN108072343B (en) * | 2017-12-18 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | The appraisal procedure of PCB new material harmomegathus penalty coefficient |
| US11341628B2 (en) | 2019-12-20 | 2022-05-24 | Industrial Technology Research Institute | Method for compensating design image of workpiece and system for processing design image of workpiece |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN113347779A (en) * | 2021-05-31 | 2021-09-03 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with vertical transmission structure and preparation method |
| CN113573477A (en) * | 2021-06-21 | 2021-10-29 | 广州添利电子科技有限公司 | PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipment |
| CN113573477B (en) * | 2021-06-21 | 2022-06-03 | 广州添利电子科技有限公司 | PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipment |
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Application publication date: 20160601 |