CN103068165B - Printed circuit board (PCB) outer edge plating layer manufacturing technology - Google Patents
Printed circuit board (PCB) outer edge plating layer manufacturing technology Download PDFInfo
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- CN103068165B CN103068165B CN201210556834.1A CN201210556834A CN103068165B CN 103068165 B CN103068165 B CN 103068165B CN 201210556834 A CN201210556834 A CN 201210556834A CN 103068165 B CN103068165 B CN 103068165B
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Abstract
The invention discloses a printed circuit board (PCB) outer edge plating layer manufacturing technology which comprises the steps of rough shape cutting to form a jointed board; inner-layer pattern manufacturing after which the jointed board is divided into a PCB unit board and a tool edge surrounding the PCB unit board; laminating; hole drilling; slotted hole milling; electroless copper plating; outer-layer pattern manufacturing; surface processing; board milling; and electronic testing. In the step of the slotted hole milling, a plurality of slotted holes around the PCB unit board are formed in the tool edge where the tool edge is connected with the edge of the PCB unit board by means of a program-controlled machinery milling technology, wherein the slotted holes are exposed from the side wall of the board edge of the PCB unit board. In the step of the electroless copper plating, a copper layer is plated on the side wall of the board edge of the PCB unit board, and therefore transmission loss of PCB signals is effectively reduced, signal shielding capacity is strengthened, and high-frequency signal transmission quality is improved.
Description
Technical field
The present invention relates to a kind of for pcb board manufacture craft, particularly relate to a kind of pcb board profile limit coating manufacture craft.
Background technology
Traditional printed wiring board (PCB) makes and adopts jigsaw design, design multiple PCB delivery unit in a jigsaw, on the instrument limit of cell board periphery design one fixed width size, the tooling holes such as target hole, location hole, rivet hole, Aligning degree instrument connection, contraposition ring, film aligning hole, type designations, choker bar or baffle or trace labelling design are contained in instrument limit, after PCB graphic making completes, instrument side milling removes by employing gong or miller skill, PCB cell board required for acquisition, therefore, traditional not coated coating of PCB unit edges of boards.
But, along with the mechanicss of communication such as 3G and modern electronic technology are towards high frequency, future development at a high speed, more and more higher to the requirement of PCB cell board, traditional not coated coating of PCB unit edges of boards, easily cause high-frequency signal to transmit to reveal, affect electronic devices and components and normally work.
Summary of the invention
Based on this, for the shortcoming of prior art, the invention provides a kind of pcb board profile limit coating manufacture craft reducing PCB signal transmission attenuation, strengthen signal shielding ability, improve signal high-frequency signal transmission quality.
A kind of pcb board profile limit coating manufacture craft, it comprises the following steps: (1) sawing sheet, and form jigsaw, this jigsaw comprises internal substrate and invests the Copper Foil of this internal substrate upper and lower surface; (2) inner figure makes, and circuitry shapes is transferred on the Copper Foil of jigsaw, forms the line pattern of Copper Foil, and the Copper Foil of upper and lower surface forms circuit layer; Carry out brown process again, the jigsaw after process is divided into PCB cell board and is located in the instrument limit outside PCB cell board; (3) lamination, forms multi-layer sheet by described internal substrate and prepreg and Copper Foil; (4) hole, described multi-layer sheet gets out required hole, form the channel of the electric conductivity between connection line layer; (5) groove milling hole, by program control mechanical miller skill, described instrument limit offers some slotted eyes with PCB unit edges of boards junction around PCB cell board, exposes PCB cell board edges of boards sidewall; (6) electroless copper plating, PCB cell board edges of boards sidewall plating one deck layers of copper, realizes the coated coating of PCB cell board edges of boards; (7) outer graphics makes, and exposes to wiring board the processing that copper face carries out a layer; (8) surface treatment, ensures the solderability that wiring board is good or electric conductivity.; (9) milling plate, instrument limit described in mill off, the PCB cell board needed for acquisition; (10) Electronic Testing, checks that the open circuit of circuit and short circuit are tested.
Wherein in an embodiment, in step (5), between described slotted eye, leave some dowels.
Wherein in an embodiment, in described step (9), to be broken instrument limit described in the junction of described dowel and PCB cell board thus mill off by milling.
Wherein in an embodiment, the length of described dowel is 5mm ~ 15mm.
Wherein in an embodiment, the length of described dowel is 10mm.
Wherein in an embodiment, described slotted eye width is 2mm ~ 3mm.
Wherein in an embodiment, described slotted eye width is 2mm.
Wherein in an embodiment, the quantity of the PCB cell board on described jigsaw is at least two, forms a support plate, offers some slotted eyes between described support plate and PCB cell board, and leave some dowels between this slotted eye between the PCB cell board on jigsaw.
Wherein in an embodiment, the quantity of the PCB cell board on described jigsaw is at least four, form one between PCB cell board on jigsaw in " ten " shape support plate, offer some slotted eyes between described support plate and PCB cell board, and leave some dowels between this slotted eye.
Above-mentioned pcb board profile limit coating manufacture craft by offering several slotted eye with PCB unit edges of boards link position place around PCB cell board on instrument limit, expose PCB cell board edges of boards sidewall, again through electroless copper plating technique at PCB cell board edges of boards sidewall plating one deck copper plate, realize the coated coating of PCB cell board edges of boards, effective minimizing PCB signal transmission attenuation, strengthen signal shielding ability, improve signal high-frequency signal transmission quality.
Accompanying drawing explanation
Fig. 1 is the jigsaw schematic diagram after the PROCESS FOR TREATMENT that inner figure makes.
Fig. 2 is the jigsaw schematic diagram after the PROCESS FOR TREATMENT in groove milling hole.
Fig. 3 is the technological process of pcb board profile limit of the present invention coating manufacture craft.
Below that parts sign flag of the present invention illustrates:
PCB cell board 10, instrument limit 20, slotted eye 30, dowel 40, support plate 50.
Embodiment
For feature of the present invention, technological means and the specific purposes reached, function can be understood further, resolve the advantages and spirit of the present invention, by below in conjunction with accompanying drawing and embodiment, detailed description of the present invention is further understood.
Refer to Fig. 1 and Fig. 2, pcb board profile limit of the present invention coating manufacture craft, it has comprised the following steps the making of pcb board profile limit coating:
Step 1: sawing sheet, selects suitable jigsaw and cutting plate mode, improves availability ratio of the armor plate to greatest extent, and this jigsaw comprises internal substrate and invests the Copper Foil of internal substrate upper and lower surface.
Step 2: inner figure makes, the Copper Foil of described internal substrate upper and lower surface is coated with one deck ink, utilizes the irradiation of ultraviolet light, by circuitry shapes transition diagram on the ink on the Copper Foil of jigsaw, the ink be not hardened is removed by chemical reaction, forms the line pattern of ink; Then exposed Copper Foil is removed by chemical reaction, form the line pattern of Copper Foil; Removed by chemical reaction by ink, expose the line pattern of copper, thus transfer on the Copper Foil of jigsaw by circuitry shapes, the Copper Foil of internal substrate upper and lower surface forms circuit layer; Carry out brown process again, clean internal substrate and circuit layer before pressing, the foreign material on removing surface, improve adhesion between internal substrate and PP (prepreg, prepreg) layer, avoid lamination to occur, improve the reliability of product.Jigsaw after process is divided into PCB cell board 10 and is located in the instrument limit 20 outside PCB cell board 10.
Step 3: lamination, coincides together in order by internal substrate, PP, Copper Foil, and internal substrate, PP layer and the Copper Foil after coinciding is combined at high temperature under high pressure, forms multi-layer sheet.
Step 4: boring, get out required hole on multilayer boards, offer in the circuit board one allow that rear operation completes after, the channel of the electric conductivity between connection line layer.
Step 5: groove milling hole, by program control mechanical miller skill, jigsaw offers some slotted eyes 30 around PCB cell board, exposes PCB cell board 10 edges of boards sidewall.Described slotted eye 30 width is 2mm ~ 3mm is good, and this width is 2mm in the present embodiment, both ensure that enough width can carry out copper facing to the edges of boards sidewall of PCB cell board 10, it also avoid that width is excessive causes that the size on instrument limit 20 is too large or width is too little.Wherein, the PCB cell board 10 on each jigsaw totally four, forms a support plate 50 between the PCB cell board 10 on jigsaw, and described support plate 50 is in " ten " shape, and described slotted eye 30 is around described PCB cell board 10 and between this PCB cell board 10 and instrument limit 20.Leave some dowels 40 between described slotted eye 30 with connection PCB cell board 10 and instrument limit 20, the length of described dowel 40 is 5mm ~ 15mm is good.In the present embodiment, the length of described dowel 40 is 10mm.
Step 6: electroless copper plating, the hole wall of wiring board insulation deposits the layers of copper of one deck conduction, the connection of conducting internal layer circuit, then electroless copper plating technique is passed through in PCB cell board edges of boards sidewall plating one deck layers of copper, realize PCB cell board edges of boards coated copper coating, then carry out graphic plating or panel plating: the copper in increase circuit plate hole, line, face is thick.
Step 7: outer graphics makes, and exposes to wiring board the processing that copper face carries out a layer.
Step 8: surface treatment, ensures the solderability that wiring board is good or electric conductivity.
Step 9: milling plate, milling is broken the junction of described dowel 40 and PCB cell board, thus mill off instrument limit 20, the PCB cell board 10 of the sidewall plating one deck layers of copper needed for acquisition.
Step 10: Electronic Testing and final inspection, checks that the open circuit of circuit and short circuit are tested, and is packed by the plate of passed examination.
In sum, pcb board profile limit of the present invention coating manufacture craft by offering described slotted eye 30 with junction, PCB cell board 10 limit around PCB cell board on instrument limit 20, expose PCB cell board 10 edges of boards sidewall, again through electroless copper plating technique in PCB cell board 10 edges of boards sidewall plating one deck layers of copper, realize the coated coating of PCB cell board edges of boards, effective minimizing PCB signal transmission attenuation, strengthens signal shielding ability, improves signal high-frequency signal transmission quality.
Understandably, the PCB cell board 10 on described jigsaw can be not limited to four, as two, three or more than four; When the PCB cell board 10 on jigsaw is two time, form a support plate 50 between two PCB cell boards 10 on jigsaw, between described support plate and PCB cell board 10, offer some slotted eyes 30, and leave some dowels 40 between this slotted eye 30.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a pcb board profile limit coating manufacture craft, it comprises the following steps:
(1) sawing sheet, form jigsaw, this jigsaw comprises internal substrate and invests the Copper Foil of this internal substrate upper and lower surface;
(2) inner figure makes, and circuitry shapes is transferred on the Copper Foil of jigsaw, forms the line pattern of Copper Foil, and the Copper Foil of upper and lower surface forms circuit layer; Carry out brown process again, the jigsaw after process is divided into PCB cell board and is located in the instrument limit outside PCB cell board;
(3) lamination, forms multi-layer sheet by described internal substrate and prepreg and Copper Foil;
(4) hole, described multi-layer sheet gets out required hole, form the channel of the electric conductivity between connection line layer;
(5) groove milling hole; By program control mechanical miller skill, described instrument limit offers some slotted eyes with PCB unit edges of boards junction around PCB cell board, expose PCB cell board edges of boards sidewall; The width of described slotted eye is 2mm ~ 3mm;
(6) electroless copper plating, PCB cell board edges of boards sidewall plating one deck layers of copper, realizes the coated coating of PCB cell board edges of boards;
(7) outer graphics makes, and exposes to wiring board the processing that copper face carries out a layer;
(8) surface treatment, ensures the solderability that wiring board is good or electric conductivity;
(9) milling plate, instrument limit described in mill off, the PCB cell board needed for acquisition;
(10) Electronic Testing, checks that the open circuit of circuit and short circuit are tested.
2. pcb board profile limit according to claim 1 coating manufacture craft, is characterized in that, in step (5), leave some dowels between described slotted eye.
3. pcb board profile limit according to claim 2 coating manufacture craft, is characterized in that, in described step (9), to be broken instrument limit described in the junction of described dowel and PCB cell board thus mill off by milling.
4. pcb board profile limit according to claim 2 coating manufacture craft, is characterized in that, the length of described dowel is 5mm ~ 15mm.
5. pcb board profile limit according to claim 4 coating manufacture craft, is characterized in that, the length of described dowel is 10mm.
6. pcb board profile limit according to claim 1 coating manufacture craft, it is characterized in that, described slotted eye width is 2mm.
7. pcb board profile limit according to claim 1 coating manufacture craft, it is characterized in that, the quantity of the PCB cell board on described jigsaw is at least two, a support plate is formed between PCB cell board on jigsaw, offer some slotted eyes between described support plate and PCB cell board, and leave some dowels between this slotted eye.
8. pcb board profile limit according to claim 1 coating manufacture craft, it is characterized in that, the quantity of the PCB cell board on described jigsaw is at least four, one is formed in " ten " shape support plate between PCB cell board on jigsaw, offer some slotted eyes between described support plate and PCB cell board, and leave some dowels between this slotted eye.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210556834.1A CN103068165B (en) | 2012-12-20 | 2012-12-20 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
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| CN201210556834.1A CN103068165B (en) | 2012-12-20 | 2012-12-20 | Printed circuit board (PCB) outer edge plating layer manufacturing technology |
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| CN103068165A CN103068165A (en) | 2013-04-24 |
| CN103068165B true CN103068165B (en) | 2015-05-13 |
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| CN103730375B (en) * | 2014-01-14 | 2016-08-17 | 无锡江南计算技术研究所 | OSP surface processes base plate for packaging molding milling method |
| CN105208799A (en) * | 2014-06-23 | 2015-12-30 | 欣兴电子股份有限公司 | Method for making multi-layer flexible circuit structure |
| CN104254210B (en) * | 2014-09-19 | 2017-11-07 | 江西景旺精密电路有限公司 | Pcb board and the preparation method for preventing layer sequence error from flowing into process after milling side |
| CN104902672A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Circuit board having board edge structure and preparation method thereof |
| CN105430927B (en) * | 2015-12-29 | 2017-12-26 | 潍坊学院 | A kind of method and apparatus of printed circuit board chemical palladium-plating |
| CN106981745B (en) * | 2016-01-15 | 2019-05-10 | 上海新微技术研发中心有限公司 | Board edge connecting structure of SMA connector |
| CN105704914B (en) * | 2016-04-25 | 2019-02-22 | 胜宏科技（惠州）股份有限公司 | A kind of production method of the thick copper sheet and wiring board of different type wiring board |
| TWI634822B (en) * | 2017-04-19 | 2018-09-01 | 南亞電路板股份有限公司 | Circuit board structure and method for fabricating the same |
| CN110896592B (en) * | 2018-09-12 | 2022-12-16 | 胜宏科技（惠州）股份有限公司 | 3D (three-dimensional) switching type PCB (printed circuit board) and manufacturing method thereof |
| CN112449494B (en) * | 2019-08-27 | 2022-04-12 | 深南电路股份有限公司 | Manufacturing method of printed circuit board |
| CN111031674B (en) * | 2019-11-21 | 2023-04-21 | 惠州美锐电子科技有限公司 | Method for removing selective electroplating edge at specific position on PCB |
| CN111757603B (en) * | 2020-06-08 | 2023-09-12 | 大连崇达电路有限公司 | Processing method for improving oxidation of small PCS (process control System) plate metal surface |
| CN114430609B (en) * | 2020-10-29 | 2023-07-07 | 深南电路股份有限公司 | Battery protection plate, processing method and electronic equipment |
| CN113030657B (en) * | 2021-03-01 | 2022-08-23 | 南亚新材料科技股份有限公司 | Copper-clad plate Hi-pot short circuit rapid analysis method |
| CN113207220A (en) * | 2021-05-19 | 2021-08-03 | 黄石西普电子科技有限公司 | Full-shielding anti-signal interference circuit board and manufacturing method thereof |
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| CN201709026U (en) * | 2010-07-09 | 2011-01-12 | 远东(三河)多层电路有限公司 | Printed circuit board capable of shielding interference signal |
| CN102223755A (en) * | 2010-04-13 | 2011-10-19 | 竞陆电子(昆山)有限公司 | Plate with coppered edge |
| CN102573289A (en) * | 2010-12-15 | 2012-07-11 | 相互股份有限公司 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
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| CN103068165A (en) | 2013-04-24 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |