CN202262100U - Ultrahigh frequency (UHF) multi-layer printed circuit board production system - Google Patents
Ultrahigh frequency (UHF) multi-layer printed circuit board production system Download PDFInfo
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- CN202262100U CN202262100U CN2011203901444U CN201120390144U CN202262100U CN 202262100 U CN202262100 U CN 202262100U CN 2011203901444 U CN2011203901444 U CN 2011203901444U CN 201120390144 U CN201120390144 U CN 201120390144U CN 202262100 U CN202262100 U CN 202262100U
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Abstract
The utility model discloses an ultrahigh frequency (UHF) multi-layer printed circuit board production system comprising UHF multi-layer printed circuit board inner layer manufacturing equipment, UHF multi-layer printed circuit board outer layer manufacturing equipment, an on-off testing machine, OSP (optical signal processor) equipment, final inspection equipment, delivery inspection equipment, a vacuum packaging machine and warehousing equipment, wherein the UHF multi-layer printed circuit board inner layer manufacturing equipment is connected with the UHF multi-layer printed circuit board outer layer manufacturing equipment which is connected with the on-off testing machine, the on-off testing machine is connected with the OSP equipment, the OSP equipment is connected with the final inspection equipment which is connected with the delivery inspection equipment, the delivery inspection equipment is connected with the vacuum packaging machine, and the vacuum packaging machine is connected with the warehousing equipment. The UHF multi-layer printed circuit board production system is used for producing UHF multi-layer printed circuit board and realizes the automated production of the UHF printed circuit boards in batches.
Description
Technical field
The utility model relates to the wiring board production field, relates in particular to a kind of hyperfrequency multilayer printed wiring board production system, in order to produce the hyperfrequency multilayer printed board, has realized the automation and the mass production of hyperfrequency circuit plate.
Background technology
The development course of over half a century has been passed through in PCB technology and production; Whole world PCB annual production now is above 400,000,000 square metres; PCB has become an important component part of electronics and IT products basic material, and the develop rapidly of electronic information industry makes electronic product to miniaturization, functionalization, high performance, the development of high reliability aspect; The development of high-density interconnect technology simultaneously promotes printed board and also develops to the high density direction, thereby promotes that the technology of PCB is also progressive in continuous innovation.
After the nineties; American-European countries has begun to produce two-sided high-frequency copper foil covered plate; Seek partner and agent to China one after another like companies such as Rogers, Arlon, Tacorue and Metclad; The RT/Duoid series that U.S. Rogers company produces, Tmm series and Ro series microwave sheet material progressively are applied, and mainly contain polytetrafluoroethylene PCB, Rogers4000 Series PC B that glass fiber strengthens.Price is very expensive.Although U.S. ARLON company small scale, it forms the situation of vying each other with U.S. Rogers company around reducing the supporting with it material of dielectric constant Development of Series, and companies such as Japanese chukoh also formulate the plan that develops towards this direction one after another.U.S. Rogers company produces the hyperfrequency multilayer printed wiring board at present, but the R&D work that some the PCB material scientific research institutions and the production company of the U.S. and Japan are also carrying out the hyperfrequency multilayer printed wiring board.
In recent years; Aspect high-frequency microwave, the existing numerous printed board enterprise in East China, North China and area, Pearl River Delta gets dynamically and information at collection high frequency plate, thinks that the high-frequency microwave printed wiring board is electronic information, the requisite auxiliary products of high and new technology industry; Especially the hyperfrequency multilayer printed board is the direction of future development; Have vast market space and development prospect, and allot certain funds and investigate and develop, but the hyperfrequency multilayer printed board still is in blank at home.
The utility model content
The technical problem that the utility model mainly solves provides a kind of hyperfrequency multilayer printed wiring board production system, in order to produce the hyperfrequency multilayer printed board, has realized the automation and the mass production of hyperfrequency circuit plate.
For solving the problems of the technologies described above; The technical scheme that the utility model adopts is: a kind of hyperfrequency multilayer printed wiring board production system is provided, comprises hyperfrequency multilayer printed wiring board internal layer making apparatus, hyperfrequency multilayer printed wiring board outer making apparatus, on off test machine, OSP equipment, whole inspection equipment, the checkout facility that dispatches from the factory, vacuum packing machine and go into library facilities; Said hyperfrequency multilayer printed wiring board internal layer making apparatus links to each other with the outer making apparatus of said hyperfrequency multilayer printed wiring board; The outer making apparatus of said hyperfrequency multilayer printed wiring board links to each other with said on off test machine; Said on off test machine links to each other with said OSP equipment; Said OSP equipment links to each other with said whole inspection equipment; Said whole inspection equipment links to each other with the said checkout facility that dispatches from the factory, and the said checkout facility that dispatches from the factory links to each other with said vacuum packing machine, and said vacuum packing machine is gone into library facilities and linked to each other with said.
Wherein, said hyperfrequency multilayer printed wiring board internal layer making apparatus comprises that automatic cutting machine, high temperature baking oven, first Plate grinder, internal layer figure transfer equipment, first developing machine, first etching machine, first move back film machine, AOI machine, melanism equipment, type-setting equipment, laminating machine and target-shooting machine; Said automatic cutting machine links to each other with said high temperature baking oven, and said high temperature baking oven links to each other with said first Plate grinder, and said first Plate grinder links to each other with said internal layer figure transfer equipment; Said internal layer figure transfer equipment links to each other with said first developing machine; Said first developing machine links to each other with said first etching machine, and said first etching machine and said first moves back the film machine and links to each other, and said first moves back the film machine links to each other with said AOI machine; Said AOI machine links to each other with said melanism equipment; Said melanism equipment links to each other with said type-setting equipment, and said type-setting equipment links to each other with said laminating machine, and said laminating machine links to each other with said target-shooting machine;
The outer making apparatus of said hyperfrequency multilayer printed wiring board comprises that data rig, de-smear equipment, second Plate grinder, heavy copper equipment, the first automatic electrolytic copper equipment, outer graphics transfer equipment, the second automatic electrolytic copper equipment, first equipment, second move back film machine, second etching machine, move back tin equipment, first automatic screen printer, second automatic screen printer, second equipment, numerical control gong machine; Said data rig links to each other with said de-smear equipment; Said de-smear equipment links to each other with said second Plate grinder, and said second Plate grinder links to each other with said heavy copper equipment, and said heavy copper equipment links to each other with the said first automatic electrolytic copper equipment; The said first automatic electrolytic copper equipment links to each other with said outer graphics transfer equipment; Said outer graphics transfer equipment links to each other with the said second automatic electrolytic copper equipment, and the said second automatic electrolytic copper equipment links to each other with said first equipment, and said first equipment and said second moves back the film machine and links to each other; Said second moves back the film machine links to each other with said second etching machine; Said second etching machine links to each other with the said tin equipment that moves back, and the said tin equipment that moves back links to each other with first automatic screen printer, and said first automatic screen printer links to each other with said second automatic screen printer; Said second automatic screen printer links to each other with said second equipment, and said second equipment links to each other with said numerical control gong machine; Said first equipment comprises automatic electric tin equipment and automatic electric nickel/golden equipment, and said second equipment comprises tin-spraying machine and heavy nickel/golden equipment.
Wherein, said internal layer figure transfer equipment comprises first exposure machine and second developing machine, and said outer graphics transfer equipment comprises second exposure machine and the 3rd developing machine.
Wherein, but said whole inspection equipment comprises magnifying glass, heat shock resistance stove and brazier.
The beneficial effect of the utility model is: a kind of hyperfrequency multilayer printed wiring board production system is provided, in order to produce the hyperfrequency multilayer printed board, has realized the automation and the mass production of hyperfrequency circuit plate.
Description of drawings
Fig. 1 is the structural representation of the utility model hyperfrequency multilayer printed wiring board production system.
Embodiment
By the technology contents, the structural feature that specify the utility model, realized purpose and effect, know clearly below in conjunction with execution mode and conjunction with figs. and give explanation.
See also Fig. 1; The utility model hyperfrequency multilayer printed wiring board production system comprises hyperfrequency multilayer printed wiring board internal layer making apparatus, hyperfrequency multilayer printed wiring board outer making apparatus, on off test machine, OSP equipment, whole inspection equipment, the checkout facility that dispatches from the factory, vacuum packing machine and goes into library facilities; Said hyperfrequency multilayer printed wiring board internal layer making apparatus links to each other with the outer making apparatus of said hyperfrequency multilayer printed wiring board; The outer making apparatus of said hyperfrequency multilayer printed wiring board links to each other with said on off test machine; Said on off test machine links to each other with said OSP equipment; Said OSP equipment links to each other with said whole inspection equipment; Said whole inspection equipment links to each other with the said checkout facility that dispatches from the factory, and the said checkout facility that dispatches from the factory links to each other with said vacuum packing machine, and said vacuum packing machine is gone into library facilities and linked to each other with said.
Wherein, said hyperfrequency multilayer printed wiring board internal layer making apparatus comprises that automatic cutting machine, high temperature baking oven, first Plate grinder, internal layer figure transfer equipment, first developing machine, first etching machine, first move back film machine, AOI machine, melanism equipment, type-setting equipment, laminating machine and target-shooting machine; Said automatic cutting machine links to each other with said high temperature baking oven, and said high temperature baking oven links to each other with said first Plate grinder, and said first Plate grinder links to each other with said internal layer figure transfer equipment; Said internal layer figure transfer equipment links to each other with said first developing machine; Said first developing machine links to each other with said first etching machine, and said first etching machine and said first moves back the film machine and links to each other, and said first moves back the film machine links to each other with said AOI machine; Said AOI machine links to each other with said melanism equipment; Said melanism equipment links to each other with said type-setting equipment, and said type-setting equipment links to each other with said laminating machine, and said laminating machine links to each other with said target-shooting machine;
The outer making apparatus of said hyperfrequency multilayer printed wiring board comprises that data rig, de-smear equipment, second Plate grinder, heavy copper equipment, the first automatic electrolytic copper equipment, outer graphics transfer equipment, the second automatic electrolytic copper equipment, first equipment, second move back film machine, second etching machine, move back tin equipment, first automatic screen printer, second automatic screen printer, second equipment, numerical control gong machine; Said data rig links to each other with said de-smear equipment; Said de-smear equipment links to each other with said second Plate grinder, and said second Plate grinder links to each other with said heavy copper equipment, and said heavy copper equipment links to each other with the said first automatic electrolytic copper equipment; The said first automatic electrolytic copper equipment links to each other with said outer graphics transfer equipment; Said outer graphics transfer equipment links to each other with the said second automatic electrolytic copper equipment, and the said second automatic electrolytic copper equipment links to each other with said first equipment, and said first equipment and said second moves back the film machine and links to each other; Said second moves back the film machine links to each other with said second etching machine; Said second etching machine links to each other with the said tin equipment that moves back, and the said tin equipment that moves back links to each other with first automatic screen printer, and said first automatic screen printer links to each other with said second automatic screen printer; Said second automatic screen printer links to each other with said second equipment, and said second equipment links to each other with said numerical control gong machine; Said first equipment comprises automatic electric tin equipment and automatic electric nickel/golden equipment, and said second equipment comprises tin-spraying machine and heavy nickel/golden equipment.Said internal layer figure transfer equipment comprises first exposure machine and second developing machine, and said outer graphics transfer equipment comprises second exposure machine and the 3rd developing machine.But said whole inspection equipment comprises magnifying glass, heat shock resistance stove and brazier.
In the utility model, said AOI machine is an automated optical detection equipment; Said OSP equipment is Organic Solderability protective finish equipment.These two equipment are the known term in industry the inside.
During use, cutting machine is opened material automatically, is ready to copper-clad base plate; Dry behind the copper-clad base plate process high temperature baking oven; Pass through the Plate grinder nog plate after the oven dry again; Pass through internal layer figure transfer equipment (exposure machine, first developing machine) again, circuitous pattern is transformed on the copper-clad base plate; Through second developing machine, let not etched place protect with dry film or wet film, then expose in etched place; Through the etching machine etching, through moving back the film machine dry film or wet film are removed again; Scanning detects through AOI machine (automated optical detection equipment), finds out the defective of circuit board; Through melanism equipment melanism, make between multiple-plate copper face and the resin sheet after pressing, can keep stronger pull-out capacity; Set type through type-setting equipment; Through the laminating machine pressing plate, make each layer circuit board bonded to each other; The process target-shooting machine is towards the target position hole.Hyperfrequency multilayer printed wiring board internal layer was made and was accomplished this moment.
Below be outer the making: the copper-clad base plate that will pass through after hyperfrequency multilayer printed wiring board internal layer manufacture craft is accomplished is holed through digital control hole drilling, and the corresponding copper cash of circuit board upper-lower position is connected; Through de-smear equipment de-smear; Carry out nog plate through second Plate grinder; Carry out electroless copper plating through heavy copper equipment; Carry out electrolytic copper through the first automatic electrolytic copper equipment, be transformed into copper-clad base plate, carry out electrolytic copper through the second automatic electrolytic copper equipment again through outer graphics transfer equipment (second exposure machine and the 3rd developing machine) circuitous pattern; Carry out electric tin and electric nickel/gold through first equipment (automatic electric tin equipment and automatic electric nickel/golden equipment); Move back the film machine through second and move back film; Carry out etching through second etching machine, tin is removed through moving back tin equipment, hinder weldering through first automatic screen printer and make with second automatic screen printer and carry out the character making; Tin is sprayed onto on the copper-clad base plate and carries out chemical sinking nickel/gold through second equipment (tin-spraying machine and heavy nickel/golden equipment), carry out numerical control gong machine and carry out external form processing.The outer making of hyperfrequency multilayer printed wiring board this moment accomplished.
To pass through the copper-clad base plate after the above-mentioned technology; Through on off test machine testing copper-clad base plate whether short circuit or breaking phenomena are arranged again; Through OSP equipment it is coated the Organic Solderability protective finish; Carry out the comprehensive detection of performance quality through the whole inspection equipment and the checkout facility that dispatches from the factory, through the vacuum packing machine packing, again through going into the library facilities warehousing.Whole hyperfrequency multilayer printed wiring board making work is accomplished.
The beneficial effect of the utility model is: a kind of hyperfrequency multilayer printed wiring board production system is provided, in order to produce the hyperfrequency multilayer printed board, has realized the automation and the mass production of hyperfrequency circuit plate.
The above is merely the embodiment of the utility model; Be not thus the restriction the utility model scope; Every equivalent structure or flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the utility model.
Claims (4)
1. hyperfrequency multilayer printed wiring board production system is characterized in that:
Comprise hyperfrequency multilayer printed wiring board internal layer making apparatus, hyperfrequency multilayer printed wiring board outer making apparatus, on off test machine, OSP equipment, whole inspection equipment, the checkout facility that dispatches from the factory, vacuum packing machine and go into library facilities;
Said hyperfrequency multilayer printed wiring board internal layer making apparatus links to each other with the outer making apparatus of said hyperfrequency multilayer printed wiring board; The outer making apparatus of said hyperfrequency multilayer printed wiring board links to each other with said on off test machine; Said on off test machine links to each other with said OSP equipment; Said OSP equipment links to each other with said whole inspection equipment; Said whole inspection equipment links to each other with the said checkout facility that dispatches from the factory, and the said checkout facility that dispatches from the factory links to each other with said vacuum packing machine, and said vacuum packing machine is gone into library facilities and linked to each other with said.
2. hyperfrequency multilayer printed wiring board production system according to claim 1 is characterized in that: said hyperfrequency multilayer printed wiring board internal layer making apparatus comprises that automatic cutting machine, high temperature baking oven, first Plate grinder, internal layer figure transfer equipment, first developing machine, first etching machine, first move back film machine, AOI machine, melanism equipment, type-setting equipment, laminating machine and target-shooting machine; Said automatic cutting machine links to each other with said high temperature baking oven, and said high temperature baking oven links to each other with said first Plate grinder, and said first Plate grinder links to each other with said internal layer figure transfer equipment; Said internal layer figure transfer equipment links to each other with said first developing machine; Said first developing machine links to each other with said first etching machine, and said first etching machine and said first moves back the film machine and links to each other, and said first moves back the film machine links to each other with said AOI machine; Said AOI machine links to each other with said melanism equipment; Said melanism equipment links to each other with said type-setting equipment, and said type-setting equipment links to each other with said laminating machine, and said laminating machine links to each other with said target-shooting machine;
The outer making apparatus of said hyperfrequency multilayer printed wiring board comprises that data rig, de-smear equipment, second Plate grinder, heavy copper equipment, the first automatic electrolytic copper equipment, outer graphics transfer equipment, the second automatic electrolytic copper equipment, first equipment, second move back film machine, second etching machine, move back tin equipment, first automatic screen printer, second automatic screen printer, second equipment, numerical control gong machine; Said data rig links to each other with said de-smear equipment; Said de-smear equipment links to each other with said second Plate grinder, and said second Plate grinder links to each other with said heavy copper equipment, and said heavy copper equipment links to each other with the said first automatic electrolytic copper equipment; The said first automatic electrolytic copper equipment links to each other with said outer graphics transfer equipment; Said outer graphics transfer equipment links to each other with the said second automatic electrolytic copper equipment, and the said second automatic electrolytic copper equipment links to each other with said first equipment, and said first equipment and said second moves back the film machine and links to each other; Said second moves back the film machine links to each other with said second etching machine; Said second etching machine links to each other with the said tin equipment that moves back, and the said tin equipment that moves back links to each other with first automatic screen printer, and said first automatic screen printer links to each other with said second automatic screen printer; Said second automatic screen printer links to each other with said second equipment, and said second equipment links to each other with said numerical control gong machine;
Said first equipment comprises automatic electric tin equipment and automatic electric nickel/golden equipment, and said second equipment comprises tin-spraying machine and heavy nickel/golden equipment.
3. hyperfrequency multilayer printed wiring board production system according to claim 2 is characterized in that: said internal layer figure transfer equipment comprises first exposure machine and second developing machine, and said outer graphics transfer equipment comprises second exposure machine and the 3rd developing machine.
4. according to each described hyperfrequency multilayer printed wiring board production system of claim 1 to 3, it is characterized in that: but said whole inspection equipment comprises magnifying glass, heat shock resistance stove and brazier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203901444U CN202262100U (en) | 2011-10-13 | 2011-10-13 | Ultrahigh frequency (UHF) multi-layer printed circuit board production system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203901444U CN202262100U (en) | 2011-10-13 | 2011-10-13 | Ultrahigh frequency (UHF) multi-layer printed circuit board production system |
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| Publication Number | Publication Date |
|---|---|
| CN202262100U true CN202262100U (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203901444U Expired - Lifetime CN202262100U (en) | 2011-10-13 | 2011-10-13 | Ultrahigh frequency (UHF) multi-layer printed circuit board production system |
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| CN (1) | CN202262100U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730375A (en) * | 2014-01-14 | 2014-04-16 | 无锡江南计算技术研究所 | OSP surface treatment package substrate forming milling method |
| CN104990940A (en) * | 2015-07-01 | 2015-10-21 | 江门崇达电路技术有限公司 | Method for reducing ideal points during AOI (automatic optic inspection) on PCB (printed circuit board) |
| CN108271316A (en) * | 2018-01-25 | 2018-07-10 | 江西景旺精密电路有限公司 | A kind of PCB dual platens sawing sheet system |
-
2011
- 2011-10-13 CN CN2011203901444U patent/CN202262100U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730375A (en) * | 2014-01-14 | 2014-04-16 | 无锡江南计算技术研究所 | OSP surface treatment package substrate forming milling method |
| CN103730375B (en) * | 2014-01-14 | 2016-08-17 | 无锡江南计算技术研究所 | OSP surface processes base plate for packaging molding milling method |
| CN104990940A (en) * | 2015-07-01 | 2015-10-21 | 江门崇达电路技术有限公司 | Method for reducing ideal points during AOI (automatic optic inspection) on PCB (printed circuit board) |
| CN108271316A (en) * | 2018-01-25 | 2018-07-10 | 江西景旺精密电路有限公司 | A kind of PCB dual platens sawing sheet system |
| CN108271316B (en) * | 2018-01-25 | 2020-08-18 | 江西景旺精密电路有限公司 | PCB double sided board cutting system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Shengxian Inventor before: Liu Guangrong |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160518 Address after: Chi Gang Jie Chi Hong Kong Overseas Chinese Economic Development Zone 351117 Putian province Fujian City Hanjiang District Jiangkou Town, No. 889 Patentee after: PUTIAN HANJIANG YD PCB CO., LTD. Address before: Chi Hong Kong Overseas Chinese Economic Development Zone 351117 Putian city of Fujian province Jiangkou Town Hanjiang District Patentee before: Fujian Putian Nanhua Circuit Board Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120530 |
|
| CX01 | Expiry of patent term |